SN74ALVCH16245 16-BIT BUS TRANSCEIVER WITH 3-STATE OUTPUTS www.ti.com FEATURES • • • • • • • Member of the Texas Instruments Widebus™ Family Operates From 1.65 V to 3.6 V Max tpd of 3 ns at 3.3 V ±24-mA Output Drive at 3.3 V Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors Latch-Up Performance Exceeds 250 mA Per JESD 17 ESD Protection Exceeds JESD 22 - 2000-V Human-Body Model (A114-A) - 200-V Machine Model (A115-A) DESCRIPTION/ORDERING INFORMATION This 16-bit (dual-octal) noninverting bus transceiver is designed for 1.65-V to 3.6-V VCC operation. The SN74ALVCH16245 is designed for asynchronous communication between two data buses. The logic levels of the direction-control (DIR) input and the output-enable (OE) input activate either the B-port outputs or the A-port outputs or place both output ports into the high-impedance mode. The device transmits data from the A bus to the B bus when the B-port outputs are activated, and from the B bus to the A bus when the A-port outputs are activated. The input circuitry on both A and B ports is always active and must have a logic HIGH or LOW level applied to prevent excess ICC and ICCZ. SCES015L – JULY 1995 – REVISED NOVEMBER 2005 DGG, DGV, OR DL PACKAGE (TOP VIEW) 1DIR 1B1 1B2 GND 1B3 1B4 VCC 1B5 1B6 GND 1B7 1B8 2B1 2B2 GND 2B3 2B4 VCC 2B5 2B6 GND 2B7 2B8 2DIR 1 48 2 47 3 46 4 45 5 44 6 43 7 42 8 41 9 40 10 39 11 38 12 37 13 36 14 35 15 34 16 33 17 32 18 31 19 30 20 29 21 28 22 27 23 26 24 25 1OE 1A1 1A2 GND 1A3 1A4 VCC 1A5 1A6 GND 1A7 1A8 2A1 2A2 GND 2A3 2A4 VCC 2A5 2A6 GND 2A7 2A8 2OE xxxxxx To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Widebus is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1995–2005, Texas Instruments Incorporated SN74ALVCH16245 16-BIT BUS TRANSCEIVER WITH 3-STATE OUTPUTS www.ti.com SCES015L – JULY 1995 – REVISED NOVEMBER 2005 ORDERING INFORMATION PACKAGE (1) TA FBGA – GRD FBGA – ZRD (Pb-free) SSOP – DL –40°C to 85°C SN74ALVCH16245DL SN74ALVCH16245DLR TVSOP – DGV Tape and reel Tape and reel TOP-SIDE MARKING VH245 SN74ALVCH16245ZRDR Tape and reel Tape and reel VFBGA – ZQL (Pb-free) SN74ALVCH16245GRDR Tube TSSOP – DGG VFBGA – GQL (1) Tape and reel ORDERABLE PART NUMBER ALVCH16245 SN74ALVCH16245DGGR ALVCH16245 74ALVCH16245DGGRG4 SN74ALVCH16245DGVR VH245 74ALVCH16245DGVRE4 SN74ALVCH16245KR VH245 74ALVCH16245ZQLR Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. GQL OR ZQL PACKAGE (TOP VIEW) TERMINAL ASSIGNMENTS (1) (56-Ball GQL/ZQL Package) 1 2 3 4 5 6 A B C D E F G H J K XXX 1 2 3 4 5 6 A 1DIR NC NC NC NC 1OE B 1B2 1B1 GND GND 1A1 1A2 C 1B4 1B3 VCC VCC 1A3 1A4 D 1B6 1B5 GND GND 1A5 1A6 E 1B8 1B7 1A7 1A8 F 2B1 2B2 2A2 2A1 G 2B3 2B4 GND GND 2A4 2A3 H 2B5 2B6 VCC VCC 2A6 2A5 J 2B7 2B8 GND GND 2A8 2A7 K 2DIR NC NC NC NC 2OE XXX (1) XXX NC – No internal connection GRD OR ZRD PACKAGE (TOP VIEW) 1 2 3 4 5 6 TERMINAL ASSIGNMENTS (1) (54-Ball GRD/ZRD Package) A B 1 2 3 4 5 6 A 1B1 NC 1DIR 1OE NC 1A1 B 1B3 1B2 NC NC 1A2 1A3 C 1B5 1B4 VCC VCC 1A4 1A5 C D 1B7 1B6 GND GND 1A6 1A7 D E 2B1 1B8 GND GND 1A8 2A1 F 2B3 2B2 GND GND 2A2 2A3 G 2B5 2B4 VCC VCC 2A4 2A5 H 2B7 2B6 NC NC 2A6 2A7 J 2B8 NC 2DIR 2OE NC 2A8 E F G H J (1) 2 NC – No internal connection SN74ALVCH16245 16-BIT BUS TRANSCEIVER WITH 3-STATE OUTPUTS www.ti.com SCES015L – JULY 1995 – REVISED NOVEMBER 2005 (1) FUNCTION TABLE (EACH 8-BIT SECTION) CONTROL INPUTS OE (1) OUTPUT CIRCUITS OPERATION DIR A PORT B PORT L L Enabled Hi-Z B data to A bus L H Hi-Z Enabled A data to B bus H X Hi-Z Hi-Z Isolation Input circuits of the data I/Os always are active. LOGIC DIAGRAM (POSITIVE LOGIC) 1DIR 1 2DIR 48 1A1 25 1OE 47 2A1 2 24 2OE 36 13 1B1 2B1 To Seven Other Channels To Seven Other Channels Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) VCC Supply voltage range range (2) (3) VI Input voltage VO Output voltage range (2) (3) IIK Input clamp current VI < 0 IOK Output clamp current VO < 0 IO Continuous output current MIN MAX –0.5 4.6 V –0.5 VCC + 0.5 V –0.5 VCC + 0.5 Continuous current through each VCC or GND θJA Package thermal impedance (4) (1) (2) (3) (4) Storage temperature range V -50 mA -50 mA ±50 mA ±100 mA DGG package 70 DGV package 58 DL package 63 GQL/ZQL package 42 GRD/ZRD package Tstg UNIT °C/W 36 –65 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. This value is limited to 4.6 V maximum. The package thermal impedance is calculated in accordance with JESD 51-7. 3 SN74ALVCH16245 16-BIT BUS TRANSCEIVER WITH 3-STATE OUTPUTS www.ti.com SCES015L – JULY 1995 – REVISED NOVEMBER 2005 Recommended Operating Conditions (1) VCC Supply voltage VIH High-level input voltage VCC = 1.65 V to 1.95 V MIN MAX 1.65 3.6 Low-level input voltage VI Input voltage VO Output voltage IOH High-level output current IOL Low-level output current ∆t/∆v Input transition rise or fall rate TA Operating free-air temperature (1) 4 V 0.65 × VCC VCC = 2.3 V to 2.7 V 1.7 VCC = 2.7 V to 3.6 V 2 V 0.35 × VCC VCC = 1.65 V to 1.95 V VIL UNIT VCC = 2.3 V to 2.7 V 0.7 VCC = 2.7 V to 3.6 V 0.8 V 0 VCC V 0 VCC V VCC = 1.65 V –4 VCC = 2.3 V –12 VCC = 2.7 V –12 VCC = 3 V –24 VCC = 1.65 V 4 VCC = 2.3 V 12 VCC = 2.7 V 12 VCC = 3 V 24 –40 mA mA 10 ns/V 85 °C All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. SN74ALVCH16245 16-BIT BUS TRANSCEIVER WITH 3-STATE OUTPUTS www.ti.com SCES015L – JULY 1995 – REVISED NOVEMBER 2005 Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS IOH = –100 µA 1.65 V to 3.6 V 1.65 V IOH = –6 mA 2.3 V 2 2.3 V 1.7 2.7 V 2.2 IOH = –12 mA II(hold) V 3V 2.4 3V 2 IOL = 100 µA 1.65 V to 3.6 V 0.2 IOL = 4 mA 1.65 V 0.45 IOL = 6 mA 2.3 V 0.4 2.3 V 0.7 2.7 V 0.4 3V 0.55 IOL = 24 mA II 1.2 IOH = –24 mA IOL = 12 mA UNIT VCC – 0.2 IOH = –4 mA VOH VOL MIN TYP (1) MAX VCC V ±5 VI = VCC or GND 3.6 V VI = 0.58 V 1.65 V 25 VI = 1.07 V 1.65 V –25 VI = 0.7 V 2.3 V 45 VI = 1.7 V 2.3 V –45 VI = 0.8 V 3V 75 VI = 2 V 3V –75 µA µA VI = 0 to 3.6 V (2) 3.6 V ±500 IOZ (3) VO = VCC or GND 3.6 V ±10 µA ICC VI = VCC or GND, IO = 0 3.6 V 40 µA ∆ICC One input at VCC – 0.6 V, Other inputs at VCC or GND 3 V to 3.6 V 750 µA Ci Control inputs VI = VCC or GND 3.3 V 4 pF Cio A or B ports VO = VCC or GND 3.3 V 8 pF (1) (2) (3) All typical values are at VCC = 3.3 V, TA = 25°C. This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to another. For I/O ports, the parameter IOZ includes the input leakage current. Switching Characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) PARAMETER tpd (1) VCC = 2.5 V ± 0.2 V VCC = 2.7 V VCC = 3.3 V ± 0.3 V MIN MAX MIN MAX MIN MAX FROM (INPUT) TO (OUTPUT) VCC = 1.8 V A or B B or A (1) 1 3.7 3.6 1 3 ns 1 5.7 5.4 1 4.4 ns 1 5.2 4.6 1 4.1 ns TYP ten OE A or B (1) tdis OE A or B (1) UNIT This information was not available at the time of publication. 