LITTELFUSE SP3003

SPA™ Silicon Protection Array Products
Low Capacitance ESD Protection Array
HF
Pb
RoHS
GREEN
SP3003 Lead-Free/Green Series
Description
The SP3003 has ultra low capacitance rail-to-rail diodes
with an additional zener diode fabricated in a proprietary
silicon avalanche technology to protect each I/O pin
providing a high level of protection for electronic equipment
that may experience destructive electrostatic discharges
(ESD). These robust diodes can safely absorb repetitive
ESD strikes at the maximum level specified in the IEC
61000-4-2 international standard (Level 4, ±8kV contact
discharge) without performance degradation. Their very low
loading capacitance also makes them ideal for protecting
high speed signal pins such as HDMI, DVI, USB2.0, and
IEEE 1394.
Pinout
Features
NC
SP3003-04X/J
I/O 1
GND
I/O 2
VCC
I/O 1
I/O 4
GND
VCC
I/O 2
I/O 3
SP3003-04A
I/O 1
NC
I/O 2
NC
I/O 3
NC
I/O 4
NC
t-PXMFBLBHFDVSSFOUPG
0.5μA (MAX) at 5V
t&4%QSPUFDUJPOPGœL7
contact discharge,
±15kV air discharge,
(IEC61000-4-2)
t4NBMMQBDLBHFTTBWF
board space (SC70,
SOT553, SOT563,
MSOP10)
t&'5QSPUFDUJPO
IEC61000-4-4, 40A
(5/50ns)
t-JHIUOJOH1SPUFDUJPO
IEC61000-4-5, 2.5A
(8/20μs)
Applications
GND
VCC
t-PXDBQBDJUBODFPG
0.65pF (TYP) per I/O
t $PNQVUFS1FSJQIFSBMT
t/FUXPSL)BSEXBSF1PSUT
t.PCJMF1IPOFT
t5FTU&RVJQNFOU
t1%"T
t.FEJDBM&RVJQNFOU
t%JHJUBM$BNFSBT
Functional Block Diagram
SP3003-02
SP3003-04
VCC
I/O1
I/O2
VCC
I/O4
I/O2
GND
I/O1
GND
I/O3
-JGF4VQQPSU/PUF
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
65
Revised: August 19, 2010
SP3003 Lead-Free/Green Series
Lead-Free/Green SP3003
SP3003-02X/J
SPA™ Silicon Protection Array Products
Low Capacitance ESD Protection Array
Absolute Maximum Ratings
Symbol
Parameter
Value
Units
2.5
A
Operating Temperature
-40 to 85
°C
Storage Temperature
-50 to 150
°C
IPP
Peak Current (tp=8/20μs)
TOP
TSTOR
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of
the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Thermal Information
Parameter
Rating
Units
-65 to 150
°C
Maximum Junction Temperature
150
°C
Maximum Lead Temperature (Soldering 10s)
260
°C
Storage Temperature Range
Electrical Characteristics (TOP=25ºC)
Parameter
Symbol
Test Conditions
Reverse Standoff Voltage
VRWM
IR ≤ 1μA
6
V
Reverse Leakage Current
ILEAK
VR=5V
0.5
μA
Clamp Voltage1
VC
ESD Withstand Voltage1
Diode Capacitance1
1
Diode Capacitance
VESD
C*0(/%
Min
Typ
Max
Units
IPP=1A, tp=8/20μs, Fwd
10.0
12.0
V
IPP=2A, tp=8/20μs, Fwd
11.8
15.0
V
IEC61000-4-2 (Contact)
±8
kV
IEC61000-4-2 (Air)
±15
kV
Reverse Bias=0V
0.7
0.8
0.95
pF
Reverse Bias=1.65V
0.55
0.65
0.8
pF
CI/O-I/O
Reverse Bias=0V
0.35
pF
/PUF1BSBNFUFSJTHVBSBOUFFECZEFTJHOBOEPSEFWJDFDIBSBDUFSJ[BUJPO
SP3003 Lead-Free/Green Series
66
Revised: August 19, 2010
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
SPA™ Silicon Protection Array Products
Low Capacitance ESD Protection Array
Insertion Loss (S21) I/O to GND
Capacitance vs. Bias Voltage
1.00
1
