TI SN74CB3Q16244DGVR

www.ti.com
SN74CB3Q16244
16-BIT FET BUS SWITCH
2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCH
FEATURES
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
(1)
High-Bandwidth Data Path (up to 500 MHz (1))
5-V Tolerant I/Os With Device Powered Up or
Powered Down
Low and Flat ON-State Resistance (ron)
Characteristics Over Operating Range
(ron = 5 Ω Typ)
Rail-to-Rail Switching on Data I/O Ports
– 0- to 5-V Switching With 3.3-V VCC
– 0- to 3.3-V Switching With 2.5-V VCC
Bidirectional Data Flow With Near-Zero
Propagation Delay
Low Input/Output Capacitance Minimizes
Loading and Signal Distortion
(Cio(OFF) = 4 pF Typ)
Fast Switching Frequency (fOE = 20 MHz Max)
Data and Control Inputs Provide Undershoot
Clamp Diodes
Low Power Consumption (ICC = 1 mA Typ)
VCC Operating Range From 2.3 V to 3.6 V
Data I/Os Support 0- to 5-V Signaling Levels
(0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V)
Control Inputs Can Be Driven by TTL or
5-V/3.3-V CMOS Outputs
Ioff Supports Partial-Power-Down Mode
Operation
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Performance Tested Per JESD 22
– 2000-V Human-Body Model
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
Supports Both Digital and Analog
Applications: PCI Interface, Differential Signal
Interface, Memory Interleaving, Bus Isolation,
Low-Distortion Signal Gating
SCDS168 – MAY 2004 – REVISED MARCH 2005
DGG, DGV, OR DL PACKAGE
(TOP VIEW)
1OE
1B1
1B2
GND
1B3
1B4
VCC
2B1
2B2
GND
2B3
2B4
3B1
3B2
GND
3B3
3B4
VCC
4B1
4B2
GND
4B3
4B4
4OE
1
48
2
47
3
46
4
45
5
44
6
43
7
42
8
41
9
40
10
39
11
38
12
37
13
36
14
35
15
34
16
33
17
32
18
31
19
30
20
29
21
28
22
27
23
26
24
25
2OE
1A1
1A2
GND
1A3
1A4
VCC
2A1
2A2
GND
2A3
2A4
3A1
3A2
GND
3A3
3A4
VCC
4A1
4A2
GND
4A3
4A4
3OE
For additional information regarding the performance characteristics of the CB3Q family, refer to the TI application report,
CBT-C, CB3T, and CB3Q Signal-Switch Families, literature
number SCDA008.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004–2005, Texas Instruments Incorporated
SN74CB3Q16244
16-BIT FET BUS SWITCH
2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCH
www.ti.com
SCDS168 – MAY 2004 – REVISED MARCH 2005
DESCRIPTION/ORDERING INFORMATION
The SN74CB3Q16244 is a high-bandwidth FET bus switch utilizing a charge pump to elevate the gate voltage of
the pass transistor, providing a low and flat ON-state resistance (ron). The low and flat ON-state resistance allows
for minimal propagation delay and supports rail-to-rail switching on the data input/output (I/O) ports. The device
also features low data I/O capacitance to minimize capacitive loading and signal distortion on the data bus.
Specifically designed to support high-bandwidth applications, the SN74CB3Q16244 provides an optimized
interface solution ideally suited for broadband communications, networking, and data-intensive computing
systems.
The SN74CB3Q16244 is organized as four 4-bit bus switches with separate output-enable (1OE, 2OE, 3OE,
4OE) inputs. It can be used as four 4-bit bus switches, two 8-bit bus switches, or one 16-bit bus switch. When
OE is low, the associated 4-bit bus switch is ON, and the A port is connected to the B port, allowing bidirectional
data flow between ports. When OE is high, the associated 4-bit bus switch is OFF, and a high-impedance state
exists between the A and B ports.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry prevents damaging
current backflow through the device when it is powered down. The device has isolation during power off.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
ORDERING INFORMATION
PACKAGE (1)
TA
SSOP – DL
–40°C to 85°C
TSSOP – DGG
TVSOP – DGV
(1)
ORDERABLE PART NUMBER
Tube
SN74CB3Q16244DL
Tape and reel
SN74CB3Q16244DLR
Tube
SN74CB3Q16244DGG
Tape and reel
SN74CB3Q16244DGGR
Tape and reel
SN74CB3Q16244DGVR
CB3Q16244
CB3Q16244
BW244
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
FUNCTION TABLE
(EACH 4-BIT BUS SWITCH)
2
TOP-SIDE MARKING
INPUT
OE
INPUT/OUTPUT
A
FUNCTION
L
B
A port = B port
H
Z
Disconnect
SN74CB3Q16244
16-BIT FET BUS SWITCH
2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCH
www.ti.com
SCDS168 – MAY 2004 – REVISED MARCH 2005
LOGIC DIAGRAM (POSITIVE LOGIC)
47
1A1
2
SW
43
1A4
41
1B1
2A1
1B4
2A4
6
SW
37
1
2B1
12
2B4
SW
48
1OE
2OE
36
3A1
13
SW
30
3B1
4A1
3B4
4A4
17
32
3A4
3OE
8
SW
SW
19
23
26
25
4OE
4B1
SW
SW
4B4
24
SIMPLIFIED SCHEMATIC, EACH FET SWITCH (SW)
A
B
VCC
Charge
Pump
EN(1)
(1)
EN is the internal enable signal applied to the switch.
