EXAR SP3222EEY-L-TR

SP3222E/SP3232E
True +3.0V to +5.5V RS-232 Transceivers
FEATURES
■ Meets true EIA/TIA-232-F Standards
from a +3.0V to +5.5V power supply
■ Minimum 120kbps Data Rate Under Full
Load
■ 1µA Low Power Shutdown with
Receivers active (SP3222E)
■ Interoperable with RS-232 down to a
+2.7V power source
■ Enhanced ESD Specifications:
+15kV Human Body Model
+15kV IEC61000-4-2 Air Discharge
+8kV IEC61000-4-2 Contact Discharge
EN
18 SHDN
1
C1+ 2
17 VCC
V+ 3
16 GND
C1- 4
C2+ 5
15 T1OUT
SP3222E
13 R1OUT
C2- 6
V-
14 R1IN
7
12 T1IN
T2OUT 8
11 T2IN
R2IN 9
10 R2OUT
nSOIC
Now Available in Lead Free Packaging
Note: See page 6 for other pinouts
DESCRIPTION
The SP3222E/SP3232E series is an RS-232 transceiver solution intended for portable or
hand-held applications such as notebook or palmtop computers. The SP3222E/SP3232E
series has a high-efficiency, charge-pump power supply that requires only 0.1µF capacitors in 3.3V operation. This charge pump allows the SP3222E/SP3232E series to deliver
true RS-232 performance from a single power supply ranging from +3.0V to +5.5V. The
SP3222E/SP3232E are 2-driver/2-receiver devices. This series is ideal for portable or
hand-held applications such as notebook or palmtop computers. The ESD tolerance of the
SP3222E/SP3232E devices are over +/-15kV for both Human Body Model and IEC61000-4-2
Air discharge test methods. The SP3222E device has a low-power shutdown mode where
the devices' driver outputs and charge pumps are disabled. During shutdown, the supply
current falls to less than 1µA.
SELECTION TABLE
MODEL
Power
Supplies
RS-232
Drivers
RS-232
Receivers
External
Components
Shutdown
TTL
3-State
# of
Pins
SP3222E +3.0V to +5.5V
2
2
4 Capacitors
Yes
Yes
18, 20
SP3232E +3.0V to +5.5V
2
2
4 Capacitors
No
No
16
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3222E/SP3232E_101_031413
ABSOLUTE MAXIMUM RATINGS
These are stress ratings only and functional operation
of the device at these ratings or any other above those
indicated in the operation sections of the specifications
below is not implied. Exposure to absolute maximum
rating conditions for extended periods of time may
affect reliability and cause permanent damage to the
device.
Power Dissipation per package
VCC.......................................................-0.3V to +6.0V
V+ (NOTE 1).......................................-0.3V to +7.0V
V- (NOTE 1)........................................+0.3V to -7.0V
V+ + |V-| (NOTE 1)...........................................+13V
ICC (DC VCC or GND current).........................+100mA
20-pin SSOP (derate 9.25mW/oC above +70oC)..............750mW
18-pin SOIC (derate 15.7mW/oC above +70oC)..............1260mW
20-pin TSSOP (derate 11.1mW/oC above +70oC).............890mW
16-pin SSOP (derate 9.69mW/oC above +70oC)...............775mW
16-pin PDIP (derate 14.3mW/oC above +70oC)...............1150mW
16-pin Wide SOIC (derate 11.2mW/oC above +70oC)........900mW
16-pin TSSOP (derate 10.5mW/oC above +70oC)..............850mW
16-pin nSOIC (derate 13.57mW/oC above +70oC)...........1086mW
Input Voltages
TxIN, EN, SHDN...........................-0.3V to Vcc + 0.3V
RxIN...................................................................+15V
Output Voltages
TxOUT.............................................................+13.2V
RxOUT, .......................................-0.3V to (VCC +0.3V)
Short-Circuit Duration
TxOUT....................................................Continuous
Storage Temperature......................-65°C to +150°C
NOTE 1: V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V.
ELECTRICAL CHARACTERISTICS
Unless otherwise noted, the following specifications apply for VCC = +3.0V to +5.5V with TAMB = TMIN to TMAX,
PARAMETER
MIN.