0
0.95
0.90
-2
I/O Capacitance (pF)
Insertion Loss [dB]
-1
-3
-4
-5
-6
-7
0.85
0.80
VCC = Float
0.75
0.70
VCC = 3.3V
0.65
VCC = 5V
0.60
-8
0.55
-9
0.50
-10
1.E+06
1.E+07
1.E+08
1.E+09
0.0
1.E+10
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
I/O DC Bias (V)
Frequency [Hz]
Capacitance vs. Frequency
1.4E-12
Capacitance [F]
1.2E-12
1E-12
8E-13
6E-13
4E-13
Lead-Free/Green SP3003
2E-13
0
1.E+06
1.E+07
1.E+08
1.E+09
Frequency [Hz]
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
67
Revised: August 19, 2010
SP3003 Lead-Free/Green Series
SPA™ Silicon Protection Array Products
Low Capacitance ESD Protection Array
Application Example
+5V
D2+
D2+
Gnd
D2-
D26
5
4
SP300x-04
1
2
3
D1+
D1+
Gnd
D1HDMI
or DVI
Connector
D1HDMI
or DVI
Interface
IC
D0+
D0+
Gnd
D0-
D06
5
4
SP300x-04
1
2
3
Clk+
Clk+
Gnd
Clk-
ClkGnd
ASIC HDMI/DVI drivers can also be protected with the
SP300x-04, the +VCC pins on the SP300x-04 can be
substituted with a suitable bypass capacitor or in some
backdrive applications the +VCC of the SP300x-04 can be
nPBUFEPS/$
HDMI or DVI application example for the Littelfuse
SP300x-04 protection devices. A single 4 channel
SP300x-04 device can be used to protect four of the data
lines in a HDMI/DVI interface. Two (2) SP300x-04 devices
provide protection for the main data lines. Low voltage
Soldering Parameters
Reflow Condition
Pre Heat
Pb – Free assembly
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus) Temp
(TL) to peak
3°C/second max
TS(max) to TL - Ramp-up Rate
3°C/second max
Reflow
- Temperature (TL) (Liquidus)
217°C
- Temperature (tL)
60 – 150 seconds
Peak Temperature (TP)
250+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (TP)
8 minutes Max.
Do not exceed
260°C
SP3003 Lead-Free/Green Series
68
Revised: August 19, 2010
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
SPA™ Silicon Protection Array Products
Low Capacitance ESD Protection Array
Package Dimensions — SC70-5
e
e
6
5
Package
Solder Pad Layout
4
not used
E
HE
SC70-5
Pins
5
JEDEC
MO-203 Issue A
Millimeters
3
2
1
Min
B
D
A2 A
A1
C
Min
Max
A
0.80
1.10
0.031
0.043
A1
0.00
0.10
0.000
0.004
A2
0.70
1.00
0.028
0.039
B
0.15
0.30
0.006
0.012
c
0.08
0.25
0.003
0.010
D
1.85
2.25
0.073
0.089
E
1.15
1.35
0.045
0.053
e
L
Inches
Max
0.65 BSC
0.026 BSC
HE
2.00
2.40
0.079
0.094
L
0.26
0.46
0.010
0.018
Package Dimensions — SC70-6
6
5
Package
SC70-6
Pins
6
Solder Pad Layout
4
JEDEC
E
2
1
HE
MO-203 Issue A
Millimeters
B
D
A2 A
A1
C
Max
Min
Max
A
0.80
1.10
0.031
0.043
A1
0.00
0.10
0.000
0.004
A2
0.70
1.00
0.028
0.039
B
0.15
0.30
0.006
0.012
c
0.08
0.25
0.003
0.010
D
1.85
2.25
0.073
0.089
E
1.15
1.35
0.045
0.053
e
L
Inches
Min
3
0.65 BSC
0.026 BSC
HE
2.00
2.40
0.079
0.094
L
0.26
0.46
0.010
0.018
Package Dimensions — SOT553
6
L
5
4
(not used)
2
Package
A
D
E
HE
Solder Pad Layout
c
B
Min
Max
Min
Max
0.60
0.020
0.024
B
0.17
0.27
0.007
0.011
c
0.08
0.18
0.003
0.007
D
1.50
1.70
0.059
0.067
E
1.10
1.30
0.043
0.051
e
©2010 Littelfuse, Inc.
