TI SN65HVD3086EDGSR

SN65HVD3080E
SN65HVD3083E
SN65HVD3086E
www.ti.com
SLLS771B – NOVEMBER 2006 – REVISED MARCH 2007
LOW-POWER RS-485 FULL-DUPLEX DRIVERS/RECEIVERS
FEATURES
•
•
•
•
•
•
•
SN65HVD308xE
(TOP VIEW)
Low Quiescent Power
– 375 µA (Typical) Enabled Mode
– 2 nA (Typical) Shutdown Mode
Small MSOP Package
1/8 Unit-Load—Up to 256 Nodes per Bus
16 kV Bus-Pin ESD Protection, 6 kV All Pins
Failsafe Receiver (Bus Open, Short, Idle)
TIA/EIA-485A Standard Compliant
RS-422 Compatible
R
RE
DE
D
GND
APPLICATIONS
•
•
•
•
•
•
•
Motion Controllers
Point-of-Sale (POS) Terminals
Rack-to-Rack Communications
Industrial Networks
Power Inverters
Battery-Powered Applications
Building Automation
1
10
2
9
3
8
4
7
5
6
VCC
A
B
Z
Y
DEVICE
SIGNAL RATE
SN65HVD3080E
200 kbps
SN65HVD3083E
1 Mbps
SN65HVD3086E
20 Mbps
DESCRIPTION
Each of these devices is a balanced driver and receiver designed for full-duplex RS-485 or RS-422 data bus
networks. Powered by a 5-V supply, they are fully compliant with the TIA/EIA-485A standard.
With controlled bus output transition times, the devices are suitable for signaling rates from 200 kbps to
20 Mbps.
The devices are designed to operate with a low supply current, less than 1 mA (typical), exclusive of the load.
When in the inactive shutdown mode, the supply current drops to a few nanoamps, making these devices ideal
for power-sensitive applications.
The wide common-mode range and high ESD protection levels of these devices make them suitable for
demanding applications such as motion controllers, electrical inverters, industrial networks, and cabled chassis
interconnects where noise tolerance is essential.
These devices are characterized for operation over the temperature range -40°C to 85°C
Enabled ICC
ISL
MAX
TI
350
370
390
410
430
450
470
490
510
530
550
Current - mA
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006–2007, Texas Instruments Incorporated
SN65HVD3080E
SN65HVD3083E
SN65HVD3086E
www.ti.com
SLLS771B – NOVEMBER 2006 – REVISED MARCH 2007
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
ORDERING INFORMATION
PACKAGE (1)
PART NUMBER
MARKED AS
SN65HVD3080E
BTT
SN65HVD3083E
DGS, DGSR
(2)
BTU
SN65HVD3086E
(1)
(2)
BTF
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
The R suffix indicated tape and reel.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted (1)
UNIT
VCC
Supply voltage range (2)
–0.3 V to 7 V
V(A), V(B), V(Y), V(Z)
Voltage range at any bus terminal (A, B, Y, Z)
–9 V to 14 V
V(TRANS)
Voltage input, transient pulse through 100 Ω.
See Figure 10 (A, B, Y, Z)
–50 to 50 V
VI
Input voltage range (D, DE, RE)
PD
Continuous total power dissipation
TJ
Junction temperature
(1)
(2)
-0.3 V to VCC+0.3 V
See the dissipation rating table
170°C
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.
POWER DISSIPATION RATINGS
(1)
PACKAGE
TA < 25°C
DERATING FACTOR (1)
ABOVE TA < 25°C
TA = 85°C
DGS-10
463 mW
3.71 mW/°C
241 mW
This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow.
ELECTROSTATIC DISCHARGE PROTECTION
PARAMETER
Human Body Model (1)
Field-induced-Charged Device Mode (2)
TEST CONDITIONS
A,B,Y,Z, and GND
(2)
2
TYP
MAX
UNIT
16k
V
All pins
6k
V
All pins
1.5k
V
200
V
Machine Model
(1)
MIN
Tested in accordance JEDEC Standard 22, Test Method A114-A. Bus pin stressed with respect to a common connection of GND and
VCC.
Tested in accordance JEDEC Standard 22, Test Method C101.
