SQJ962EP www.vishay.com Vishay Siliconix Automotive Dual N-Channel 60 V (D-S) 175 °C MOSFET FEATURES PRODUCT SUMMARY VDS (V) • TrenchFET® Power MOSFET • AEC-Q101 Qualified • 100 % Rg and UIS Tested 60 RDS(on) () at VGS = 10 V 0.060 RDS(on) () at VGS = 4.5 V 0.080 ID (A) per leg 8 Configuration Dual • Material categorization: For definitions of compliance please see www.vishay.com/doc?99912 PowerPAK® SO-8L Dual D1 m 5m 6.1 D2 5.1 3m m D 2 G1 D 1 4 G2 S2 G2 3 2 G1 1 S1 S1 Bottom View N-Channel MOSFET S2 N-Channel MOSFET ORDERING INFORMATION Package PowerPAK SO-8L Lead (Pb)-free and Halogen-free SQJ962EP-T1-GE3 ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted) PARAMETER SYMBOL LIMIT Drain-Source Voltage VDS 60 Gate-Source Voltage VGS ± 20 Continuous Drain Currenta TC = 25 °C TC = 125 °C Continuous Source Current (Diode Conduction)a Pulsed Drain Currentb Single Pulse Avalanche Current Single Pulse Avalanche Energy Maximum Power Dissipationb L = 0.1 mH TC = 25 °C TC = 125 °C ID IDM 32 IAS 10 TJ, Tstg Operating Junction and Storage Temperature Range 8 8 PD Soldering Recommendations (Peak Temperature)d, e V 8 IS EAS UNIT 5 25 8 - 55 to + 175 260 A mJ W °C THERMAL RESISTANCE RATINGS PARAMETER Junction-to-Ambient Junction-to-Case (Drain) PCB Mountc SYMBOL LIMIT RthJA 85 RthJC 6 UNIT °C/W Notes a. Package limited. b. Pulse test; pulse width 300 μs, duty cycle 2 %. c. When mounted on 1" square PCB (FR4 material). d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8L. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection.. e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components. S12-2198-Rev. C, 24-Sep-12 Document Number: 67018 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SQJ962EP www.vishay.com Vishay Siliconix SPECIFICATIONS (TC = 25 °C, unless otherwise noted) PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT Static Drain-Source Breakdown Voltage Gate-Source Threshold Voltage Gate-Source Leakage VDS VGS = 0 V, ID = 250 μA 60 - - VGS(th) VDS = VGS, ID = 250 μA 1.5 2.0 2.5 VDS = 0 V, VGS = ± 20 V IGSS - - ± 100 VGS = 0 V VDS = 60 V - - 1 - - 50 Zero Gate Voltage Drain Current IDSS VGS = 0 V VDS = 60 V, TJ = 125 °C VGS = 0 V VDS = 60 V, TJ = 175 °C - - 150 On-State Drain Currenta ID(on) VGS = 10 V VDS5 V 15 - - VGS = 10 V ID = 4.3 A - 0.046 0.060 VGS = 10 V ID = 4.3 A, TJ = 125 °C - - 0.102 VGS = 10 V ID = 4.3 A, TJ = 175 °C - - 0.127 VGS = 4.5 V ID = 3.5 A Drain-Source On-State Resistancea Forward Transconductanceb RDS(on) gfs VDS = 15 V, ID = 4.3 A - 0.060 0.080 - 10 - - 379 475 - 72 90 V nA μA A S Dynamicb Input Capacitance Ciss Output Capacitance Coss Reverse Transfer Capacitance Crss - 32 40 Total Gate Chargec Qg - 8.5 14 - 1.4 - - 3.3 - f = 1 MHz 2.25 4.50 6.75 - 5 8 VDD = 30 V, RL = 30 ID 1 A, VGEN = 10 V, Rg = 1 - 11 17 - 16 24 - 6 9 Gate-Source Chargec Qgs Gate-Drain Chargec Qgd Gate Resistance Rg Turn-On Delay Timec Rise Timec Turn-Off Delay Timec Fall Timec VGS = 0 V VGS = 10 V VDS = 25 V, f = 1 MHz VDS = 30 V, ID = 4.5 A td(on) tr td(off) tf pF nC ns Source-Drain Diode Ratings and Characteristicsb Pulsed Currenta ISM Forward Voltage VSD IF = 3.5 A, VGS = 0 V - - 32 A - 0.8 1.1 V Notes a. Pulse test; pulse width 300 μs, duty cycle 2 %. b. Guaranteed by design, not subject to production testing. c. Independent of operating temperature. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. S12-2198-Rev. C, 24-Sep-12 Document Number: 67018 2 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SQJ962EP www.vishay.com Vishay Siliconix TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise noted) 20 20 VGS = 10 V thru 5 V 16 ID - Drain Current (A) ID - Drain Current (A) 16 VGS = 4 V 12 8 12 TC = 25 °C 8 4 4 VGS = 3 V TC = 125 °C 1 2 3 4 0 5 4 6 8 VDS - Drain-to-Source Voltage (V) Output Characteristics Transfer Characteristics 2.0 20 1.6 16 1.2 TC = 25 °C 0.8 0.4 TC = 125 °C 1 2 10 TC = - 55 °C TC = 25 °C 12 TC = 125 °C 8 4 TC = - 55 °C 0.0 0 2 VGS - Gate-to-Source Voltage (V) gfs - Transconductance (S) ID - Drain Current (A) 0 3 4 0 5 0 3 6 9 12 VGS - Gate-to-Source Voltage (V) ID - Drain Current (A) Transfer Characteristics Transconductance 15 600 0.24 0.21 500 0.18 C - Capacitance (pF) RDS(on) - On-Resistance (Ω) TC = - 55 °C 0 0 0.15 0.12 VGS = 4.5 V 0.09 Ciss 400 300 200 0.06 Coss 0.03 100 VGS = 10 V 0.00 0 4 8 12 16 ID - Drain Current (A) On-Resistance vs. Drain Current S12-2198-Rev. C, 24-Sep-12 20 Crss 0 0 10 20 30 40 50 60 VDS - Drain-to-Source Voltage (V) Capacitance Document Number: 67018 3 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SQJ962EP www.vishay.com Vishay Siliconix TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise noted) 10 2.5 2.1 RDS(on) - On-Resistance (Normalized) VGS - Gate-to-Source Voltage (V) ID = 4.3 A ID = 5 A VDS = 30 V 8 6 4 2 VGS = 10 V 1.7 VGS = 4.5 V 1.3 0.9 0 0 2 4 6 8 0.5 - 50 - 25 10 0 Qg - Total Gate Charge (nC) 100 0.25 10 0.20 RDS(on) - On-Resistance (Ω) IS - Source Current (A) 75 100 125 150 175 On-Resistance vs. Junction Temperature TJ = 150 °C 1 0.1 TJ = 25 °C 0.01 0.15 TJ = 150 °C 0.10 0.05 TJ = 25 °C 0.00 0.2 0.4 0.6 0.8 1.0 1.2 0 2 VSD - Source-to-Drain Voltage (V) 6 8 10 VGS - Gate-to-Source Voltage (V) 77 0.6 VDS - Drain-to-Source Voltage (V) 0.3 0.0 ID = 5 mA - 0.3 ID = 250 μA - 0.6 - 0.9 - 1.2 - 50 - 25 4 On-Resistance vs. Gate-to-Source Voltage Source Drain Diode Forward Voltage VGS(th) Variance (V) 50 TJ - Junction Temperature (°C) Gate Charge 0.001 0.0 25 0 25 50 75 100 125 150 175 74 ID = 1 mA 71 68 65 62 - 50 - 25 0 25 50 75 100 125 150 175 TJ - Temperature (°C) TJ - Junction Temperature (°C) Threshold Voltage Drain Source Breakdown vs. Junction Temperature S12-2198-Rev. C, 24-Sep-12 Document Number: 67018 4 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SQJ962EP www.vishay.com Vishay Siliconix THERMAL RATINGS (TA = 25 °C, unless otherwise noted) 100 ID - Drain Current (A) IDM Limited ID Limited 10 100 μs 1 ms 10 ms 100 ms 1 s,10 s, DC 1 Limited by RDS(on)* 0.1 BVDSS Limited TC = 25 °C Single Pulse 0.01 0.01 0.1 