SN74LVC07A-Q1 HEX BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS www.ti.com SCAS783C – OCTOBER 2004 – REVISED DECEMBER 2007 FEATURES 1 • • • • D OR PW PACKAGE (TOP VIEW) Qualified for Automotive Applications Operates From 1.65 V to 3.6 V Inputs and Open-Drain Outputs Accept Voltages up to 5.5 V Latch-Up Performance Exceeds 250 mA Per JESD 17 DESCRIPTION/ORDERING INFORMATION This hex buffer/driver is designed for 1.65-V to 3.6-V VCC operation. The outputs of the SN74LVC07A device are open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 24 mA. Inputs can be driven from 1.8-V, 2.5-V, 3.3-V (LVTTL), or 5-V (CMOS) devices. This feature allows the use of this device as a translator in a mixed-system environment. ORDERING INFORMATION (1) PACKAGE (2) TA –40°C to 125°C (1) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING SOIC – D Reel of 2500 SN74LVC07AQDRQ1 LVC07AQ TSSOP – PW Reel of 2000 SN74LVC07AQPWRQ1 LVC07AQ For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. FUNCTION TABLE (EACH BUFFER/DRIVER) INPUT A OUTPUT Y H H L L LOGIC DIAGRAM, EACH BUFFER/DRIVER (POSITIVE LOGIC) A Y 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2004–2007, Texas Instruments Incorporated SN74LVC07A-Q1 HEX BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS www.ti.com SCAS783C – OCTOBER 2004 – REVISED DECEMBER 2007 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range –0.5 6.5 V VI Input voltage range (2) –0.5 6.5 V VO Output voltage range 6.5 V IIK Input clamp current VI < 0 –50 mA IOK Output clamp current VO < 0 –50 mA IO Continuous output current ±50 mA ±100 mA –0.5 Continuous current through VCC or GND θJA Package thermal impedance (3) Tstg Storage temperature range (1) (2) (3) D package 86 PW package 113 –65 150 UNIT °C/W °C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. The package thermal impedance is calculated in accordance with JESD 51-7. Recommended Operating Conditions (1) VCC Supply voltage VCC = 1.65 V to 1.95 V VIH High-level input voltage MIN MAX 1.65 3.6 UNIT V 0.65 × VCC VCC = 2.3 V to 2.7 V 1.7 VCC = 2.7 V to 3.6 V 2 V 0.35 × VCC VCC = 1.65 V to 1.95 V VIL Low-level input voltage VCC = 2.3 V to 2.7 V 0.7 VI Input voltage 0 5.5 V VO Output voltage 0 5.5 V VCC = 2.7 V to 3.6 V IOL Low-level output current TA Operating free-air temperature 0.8 VCC = 1.65 V 4 VCC = 2.3 V 12 VCC = 2.7 V 12 VCC = 3 V (1) 2 V mA 24 –40 125 °C All unused inputs of the device must be held at VCC or GND to ensure proper device operation. See the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. Submit Documentation Feedback Copyright © 2004–2007, Texas Instruments Incorporated Product Folder Link(s): SN74LVC07A-Q1 SN74LVC07A-Q1 HEX BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS www.ti.com SCAS783C – OCTOBER 2004 – REVISED DECEMBER 2007 Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS IOL = 100 µA 0.2 1.65 V 0.45 2.3 V 0.7 2.7 V 0.4 3V 0.65 IOL = 12 mA IOL = 24 mA II ICC ΔICC Ci (1) MAX 1.65 V to 3.6 V IOL = 4 mA VOL MIN TYP (1) VCC UNIT V VI = 5.5 V or GND 3.6 V ±5 µA VI = VCC or GND, IO = 0 3.6 V 10 µA 2.7 V to 3.6 V 500 µA One input at VCC – 0.6 V, Other inputs at VCC or GND VI = VCC or GND 3.3 V 5 pF All typical values are at VCC = 3.3 V, TA = 25°C. Switching Characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1 through Figure 3) PARAMETER tpd FROM (INPUT) TO (OUTPUT) A Y VCC = 1.8 V ± 0.15 V VCC = 2.5 V ± 0.2 V MIN MAX MIN MAX 1 3.5 1 2.8 VCC = 3.3 V ± 0.3 V VCC = 2.7 V MIN MAX MIN MAX 3 1 2.9 UNIT ns Operating Characteristics TA = 25°C PARAMETER Cpd Power dissipation capacitance per buffer/driver TEST CONDITIONS VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V TYP TYP TYP f = 10 MHz 1.8 2 2.5 Submit Documentation Feedback Copyright © 2004–2007, Texas Instruments Incorporated Product Folder Link(s): SN74LVC07A-Q1 UNIT pF 3 SN74LVC07A-Q1 HEX BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS www.ti.com SCAS783C – OCTOBER 2004 – REVISED DECEMBER 2007 PARAMETER MEASUREMENT INFORMATION VCC = 1.8 V ± 0.15 V 2 × VCC S1 1 kΩ From Output Under Test Open TEST S1 tPZL (see Note F) 2 × VCC tPLZ (see Note G) 2 × VCC tPHZ/tPZH 2 × VCC GND CL = 30 pF (see Note A) 1 kΩ LOAD CIRCUIT tw VCC Timing Input VCC/2 VCC/2 VCC/2 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VCC/2 VCC/2 