TI SN65HVD379DR

SN65HVD379
www.ti.com
SLLS667A – FEBRUARY 2006 – REVISED MAY 2006
3.3 V FULL-DUPLEX RS-485/RS-422 DRIVERS AND BALANCED RECEIVERS
FEATURES
DESCRIPTION
•
•
•
•
•
•
•
The SN65HVD379 is a differential line driver and
differential-input line receiver that operates with a
3.3-V power supply. Each driver and receiver has
separate input and output pins for full-duplex bus
communication designs. They are designed for
balanced transmission lines and interoperation with
ANSI TIA/EIA-485A, TIA/EIA-422-B, ITU-T v.11, and
ISO 8482:1993 standard-compliant devices.
•
•
•
Designed for INTERBUS Applications
Balanced Receiver Thresholds
1/2 Unit-Load (up to 64 nodes on the bus)
Bus-Pin ESD Protection 15 kV HBM
Bus-Fault Protection of –7V to 12V
Thermal Shutdown Protection
Power-Up/Down Glitch-free Bus Inputs and
Outputs
High Input Impedance with Low VCC
Monotonic Outputs During Power Cycling
5V Tolerant Inputs
APPLICATIONS
•
•
•
•
•
•
•
Digital Motor Control
Utility Meters
Chassis-to-Chassis Interconnections
Electronic Security Stations
Industrial, Process, and Building Automation
Point-of-Sale (POS) Terminals and Networks
DTE/DCE Interfaces
These differential bus drivers and receivers are
monolithic, integrated circuits designed for full-duplex
bi-directional data communication on multipoint
bus-transmission lines at signaling rates (1) up to 25
Mbps. The SN65HVD379 is fully enabled with no
external enabling pins.
The 1/2 unit load receiver has a higher receiver input
resistance. This results in lower bus leakage currents
over the common-mode voltage range, and reduces
the total amount of current that an RS-485 driver is
forced to source or sink when transmitting.
The balanced differential receiver input threshold
makes the SN65HVD379 more compatible with
fieldbus requirements that define an external failsafe
structure.
(1)
The signaling rate of a line is the number of voltage
transitions that are made per second expressed in the units
bps (bits per second).
BALANCED RECEIVER INPUT THRESHOLDS
SN65HVD379
D PACKAGE (TOP VIEW)
VIT –(T Y P )
VIT+ (T Y P )
Recevier Output High
VCC
R
D
GND
8
2
7
3
6
4
5
A
B
Z
Y
0.20 V
0.15 V
0.10 V
0.05 V
0V
VID
-0.05 V
-0.10 V
-0.15 V
-0.20 V
Receiver Output Low
1
R
D
2
3
8
7
5
6
A
B
Y
Z
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006, Texas Instruments Incorporated
SN65HVD379
www.ti.com
SLLS667A – FEBRUARY 2006 – REVISED MAY 2006
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
ORDERING INFORMATION
SIGNALING RATE
UNIT LOADS
PART NUMBER (1)
25 Mbps
1/2
SN65HVD379
(1)
SOIC MARKING
These are The D package is available taped and reeled. Add an R suffix to the part number (ie. SN65HVD379DR).
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted (1) (2)
UNIT
VCC
Supply voltage range
–0.3 V to 6 V
VA, VB, VY, VZ
Voltage range at any bus terminal (A, B, Y, Z)
–9 V to 14 V
VTRANS
Voltage input, transient pulse through 100 Ω. See Figure 8 (A, B, Y, Z) (3)
–50 to 50 V
VI
Input voltage range (D, DE, RE)
PCONT
Continuous total power dissipation
IO
Output current (receiver output only, R)
(1)
(2)
(3)
(4)
-0.5 V to 7 V
Internally limited (4)
11 mA
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.
This tests survivability only and the output state of the receiver is not specified.
The Thermal shutdown protection circuit internally limits the continuous total power dissipation. Thermal shutdown typically occurs when
the junction temperature reaches 165°C.
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range unless otherwise noted
PARAMETER
Supply voltage
VI or VIC
Voltage at any bus terminal (separately or common mode)
1/tUI
Signaling rate
RL
Differential load resistance
VIH
High-level input voltage
D
VIL
Low-level input voltage
D
VID
Differential input voltage
IOH
High-level output current
IOL
Low-level output current
TA
Ambient still-air temperature
(1)
2
MIN
VCC
NOM
3.6
–7 (1)
12
SN65HVD379
25
54
Driver
MAX
3.0
2
VCC
0
0.8
–12
12
60
Receiver
8
–40
85
The algebraic convention, in which the least positive (most negative) limit is designated as minimum is used in this data sheet.