TYP.
MAX.
UNITS
CONDITIONS
Supply Current
0.3
1.0
mA
no load, VCC = 3.3V,
TAMB = 25oC, TxIN = GND or VCC
Shutdown Supply Current
1.0
10
µA
SHDN = GND, VCC = 3.3V,
TAMB = 25oC, TxIN = Vcc or GND
0.8
V
TxIN, EN, SHDN, Note 2
Vcc
V
Vcc = 3.3V, Note 2
DC CHARACTERISTICS
LOGIC INPUTS AND RECEIVER OUTPUTS
Input Logic Threshold LOW
Input Logic Threshold HIGH
2.0
Input Logic Threshold HIGH
2.4
Vcc
V
Vcc = 5.0V, Note 2
Input Leakage Current
+0.01
+1.0
µA
TxIN, EN, SHDN,
TAMB = +25oC, VIN = 0V to VCC
Output Leakage Current
+0.05
+10
µA
Receivers disabled, VOUT = 0V to VCC
0.4
Output Voltage LOW
Output Voltage HIGH
V
IOUT = 1.6mA
VCC -0.6
VCC -0.1
V
IOUT = -1.0mA
+5.0
+5.4
V
All driver outputs loaded with 3kΩ to
GND, TAMB = +25oC
DRIVER OUTPUTS
Output Voltage Swing
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3222E/SP3232E_101_031413
ELECTRICAL CHARACTERISTICS
Unless otherwise noted, the following specifications apply for VCC = +3.0V to +5.5V with TAMB = TMIN to TMAX,
Typical values apply at VCC = +3.3V or +5.0V and TAMB = 25°C.
PARAMETER
MIN.
TYP.
MAX.
UNITS
+35
+60
mA
+25
µA
+15
V
CONDITIONS
DRIVER OUTPUTS (continued)
Output Resistance
300
Output Short-Circuit Current
Ω
Output Leakage Current
VCC = V+ = V- = 0V, TOUT=+2V
VOUT = 0V
VCC = 0V or 3.0V to 5.5V,
VOUT = +12V, Drivers disabled
RECEIVER INPUTS
Input Voltage Range
-15
Input Threshold LOW
0.6
1.2
V
Vcc = 3.3V
Input Threshold LOW
0.8
1.5
V
Vcc = 5.0V
Input Threshold HIGH
1.5
2.4
V
Vcc = 3.3V
Input Threshold HIGH
1.8
2.4
V
Vcc = 5.0V
Input Hysteresis
0.3
Input Resistance
V
3
5
7
kΩ
120
235
kbps
Driver Propagation Delay, tPHL
1.0
µs
RL = 3kΩ, CL = 1000pF
Driver Propagation Delay, tPLH
1.0
µs
RL = 3kΩ, CL = 1000pF
Receiver Propagation Delay, tPHL
0.3
µs
Receiver input to Receiver
output, CL = 150pF
Receiver Propagation Delay, tPLH
0.3
µs
Receiver input to Receiver
output, CL = 150pF
Receiver Output Enable Time
200
ns
Receiver Output Disable Time
200
ns
Driver Skew
100
500
ns
| tPHL - tPLH |, TAMB = 25°C
Receiver Skew
200
1000
ns
| tPHL - tPLH |
30
V/µs
TIMING CHARACTERISTICS
Maximum Data Rate
Transition-Region Slew Rate
RL = 3kΩ, CL = 1000pF, one
driver switching
Vcc = 3.3V, RL = 3kΩ,
CL = 1000pF, TAMB = 25°C,
measurements taken from -3.0V
to +3.0V or +3.0V to -3.0V
NOTE 2: Driver input hysteresis is typically 250mV.
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3222E/SP3232E_101_031413
TYPICAL PERFORMANCE CHARACTERISTICS
Unless otherwise noted, the following performance characteristics apply for VCC = +3.3V, 120kbps data rate, all
drivers loaded with 3kΩ, 0.1µF charge pump capacitors, and TAMB = +25°C.
