® SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers FEATURES ■ Meets true EIA/TIA-232-F Standards from a +3.0V to +5.5V power supply ■ Interoperable with RS-232 down to +2.7V power source ■ 1µA Low-Power Shutdown with Receivers Active (SP3222EH) ■ Enhanced ESD Specifications: +15kV Human Body Model +15kV IEC1000-4-2 Air Discharge +8kV IEC1000-4-2 Contact Discharge ■ 460Kbps Minimum Transmission Rate ■ Ideal for Handheld, Battery Operated Applications 16 VCC C1+ 1 V+ 2 15 GND C1- 3 C2+ 4 C2- 5 12 R1OUT V- 6 11 T1IN T2OUT 7 10 R2IN 8 9 14 T1OUT SP3232EH 13 R1IN T2IN R2OUT Now Available in Lead Free Packaging DESCRIPTION The SP3222EH and the 3232EH are 2 driver/2 receiver RS-232 transceiver solutions intended for portable or hand-held applications such as notebook or palmtop computers. Their data transmission rate of 460Kbps meeting the demands of high speed RS-232 applications. Both ICS have a high-efficiency, charge-pump power supply that requires only 0.1µF capacitors for 3.3V operation. The charge pump allows the SP3222EH and the 3232EH series to deliver true RS-232 performance from a single power supply ranging from +3.3V to +5.0V. The ESD tolerance of the SP3222EH/3232EH devices exceeds +15kV for both Human Body Model and IEC1000-4-2 Air discharge test methods. The SP3222EH device has a low-power shutdown mode where the devices' driver outputs and charge pumps are disabled. During shutdown, the supply current is less than 1µA. SELECTION TABLE MODEL Power Supplies RS-232 Drivers RS-232 Receivers External Components Shutdown TTL 3-State No. of Pins SP3222EH +3.0V to +5.5V 2 2 4 Yes Yes 18, 20 SP3232EH +3.0V to +5.5V 2 2 4 No No 16 Date: 06/22/04 SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers 1 © Copyright 2004 Sipex Corporation ABSOLUTE MAXIMUM RATINGS Input Voltages TxIN, EN .....................................................-0.3V to +6.0V RxIN.............................................................................±25V These are stress ratings only and functional operation of the device at these ratings or any other above those indicated in the operation sections of the specifications below is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability and cause permanent damage to the device. Output Voltages TxOUT.....................................................................±13.2V RxOUT..............................................-0.3V to (VCC + 0.3V) Short-Circuit Duration TxOUT...............................................................Continuous VCC................................................................-0.3V to +6.0V V+ (NOTE 1)................................................-0.3V to +7.0V V- (NOTE 1)................................................+0.3V to -7.0V V+ + |V-| (NOTE 1)...................................................+13V Storage Temperature.................................-65°C to +150°C Power Dissipation Per Package 20-pin SSOP (derate 9.25mW/oC above +70oC).......750mW 18-pin PDIP (derate 15.2mW/oC above +70oC)......1220mW 18-pin SOIC (derate 15.7mW/oC above +70oC)......1260mW 20-pin TSSOP (derate 11.1mW/oC above +70oC).....890mW 16-pin SSOP (derate 9.69mW/oC above +70oC).......775mW 16-pin PDIP (derate 14.3mW/oC above +70oC)......1150mW 16-pin Wide SOIC (derate 11.2mW/oC above +70oC)....900mW 16-pin TSSOP (derate 10.5mW/oC above +70oC).....850mW ICC (DC VCC or GND current).................................