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SLLS771B – NOVEMBER 2006 – REVISED MARCH 2007
SUPPLY CURRENT
over recommended operating conditions unless otherwise noted
PARAMETER
ICC
TYP
MAX
UNIT
RE at 0 V, D and DE at VCC, No load
Receiver enabled,
Driver enabled
TEST CONDITIONS
375
750
µA
RE at 0 V, D and DE at 0 V, No load
Receiver enabled,
Driver disabled
300
680
µA
RE at VCC, D and DE at VCC, No load
Receiver disabled,
Driver enabled
240
600
µA
RE at VCC, D and DE at 0 V, No load
Receiver disabled,
Driver disabled
2
1000
nA
UNIT
Supply current
MIN
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range unless otherwise noted
VCC
Supply voltage
VI or VIC
Voltage at any bus terminal (separately or common mode)
VIH
High-level input voltage
D, DE, RE
VIL
Low-level input voltage
D, DE, RE
VID
Differential input voltage
IOH
High-level output current
IOL
Low-level output current
TJ
Junction temperature
TA
Ambient still-air temperature
(1)
MIN
NOM
MAX
4.5
5
5.5
–7 (1)
12
2
VCC
0
0.8
–12
12
Driver
–60
Receiver
–10
V
mA
Driver
60
Receiver
10
150
–40
V
85
mA
°C
The algebraic convention, in which the least positive (most negative) limit is designated as minimum is used in this data sheet.
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SN65HVD3080E
SN65HVD3083E
SN65HVD3086E
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SLLS771B – NOVEMBER 2006 – REVISED MARCH 2007
DRIVER ELECTRICAL CHARACTERISTICS
over recommended operating conditions unless otherwise noted
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
3
4.3
VCC
RL = 54 Ω, See Figure 1
1.5
2.3
Vtest = –7 V to 12 V, See Figure 2
1.5
No load, IO = 0
|VOD|
Differential output voltage
∆|VOD|
Change in magnitude of differential output voltage
VOC(SS)
Steady-state common-mode output voltage
∆VOC(SS)
Common-mode output voltage (Dominant)
VOC(PP)
Peak-to-peak common-mode output voltage
RL = 100 Ω, See Figure 1
V
2
RL = 54 Ω, See Figure 1 and Figure 2
See Figure 3
–0.2
0
0.2
1
2.6
3
0
0.1
-0.1
V
V
0.5
VCC = 0 V, V(Z) or V(Y) = 12 V
Other input at 0 V
IZ(Y) or
IZ(Z)
UNIT
1
VCC = 0 V, V(Z) or V(Y) = -7 V
Other input at 0 V
High-impedance state output current
-1
µA
VCC = 5 V, V(Z) or V(Y) = 12 V
Other input at 0 V
1
VCC = 5 V, V(Z) or V(Y) = -7 V
Other input at 0 V
-1
II
Input current
D, DE
-100
100
µA
IOS
Short-circuit output current
–7 V ≤ VO ≤ 12 V
-250
250
mA
UNIT
DRIVER SWITCHING CHARACTERISTICS
over recommended operating conditions unless otherwise noted
PARAMETER (1)
tPLH,
tPHL
TEST CONDITIONS
Propagation delay time, low-to-high-level output
Propagation delay time, high-to-low-level output
TYP
MAX
HVD3080E
0.7
1.3
µs
HVD3083E
150
500
ns
HVD3086E
12
20
ns
0.9
1.5
µs
200
300
ns
7
15
ns
HVD3080E
20
200
ns
HVD3083E
5
50
ns
HVD3086E
1.4
5
ns
HVD3080E
2.5
7
µs
1
2.5
µs
13
30
ns
80
200
ns
HVD3083E
60
100
ns
HVD3086E
12
30
ns
HVD3080E
2.5
7
µs
HVD3080E
tr,
tf
Differential output signal rise time
Differential output signal fall time
HVD3083E
HVD3086E
tsk(p)
tPZH
Pulse skew (|tPHL– tPLH|)
Propagation delay time,
high-impedance-to-high-level output
HVD3083E
HVD3086E
HVD3080E
tPHZ
tPZL
Propagation delay time,
high-level-to-high-impedance output
Propagation delay time, high-impedance-to-low-level
output
1
2.5
µs
30
ns
80
200
ns
HVD3083E
60
100
ns
HVD3086E
12
30
ns
3.5
7
µs
tPZH,
Propagation delay time, standby-to-high-level output (See Figure 5)
tPZL
Propagation delay time, standby-to-low-level output (See Figure 6)
(1)
4
0.5
13
HVD3080E
Propagation delay time, low-level-to-high-impedance
output
RL = 110 Ω,
RE at 0 V,
See Figure 5
HVD3083E
HVD3086E
tPLZ
RL = 54 Ω,
CL = 50 pF,
See Figure 4
MIN
RL = 110 Ω,
RE at 0 V,
See Figure 6
RL = 110 Ω, RE at 3 V
SNHVD3080 and SNHVD3083 are in the Product Preview state of development.