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Mbps
V
mA
–8
Driver
V
Ω
60
–60
Receiver
UNIT
mA
°C
SN65HVD379
www.ti.com
SLLS667A – FEBRUARY 2006 – REVISED MAY 2006
ELECTROSTATIC DISCHARGE PROTECTION
PARAMETER
TEST CONDITIONS
MIN TYP (1)
Human body model
Bus terminals and GND
Human body model (2)
All pins
±4
Charged-device-model (3)
All pins
±1
(1)
(2)
(3)
MAX
UNIT
±16
kV
All typical values at 25°C with 3.3-V supply.
Tested in accordance with JEDEC Standard 22, Test Method A114-A.
Tested in accordance with JEDEC Standard 22, Test Method C101.
DRIVER ELECTRICAL CHARACTERISTICS
over recommended operating conditions unless otherwise noted
PARAMETER
VI(K)
TEST CONDITIONS
Input clamp voltage
II = –18 mA
IO = 0
2.0
RL = 54 Ω, See Figure 1 (2)(RS-485)
1.5
2.0
RL = 100 Ω, See Figure 1 (RS-422)
2.0
2.3
Vtest = –7 V to 12 V, See Figure 2
1.5
Steady-state differential output voltage
∆|VOD(SS)|
Change in magnitude of steady-state
differential output voltage between states
RL = 54 Ω, See Figure 1 and Figure 2
VOD(RING)
Differential Output Voltage overshoot and
undershoot
RL = 54 Ω, CL = 50 pF, See Figure 5
(Figure 3 for definitions)
VOC(PP)
Peak-to-peak common-mode output voltage
VOC(SS)
Steady-state common-mode output voltage
∆VOC(SS)
Change in steady-state common-mode output
voltage
High-impedance state output current
IZ(S) or
IY(S)
Short Circuit output Current
II
Input current
C(OD)
(1)
(2)
(3)
MAX
VCC
–0.2
0.2
0.5
See Figure 3
VCC = 0 V, VZ or VY = –7 V,
Other input at 0 V
VZ or VY = –7 V
VZ or VY = 12 V
Other input
at 0 V
VI = 0 or VI = 2.0
1.6
2.3
–0.05
0.05
90
µA
–10
–250
250
–250
250
0
100
VOD = 0.4 sin (4E6πt) + 0.5 V,
VCC at 0 V
Differential output capacitance
V
10% (3)
VCC = 0 V, VZ or VY = 12 V,
Other input at 0 V
D
UNIT
–1.5
|VOD(SS)|
IZ(Z) or
IY(Z)
MIN TYP (1)
16
mA
µA
pF
All typical values are at 25°C and with a 3.3-V supply.
VCC is 3.3 Vdc ± 5%
10% of the peak-to-peak Differential Output voltage swing, per TIA/EIA-485.
DRIVER SWITCHING CHARACTERISTICS
over recommended operating conditions unless otherwise noted
PARAMETER
TEST CONDITIONS
tPLH
Propagation delay time, low-to-high-level output
tPHL
Propagation delay time, high-to-low-level output
tr
Differential output signal rise time
tf
Differential output signal fall time
tsk(p)
tsk(pp)
(1)
(2)
RL = 54 Ω, CL = 50 pF, See Figure 5
Pulse skew (|tPHL– tPLH|)
(2)
Part-to-part skew
MIN
TYP (1)
MAX
4
10
18
ns
2.5
5
12
ns
UNIT
0.6
ns
1
ns
All typical values are at 25°C and with a 3.3-V supply.
tsk(pp) is the magnitude of the difference in propagation delay times between any specified terminals of two devices when both devices
operate with the same supply voltages, at the same temperature, and have identical packages and test circuits.