3
SN74CB3Q16244
16-BIT FET BUS SWITCH
2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCH
www.ti.com
SCDS168 – MAY 2004 – REVISED MARCH 2005
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage range (2)
–0.5
4.6
V
VIN
Control input voltage range (2) (3)
–0.5
7
V
VI/O
Switch I/O voltage
range (2) (3) (4)
IIK
Control input clamp current
VIN < 0
–50
mA
II/OK
I/O port clamp current
VI/O < 0
–50
mA
±64
mA
±100
mA
II/O
ON-state switch
–0.5
7
current (5)
Continuous current through VCC or GND
θJA
Tstg
(1)
(2)
(3)
(4)
(5)
(6)
Package thermal impedance (6)
DGG package
70
DGV package
58
DL package
63
Storage temperature range
–65
150
UNIT
V
°C/W
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to ground, unless otherwise specified.
The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
VI and VO are used to denote specific conditions for VI/O.
II and IO are used to denote specific conditions for II/O.
The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions (1)
VCC
VIH
High-level control input voltage
VIL
Low-level control input voltage
VI/O
Data input/output voltage
TA
Operating free-air temperature
(1)
4
MIN
MAX
2.3
3.6
VCC = 2.3 V to 2.7 V
1.7
5.5
VCC = 2.7 V to 3.6 V
2
5.5
VCC = 2.3 V to 2.7 V
0
0.7
VCC = 2.7 V to 3.6 V
0
0.8
0
5.5
V
–40
85
°C
Supply voltage
UNIT
V
V
V
All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
SN74CB3Q16244
16-BIT FET BUS SWITCH
2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCH
www.ti.com
SCDS168 – MAY 2004 – REVISED MARCH 2005
Electrical Characteristics
(1)
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
VIK
MIN TYP (2)
TEST CONDITIONS
VCC = 3.6 V,
II = –18 mA
VCC = 3.6 V,
VIN = 0 to 5.5 V
IOZ (3)
VCC = 3.6 V,
VO = 0 to 5.5 V,
VI = 0,
Switch OFF,
VIN = VCC or GND
Ioff
VCC = 0,
VO = 0 to 5.5 V,
VI = 0
ICC
VCC = 3.6 V,
II/O = 0,
Switch ON or OFF,
VIN = VCC or GND
Other inputs at VCC or GND
IIN
Control inputs
∆ICC
(4)
Control inputs
VCC = 3.6 V,
One input at 3 V,
ICCD (5)
Per control
input
VCC = 3.6 V,
A and B ports open,
Control input switching at 50% duty cycle
Cin
Control inputs
VCC = 3.3 V,
VIN = 5.5 V, 3.3 V, or 0
Cio(OFF)
VCC = 3.3 V,
Switch OFF,
VIN = VCC or GND,
Cio(ON)
VCC = 3.3 V,
VCC = 2.3 V,
TYP at VCC = 2.5 V
ron (6)
VCC = 3 V
(1)
(2)
(3)
(4)
(5)
(6)
MAX
UNIT
–1.8
V
±1
µA
±1
µA
1
µA
2
mA
1
30
µA
mA/
MHz
0.15
0.25
3.5
5
pF
VI/O = 5.5 V, 3.3 V, or 0
4
6
pF
Switch ON,
VIN = VCC or GND,
VI/O = 5.5 V, 3.3 V, or 0
10
13
pF
VI = 0,
IO = 30 mA
6
8
VI = 1.7 V,
IO = –15 mA
5
10
VI = 0,
IO = 30 mA
6
8
VI = 2.4 V,
IO = –15 mA
5
9
Ω
VIN and IIN refer to control inputs. VI, VO, II, and IO refer to data pins.
All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C.
For I/O ports, the parameter IOZ includes the input leakage current.
This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.
This parameter specifies the dynamic power-supply current associated with the operating frequency of a single control input
(see Figure 2).
Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance is
determined by the lower of the voltages of the two (A or B) terminals.