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SLLS771B – NOVEMBER 2006 – REVISED MARCH 2007
RECEIVER ELECTRICAL CHARACTERISTICS
over recommended operating conditions unless otherwise noted
PARAMETER
TEST CONDITIONS
VIT+
Positive-going differential input threshold voltage IO = –10 mA
VIT-
Negative-going differential input threshold
voltage
Vhys
Hysteresis voltage (VIT+ - VIT-)
MIN TYP (1)
-0.08
IO = 10 mA
UNIT
V
–0.2 -0.1
30
VOH
High-level output voltage
VID = 200 mV, IOH = –10 mA,
See Figure 7 and Figure 8
VOL
Low-level output voltage
VID = –200 mV, IOH = 10 mA,
See Figure 7 and Figure 8
IOZ
High-impedance-state output current
VO = 0 or VCC
Other input at 0V
mV
4 4.6
V
0.15
–1
0.4
V
1
µA
VA or VB = 12 V
0.04
0.11
VA or VB = 12 V, VCC = 0 V
0.06
0.13
II
Bus input current
IIH
High-level input current
VIH = 2 V
–60
IIL
Low-level input current
VIL = 0.8 V
-60
CID
Differential input capacitance
VI = 0.4 sin (4E6πt) + 0.5 V
VA or VB = -7 V
VA or VB = -7 V, VCC = 0 V
(1)
MAX
–0.01
–0.1
–0.04
–0.05
–0.03
mA
-30
µA
-30
µA
7
pF
All typical values are at 25°C and with a 3.3-V supply.
RECEIVER SWITCHING CHARACTERISTICS
over recommended operating conditions unless otherwise noted
PARAMETER
TEST CONDITIONS
tPLH
Propagation delay time, low-to-high-level output
tPHL
Propagation delay time, high-to-low-level output
tsk(p)
Pulse skew (|tPHL– tPLH|)
tr
Output signal rise time
tf
Output signal fall time
tPZH
VID = -1.5 V to 1.5 V,
CL = 15 pF, See Figure 8
Output disable time to high level
From standby
tPHZ
tPZL
Output enable time from high level
Output disable time to low level
From standby
tPLZ
Output enable time from low level
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MIN
TYP
MAX
75
100
79
100
4
10
1.5
3
UNIT
ns
1.8
3
DE at 5 V,
See Figure 9
5
50
ns
DE at 5 V,
See Figure 9
1.6
3.5
µs
DE at 5 V,
See Figure 9
5
50
ns
DE at 0 V,
See Figure 9
10
50
ns
DE at 5 V,
See Figure 9
1.7
3.5
µs
DE at 5 V,
See Figure 9
8
50
ns
5
SN65HVD3080E
SN65HVD3083E
SN65HVD3086E
www.ti.com
SLLS771B – NOVEMBER 2006 – REVISED MARCH 2007
PARAMETER MEASUREMENT INFORMATION
VCC
DE
RL
2
IO
Y
D
0 or 5 V
VOD
RL
2
IO
Z
VI
VOC
VO
VO
Figure 1. Driver VOD Test Circuit and Current Definitions
375 Ω ±1%
VCC
DE
D
Y
VOD
0 or 5 V
60 Ω ±1%
+
_ −7 V < V(test) < 12 V
Z
375 Ω ±1%
Figure 2. Driver VOD With Common-Mode Loading Test Circuit
VCC
27 Ω ± 1%
DE
Input
D
Y
VY
Z
VZ
Y
27 Ω ± 1%
Z
50 pF ±20%
VOC
Input: PRR = 500 kHz, 50% Duty Cycle,
tr < 6 ns, tf < 6 ns, ZO = 50 W
CL Includes Fixture and
Instrumentation Capacitance
VOC
VOC(SS)
VOC(PP)
Figure 3. Test Circuit and Definitions for the Driver Common-Mode Output Voltage
3V
VI
Y
VI
W
Z
RL = 54 W
1.5 V
1.5 V
CL = 50 pF ±20%
±1%
90%
VOD
0V
10%
Generator: PRR = 500 kHz, 50% Duty Cycle,
tr < 6 ns, tf < 6 ns, ZO = 50 W
Figure 4. Driver Switching Test Circuit and Voltage Waveforms
6
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VOD(H)