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3
SN65HVD379
www.ti.com
SLLS667A – FEBRUARY 2006 – REVISED MAY 2006
RECEIVER ELECTRICAL CHARACTERISTICS
over recommended operating conditions unless otherwise noted
PARAMETER
TEST CONDITIONS
VIT+
Positive-going differential input threshold
voltage
IO = –8 mA
VIT–
Negative-going differential input threshold
voltage
IO = 8 mA
Vhys
Hysteresis voltage (VIT+– VIT–)
VO
Output voltage
MIN
MAX
UNIT
0.2
V
–0.2
50
VID = 200 mV, IO = –8 mA, See Figure 7
mV
2.4
VID = –200 mV, IO = 8 mA, See Figure 7
0.20
0.35
VA or VB = 12 V, VCC = 0 V
0.24
0.40
Bus input current
CID
Differential input capacitance
VID = 0.4 sin (4E6πt) + 0.5 V, DE at 0 V
ICC
Supply current
D at 0 V or VCC and No Load
VA or VB = -7 V
Other input
at 0 V
VA or VB = -7 V, VCC = 0 V
V
0.4
VA or VB = 12 V
IA or
IB
(1)
TYP (1)
–0.35
–0.18
–0.25
–0.13
mA
15
pF
2.1
mA
TYP (1)
MAX
UNIT
26
45
All typical values are at 25°C and with a 3.3-V supply.
RECEIVER SWITCHING CHARACTERISTICS
over recommended operating conditions unless otherwise noted
PARAMETER
TEST CONDITIONS
MIN
tPLH
Propagation delay time, low-to-high-level output
tPHL
Propagation delay time, high-to-low-level output
tsk(p)
Pulse skew (|tPHL - tPLH|)
tsk(pp)
Part-to-part skew (2)
tr
Output signal rise time
5
tf
Output signal fall time
6
(1)
(2)
VID = –1.5 V to 1.5 V, CL = 15 pF,
See Figure 7
ns
7
5
All typical values are at 25°C and with a 3.3-V supply
tsk(pp) is the magnitude of the difference in propagation delay times between any specified terminals of two devices when both devices
operate with the same supply voltages, at the same temperature, and have identical packages and test circuits.
DEVICE POWER DISSIPATION – PD
PARAMETER
PD
TEST CONDITIONS
Device power dissipation
MIN
RL = 60 , CL = 50 pF, Input to D a 50% duty cycle square wave at
indicated signaling rate TA = 85°C
TYP MAX
UNIT
197
mW
FUNCTION TABLES
DRIVER
INPUT
4
RECEIVER
OUTPUTS
DIFFERENTIAL INPUTS
OUTPUTS
D
Y
Z
VID = VA–VB
R
H
H
L
VID≤– 0.2 V
L
L
L
H
–0.2 V < VID < 0.2 V
?
Open
L
H
0.2 V ≤ VID
H
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SN65HVD379
www.ti.com
SLLS667A – FEBRUARY 2006 – REVISED MAY 2006
PARAMETER MEASUREMENT INFORMATION
375 Ω ±1%
II
Y
IY
VOD
0 or 3 V
Z
RL
Y
D
VOD
0 or 3 V
IZ
60 Ω ±1%
+
_ −7 V < V(test) < 12 V
Z
VI
VZ
VY
375 Ω ±1%
Figure 1. Driver VOD Test Circuit and Voltage and
Current Definitions
Figure 2. Driver VOD With Common-Mode Loading Test
Circuit
VOD(SS)
VOD(RING)
0 V Differential
VOD(RING)
-VOD(SS)
Figure 3. VOD(RING) Waveform and Definitions
VOD(RING) is measured at four points on the output waveform, corresponding to overshoot and undershoot from
theVOD(H) and VOD(L) steady state values.
