SN74AVC2T244 SCES767B – SEPTEMBER 2011 – REVISED SEPTEMBER 2011 www.ti.com 2-BIT UNDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR Check for Samples: SN74AVC2T244 FEATURES 1 • • • • • • • Wide Operating VCC Range of 0.9 V to 3.6 V Low Static-Power Consumption, 6-µA Max ICC Output Enable Feature Allows User to Disable Outputs to Reduce Power Consumption ±24-mA Output Drive at 3.0 V Ioff Supports Partial Power-Down-Mode Operation Input Hysteresis Allows Slow Input Transition and Better Switching Noise Immunity at Input Maximum Data Rates – 380 Mbps (1.8-V to 3.3-V Translation) – 200 Mbps (<1.8-V to 3.3-V Translation) – 200 Mbps (Translate to 2.5 V or 1.8 V) – 150 Mbps (Translate to 1.5 V) – 100 Mbps (Translate to 1.2 V) • • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 – 5000-V Human-Body Model (A114-A) APPLICATIONS • Handset, Smartphone, Tablet, Server DQE/DQM PACKAGE (TOP VIEW) VCCA A1 A2 OE 1 8 2 7 3 6 4 5 VCCB B1 B2 GND DESCRIPTION/ORDERING INFORMATION This 2-bit unidirectional translator uses two separate configurable power-supply rails. The A port is designed to track VCCA. VCCA accepts any supply voltage from 0.9 V to 3.6 V. The B port is designed to track VCCB. VCCB accepts any supply voltage from 0.9 V to 3.6 V. This allows for low-voltage translation between 0.9-V, 1.2-V, 1.5-V, 1.8-V, 2.5-V and 3.6-V voltage nodes. For the SN74AVC2T244, when the output-enable (OE) input is high, all outputs are placed in the high-impedance state. The SN74AVC2T244 is designed so that the OE input circuit is referenced to VCCA. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. ORDERING INFORMATION (1) TA –40°C to 85°C (1) (2) PACKAGE (2) ORDERABLE PART NUMBER TOP-SIDE MARKING DQE – MicroQFN SN74AVC2T244DQER VA DQM – MicroQFN SN74AVC2T244DQMR VAH For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2011, Texas Instruments Incorporated SN74AVC2T244 SCES767B – SEPTEMBER 2011 – REVISED SEPTEMBER 2011 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. DEVICE INFORMATION PIN DESCRIPTION PIN FUNCTION VCCA Input Port DC Power Supply VCCB Output Port DC Power Supply GND Ground An Input Port Bn Output Port OE Output Enable ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN MAX –0.5 4.6 V An –0.5 4.6 V V DC Supply voltage, VCCA VCCB DC Input voltage, VI OE –0.5 4.6 (Power Down) Bn –0.5 4.6 (Active Mode) Bn –0.5 4.6 3-State Mode Bn –0.5 Control Input, VC Voltage DC Output voltage, VO, VCCA = VCCB = 0 V 4.6 DC Input Diode current, IIK VI < GND –20 mA DC Output Diode current, IOK VO < GND –50 mA ±50 mA ±100 mA ±100 mA 150 °C DC Output Source/Sink current, IO DC Supply current per supply pin, ICCA, ICCB IGND DC Ground current per ground pin Tstg Storage temperature range (1) UNIT –65 Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS MIN MAX 0.9 3.6 V Bus input voltage GND 3.6 V VI Input voltage GND 3.6 V VC Control input VCCA, VCCB Positive DC Supply voltage VI OE GND 3.6 V (Power Down Mode) Bn GND 3.6 V (Active Mode) Bn GND VCCB V 3-State Mode Bn GND 3.6 V –40 85 °C 0 10 nS VO Bus output voltage TA Operating free-air temperature Δt/Δv Input transition rise or fall rate VI from 30% to 70% of VCC; VCC = 3.3 V ±0.3 V 2 UNIT Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): SN74AVC2T244 SN74AVC2T244 SCES767B – SEPTEMBER 2011 – REVISED SEPTEMBER 2011 www.ti.com ELECTRICAL CHARACTERISTICS (1) (2) over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS Input HIGH Voltage (An, OE) VIH Input LOW voltage (An, OE) VIL VCCA (V) VCCB (V) MIN MAX 2.7 – 3.6 2.0 – 2.3 – 2.7 1.6 – 1.4 – 2.3 0.65 × VCCA – 0.9 – 1.4 0.9 × VCCA – 2.7 – 3.6 – 0.8 2.3 – 2.7 – 0.7 – 0.35 × VCCA – 0.1 × VCCA 1.4 – 2.3 0.9 – 3.6 0.9 – 3.6 0.9 – 1.5 VOH Output HIGH voltage IOH = –100 µA; VI = VH 0.9 – 3.6 0.9 – 3.6 VCCB – 0.2 – IOH = –0.5 mA; VI = VH 0.9 0.9 0.75 × VCCB – IOH = –2 mA; VI = VH 1.4 1.4 1.05 – 1.65 1.65 1.25 – 2.3 2.3 2.0 – 2.3 