0V tPLH Output Control (low-level enabling) tPLZ VCC VCC/2 tPZH VCC VCC/2 VOL Output Waveform 2 S1 at 2 × VCC (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES VCC/2 0V Output Waveform 1 S1 at 2 × VCC (see Note B) tPHL VCC/2 VCC VCC/2 tPZL VCC Input VOLTAGE WAVEFORMS PULSE DURATION th VCC Data Input VCC/2 0V 0V tsu Output VCC VCC/2 Input VOL + 0.15 V VOL tPHZ VCC/2 VCC VCC − 0.15 V 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2 ns, tf ≤ 2 ns. D. The outputs are measured one at a time, with one transition per measurement. E. Since this device has open-drain outputs, tPLZ and tPZL are the same as tpd. F. tPZL is measured at VCC/2. G. tPLZ is measured at VOL + 0.15 V. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms 4 Submit Documentation Feedback Copyright © 2004–2007, Texas Instruments Incorporated Product Folder Link(s): SN74LVC07A-Q1 SN74LVC07A-Q1 HEX BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS www.ti.com SCAS783C – OCTOBER 2004 – REVISED DECEMBER 2007 PARAMETER MEASUREMENT INFORMATION VCC = 2.5 V ± 0.2 V 2 × VCC S1 500 Ω From Output Under Test Open TEST S1 tPZL (see Note F) 2 × VCC tPLZ (see Note G) 2 × VCC tPHZ/tPZH 2 × VCC GND CL = 30 pF (see Note A) 500 Ω LOAD CIRCUIT tw VCC Timing Input VCC/2 VCC/2 VCC/2 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VCC/2 VCC/2 0V tPLH Output Control (low-level enabling) tPLZ VCC VCC/2 tPZH VCC VCC/2 VOL VOL + 0.15 V VOL tPHZ Output Waveform 2 S1 at 2 × VCC (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES VCC/2 0V Output Waveform 1 S1 at 2 × VCC (see Note B) tPHL VCC/2 VCC VCC/2 tPZL VCC Input VOLTAGE WAVEFORMS PULSE DURATION th VCC Data Input VCC/2 0V 0V tsu Output VCC VCC/2 Input VCC/2 VCC VCC − 0.15 V 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2 ns, tf ≤ 2 ns. D. The outputs are measured one at a time, with one transition per measurement. E. Since this device has open-drain outputs, tPLZ and tPZL are the same as tpd. F. tPZL is measured at VCC/2. G. tPLZ is measured at VOL + 0.15 V. H. All parameters and waveforms are not applicable to all devices. Figure 2. Load Circuit and Voltage Waveforms Submit Documentation Feedback Copyright © 2004–2007, Texas Instruments Incorporated Product Folder Link(s): SN74LVC07A-Q1 5 SN74LVC07A-Q1 HEX BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS www.ti.com SCAS783C – OCTOBER 2004 – REVISED DECEMBER 2007 PARAMETER MEASUREMENT INFORMATION VCC = 2.7 and 3.3 V ± 0.3 V 6V S1 500 Ω From Output Under Test Open GND CL = 50 pF (see Note A) 500 Ω TEST S1 tPZL (see Note F) 6V tPLZ (see Note G) 6V tPHZ/tPZH 6V LOAD CIRCUIT tw 2.7 V 2.7 V Timing Input 0V 0V 2.7 V 1.5 V 1.5 V 0V 1.5 V 1.5 V 0V tPLH Output Control (low-level enabling) tPLZ 3V 1.5 V tPZH 3V 1.5 V VOL 1.5 V 0V Output Waveform 1 S1 at 6 V (see Note B) tPHL 1.5 V 2.7 V 1.5 V tPZL 2.7 V Output VOLTAGE WAVEFORMS PULSE DURATION th VOLTAGE WAVEFORMS SETUP AND HOLD TIMES Input 1.5 V 1.5 V tsu Data Input 1.5 V Input Output Waveform 2 S1 at 6 V (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES VOL + 0.3 V VOL tPHZ 3V 1.5 V 2.7 V 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time, with one transition per measurement. E. Since this device has open-drain outputs, tPLZ and tPZL are the same as tpd. F. tPZL is measured at 1.5 V. G. tPLZ is measured at VOL + 0.3 V. H. All parameters and waveforms are not applicable to all devices. Figure 3. Load Circuit and Voltage Waveforms 6 Submit Documentation Feedback Copyright © 2004–2007, Texas Instruments Incorporated Product Folder Link(s): SN74LVC07A-Q1 PACKAGE OPTION ADDENDUM www.ti.com 3-Dec-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing SN74LVC07AQPWRQ1 ACTIVE TSSOP PW Pins Package Eco Plan (2) Qty 14 2000 Pb-Free (RoHS) Lead/Ball Finish CU NIPDAU MSL Peak Temp (3) Level-1-250C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID RF/IF and ZigBee® Solutions amplifier.ti.com dataconverter.ti.com dsp.ti.com www.ti.com/clocks interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti-rfid.com www.ti.com/lprf Applications Audio Automotive Broadband Digital Control Medical Military Optical Networking Security Telephony Video & Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/medical www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2008, Texas Instruments Incorporated