27 Ω ± 1%
Input
D
Y
Y
VY
Z
VZ
VOC(PP)
Z
27 Ω ± 1%
CL = 50 pF ±20%
VOC
∆VOC(SS)
VOC
CL Includes Fixture and
Instrumentation Capacitance
Input: PRR = 500 kHz, 50% Duty Cycle,t r <6ns, t f <6ns, ZO = 50 Ω
Figure 4. Test Circuit and Definitions for the Driver Common-Mode Output Voltage
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5
SN65HVD379
www.ti.com
SLLS667A – FEBRUARY 2006 – REVISED MAY 2006
PARAMETER MEASUREMENT INFORMATION (continued)
Y
W
»
W
Z
»
W
Figure 5. Driver Switching Test Circuit and Voltage Waveforms
IA
A
IO
R
VA
VID
VIC
VA + VB
2
VB
B
VO
IB
Figure 6. Receiver Voltage and Current Definitions
A
R
Input
Generator
VI
50 Ω
1.5 V
B
3V
VO
1.5 V
VI
0V
CL = 15 pF
±20%
CL Includes Fixture and Instrumentation Capacitance
1.5 V
t PLH
VO
Generator: PRR = 500 kHz, 50% Duty Cycle, t r <6 ns, t f <6 ns, Zo = 50 Ω
t PHL
VOH
90% 90%
1.5 V
10%
tr
1.5 V
10% V
OL
tf
Figure 7. Receiver Switching Test Circuit and Voltage Waveforms
A
Y
D
R
Z
100 W
±1%
+
-
Pulse Generator
15 ms duration
1% Duty Cycle
tr, tf £ 100 ns
100 W
±1%
B
+
-
Figure 8. Test Circuit, Transient Over Voltage Test
6
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SN65HVD379
www.ti.com
SLLS667A – FEBRUARY 2006 – REVISED MAY 2006
EQUIVALENT INPUT AND OUTPUT SCHEMATIC DIAGRAMS
D Input
R Output
VCC
Input
VCC
470 W
5W
Output
9V
9V
125 kW
A Input
B Input
VCC
VCC
R1
22 V
R1
22 V
R3
R3
Input
Input
22 V
R2
22 V
R2
Y and Z Outputs
VCC
16 V
Output
16 V
SN65HVD379
R1/R2
R3
9 kΩ
45 kΩ
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SN65HVD379
www.ti.com
SLLS667A – FEBRUARY 2006 – REVISED MAY 2006
TYPICAL CHARACTERISTICS
RMS Supply Current
vs
Signaling Rate
Bus Input Current
vs
Input Voltage
55
250
TA =25°C RL = 54 W
RE = VCC CL = 50 pF
DE = VCC
50
150
II - Bus Input Current - uA
ICC - RMS Supply Current - mA
TA = 25°C
RE = 0 V
DE = 0 V
200
45
VCC = 3.3 V
40
35
100
50
VCC = 3.3 V
0
-50
-100
-150
-200
30
0
5
10
15
20
25
-7
-4
Signaling Rate - Mbps
5
8
Figure 9.
Figure 10.
Driver Low-Level Output Current
vs
Low-Level Output Voltage
Driver High-Level Output Current
vs
High-Level Output Voltage
11
14
3
3.5
0.01
VCC = 3.3 V
DE = VCC
D=0V
0.12
VCC = 3.3 V
DE = VCC
D=0V
-0.01
0.1
IOH - High-level Output Current - A
IOL - Low-level Output Current - A
2
VI - Bus Input Voltage - V
0.14
0.08
0.06
0.04
0.02
0
-0.02
-0.03
-0.05
-0.07
-0.09
-0.11
-0.13
0
0.5
1
1.5
2
2.5
3
3.5
0
VOL - Low-Level Output Voltage - V
Figure 11.
8
-1
0.5
1
1.5
2
Figure 12.
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2.5
VOH - High-Level Output Voltage - V
SN65HVD379
www.ti.com
SLLS667A – FEBRUARY 2006 – REVISED MAY 2006
TYPICAL CHARACTERISTICS (continued)
Driver Differential Output Voltage
vs
Free-Air Temperature
Driver Output Current
vs
Supply Voltage
2.2
40
TA = 25°C
RL = 54 W
D = VCC
DE = VCC
35
IO - Driver Output Current - mA
VOD - Driver Differential Voltage - V
VCC = 3.3 V
DE = VCC
D = VCC
2.1
2.0
1.9
30
25
20
15
10
5
0
1.8
-40
-15
10
35
60
85
0
0.5
1
1.5
2
2.5
TA - Free Air Temperature - °C
VCC Supply Voltage - V
Figure 13.
Figure 14.
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3
3.5
9
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN65HVD379D
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65HVD379DG4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65HVD379DR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65HVD379DRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
SN65HVD379DR
Package Package Pins
Type Drawing
SOIC
D
8
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
2500
330.0
12.4
Pack Materials-Page 1
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
6.4
5.2
2.1
8.0
W
Pin1
(mm) Quadrant
12.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN65HVD379DR
SOIC
D
8
2500
346.0
346.0
29.0
Pack Materials-Page 2
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