+100mA Electrostatic Discharge HBM ......................................................................15kV IEC1000-4-2-AirDischarge....................................15kV IEC1000-4-2 Direct Contact....................................8kV NOTE 1: V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V. ELECTRICAL CHARACTERISTICS Unless otherwise noted, the following specifications apply for VCC = +3.0V to +5.0V with TAMB = TMIN to TMAX PARAMETER MIN TYP MAX UNITS CONDITIONS Supply Current 0.3 1.0 mA no load, TAMB = +25°C, VCC = +3.3V, TxIN = VCC or GND Shutdown Supply Current 1.0 10 µA SHDN=GND, TAMB = +25°C, VCC=+3.3V, TxIN=VCC or GND DC CHARACTERISTICS LOGIC INPUTS AND RECEIVER OUTPUTS Input Logic Threshold LOW Input Logic Threshold HIGH 0.8 2.0 2.4 V TxIN, EN, SHDN, Note 2 V VCC=3.3V, Note 2 VCC=5.0V, Note 2 Input Leakage Current ±0.01 ±1.0 µA TxIN, EN, SHDN, TAMB = +25°C Output Leakage Current ±0.05 ±10 µA receivers disabled Output Voltage LOW V IOUT=1.6mA VCC-0.6 VCC-0.1 0.4 V IOUT=-1.0mA Output Voltage Swing ±5.0 ±5.4 V 3kΩ load to ground at all driver outputs, TAMB=+25°C Output Resistance 300 Ω VCC= V+ = V- = 0V, TOUT = ±2V Output Voltage HIGH DRIVER OUTPUTS Output Short-Circuit Current Output Leakage Current Date: 06/22/04 ±35 ±60 mA VOUT = 0V ±25 µA VOUT = ±12V, VCC = 0V or 3.0V+5.5V, drivers disabled SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers 2 © Copyright 2004 Sipex Corporation ELECTRICAL CHARACTERISTICS Unless otherwise noted, the following specifications apply for VCC = +3.0V to +5.0V with TAMB = TMIN to TMAX . PARAMETER MIN. TYP. MAX. UNITS +15 V CONDITIONS RECEIVER INPUTS Input Voltage Range -15 Input Threshold LOW 0.6 0.8 1.2 1.5 Input Threshold HIGH 1. 5 1.8 Input Hysteresis 0.3 Input Resistance 3 5 2.4 2.4 V VCC=3.3V VCC=5.0V V VCC=3.3V VCC=5.0V V 7 kΩ TIMING CHARACTERISTICS Maximum Data Rate 460 Kbps RL=3kΩ, CL=1000pF, one driver switching Driver Propagation Delay 1.0 1.0 µs µs tPHL, RL = 3KΩ, CL = 1000pF tPLH, RL = 3KΩ, CL = 1000pF Receiver Propagation Delay 0.3 0.3 µs tPHL, RxIN to RxOUT, CL=150pF tPLH, RxIN to RxOUT, CL=150pF Receiver Output Enable Time 200 ns Receiver Output Disable Time 200 ns Driver Skew 100 500 ns | tPHL - tPLH | Receiver Skew 200 1000 ns | tPHL - tPLH | Transition-Region Slew Rate 60 Date: 06/22/04 V/µs SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers 3 VCC = 3.3V, RL = 3KΩ, TAMB = 25oC, measurements taken from -3.0V to +3.0V or +3.0V to -3.0V © Copyright 2004 Sipex Corporation TYPICAL PERFORMANCE CHARACTERISTICS Unless otherwise noted, the following performance characteristics apply for VCC = +3.3V, 460Kbps data rates, all drivers loaded with 3kΩ, 0.1µF charge pump capacitors, and TAMB = +25°C. 14 12 4 10 Vout+ Vout- 2 Slew Rate [V/µs] Transmitter Output Voltage [V] 6 0 1000 500 0 2000 1500 -2 8 6 4 +Slew -Slew -4 2 -6 0 Load Capacitance [pF] 0 Figure 1. Transmitter Output Voltage VS. Load Capacitance for the SP3222EH and the SP3232EH 500 1000 1500 Load Capacitance [pF] 2000 2330 Figure 2. Slew Rate VS. Load Capacitance for the SP3222EH and the SP3232EH 40 460Kbps 120Kbps 20Kbps Supply Current (mA) 35 30 25 20 15 10 5 0 0 500 1000 1500 2000 2500 3000 Load Capacitance (pF) Figure 3. Supply Current VS. Load Capacitance when Transmitting Data for the SP3222EH and the SP3232EH Date: 06/22/04 SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers 4 © Copyright 2004 Sipex Corporation PIN DESCRIPTION PIN NUMBER NAME SP3222EH FUNCTION DIP/SO SSOP/TSSOP SP3232EH EN Receiver Enable. Apply logic LOW for normal operation. Apply Logic HIGH to disable the receiver outputs (high-Z state). 1 1 - C1+ Positive terminal of the voltage doubler charge-pump capacitor. 2 2 1 V+ +5.5V generated by the charge pump. 3 3 2 C1- Negative terminal of the voltage doubler charge-pump capacitor. 4 4 3 C2+ Positive terminal of the inverting charge-pump capacitor. 5 5 4 C2- Negative terminal of the inverting charge-pump capacitor. 6 6 5 V- -5.5V generated by the charge pump. 7 7 6 T1OUT RS-232 driver output. 15 17 14 T2OUT RS-232 driver output. 8 8 7 R1IN RS-232 receiver input. 14 16 13 R2IN RS-232 receiver input. 9 9 8 R1OUT TTL/CMOS receiver output. 13 15 12 R2OUT TTL/CMOS receiver output. 