14
12
4
10
Vout+
Vout-
2
Slew Rate [V/µs ]
Transmitter Output Voltage [V]
6
0
500
0
1000
2000
1500
-2
8
6
4
+Slew
-Slew
2
-4
0
-6
Load Capacitance [pF]
0
500
1000
1500
Load Capacitance [pF]
2000
2330
Figure 2. Slew Rate vs Load Capacitance for the
SP3222E and SP3232E
Figure 1. Transmitter Output Voltage vs Load
Capacitance for the SP3222E and SP3232E
50
118KHz
60KHz
10KHz
45
40
Suppl y Current [mA]
35
30
25
20
15
10
5
0
0
500
1000
1500
2000
2330
Load Capacitance [pF]
Figure 3. Supply Current VS. Load Capacitance
when Transmitting Data
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3222E/SP3232E_101_031413
Pin Function
PIN NUMBER
NAME
SP3222E
FUNCTION
SOIC
SSOP
TSSOP
SP3232E
EN
Receiver Enable. Apply Logic LOW for normal operation.
Apply logic HIGH to disable the receiver outputs (high-Z state)
1
1
-
C1+
Positive terminal of the voltage doubler charge-pump capacitor
2
2
1
V+
+5.5V output generated by the charge pump
3
3
2
C1-
Negative terminal of the voltage doubler charge-pump capacitor
4
4
3
C2+
Positive terminal of the inverting charge-pump capacitor
5
5
4
C2-
Negative terminal of the inverting charge-pump capacitor
6
6
5
-5.5V output generated by the charge pump
7
7
6
T1OUT
RS-232 driver output.
15
17
14
T2OUT
RS-232 driver output.
8
8
7
R1IN
RS-232 receiver input
14
16
13
R2IN
RS-232 receiver input
9
9
8
R1OUT
TTL/CMOS receiver output
13
15
12
R2OUT
TTL/CMOS receiver output
10
10
9
T1IN
TTL/CMOS driver input
12
13
11
T2IN
TTL/CMOS driver input
11
12
10
GND
Ground
16
18
15
+3.0V to +5.5V supply voltage
17
19
16
Shutdown Control Input. Drive HIGH for normal device operation.
Drive LOW to shutdown the drivers (high-Z output) and the onboard power supply
18
20
-
-
11, 14
-
V-
VCC
SHDN
N.C.