1 10 100 VDS - Drain-to-Source Voltage (V) * VGS > minimum VGS at which RDS(on) is specified Safe Operating Area Normalized Effective Transient Thermal Impedance 2 1 Duty Cycle = 0.5 0.2 Notes: 0.1 PDM 0.1 0.05 t1 t2 1 . Duty Cycle, D = 0.02 2. Per Unit Base = R thJA = 85 °C/W 3. T JM - TA = PDMZthJA(t) Single Pulse 0.01 10- 4 t1 t2 10- 3 4. Surface Mounted 10- 2 10- 1 1 10 100 600 Square Wave Pulse Duration (s) Normalized Thermal Transient Impedance, Junction-to-Ambient S12-2198-Rev. C, 24-Sep-12 Document Number: 67018 5 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SQJ962EP www.vishay.com Vishay Siliconix THERMAL RATINGS (TA = 25 °C, unless otherwise noted) 2 Normalized Effective Transient Thermal Impedance 1 Duty Cycle = 0.5 0.2 0.1 0.1 0.05 0.02 Single Pulse 0.01 10-5 10-4 10-3 10-2 10-1 1 Square Wave Pulse Duration (s) Normalized Thermal Transient Impedance, Junction-to-Case Note • The characteristics shown in the two graphs - Normalized Transient Thermal Impedance Junction-to-Ambient (25 °C) - Normalized Transient Thermal Impedance Junction-to-Case (25 °C) are given for general guidelines only to enable the user to get a “ball park” indication of part capabilities. The data are extracted from single pulse transient thermal impedance characteristics which are developed from empirical measurements. The latter is valid for the part mounted on printed circuit board - FR4, size 1" x 1" x 0.062", double sided with 2 oz. copper, 100 % on both sides. The part capabilities can widely vary depending on actual application parameters and operating conditions. Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?67018. S12-2198-Rev. C, 24-Sep-12 Document Number: 67018 6 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Package Information www.vishay.com Vishay Siliconix PowerPAK® SO-8L Case Outline Revision: 27-Aug-12 Document Number: 69003 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Package Information www.vishay.com Vishay Siliconix MILLIMETERS DIM. INCHES MIN. NOM. MAX. MIN. NOM. MAX. A 1.00 1.07 1.14 0.039 0.042 0.045 A1 0.00 - 0.127 0.00 - 0.005 b 0.33 0.41 0.48 0.013 0.016 0.019 b1 0.44 0.51 0.58 0.017 0.020 0.023 b2 4.80 4.90 5.00 0.189 0.193 0.197 b3 0.094 0.004 b4 0.47 0.019 c 0.20 0.25 0.30 0.008 0.010 0.012 D 5.00 5.13 5.25 0.197 0.202 0.207 D1 4.80 4.90 5.00 0.189 0.193 0.197 D2 3.86 3.96 4.06 0.152 0.156 0.160 D3 1.63 1.73 1.83 0.064 0.068 0.072 e 1.27 BSC 0.050 BSC E 6.05 6.15 6.25 0.238 0.242 0.246 E1 4.27 4.37 4.47 0.168 0.172 0.176 E2 (for Al product) 2.75 2.85 2.95 0.108 0.112 0.116 E2 (for other product) 3.18 3.28 3.38 0.125 0.129 0.133 0.006 F - - 0.15 - - L 0.62 0.72 0.82 0.024 0.028 0.032 L1 0.92 1.07 1.22 0.036 0.042 0.048 K 0.51 W 0.23 0.009 W1 0.41 0.016 W2 2.82 0.111 W3 2.96 0° - 0.020 0.117 10° 0° - 10° ECN: C12-0026-Rev. B, 27-Aug-12 DWG: 5976 Note • Millimeters will gover Revision: 27-Aug-12 Document Number: 69003 2 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. 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