10 10 9 T1IN TTL/CMOS driver input. 12 13 11 T2IN TTL/CMOS driver input. 11 12 10 GND Ground. 16 18 15 17 19 16 18 20 - - 11, 14 - VCC SHDN NC +3.0V to +5.5V supply voltage Shutdown Control Input. Drive HIGH for normal device operation. Drive LOW to shutdown the drivers (high-Z output) and the on-board power supply. No Connect. Table 1. Device Pin Description Date: 06/22/04 SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers 5 © Copyright 2004 Sipex Corporation EN 1 C1+ 2 20 SHDN EN 19 VCC V+ 3 18 GND C1- 4 17 C2+ 5 SP3222EH 16 C2- 6 15 R1OUT V- 7 14 T2OUT 8 13 T1IN R2IN 9 12 T2IN R2OUT 10 11 18 SHDN 1 C1+ 2 V+ 3 16 GND C1- 4 15 C2+ 5 SP3222EH 14 C2- 6 13 R1OUT V- 7 12 T1IN T2OUT 8 11 T2IN R2IN 9 10 T1OUT R1IN NC NC 17 VCC T1OUT R1IN R2OUT DIP/SO SSOP/TSSOP Figure 4. Pinout Configurations for the SP3222EH 16 VCC C1+ 1 V+ 2 15 GND C1- 3 C2+ 4 C2- 5 12 R1OUT V- 6 11 T1IN T2OUT 7 10 R2IN 8 9 14 T1OUT SP3232EH 13 R1IN T2IN R2OUT Figure 5. Pinout Configuration for the SP3232EH Date: 06/22/04 SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers 6 © Copyright 2004 Sipex Corporation VCC + C5 C1 + VCC 19 VCC 0.1µF V+ 0.1µF LOGIC INPUTS 0.1µF 2 C1+ 0.1µF + C1 V+ 3 0.1µF *C3 4 C1- SP3222EH SSOP TSSOP 6 C2- V- 13 T1IN T1OUT 17 12 T2IN T2OUT 8 R1IN R2IN + 0.1µF + C2 RS-232 OUTPUTS LOGIC INPUTS RS-232 INPUTS LOGIC OUTPUTS 0.1µF 9 C4 12 T1IN T1OUT 15 11 T2IN T2OUT 8 R1IN 14 R2IN 9 5kΩ 10 R2OUT + 0.1µF 7 6 C2- + 0.1µF RS-232 OUTPUTS RS-232 INPUTS 5kΩ 5kΩ 1 EN V- 13 R1OUT 16 5kΩ 10 R2OUT SP3222EH DIP/SO 5 C2+ 7 C4 15 R1OUT LOGIC OUTPUTS + *C3 5 C2+ + 17 VCC 0.1µF 3 4 C1- C2 + C5 2 C1+ SHDN 1 EN 20 SHDN 18 GND GND *can be returned to either VCC or GND 18 16 *can be returned to either VCC or GND Figure 6. SP3222EH Typical Operating Circuits VCC C5 C1 + + 16 VCC 0.1µF 1 C1+ V+ 2 0.1µF *C3 3 C14 C2+ C2 LOGIC INPUTS + 0.1µF SP3232EH V- LOGIC OUTPUTS C4 11 T1IN T1OUT 14 10 T2IN T2OUT 7 R1IN 13 R2IN 8 5kΩ 9 R2OUT 0.1µF 6 5 C2- 12 R1OUT + + 0.1µF RS-232 OUTPUTS RS-232 INPUTS 5kΩ GND 15 *can be returned to either VCC or GND Figure 7. SP3232EH Typical Operating Circuit Date: 06/22/04 SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers 7 © Copyright 2004 Sipex Corporation DESCRIPTION The SP3222EH and SP3232EH are 2-driver/ 2-receiver devices ideal for portable or hand-held applications. The SP3222EH features a 1µA shutdown mode that reduces power consumption and extends battery life in portable systems. Its receivers remain active in shutdown mode, allowing external devices such as modems to be monitored using only 1µA supply current. The slew rate of the driver output is internally limited to a maximum of 30V/µs in order to meet the EIA standards (EIA RS-232D 2.1.7, Paragraph 5). The transition of the loaded output from HIGH to LOW also meets the monotonicity requirements of the standard. Figure 8 shows a loopback circuit used to test the RS-232 drivers. Figure 9 shows the test results of the loopback circuit with all drivers active at 120Kbps and RS-232 loads in parallel with 1000pF capacitors. Figure 10 shows the test results where one driver is active at 460Kbps and all drivers are loaded with an RS-232 receiver in parallel with a 1000pF capacitor. The SP3222EH/3232EH transceivers meet the EIA/TIA-232 and V.28/V.24 communication protocols. They feature Sipex's proprietary on-board charge pump circuitry that generates 2 x VCC for RS-232 voltage levels from a single +3.0V to +5.5V power supply. The SP3222EH/ 3232EH drivers operate at a minimum data rate of 460Kbps. The SP3222EH driver's output stages are tri-stated in shutdown mode. When the power is off, the SP3222EH device permits the outputs to be driven up to +12V. Because the driver's inputs do not have pull-up resistors, unused inputs should be connected to VCC or GND. THEORY OF OPERATION The SP3222EH/3232EH