No Connect
Table 1. Device Pin Description
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3222E/SP3232E_101_031413
PINOUT
EN
1
C1+ 2
V+ 3
C1-
EN 1
18 SHDN
19 VCC
C1+ 2
17 VCC
V+ 3
16 GND
18 GND
4
C2+ 5
20 SHDN
17 T1OUT
SP3222E
C1- 4
16 R1IN
C2-
6
15 R1OUT
V-
7
14 N.C.
T2OUT 8
13 T1IN
C2+ 5
SP3222E 14 R1IN
13 R1OUT
C2- 6
V- 7
12 T1IN
11 T2IN
9
12 T2IN
T2OUT 8
R2OUT 10
11 N.C.
R2IN 9
R2IN
15 T1OUT
10 R2OUT
nSOIC
SSOP/TSSOP
Figure 4. Pinout Configurations for the SP3222E
C1+ 1
16 VCC
V+ 2
15 GND
C1- 3
C2+ 4
14 T1OUT
SP3232E 13 R1IN
C2- 5
12 R1OUT
V- 6
11 T1IN
T2OUT 7
10 T2IN
R2IN 8
9 R2OUT
Figure 5. Pinout Configuration for the SP3232E
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3222E/SP3232E_101_031413
TYPICAL OPERATING CIRCUITS
VCC
C5
C1
C2
LOGIC
INPUTS
+
+
+
0.1µF
2 C1+
0.1µ F
19
VCC
6 C2-
V+
SP3222E
SSOP
TSSOP
3
+
*C3
0.1µF
+
C1
V- 7
C4
13 T1IN
T1OUT 17
12 T2IN
T2OUT 8
+
0.1µF
+
C2
RS-232
OUTPUTS
2 C1+
0.1µF
LOGIC
INPUTS
RS-232
INPUTS
R2IN 9
6 C2-
SP3222E
WSOIC
*C3
C4
T1OUT 15
11 T2IN
T2OUT 8
0.1µF
+
0.1µF
RS-232
OUTPUTS
R1IN 14
5kΩ
LOGIC
OUTPUTS
+
V- 7
12 T1IN
10 R2OUT
R2IN 9
5kΩ
1 EN
3
4 C15 C2+
0.1µF
V+
13 R1OUT
5kΩ
10 R2OUT
17
VCC
0.1µF
R1IN 16
15 R1OUT
LOGIC
OUTPUTS
+
C5
4 C15 C2+
0.1µF
VCC
RS-232
INPUTS
5kΩ
SHDN
GND
1 EN
20
SHDN
GND
*can be returned to
either VCC or GND
18
16
18
*can be returned to
either VCC or GND
Figure 6. SP3222E Typical Operating Circuits
VCC
C5
C1
C2
+
+
+
0.1µF
1 C1+
0.1µF
LOGIC
INPUTS
V+
SP3232E
V-
*C3
+
0.1µF
6
C4
5 C211 T1IN
T1OUT
14
10 T2IN
T2OUT
7
+
0.1µF
RS-232
OUTPUTS
R1IN 13
12 R1OUT
LOGIC
OUTPUTS
2
3 C14 C2+
0.1µF
16
VCC
5kΩ
R2IN
9 R2OUT
8
RS-232
INPUTS
5kΩ
GND
15
*can be returned to
either VCC or GND
Figure 7. SP3232E Typical Operating Circuit
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3222E/SP3232E_101_031413
DESCRIPTION
The SP3222E/SP3232E transceivers
meet the EIA/TIA-232 and ITU-T V.28/V.24
communication protocols and can be implemented in battery-powered, portable, or
hand-held applications such as notebook or
palmtop computers. The SP3222E/SP3232E
devices feature Exar's proprietary on-board
charge pump circuitry that generates ±5.5V
for RS-232 voltage levels from a single
+3.0V to +5.5V power supply. This series is
ideal for +3.3V-only systems, mixed +3.3V
to +5.5V systems, or +5.0V-only systems
that require true RS-232 performance. The
SP3222E/SP3232E devices can operate
at a typical data rate of 235kbps when fully
loaded.
The drivers can guarantee a data rate of
120kbps fully loaded with 3kΩ in parallel
with 1000pF, ensuring compatability with
PC-to-PC communication software.
The slew rate of the driver is internally limited
to a maximum of 30V/µs in order to meet the
EIA standards (EIA RS-232D 2.1.7, Paragraph 5). The transition of the loaded output
from HIGH to LOW also meet the monotonicity requirements of the standard.
Figure 8 shows a loopback test circuit
used to test the RS-232 Drivers. Figure
9 shows the test results of the loopback
circuit with all drivers active at 120kbps
with RS-232 loads in parallel with a
1000pF capacitor. Figure 10 shows the
test results where one driver was active
at 235kbps and all drivers loaded with an
RS-232 receiver in parallel with 1000pF
capacitors. A solid RS-232 data transmission rate of 120kbps provides compatibility
with many designs in personal computer
peripherals and LAN applications.
The SP3222E and SP3232E are 2-driver/2receiver devices ideal for portable or handheld applications. The SP3222E features a
1µA shutdown mode that reduces power
consumption and extends battery life in portable systems. Its receivers remain active in
shutdown mode, allowing external devices
such as modems to be monitored using only
1µA supply current.
The SP3222E driver's output stages are
turned off (tri-state) when the device is in
shutdown mode. When the power is off, the
SP3222E device permits the outputs to be
driven up to +/-12V. The driver's inputs do
not have pull-up resistors. Designers should
connect unused inputs to Vcc or GND.
THEORY OF OPERATION
The SP3222E/SP3232E series is made up
of three basic circuit blocks:
1. Drivers
2. Receivers
3. The Exar proprietary charge pump
In the shutdown mode, the supply current
falls to less than 1µA, where SHDN = LOW.