5 SN74ALVCH16245 16-BIT BUS TRANSCEIVER WITH 3-STATE OUTPUTS www.ti.com SCES015L – JULY 1995 – REVISED NOVEMBER 2005 Operating Characteristics TA = 25°C PARAMETER Cpd (1) 6 Power dissipation capacitance Outputs enabled Outputs disabled TEST CONDITIONS CL = 50 pF, This information was not available at the time of publication. f = 10 MHz VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V TYP TYP TYP (1) 22 29 (1) 4 5 UNIT pF SN74ALVCH16245 16-BIT BUS TRANSCEIVER WITH 3-STATE OUTPUTS www.ti.com SCES015L – JULY 1995 – REVISED NOVEMBER 2005 PARAMETER MEASUREMENT INFORMATION VLOAD S1 RL From Output Under Test Open GND CL (see Note A) RL TEST S1 tpd tPLZ/tPZL tPHZ/tPZH Open VLOAD GND LOAD CIRCUIT INPUT VCC 1.8 V 2.5 V ± 0.2 V 2.7 V 3.3 V ± 0.3 V VI tr/tf VCC VCC 2.7 V 2.7 V ≤2 ns ≤2 ns ≤2.5 ns ≤2.5 ns VM VLOAD CL RL V∆ VCC/2 VCC/2 1.5 V 1.5 V 2 × VCC 2 × VCC 6V 6V 30 pF 30 pF 50 pF 50 pF 1 kΩ 500 Ω 500 Ω 500 Ω 0.15 V 0.15 V 0.3 V 0.3 V tw VI Timing Input VM VM VM 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VM VM 0V tPLH Output Control (low-level enabling) tPLZ VLOAD/2 VM tPZH VOH VM VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES VM 0V Output Waveform 1 S1 at VLOAD (see Note B) tPHL VM VI VM tPZL VI Input VOLTAGE WAVEFORMS PULSE DURATION th VI Data Input VM 0V 0V tsu Output VI VM Input Output Waveform 2 S1 at GND (see Note B) VOL + V∆ VOL tPHZ VOH VM VOH − V∆ 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms 7 PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing 74ALVCH16245DGGRG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ALVCH16245DGVRE4 ACTIVE TVSOP DGV 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ALVCH16245DGVRG4 ACTIVE TVSOP DGV 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ALVCH16245DLG4 ACTIVE SSOP DL 48 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ALVCH16245DLRG4 ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ALVCH16245GRDR ACTIVE BGA MI CROSTA R JUNI OR GRD 54 1000 SNPB Level-1-240C-UNLIM 74ALVCH16245ZQLR ACTIVE BGA MI CROSTA R JUNI OR ZQL 56 1000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM 74ALVCH16245ZRDR ACTIVE BGA MI CROSTA R JUNI OR ZRD 54 1000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM SN74ALVCH16245DGGR ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVCH16245DGVR ACTIVE TVSOP DGV 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVCH16245DL ACTIVE SSOP DL 48 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVCH16245DLR ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVCH16245KR NRND GQL 56 1000 SNPB Level-1-240C-UNLIM BGA MI CROSTA R JUNI OR Pins Package Eco Plan (2) Qty 25 25 TBD TBD Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2008 (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN74ALVCH16245 : • Enhanced Product: SN74ALVCH16245-EP NOTE: Qualified Version Definitions: • Enhanced Product - Supports Defense, Aerospace and Medical Applications Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 11-Aug-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 74ALVCH16245GRDR BGA MI CROSTA R JUNI OR GRD 54 1000 330.0 16.4 5.8 8.3 1.55 8.0 16.0 Q1 74ALVCH16245ZQLR BGA MI CROSTA R JUNI OR ZQL 56 1000 330.0 16.4 4.8 7.3 1.45 8.0 16.0 Q1 74ALVCH16245ZQLR BGA MI CROSTA R JUNI OR ZQL 56 1000 330.0 16.4 4.8 7.3 1.5 8.0 16.0 Q1 74ALVCH16245ZRDR BGA MI CROSTA R JUNI OR ZRD 54 1000 330.0 16.4 5.8 8.3 1.55 8.0 16.0 Q1 SN74ALVCH16245DGGR TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1 SN74ALVCH16245DGVR TVSOP DGV 48 2000 330.0 16.4 7.1 10.2 1.6 12.0 16.0 Q1 DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1 GQL 56 1000 330.0 16.4 4.8 7.3 1.45 8.0 16.0 Q1 SN74ALVCH16245DLR SN74ALVCH16245KR SSOP BGA MI CROSTA R JUNI Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Aug-2009 Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) 7.3 1.5 8.0 W Pin1 (mm) Quadrant OR SN74ALVCH16245KR BGA MI CROSTA R JUNI OR GQL 56 1000 330.0 16.4 4.8 16.0 Q1 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) 74ALVCH16245GRDR BGA MICROSTAR JUNIOR GRD 54 1000 346.0 346.0 33.0 74ALVCH16245ZQLR BGA MICROSTAR JUNIOR ZQL 56 1000 346.0 346.0 33.0 74ALVCH16245ZQLR BGA MICROSTAR JUNIOR ZQL 56 1000 333.2 345.9 28.6 74ALVCH16245ZRDR BGA MICROSTAR JUNIOR ZRD 54 1000 346.0 346.0 33.0 SN74ALVCH16245DGGR TSSOP DGG 48 2000 346.0 346.0 41.0 SN74ALVCH16245DGVR TVSOP DGV 48 2000 346.0 346.0 33.0 SN74ALVCH16245DLR SSOP DL 48 1000 346.0 346.0 49.0 SN74ALVCH16245KR BGA MICROSTAR JUNIOR GQL 56 1000 346.0 346.0 33.0 SN74ALVCH16245KR BGA MICROSTAR GQL 56 1000 333.2 345.9 28.6 Pack Materials-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 11-Aug-2009 Device Package Type Package Drawing Pins SPQ JUNIOR Pack Materials-Page 3 Length (mm) Width (mm) Height (mm) MECHANICAL DATA MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001 DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0.025 (0,635) 0.0135 (0,343) 0.008 (0,203) 48 0.005 (0,13) M 25 0.010 (0,25) 0.005 (0,13) 0.299 (7,59) 0.291 (7,39) 0.420 (10,67) 0.395 (10,03) Gage Plane 0.010 (0,25) 1 0°–ā8° 24 0.040 (1,02) A 0.020 (0,51) Seating Plane 0.110 (2,79) MAX 0.004 (0,10) 0.008 (0,20) MIN PINS ** 28 48 56 A MAX 0.380 (9,65) 0.630 (16,00) 0.730 (18,54) A MIN 0.370 (9,40) 0.620 (15,75) 0.720 (18,29) DIM 4040048 / E 12/01 NOTES: A. B. C. D. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). Falls within JEDEC MO-118 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS003D – JANUARY 1995 – REVISED JANUARY 1998 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,17 0,50 48 0,08 M 25 6,20 6,00 8,30 7,90 0,15 NOM Gage Plane 1 0,25 24 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 48 56 64 A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 DIM 4040078 / F 12/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0°–8° 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. 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