are made up of three basic circuit blocks: 1. Drivers, 2. Receivers, and 3. the Sipex proprietary charge pump. In the shutdown mode, the supply current is less than 1µA, where SHDN = LOW. When the SP3222EH device is shut down, the device's driver outputs are disabled (tri-stated) and the charge pumps are turned off with V+ pulled down to VCC and V- pulled to GND. The time required to exit shutdown is typically 100µs. SHDN is connected to VCC if the shutdown mode is not used. SHDN has no effect on RxOUT or RxOUTB. As they become active, the two driver outputs go to opposite RS-232 levels: one driver input is HIGH and the other LOW. Note that the drivers are enabled only when the magnitude of V- exceeds approximately 3V. Drivers The drivers are inverting level transmitters that convert TTL or CMOS logic levels to +5.0V EIA/TIA-232 levels inverted relative to the input logic levels. Typically, the RS-232 output voltage swing is +5.5V with no load and at least +5V minimum fully loaded. The driver outputs are protected against infinite short-circuits to ground without degradation in reliability. Driver outputs will meet EIA/TIA-562 levels of +3.7V with supply voltages as low as 2.7V. The drivers have a minimum data rate of 460Kbps fully loaded with 3KΩ in parallel with 1000pF, ensuring compatibility with PC-to-PC communication software. Date: 06/22/04 SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers 8 © Copyright 2004 Sipex Corporation VCC C5 C1 + + 0.1µF VCC C1+ V+ + 0.1µF 0.1µF C3 C1- C2 + C2+ 0.1µF SP3222EH SP3232EH VC4 C2LOGIC INPUTS LOGIC OUTPUTS + 0.1µF TxOUT TxIN RxIN RxOUT 5kΩ EN *SHDN VCC GND 1000pF * SP3222 only Figure 8. SP3222EH/3232EH Driver Loopback Test Circuit T1 IN T1 IN T1 OUT T1 OUT R1 OUT R1 OUT Figure 9. Driver Loopback Test Results at 120Kbps Date: 06/22/04 Figure 10. Driver Loopback Test Results at 460Kbps SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers 9 © Copyright 2004 Sipex Corporation Receivers The receivers convert EIA/TIA-232 levels to TTL or CMOS logic output levels. The SP3222EH receivers have an inverting tri-state output.Receiver outputs (RxOUT) are tri-stated when the enable control EN = HIGH. In the shutdown mode, the receivers can be active or inactive. EN has no effect on TxOUT. The truth table logic of the SP3222EH driver and receiver outputs can be found in Table 2. In most circumstances, decoupling the power supply can be achieved adequately using a 0.1µF bypass capacitor at C5 (refer to Figures 6 and 7). In applications that are sensitive to power-supply noise,VCC and ground can be decoupled with a capacitor of the same value as charge-pump capacitor C1. It is always important to physically locate bypass capacitors close to the IC. Since receiver input is usually from a transmission line where long cable lengths and system interference can degrade the signal and inject noise, the inputs have a typical hysteresis margin of 300mV. Should an input be left unconnected, a 5kΩ pulldown resistor to ground forces the output of the receiver HIGH. The charge pump operates in a discontinuous mode using an internal oscillator. If the output voltage is less than 5.5V, the charge pump is enabled. If the output voltage exceeds 5.5V, the charge pump is disabled. An oscillator controls the four phases of the voltage shifting. A description of each phase follows. Charge Pump Phase 1: VSS Charge Storage (Figure 12) During this phase of the clock cycle, the positive side of capacitors C1 and C2 are charged to VCC. Cl+ is then switched to GND and the charge in C1– is transferred to C2–. Since C2+ is connected to VCC, the voltage potential across capacitor C2 is now 2 times VCC. The Sipex patented charge pump (5,306,954) uses a four–phase voltage shifting technique to attain symmetrical 5.5V power supplies and