When the SP3222E device is shut down,
the device's driver outputs are disabled (tristated) and the charge pumps are turned off
with V+ pulled down to Vcc and V- pulled to
GND. The time required to exit shutdown is
typically 100µs. Connect SHDN to Vcc if the
shutdown mode is not used.
Drivers
The drivers are inverting level transmitters
that convert TTL or CMOS logic levels to
+5.0V EIA/TIA-232 levels with an inverted
sense relative to the input logic levels.
Typically, the RS-232 output voltage swing
is +5.4V with no load and +5V minimum fully
loaded. The driver outputs are protected
against infinite short-circuits to ground without degradation in reliability. Driver outputs
will meet EIA/TIA-562 levels of +/-3.7V with
supply voltages as low as 2.7V.
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3222E/SP3232E_101_031413
DESCRIPTION
Receivers
VCC
C5
C1
+
+
0.1µF
0.1µF
C1+
+
V+
C3
C1C2
C2+
0.1µF
SP3222E
SP3232E
LOGIC
OUTPUTS
+
0.1µF
VC4
C2LOGIC
INPUTS
The Receivers convert EIA/TIA-232 levels
to TTL or CMOS logic output levels. The
SP3222E receivers have an inverting tri-state
output. These receiver outputs (RxOUT)
are tri-stated when the enable control EN =
HIGH. In the shutdown mode, the receivers
can be active or inactive. EN has no effect on
TxOUT. The truth table logic of the SP3222E
driver and receiver outputs can be found in
Table 2.
VCC
+
0.1µF
TxOUT
TxIN
RxIN
RxOUT
5kΩ
EN*
VCC
*SHDN
GND
1000pF
* SP3222E only
Figure 8. SP3222E/SP3232E Driver Loopback Test
Circuit
[
T
]
T
T
R1 OUT 3
0V
Figure 9. Loopback Test results at 120kbps
[
T1 IN 1
T
RxOUT
0
0
Tri-state
Active
0
1
Tri-state
Tri-state
1
0
Active
Active
1
1
Active
Tri-state
Charge Pump
The charge pump is an Exar-patended
design (U.S. 5,306,954) and uses a unique
approach compared to older less-efficient
designs. The charge pump still requires four
external capacitors, but uses a four-phase
voltage shifting technique to attain symmetrical 5.5V power supplies. The internal
power supply consists of a regulated dual
charge pump that provides output voltages
of +/-5.5V regardless of the input voltage
(Vcc) over the +3.0V to +5.5V range.
]
T
T1 OUT 2
T
T
R1 OUT 3
Ch1 5.00V Ch2 5.00V M 2.50µs Ch1
Ch3 5.00V
TxOUT
Since receiver input is usually from a transmission line where long cable lengths and
system interference can degrade the signal,
the inputs have a typical hysteresis margin
of 300mV. This ensures that the receiver
is virtually immune to noisy transmission
lines. Should an input be left unconnected,
an internal 5kΩ pulldown resistor to ground
will commit the output of the receiver to a
HIGH state.
T1 OUT 2
Ch1 5.00V Ch2 5.00V M 5.00µs Ch1
Ch3 5.00V
EN
Table 2. SP3222E Truth Table Logic for Shutdown
and Enable Control
T
T1 IN 1
SHDN
0V
Figure 10. Loopback Test results at 235kbps
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3222E/SP3232E_101_031413
DESCRIPTION
In most circumstances, decoupling the
power supply can be achieved adequately
using a 0.1µF bypass capacitor at C5 (refer
to figures 6 and 7). In applications that are
sensitive to power-supply noise, decouple
Vcc to ground with a capacitor of the same
value as charge-pump capacitor C1. Physically connect bypass capcitors as close to
the IC as possible.
Phase 4
— VDD transfer — The fourth phase of
the clock connects the negative terminal
of C2 to GND, and transfers this positive
generated voltage across C2 to C4, the
VDD storage capacitor. This voltage is
regulated to +5.5V. At this voltage, the internal oscillator is disabled. Simultaneous
with the transfer of the voltage to C4, the
positive side of capacitor C1 is switched
to VCC and the negative side is connected to GND, allowing the charge
pump cycle to begin again. The charge
pump cycle will continue as long as the
operational conditions for the internal
oscillator are present.