90%
0V
10%
VOD(L)
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SN65HVD3083E
SN65HVD3086E
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SLLS771B – NOVEMBER 2006 – REVISED MARCH 2007
PARAMETER MEASUREMENT INFORMATION (continued)
Y
3V
1.5 V
RL = 110 W
CL = 50 pF
0.5 V
tPZH
±1%
±20%
50 W
VI
0V
V OH
VO
Generator: PRR = 500 kHz,
50% Duty Cycle, tr < 6 ns,
1.5 V
VI
Z
DE
Input
Generator
3V
S1 VO
D
2.5 V
»0V
tPHZ
CL Includes Fixture and
Instrumentation Capacitance
tf < 6 ns, ZO = 50 W
Figure 5. Driver High-Level Output Enable and Disable Time Test Circuit and Voltage Waveforms
3V
RL = 110 W
Y
50 W
VI
1.5 V
VI
VO
DE
Input
Generator
S1
D
0V
3V
±1%
1.5 V
tPZL
Z
0V
tPLZ
CL = 50 pF
VO
±20%
5V
0.5 V
2.5 V
VOL
Generator: PRR = 500 kHz,
50% Duty Cycle, tr < 6 ns,
CL Includes Fixture and
Instrumentation Capacitance
tf < 6 ns, ZO = 50 W
Figure 6. Driver Low-Level Output Enable and Disable Time Test Circuit and Voltage Waveforms
IA
A
IO
R
VA
VA + VB
2
VID
VIC
B
VO
IB
VB
Figure 7. Receiver Voltage and Current Definitions
A
Input
Generator
R
VI
50 Ω
1.5 V
B
3V
VO
1.5 V
0V
CL = 15 pF
RE
1.5 V
VI
t PLH
±20%
t PHL
VOH
90% 90%
Generator: PRR = 500 kHz,
50% Duty Cycle,tr < 6 ns,
tf < 6 ns, ZO = 50 W
CL Includes Fixture and
Instrumentation Capacitance
VO
1.5 V
10%
tr
1.5 V
10%
VOL
tf
Figure 8. Receiver Switching Test Circuit and Voltage Waveforms
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SLLS771B – NOVEMBER 2006 – REVISED MARCH 2007
PARAMETER MEASUREMENT INFORMATION (continued)
VCC
0 or 2.5 V
A
VO
R
2.5 or 0 V
B
CL = 15 pF
RE
Input
Generator
VI
C
1 kW ±1%
3V
VI
S1
tPHZ
tPZH
±20%
A at 2.5 V
B at 0 V
S1 to D
VOH - 0.5 V
1.5 V
VO
CL Includes Fixture and
Instrumentation Capacitance
tPZL
A at 0 V
B at 2.5 V
S1 to C
Generator: PRR = 500 kHz, 50% Duty Cycle,
tr < 6 ns, tf < 6 ns, ZO = 50 W
1.5 V
0V
D
50 W
1.5 V
VO
tPLZ
1.5 V
VOL
A
Y
D
R
Z
+
-
A.
100 W
100 W
±1%
±1%
Pulse Generator
15 ms duration
1% Duty Cycle
tr, tf £ 100 ns
B
+
-
This test is conducted to test survivability only. Data stability at the R output is not specified.
Figure 10. Transient Overvoltage Test Circuit
8
»0V
»5V
VOL + 0.5 V
Figure 9. Receiver Enable and Disable Test Circuit and Voltage Waveforms
0 V or 3 V
DE
VOH
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RE
0 V or 3 V
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SLLS771B – NOVEMBER 2006 – REVISED MARCH 2007
DEVICE INFORMATION
FUNCTION TABLES
DRIVER (1)
(1)
INPUT
Enable
D
DE
Y
OUTPUTS
Z
H
H
H
L
L
H
L
H
X
L
Z
Z
Open
H
H
L
H = high level, L = low level, Z = high impedance, X = irrelevant, ?
= indeterminate
RECEIVER (1)
DIFFERENTIAL INPUTS
VID = V(A) - V(B)
ENABLE
RE
OUTPUT
R
VID ≤ –0.2 V
L
L
–0.2 V < VID < –0.01 V
L
?
–0.01 V ≤ VID
L
H
X
H
Z
Open Circuit
L
H
BUS Idle
L
H
Short Circuit
L
H
(1)
H = high level, L = low level, Z = high impedance, X = irrelevant, ?