Switching Characteristics
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3)
(1)
(2)
VCC = 2.5 V
± 0.2 V
VCC = 3.3 V
± 0.3 V
FROM
(INPUT)
TO
(OUTPUT)
fOE (1)
OE
A or B
10
20
MHz
tpd (2)
A or B
B or A
0.18
0.3
ns
ten
OE
A or B
1.5
8
1.5
7
ns
tdis
OE
A or B
1
8
1
7
ns
PARAMETER
MIN
MAX
MIN
UNIT
MAX
Maximum switching frequency for control input (VO > VCC, VI = 5 V, RL ≥ 1 MΩ, CL = 0)
The propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified load
capacitance, when driven by an ideal voltage source (zero output impedance).
5
SN74CB3Q16244
16-BIT FET BUS SWITCH
2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCH
www.ti.com
SCDS168 – MAY 2004 – REVISED MARCH 2005
ron – ON-State Resistance – 16
VCC = 3.3 V
TA = 25°C
IO = −15 mA
14
12
10
8
6
4
2
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
VI − V
Figure 1. Typical ron vs VI
12
VCC = 3.3 V
TA = 25°C
A and B Ports Open
10
ICC − mA
8
6
4
One OE Switching
2
0
0
2
4
6
8
10
12
14
OE Switching Frequency − MHz
Figure 2. Typical ICC vs OE Switching Frequency
6
16
18
20
SN74CB3Q16244
16-BIT FET BUS SWITCH
2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCH
www.ti.com
SCDS168 – MAY 2004 – REVISED MARCH 2005
PARAMETER MEASUREMENT INFORMATION
VCC
Input Generator
VIN
50 Ω
50 Ω
VG1
TEST CIRCUIT
DUT
2 × VCC
Input Generator
S1
RL
VO
VI
50 Ω
50 Ω
VG2
CL
(see Note A)
RL
TEST
VCC
S1
RL
VI
CL
tpd(s)
2.5 V ± 0.2 V
3.3 V ± 0.3 V
Open
Open
500 Ω
500 Ω
VCC or GND
VCC or GND
30 pF
50 pF
tPLZ/tPZL
2.5 V ± 0.2 V
3.3 V ± 0.3 V
2 × VCC
2 × VCC
500 Ω
500 Ω
GND
GND
30 pF
50 pF
0.15 V
0.3 V
tPHZ/tPZH
2.5 V ± 0.2 V
3.3 V ± 0.3 V
GND
GND
500 Ω
500 Ω
VCC
VCC
30 pF
50 pF
0.15 V
0.3 V
V∆
VCC
Output
Control
(VIN)
VCC/2
VCC
VCC/2
VCC/2
0V
tPLH
VOH
Output
VCC/2
VCC/2
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES (tpd(s))
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
tPLZ
VCC
VCC/2
VOL + V∆
VOL
tPZH
tPHL
VCC/2
0V
tPZL
Output
Control
(VIN)
Open
GND
Output
Waveform 2
S1 at GND
(see Note B)
tPHZ
VOH
VCC/2
VOH − V∆
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd(s). The tpd propagation delay is the calculated RC time constant of the typical ON-state resistance
of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance).
H. All parameters and waveforms are not applicable to all devices.
Figure 3. Test Circuit and Voltage Waveforms
7
PACKAGE OPTION ADDENDUM
www.ti.com
30-Mar-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74CB3Q16244DGG
PREVIEW
TSSOP
DGG
48
40
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
SN74CB3Q16244DGGR
ACTIVE
TSSOP
DGG
48
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
SN74CB3Q16244DGVR
ACTIVE
TVSOP
DGV
48
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
SN74CB3Q16244DL
ACTIVE
SSOP
DL
48
25
TBD
CU NIPDAU
Level-1-235C-UNLIM
SN74CB3Q16244DLR
ACTIVE
SSOP
DL
48
1000
TBD
CU NIPDAU
Level-1-235C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
DL (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0.025 (0,635)
0.0135 (0,343)
0.008 (0,203)
48
0.005 (0,13) M
25
0.010 (0,25)
0.005 (0,13)
0.299 (7,59)
0.291 (7,39)
0.420 (10,67)
0.395 (10,03)
Gage Plane
0.010 (0,25)
1
0°–ā8°
24
0.040 (1,02)
A
0.020 (0,51)
Seating Plane
0.110 (2,79) MAX
0.004 (0,10)
0.008 (0,20) MIN
PINS **
28
48
56
A MAX
0.380
(9,65)
0.630
(16,00)
0.730
(18,54)
A MIN
0.370
(9,40)
0.620
(15,75)
0.720
(18,29)
DIM
4040048 / E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
Falls within JEDEC MO-118
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
0,50
48
0,08 M
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
1
0,25
24
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
48
56
64
A MAX
12,60
14,10
17,10
A MIN
12,40
13,90
16,90
DIM
4040078 / F 12/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address:
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright  2005, Texas Instruments Incorporated