The charge pump operates in a discontinuous mode using an internal oscillator. If the
output voltages are less than a magnitude
of 5.5V, the charge pump is enabled. If the
output voltages exceed a magnitude of 5.5V,
the charge pump is disabled. This oscillator
controls the four phases of the voltage shifting. A description of each phase follows.
Since both V+ and V– are separately generated from VCC, in a no–load condition V+
and V– will be symmetrical. Older charge
pump approaches that generate V– from
V+ will show a decrease in the magnitude
of V– compared to V+ due to the inherent
inefficiencies in the design.
Phase 1
— VSS charge storage — During this phase
of the clock cycle, the positive side of capacitors C1 and C2 are initially charged to VCC.
Cl+ is then switched to GND and the charge
in C1– is transferred to C2–. Since C2+ is connected to VCC, the voltage potential across
capacitor C2 is now 2 times VCC.
The clock rate for the charge pump typically
operates at greater than 250kHz. The external capacitors can be as low as 0.1µF with
a 16V breakdown voltage rating.
Phase 2
— VSS transfer — Phase two of the clock
connects the negative terminal of C2 to the VSS
storage capacitor and the positive terminal of
C2 to GND. This transfers a negative generated voltage to C3. This generated voltage is
regulated to a minimum voltage of -5.5V.
Simultaneous with the transfer of the voltage to C3, the positive side of capacitor C1
is switched to VCC and the negative side is
connected to GND.
Phase 3
— VDD charge storage — The third phase of
the clock is identical to the first phase — the
charge transferred in C1 produces –VCC in
the negative terminal of C1, which is applied
to the negative side of capacitor C2. Since
C2+ is at VCC, the voltage potential across C2
is 2 times VCC.
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
10
SP3222E/SP3232E_101_031413
DESCRIPTION
VCC = +5V
C4
+5V
C1
+
+
C2
–
–5V
–
+
–
VDD Storage Capacitor
–
+
VSS Storage Capacitor
C3
–5V
Figure 11. Charge Pump — Phase 1
VCC = +5V
C4
+
C1
C2
–
+
–
+
–
–
+
VDD Storage Capacitor
VSS Storage Capacitor
C3
-5.5V
Figure 12. Charge Pump — Phase 2
[
T
]
+6V
a) C2+
T
GND 1
GND 2
b) C2-6V
T
Ch1 2.00V
Ch2
2.00V M 1.00µs Ch1 5.48V
Figure 13. Charge Pump Waveforms
VCC = +5V
C4
+5V
C1
+
–
C2
–5V
+
+
–
–
–
VDD Storage Capacitor
+
VSS Storage Capacitor
C3
–5V
Figure 14. Charge Pump — Phase 3
VCC = +5V
+5.5V
C1
+
–
C2
C4
+
+
–
–
–
+
VDD Storage Capacitor
VSS Storage Capacitor
C3
Figure 15. Charge Pump — Phase 4
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
11
SP3222E/SP3232E_101_031413
DESCRIPTION
ESD Tolerance
The SP3222E/SP3232E series incorporates ruggedized ESD cells on all driver
output and receiver input pins. The ESD
structure is improved over our previous
family for more rugged applications and
environments sensitive to electro-static
discharges and associated transients. The
improved ESD tolerance is at least +15kV
without damage nor latch-up.
the system is required to withstand an amount
of static electricity when ESD is applied to
points and surfaces of the equipment that
are accessible to personnel during normal
usage. The transceiver IC receives most
of the ESD current when the ESD source is
applied to the connector pins. The test circuit
for IEC61000-4-2 is shown on Figure 17.
There are two methods within IEC61000-4-2,
the Air Discharge method and the Contact
Discharge method.
There are different methods of ESD testing
applied:
With the Air Discharge Method, an ESD
voltage is applied to the equipment under
test (EUT) through air. This simulates an
electrically charged person ready to connect
a cable onto the rear of the system only to
find an unpleasant zap just before the person
touches the back panel. The high energy
potential on the person discharges through
an arcing path to the rear panel of the system
before he or she even touches the system.