requires four external capacitors. The internal power supply consists of a regulated dual charge pump that provides an output voltage of 5.5V regardless of the input voltage (VCC) over the +3.0V to +5.5V range. SHDN EN TxOUT RxOUT 0 0 Tri-state Active 0 1 Tri-state Tri-state 1 0 Active Active 1 1 Active Tri-state Phase 2: VSS Transfer (Figure 13) Phase two of the clock connects the negative terminal of C2 to the VSS storage capacitor and the positive terminal of C2 to GND. This transfers a negative generated voltage to C3. This generated voltage is regulated to a minimum voltage of -5.5V. Simultaneous with the transfer of the voltage to C3, the positive side of capacitor C1 is switched to VCC and the negative side is connected to GND. Phase 3: VDD Charge Storage (Figure 15) The third phase of the clock is identical to the first phase — the charge transferred in C1 produces –VCC in the negative terminal of C1, which is applied to the negative side of capacitor C2. Since C2+ is at VCC, the voltage potential across C2 is 2 times VCC. Table 2. Truth Table Logic for Shutdown and Enable Control Date: 06/22/04 SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers 10 © Copyright 2004 Sipex Corporation discharge it to an integrated circuit. The simulation is performed by using a test model as shown in Figure 17. This method will test the IC’s capability to withstand an ESD transient during normal handling such as in manufacturing areas where the ICs tend to be handled frequently. Phase 4: VDD Transfer (Figure 16) The fourth phase of the clock connects the negative terminal of C2 to GND, and transfers this positive generated voltage across C2 to C4, the VDD storage capacitor. This voltage is regulated to +5.5V. At this voltage, the internal oscillator is disabled. Simultaneous with the transfer of the voltage to C4, the positive side of capacitor C1 is switched to VCC and the negative side is connected to GND, allowing the charge pump cycle to repeat. The charge pump cycle will continue as long as the operational conditions for the internal oscillator are present. The IEC-1000-4-2, formerly IEC801-2, is used for testing ESD on equipment and systems. For system manufacturers, they must guarantee a certain amount of ESD protection since the system itself is exposed to the outside environment and human presence. The premise with IEC1000-4-2 is that the system is required to withstand an amount of static electricity when ESD is applied to points and surfaces of the equipment that are accessible to personnel during normal usage. In many cases, the RS232 transceiver IC receives most of the ESD current when the ESD source is applied to the connector pins. The test circuit for IEC1000-4-2 is shown on Figure 18. There are two methods within IEC1000-4-2, the Air Discharge method and the Contact Discharge method. Since both V+ and V– are separately generated from VCC; in a no–load condition V+ and V– will be symmetrical. Older charge pump approaches that generate V– from V+ will show a decrease in the magnitude of V– compared to V+ due to the inherent inefficiencies in the design. The charge pump clock rate typically operates at 250kHz. The external capacitors can be as low as 0.1µF with a 16V breakdown voltage rating. ESD Tolerance With the Air Discharge Method, an ESD voltage is applied to the equipment under test (EUT) through air. This simulates an electrically charged person ready to connect a cable onto the rear of the system. The high energy potential on the person discharges through an arcing path to the rear panel of the system before he or she touches the system. This energy, whether discharged directly or through air, is predominantly a function of the discharge current rather than the discharge voltage. Variables with an air discharge such as approach