= indeterminate
DEVICE ELECTRICAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETERS
P(AVG)
Average power dissipation
TEST CONDITIONS
RL = 60 Ω, Input to D a 500-kHz 50% duty
cycle square-wave
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MIN
TYP
MAX
UNIT
85
109
136
mW
9
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SN65HVD3083E
SN65HVD3086E
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SLLS771B – NOVEMBER 2006 – REVISED MARCH 2007
Equivalent Input and Output Schematic Diagrams
D and RE Input
DE Input
VCC
VCC
50 kW
500
500
Input
Input
9V
50 kΩ
9V
A Input
B Input
VCC
16 V
VCC
16 V
36 kW
180 kW
36 kW
180 kW
Input
Input
16 V
36 kW
16 V
36 kW
Y and Z Outputs
R Outputs
VCC
VCC
16 V
5W
Output
16 V
10
Output
9V
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SLLS771B – NOVEMBER 2006 – REVISED MARCH 2007
TYPICAL CHARACTERISTICS
HVD3080E
SUPPLY CURRENT
vs
SIGNALING RATE
INPUT BIAS CURRENT
vs
BUS INPUT VOLTAGE
10
80
No Load
VCC = 5 V
TA = 25°C
50% Square wave input
ICC − Supply Current − mA
II − Input Bias Current − µA
60
40
20
VCC = 0 V
VCC = 5 V
0
−20
Driver and Receiver
1
Receiver Only
−40
0.1
−60
−8
−6
−4
−2
0
2
4
6
8
10
12
1
10
VI − Bus Input Voltage − V
Figure 11.
Figure 12.
HVD3083E
SUPPLY CURRENT
vs
SIGNALING RATE
HVD3086E
SUPPLY CURRENT
vs
SIGNALING RATE
100
100
No Load
VCC = 5 V
TA = 25°C
50% Square wave input
ICC − Supply Current − mA
No Load
VCC = 5 V
TA = 25°C
50% Square wave input
ICC − Supply Current − mA
100
Signaling Rate − kbps
10
Driver and Receiver
1
Receiver Only
10
Driver and Receiver
1
Receiver Only
0.1
1
10
100
1k
0.1
0.001
Signaling Rate − kbps
0.01
0.1
1
10
100
Signaling Rate − Mbps
Figure 13.
Figure 14.
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SLLS771B – NOVEMBER 2006 – REVISED MARCH 2007
TYPICAL CHARACTERISTICS (continued)
DIFFERENTIAL OUTPUT VOLTAGE
vs
DIFFERENTIAL OUTPUT CURRENT
RECEIVER OUTPUT VOLTAGE
vs
DIFFERENTIAL INPUT VOLTAGE
5.0
5.0
TA = 25°C
VCC = 5 V
4.5
RL = 120 Ω
4.0
VO − Receiver Output Voltage − V
VOD − Differential Output Voltage − V
4.5
3.5
3.0
RL = 60 Ω
2.5
2.0
1.5
1.0
0.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0
10
20
30
40
50
0.0
−200−180 −160 −140−120 −100 −80 −60 −40 −20
IO − Differential Output Current − mA
Figure 15.
12
TA = 25°C
VCC = 5 V
VIC = 0.75 V
VID − Differential Input Voltage − V
Figure 16.
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SLLS771B – NOVEMBER 2006 – REVISED MARCH 2007
Changes from A Revision (December 2006) to B Revision .......................................................................................... Page
•
Changed VOH + 0.5 V to VOH - 0.5 V in Figure 9 .................................................................................................................. 8
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PACKAGE OPTION ADDENDUM
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29-Mar-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN65HVD3080EDGS
ACTIVE
MSOP
DGS
10
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
SN65HVD3080EDGSG4
ACTIVE
MSOP
DGS
10
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
SN65HVD3080EDGSR
ACTIVE
MSOP
DGS
10
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
SN65HVD3080EDGSRG4
ACTIVE
MSOP
DGS
10
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
SN65HVD3083EDGS
ACTIVE
MSOP
DGS
10
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
SN65HVD3083EDGSG4
ACTIVE
MSOP
DGS
10
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
SN65HVD3083EDGSR
ACTIVE
MSOP
DGS
10
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
SN65HVD3083EDGSRG4
ACTIVE
MSOP
DGS
10
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
SN65HVD3086EDGS
ACTIVE
MSOP
DGS
10
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
SN65HVD3086EDGSG4
ACTIVE
MSOP
DGS
10
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
SN65HVD3086EDGSR
ACTIVE
MSOP
DGS
10
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
SN65HVD3086EDGSRG4
ACTIVE
MSOP
DGS
10
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
29-Mar-2007
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
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