This energy, whether discharged directly or
through air, is predominantly a function of the
discharge current rather than the discharge
voltage. Variables with an air discharge such
as approach speed of the object carrying the
ESD potential to the system and humidity
will tend to change the discharge current.
For example, the rise time of the discharge
current varies with the approach speed.
a) MIL-STD-883, Method 3015.7
b) IEC61000-4-2 Air-Discharge
c) IEC61000-4-2 Direct Contact
The Human Body Model has been the
generally accepted ESD testing method
for semi-conductors. This method is also
specified in MIL-STD-883, Method 3015.7
for ESD testing. The premise of this ESD test
is to simulate the human body’s potential to
store electro-static energy and discharge it
to an integrated circuit. The simulation is
performed by using a test model as shown
in Figure 16. This method will test the IC’s
capability to withstand an ESD transient
during normal handling such as in manufacturing areas where the ICs tend to be
handled frequently.
The Contact Discharge Method applies the
ESD current directly to the EUT. This method
was devised to reduce the unpredictability
of the ESD arc. The discharge current rise
time is constant since the energy is directly
transferred without the air-gap arc. In situations such as hand held systems, the ESD
charge can be directly discharged to the
The IEC-61000-4-2, formerly IEC801-2, is
generally used for testing ESD on equipment
and systems. For system manufacturers,
they must guarantee a certain amount of ESD
protection since the system itself is exposed
to the outside environment and human presence. The premise with IEC61000-4-2 is that
RS
RC
SW1
DC Power
Source
SW2
CS
Figure 16. ESD Test Circuit for Human Body Model
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
12
Device
Under
Test
SP3222E/SP3232E_101_031413
DESCRIPTION
Contact-Discharge Model
RS
RC
RV
SW1
SW2
Device
Under
Test
CS
DC Power
Source
R S and RV add up to 330Ω for IEC61000-4-2.
Figure 17. ESD Test Circuit for IEC61000-4-2
equipment from a person already holding
the equipment. The current is transferred
on to the keypad or the serial port of the
equipment directly and then travels through
the PCB and finally to the IC.
The higher CS value and lower RS value in
the IEC61000-4-2 model are more stringent
than the Human Body Model. The larger
storage capacitor injects a higher voltage
to the test point when SW2 is switched on.
The lower current limiting resistor increases
the current charge onto the test point.
I→
The circuit models in Figures 16 and 17 represent the typical ESD testing circuit used for
all three methods. The CS is initially charged
with the DC power supply when the first
switch (SW1) is on. Now that the capacitor
is charged, the second switch (SW2) is on
while SW1 switches off. The voltage stored
in the capacitor is then applied through RS,
the current limiting resistor, onto the device
under test (DUT). In ESD tests, the SW2
switch is pulsed so that the device under
test receives a duration of voltage.
30A
15A
For the Human Body Model, the current
limiting resistor (RS) and the source capacitor
(CS) are 1.5kΩ an 100pF, respectively. For
IEC-61000-4-2, the current limiting resistor
(RS) and the source capacitor (CS) are 330Ω
an 150pF, respectively.