speed of the object carrying the ESD potential to the system and humidity will tend to change the discharge current. For example, the rise time of the discharge current varies with the approach speed. The SP3222EH/3232EH series incorporates ruggedized ESD cells on all driver output and receiver input pins. The improved ESD tolerance is at least ±15kV without damage or latch-up. Three methods of ESD testing are performed: a) MIL-STD-883, Method 3015.7 b) IEC1000-4-2 Air-Discharge c) IEC1000-4-2 Direct Contact The Human Body Model has been the generally accepted ESD testing method for semiconductors. This method is also specified in MIL-STD883, Method 3015.7 for ESD testing. The premise of this ESD test is to simulate the human body’s potential to store electro-static energy and Date: 06/22/04 SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers 11 © Copyright 2004 Sipex Corporation VCC = +5V C4 +5V + C1 C2 – –5V + – – + VDD Storage Capacitor + – VSS Storage Capacitor C3 –5V Figure 12. Charge Pump — Phase 1 VCC = +5V C4 + C1 C2 – + – – + VDD Storage Capacitor + – VSS Storage Capacitor C3 –10V Figure 13. Charge Pump — Phase 2 [ T ] +6V a) C2+ T GND 1 GND 2 b) C2- T -6V Ch1 2.00V Ch2 2.00V M 1.00µs Ch1 5.48V Figure 14. Charge Pump Waveforms VCC = +5V C4 +5V C1 + C2 – –5V + – – + + – VDD Storage Capacitor VSS Storage Capacitor C3 –5V Figure 15. Charge Pump — Phase 3 VCC = +5V C4 +10V C1 + – C2 + – – + + – VDD Storage Capacitor VSS Storage Capacitor C3 Figure 16. Charge Pump — Phase 4 Date: 06/22/04 SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers 12 © Copyright 2004 Sipex Corporation R RSS R RC C SW2 SW2 SW1 SW1 Device Under Test C CSS DC Power Source Figure 17. ESD Test Circuit for Human Body Model The Contact Discharge Method applies the ESD current directly to the EUT. This method was devised to reduce the unpredictability of the ESD arc. The discharge current rise time is constant since the energy is directly transferred without the air-gap arc. In situations such as hand held systems, the ESD charge can be directly discharged to the equipment from a person already holding the equipment. The current is transferred on to the keypad or the serial port of the equipment directly and then travels through the PCB and finally to the IC. The circuit models in Figures 17 and 18 represent the typical ESD testing circuits used for all three methods. The CS is initially charged with the DC power supply when the first switch (SW1) is on. Now that the capacitor is charged, the second switch (SW2) is on while SW1 switches off. The voltage stored in the capacitor is then applied through RS, the current limiting resistor, onto the device under test (DUT). In ESD tests, the SW2 switch is pulsed so that the device under test receives a duration of voltage. Contact-Discharge Module RSS RC C RV SW2 SW1 Device Under Test CSS DC Power Source RS and RV add up to 330 330Ω Ω ffor or IEC1000-4-2. Figure 18. ESD Test Circuit for IEC1000-4-2 Date: 06/22/04 SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers 13 © Copyright 2004 Sipex Corporation I➙ For the Human Body Model, the current limiting resistor (RS) and the source capacitor (CS) are 1.5kΩ an 100pF, respectively. For IEC-1000-4-2, the current limiting resistor (RS) and the source capacitor (CS) are 330Ω an 150pF, respectively. 30A 15A The higher CS value and lower RS value in the IEC1000-4-2 model are more stringent than the Human Body Model. The larger storage capacitor injects a higher voltage to the test point when SW2 is switched on. The lower current limiting resistor increases the current charge onto the test point. 