2.3 1.8 – 2.7 2.7 2.2 – 2.3 2.3 1.7 – 3.0 3.0 2.4 – IOH = –24 mA; VI = VH 3.0 3.0 2.2 – IOH = 100 µA; VI = VH 0.9 – 3.6 0.9 – 3.6 – 0.2 IOH = 0.5 mA; VI = VH 1.1 1.1 – 0.3 IOH = 2 mA; VI = VH 1.4 1.4 – 0.35 IOH = 6 mA; VI = VH 1.65 1.65 – 0.3 2.3 2.3 – 0.4 2.7 2.7 – 0.4 2.3 2.3 – 0.6 3.0 3.0 – 0.4 3.0 3.0 – 0.55 0.9 – 3.6 0.9 – 3.6 –1.0 1.5 IOH = –6 mA; VI = VH IOH = –12 mA; VI = VH IOH = –18 mA; VI = VH VOL Output LOW voltage –40°C to 85°C IOH = 12 mA; VI = VH IOH = 18 mA; VI = VH IOH = 24 mA; VI = VH II Input Leakage Current VI = VCCA or GND IOFF Power-Off Leakage Current OE = 0V ICCA Quiescent Supply Current ICCB UNIT V V V V μA 0 0.9 – 3.6 –1.0 1.3 0.9 – 3.6 0 –1.0 1.5 VI = VCCA or GND; IO = 0 0.9 – 3.6 0.9 – 3.6 – 3.0 μA Quiescent Supply Current VI = VCCA or GND; IO = 0 0.9 – 3.6 0.9 – 3.6 – 3.0 μA ICCA + ICCB Quiescent Supply Current VI = VCCA or GND; IO = 0 0.9 – 3.6 0.9 – 3.6 – 6.0 μA ΔICCA Increase in ICC per Input Voltage, Other inputs at VCCA or GND VI = VCCA – 0.3 V; VI = VCCA or GND 3.6 3.6 – 5.0 μA (1) (2) μA VCCO is the VCC associated with the output port. VCCI is the VCC associated with the input port. Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): SN74AVC2T244 3 SN74AVC2T244 SCES767B – SEPTEMBER 2011 – REVISED SEPTEMBER 2011 www.ti.com ELECTRICAL CHARACTERISTICS(1) (2) (continued) over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS ΔICCB Increase in ICC per Input Voltage, Other inputs at VCCA or GND VI = VCCA – 0.3 V; VI = VCCA or GND IOZ I/O Tri-State Output Leakage Current TA = 25°C, OE = 0 V 4 VCCA (V) VCCB (V) 3.6 3.6 0.9 – 3.6 0.9 – 3.6 Submit Documentation Feedback –40°C to 85°C UNIT MIN MAX – 5.0 μA –1.0 1.0 μA Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): SN74AVC2T244 SN74AVC2T244 SCES767B – SEPTEMBER 2011 – REVISED SEPTEMBER 2011 www.ti.com AC ELECTRICAL CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) Symbol tPLH, tPHL tPZH, tPZL tPHZ, tPLZ tOSHL, tOSLH Parameter Propagation Delay, An to Bn Output Enable, OE to Bn Output Disable, OE to Bn Output to Output Skew, Time VCCA (V) VCCB (V) MIN MAX 0.9 – 3.6 0.9 – 3.6 1.2 – 3.6 1.2 – 3.6 7 1.8 – 3.6 1.8 – 3.6 3.5 0.9 – 3.6 0.9 – 3.6 23 1.2 – 3.6 1.2 – 3.6 6.5 1.8 – 3.6 1.8 – 3.6 4.1 0.9 – 3.6 0.9 – 3.6 17 1.2 – 3.6 1.2 – 3.6 7 1.8 – 3.6 1.8 – 3.6 4.3 0.9 – 3.6 0.9 – 3.6 0.15 1.2 – 3.6 1.2 – 3.6 0.15 1.8 – 3.6 1.8 – 3.6 0.15 UNIT 20 nS nS nS nS Table 1. CAPACITANCE (1) Symbol (1) (2) Parameter Test Conditions TYP (2) Unit 3.5 pF CIN Control Pin Input Capacitance VCCA = VCCB = 3.3 V, VI = 0 V or VCCA/B CI/O I/O Pin Input capacitance VCCA = VCCB = 3.3 V, VI = 0 V or VCCA/B 5.0 pF CPD Power Dissipation Capacitance VCCA = VCCB = 3.3 V, VI = 0 V or VCCA/B, f = 10 MHz 33 pF CPD is defined as the value of the IC's equivalent capacitance from which the operating current can be calculated from: ICC(operating) ≈ CPD × VCC × fIN × NSW where ICC = ICCA + ICCB and NSW = total number of outputs switching. Typical values are at TA = +25°C. Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): SN74AVC2T244 5 PACKAGE OPTION ADDENDUM www.ti.com 30-Jan-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp SN74AVC2T244DQER ACTIVE X2SON DQE 8 5000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AVC2T244DQMR ACTIVE X2SON DQM 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (3) Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 13-Apr-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74AVC2T244DQER X2SON DQE 8 5000 180.0 8.4 1.17 1.67 0.73 4.0 8.0 Q1 SN74AVC2T244DQMR X2SON DQM 8 3000 180.0 8.4 1.57 2.21 0.59 4.0 8.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 13-Apr-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74AVC2T244DQER SN74AVC2T244DQMR X2SON DQE 8 5000 202.0 201.0 28.0 X2SON DQM 8 3000 202.0 201.0 28.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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