Device PIN
TESTED
Driver Outputs
Receiver Inputs
0A
t = 0ns
t = 30ns
Figure 18. ESD Test Waveform for IEC61000-4-2
Human Body
MODEL
Air Discharge
+15kV
+15kV
t→
+15kV
+15kV
IEC61000-4-2
Direct Contact
Level
+8kV
+8kV
4
4
Table 3. Transceiver ESD Tolerance Levels
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
13
SP3222E/SP3232E_101_031413
PACKAGE: 20 PIN SSOP
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
14
SP3222E/SP3232E_101_031413
PACKAGE: 16 PIN SSOP
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
15
SP3222E/SP3232E_101_031413
▲
▲
PACKAGE: 16 PIN PDIP
e
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
16
SP3222E/SP3232E_101_031413
PACKAGE: 16 PIN WSOIC
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
17
SP3222E/SP3232E_101_031413
PACKAGE: 18 PIN WSOIC
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
18
SP3222E/SP3232E_101_031413
PACKAGE: 16 PIN nSOIC
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
19
SP3222E/SP3232E_101_031413
PACKAGE: 16 PIN TSSOP
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
20
SP3222E/SP3232E_101_031413
PACKAGE: 20 PIN TSSOP
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
21
SP3222E/SP3232E_101_031413
ORDERING INFORMATION
Part Number
Temp. Range
Package
SP3222ECA-L
0°C to +70°C
20 Pin SSOP
SP3222ECA-L/TR
0°C to +70°C
20 Pin SSOP
SP3222ECT-L
0°C to +70°C
18 Pin WSOIC
SP3222ECT-L/TR
0°C to +70°C
18 Pin WSOIC
SP3222ECY-L
0°C to +70°C
20 Pin TSSOP
SP3222ECY-L/TR
0°C to +70°C
20 Pin TSSOP
SP3222EEA-L
-40°C to +85°C
20 Pin SSOP
SP3222EEA-L/TR
-40°C to +85°C
20 Pin SSOP
SP3222EET-L
-40°C to +85°C
18 Pin WSOIC
SP3222EET-L/TR
-40°C to +85°C
18 Pin WSOIC
SP3222EEY-L
-40°C to +85°C
20 Pin TSSOP
SP3222EEY-L/TR
-40°C to +85°C
20 Pin TSSOP
Part Number
Temp. Range
Package
SP3232ECA-L
0°C to +70°C
16 Pin SSOP
SP3232ECA-L/TR
0°C to +70°C
16 Pin SSOP
SP3232ECN-L
0°C to +70°C
16 Pin NSOIC
SP3232ECN-L/TR
0°C to +70°C
16 Pin NSOIC
SP3232ECP-L
0°C to +70°C
16 Pin PDIP
SP3232ECT-L
0°C to +70°C
16 Pin WSOIC
SP3232ECT-L/TR
0°C to +70°C
16 Pin WSOIC
SP3232ECY-L
0°C to +70°C
16 Pin TSSOP
SP3232ECY-L/TR
0°C to +70°C
16 Pin TSSOP
SP3232EEA-L
-40°C to +85°C
16 Pin SSOP
SP3232EEA-L/TR
-40°C to +85°C
16 Pin SSOP
SP3232EEN-L
-40°C to +85°C
16 Pin NSOIC
SP3232EEN-L/TR
-40°C to +85°C
16 Pin NSOIC
SP3232EEP-L
-40°C to +85°C
16 Pin PDIP
SP3232EET-L
-40°C to +85°C
16 Pin WSOIC
SP3232EET-L/TR
-40°C to +85°C
16 Pin WSOIC
SP3232EEY-L
-40°C to +85°C
16 Pin TSSOP
SP3232EEY-L/TR
-40°C to +85°C
16 Pin TSSOP
Note: "/TR" is for tape and Reel option. "-L" is for lead free packaging
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
22
SP3222E/SP3232E_101_031413
REVISION HISTORY
DATE
REVISION DESCRIPTION
08/22/05
--
12/08/10
1.0.0
Convert to Exar Format and update ordering information.
03/14/13
1.0.1
Correct type error to driver Transition-Region Slew Rate
conditions.
Legacy Sipex Datasheet
Notice
EXAR Corporation reserves the right to make changes to any products contained in this publication in order to improve design, performance or reliability. EXAR Corporation assumes no representation that the circuits are free of patent infringement. Charts and schedules contained herein are
only for illustration purposes and may vary depending upon a user's specific application. While the information in this publication has been carefully
checked; no responsibility, however, is assumed for inaccuracies.
EXAR Corporation does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can
reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for
use in such applications unless EXAR Corporation receives, in writting, assurances to its satisfaction that: (a) the risk of injury or damage has been
minimized ; (b) the user assumes all such risks; (c) potential liability of EXAR Corporation is adequately protected under the circumstances.
Copyright 2013 EXAR Corporation
Datasheet March 2013
For technical questions please email Exar's Serial Technical Support group at: [email protected]
Reproduction, in part or whole, without the prior written consent of EXAR Corporation is prohibited.
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
23
SP3222E/SP3232E_101_031413