0A t=0ns t=30ns t➙ Figure 19. ESD Test Waveform for IEC1000-4-2 Device Pin Tested Human Body Model Air Discharge Driver Outputs Receiver Inputs ±15kV ±15kV ±15kV ±15kV IEC1000-4-2 Direct Contact ±8kV ±8kV Level 4 4 Table 3. Transceiver ESD Tolerance Levels Date: 06/22/04 SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers 14 © Copyright 2004 Sipex Corporation PACKAGE: PLASTIC SHRINK SMALL OUTLINE (SSOP) E H D A Ø e A1 B DIMENSIONS (Inches) Minimum/Maximum (mm) Date: 06/22/04 L 16–PIN 20–PIN 24–PIN 28–PIN A 0.068/0.078 (1.73/1.99) 0.068/0.078 (1.73/1.99) 0.068/0.078 (1.73/1.99) 0.068/0.078 (1.73/1.99) A1 0.002/0.008 (0.05/0.21) 0.002/0.008 (0.05/0.21) 0.002/0.008 (0.05/0.21) 0.002/0.008 (0.05/0.21) B 0.010/0.015 (0.25/0.38) 0.010/0.015 (0.25/0.38) 0.010/0.015 (0.25/0.38) 0.010/0.015 (0.25/0.38) D 0.239/0.249 (6.07/6.33) 0.278/0.289 (7.07/7.33) 0.317/0.328 (8.07/8.33) 0.397/0.407 (10.07/10.33) E 0.205/0.212 (5.20/5.38) 0.205/0.212 (5.20/5.38) 0.205/0.212 (5.20/5.38) 0.205/0.212 (5.20/5.38) e 0.0256 BSC (0.65 BSC) 0.0256 BSC (0.65 BSC) 0.0256 BSC (0.65 BSC) 0.0256 BSC (0.65 BSC) H 0.301/0.311 (7.65/7.90) 0.301/0.311 (7.65/7.90) 0.301/0.311 (7.65/7.90) 0.301/0.311 (7.65/7.90) L 0.022/0.037 (0.55/0.95) 0.022/0.037 (0.55/0.95) 0.022/0.037 (0.55/0.95) 0.022/0.037 (0.55/0.95) Ø 0°/8° (0°/8°) 0°/8° (0°/8°) 0°/8° (0°/8°) 0°/8° (0°/8°) SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers 15 © Copyright 2004 Sipex Corporation PACKAGE: PLASTIC DUAL–IN–LINE (NARROW) E1 E D1 = 0.005" min. (0.127 min.) A1 = 0.015" min. (0.381min.) D A = 0.210" max. (5.334 max). C A2 e = 0.100 BSC (2.540 BSC) B1 B Ø L eA = 0.300 BSC (7.620 BSC) ALTERNATE END PINS (BOTH ENDS) DIMENSIONS (Inches) Minimum/Maximum (mm) 16–PIN 18–PIN A2 0.115/0.195 (2.921/4.953) 0.115/0.195 (2.921/4.953) B 0.014/0.022 (0.356/0.559) 0.014/0.022 (0.356/0.559) B1 0.045/0.070 (1.143/1.778) 0.045/0.070 (1.143/1.778) C 0.008/0.014 (0.203/0.356) 0.008/0.014 (0.203/0.356) D Date: 06/22/04 0.780/0.800 0.880/0.920 (19.812/20.320) (22.352/23.368) E 0.300/0.325 (7.620/8.255) 0.300/0.325 (7.620/8.255) E1 0.240/0.280 (6.096/7.112) 0.240/0.280 (6.096/7.112) L 0.115/0.150 (2.921/3.810) 0.115/0.150 (2.921/3.810) Ø 0°/ 15° (0°/15°) 0°/ 15° (0°/15°) SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers 16 © Copyright 2004 Sipex Corporation PACKAGE: PLASTIC SMALL OUTLINE (SOIC) E H D A Ø e B A1 L DIMENSIONS (Inches) Minimum/Maximum (mm) Date: 06/22/04 16–PIN 18–PIN A 0.090/0.104 (2.29/2.649) 0.090/0.104 (2.29/2.649)) A1 0.004/0.012 (0.102/0.300) 0.004/0.012 (0.102/0.300) B 0.013/0.020 (0.330/0.508) 0.013/0.020 (0.330/0.508) D 0.398/0.413 (10.10/10.49) 0.447/0.463 (11.35/11.74) E 0.291/0.299 (7.402/7.600) 0.291/0.299 (7.402/7.600) e 0.050 BSC (1.270 BSC) 0.050 BSC (1.270 BSC) H 0.394/0.419 (10.00/10.64) 0.394/0.419 (10.00/10.64) L 0.016/0.050 (0.406/1.270) 0.016/0.050 (0.406/1.270) Ø 0°/8° (0°/8°) 0°/8° (0°/8°) SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers 17 © Copyright 2004 Sipex Corporation PACKAGE: PLASTIC THIN SMALL OUTLINE (TSSOP) E2 E D A Ø e B A1 L DIMENSIONS in inches (mm) Minimum/Maximum Date: 06/22/04 16–PIN 20–PIN A - /0.043 (- /1.10) - /0.043 (- /1.10) A1 0.002/0.006 (0.05/0.15) 0.002/0.006 (0.05/0.15) B 0.007/0.012 (0.19/0.30) 0.007/0.012 (0.19/0.30) D 0.193/0.201 (4.90/5.10) 0.252/0.260 (6.40/6.60) E 0.169/0.177 (4.30/4.50) 0.169/0.177 (4.30/4.50) e 0.026 BSC (0.65 BSC) 0.026 BSC (0.65 BSC) E2 0.126 BSC (3.20 BSC) 0.126 BSC (3.20 BSC) L 0.020/0.030 (0.50/0.75) 0.020/0.030 (0.50/0.75) Ø 0°/8° 0°/8° SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers 18 © Copyright 2004 Sipex Corporation ORDERING INFORMATION Part Number Temperature Range Package Type SP3222EHCA .......................................... 0˚C to +70˚C .......................................... 20-Pin SSOP SP3222EHCA/TR .................................... 0˚C to +70˚C .......................................... 20-Pin SSOP SP3222EHEA ......................................... -40˚C to +85˚C ........................................ 