69
Revised: August 19, 2010
Inches
0.50
A
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
5
Millimeters
3
e
SOT 553
Pins
0.50 BSC
0.020 BSC
L
0.10
0.30
0.004
0.012
HE
1.50
1.70
0.059
0.067
SP3003 Lead-Free/Green Series
Lead-Free/Green SP3003
e
e
SPA™ Silicon Protection Array Products
Low Capacitance ESD Protection Array
Package Dimensions — SOT563
A
D
6
5
2
4
E
Package
L
e
6
Millimeters
Solder Pad Layout
HE
3
SOT 563
Pins
c
B
Inches
Min
Max
Min
Max
A
0.50
B
0.17
0.60
0.020
0.024
0.27
0.007
c
0.011
0.08
0.18
0.003
0.007
D
1.50
1.70
0.059
0.067
E
1.10
1.30
0.043
0.051
0.50 BSC
e
0.020 BSC
L
0.10
0.30
0.004
0.012
HE
1.50
1.70
0.059
0.067
Package Dimensions — MSOP10
Package
MSOP10
Pins
10
Millimeters
Solder Pad Layout
Max
Min
Max
A
-
1.10
-
0.043
A1
0.00
0.15
0.000
0.006
B
0.17
0.27
0.007
0.011
c
0.08
0.23
0.003
0.009
D
2.90
3.10
0.114
0.122
E
4.67
5.10
0.184
0.200
E1
2.90
3.10
0.114
0.122
0.50 BSC
e
HE
Part Numbering System
0.40
SP3003-04 X T G
0.016
0.031
Lead Plating
Matte Tin (SC70-x, MSOP-10),
Pre-Plated Frame (SOT5x3)
Lead Material
Copper Alloy
Lead Coplanarity
0.0004 inches (0.102mm)
Subsitute Material
Silicon
Body Material
Molded Epoxy
Flammability
UL94-V-0
G= Green
T= Tape & Reel
Package
A = MSOP-10, 3000 quantity
J = SC70-5 or SC70-6, 3000 quantity
-02 = 2 channel
X = SOT553 or SOT563, 5000 quantity
(SC70-5, SOT553 packages)
-04 = 4 channel
(SC70-6, SOT563, MSOP-10 packages)
Number of Channels
0.80
0.020 BSC
Product Characteristics
Silicon
Protection
Array
Series
Inches
Min
Part Marking System
1. All dimensions are in millimeters
XXX
XXX
Product Series
(varies) F, H or P =
SP3003 series
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. All specifications comply to JEDEC SPEC MO-223 Issue A
Number of Channels
(varies) 2 or 4
5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
Assembly Site
6. Package surface matte finish VDI 11-13.
(varies)
SP3003 Lead-Free/Green Series
70
Revised: August 19, 2010
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
SPA™ Silicon Protection Array Products
Low Capacitance ESD Protection Array
Ordering Information
Part Number
Package
Marking
Min. Order Qty.
SP3003-02JTG
SC70-5
FX2
3000
SP3003-02XTG
SOT553
FX2
5000
SP3003-04ATG
MSOP-10
FX4
4000
SP3003-04JTG
SC70-6
FX4
3000
SP3003-04XTG
SOT563
FX4
5000
Embossed Carrier Tape & Reel Specifications - SC70-5 and SC70-6
Millimetres
Inches
Max
Min
Max
E
1.65
1.85
0.064
0.073
F
3.45
3.55
0.135
0.139
P2
1.95
2.05
0.077
0.081
D
1.40
1.60
0.055
0.063
D1
1.00
1.25
0.039
0.049
P0
3.90
4.10
0.154
0.161
10P0
40.0+/- 0.20
1.574+/-0.008
W
7.70
8.10
0.303
0.318
P
3.90
4.10
0.153
0.161
A0
2.14
2.34
0.084
0.092
B0
2.24
2.44
0.088
0.960
K0
1.12
1.32
0.044
0.052
t
0.27 max
0.010 max
Millimetres
Inches
Embossed Carrier Tape & Reel Specifications - SOT553 and SOT563
Min
Max
Min
Max
E
1.65
1.85
0.064
0.073
F
3.45
3.55
0.135
0.139
P2
1.95
2.05
0.076
0.081
D
1.40
1.60
0.055
0.063
D1
0.45
0.55
0.017
0.021
P0
3.90
4.10
0.154
0.161
10P0
©2010 Littelfuse, Inc.
1.574+/-0.008
W
7.70
8.10
P
3.90
4.10
0.153
0.161
A0
1.73
1.83
0.068
0.072
0.303
0.318
B0
1.73
1.83
0.068
0.072
K0
0.64
0.74
0.025
0.029
t
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
40.0+/- 0.20
71
Revised: August 19, 2010
0.22 max
0.009 max
SP3003 Lead-Free/Green Series
Lead-Free/Green SP3003
Min
SPA™ Silicon Protection Array Products
Low Capacitance ESD Protection Array
Embossed Carrier Tape & Reel Specification - MSOP-10
Millimetres
Min
Max
Min
Max
E
1.65
1.85
0.065
0.073
F
5.40
5.60
0.213
0.220
D
1.50
1.60
0.059
0.063
4.10
0.154
D1
P0
10P0
1.50 Min
3.90
0.059 Min
40.0+/- 0.20
0.161
1.574+/-0.008
W
11.90
12.10
0.469
0.476
P
7.90
8.10
0.311
0.319
A0
5.20
5.40
0.205
0.213
B0
3.20
3.40
0.126
0.134
K0
1.20
1.40
0.047
0.055
t
SP3003 Lead-Free/Green Series
Inches
72
Revised: August 19, 2010
0.30 +/- 0.05
0.012+/- 0.002
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.