20-Pin SSOP SP3222EHEA/TR .................................... -40˚C to +85˚C ........................................ 20-Pin SSOP SP3222EHCP .......................................... 0˚C to +70˚C ............................................ 18-Pin PDIP SP3222EHEP ......................................... -40˚C to +85˚C .......................................... 18-Pin PDIP SP3222EHCT .......................................... 0˚C to +70˚C ........................................ 18-Pin WSOIC SP3222EHCT/TR ..................................... 0˚C to +70˚C ........................................ 18-Pin WSOIC SP3222EHET .......................................... -40˚C to +85˚C ...................................... 18-Pin WSOIC SP3222EHET/TR .................................... -40˚C to +85˚C ...................................... 18-Pin WSOIC SP3222EHCY .......................................... 0˚C to +70˚C ........................................ 20-Pin TSSOP SP3222EHCY/TR .................................... 0˚C to +70˚C ........................................ 20-Pin TSSOP SP3222EHEY ......................................... -40˚C to +85˚C ...................................... 20-Pin TSSOP SP3222EHEY/TR .................................... -40˚C to +85˚C ...................................... 20-Pin TSSOP SP3232EHCA .......................................... 0˚C to +70˚C .......................................... 16-Pin SSOP SP3232EHCA/TR .................................... 0˚C to +70˚C .......................................... 16-Pin SSOP SP3232EHEA ......................................... -40˚C to +85˚C ........................................ 16-Pin SSOP SP3232EHEA/TR .................................... -40˚C to +85˚C ........................................ 16-Pin SSOP SP3232EHCP .......................................... 0˚C to +70˚C ............................................ 16-Pin PDIP SP3232EHEP ......................................... -40˚C to +85˚C .......................................... 16-Pin PDIP SP3232EHCT .......................................... 0˚C to +70˚C ........................................ 16-Pin WSOIC SP3232EHCT/TR ..................................... 0˚C to +70˚C ........................................ 16-Pin WSOIC SP3232EHET .......................................... -40˚C to +85˚C ...................................... 16-Pin WSOIC SP3232EHET/TR .................................... -40˚C to +85˚C ...................................... 16-Pin WSOIC SP3232EHCY .......................................... 0˚C to +70˚C ........................................ 16-Pin TSSOP SP3232EHCY/TR .................................... 0˚C to +70˚C ........................................ 16-Pin TSSOP SP3232EHEY ......................................... -40˚C to +85˚C ...................................... 16-Pin TSSOP SP3232EHEY/TR .................................... -40˚C to +85˚C ...................................... 16-Pin TSSOP Available in lead free packaging. To order add "-L" suffix to part number. Example: SP3232EHEY/TR = standard; SP3232EHEY-L/TR = lead free /TR = Tape and Reel Pack quantity is 1,500 for WSOIC, SSOP and TSSOP. Corporation ANALOG EXCELLENCE Sipex Corporation Headquarters and Sales Office 233 South Hillview Drive Milpitas, CA 95035 TEL: (408) 934-7500 FAX: (408) 935-7600 Sipex Corporation reserves the right to make changes to any products described herein. Sipex does not assume any liability arising out of the application or use of any product or circuit described hereing; neither does it convey any license under its patent rights nor the rights of others. Date: 06/22/04 SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers 19 © Copyright 2004 Sipex Corporation