STGB6NC60H N-channel 600V - 7A - D2PAK Very fast PowerMESH™ IGBT General features Type VCES VCE(sat)max @25°C IC @100°C STGB6NC60H 600V <2.5V 7A ■ Low on voltage drop (Vcesat) ■ Low CRES / CIES ratio (no cross-conduction susceptibility) ■ Very soft ultra fast recovery antiparallel diode ■ High frequency operation 3 1 D²PAK Description Using the latest high voltage technology based on a patented strip layout, STMicroelectronics has designed an advaced family of IGBTs, the PowerMESH™ IGBTs, with outstanding performances. The suffix “H” identifies a family optimized for high frequency application in order to achieve very high switching performances (reduced tfall) mantaining a low voltage drop. Internal schematic diagram Applications ■ High frequency inverters ■ SMPS and PFC in both hard switch and resonant topologies ■ Motor drivers Order codes Part number Marking Package Packaging STGB6NC60HT4 GB6NC60H D²PAK Tape & reel July 2006 Rev 2 1/14 www.st.com 14 Contents STGB6NC60H Contents 1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Electrical characteristics (curves) ............................. 6 3 Test circuit 4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5 Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 2/14 ................................................ 9 STGB6NC60H 1 Electrical ratings Electrical ratings Table 1. Symbol Absolute maximum ratings Parameter Value Unit VCES Collector-emitter voltage (VGS = 0) 600 V IC(1) Collector current (continuous) at TC = 25°C 15 A IC(1) Collector current (continuous) at TC = 100°C 7 A Collector current (pulsed) 21 A VGE Gate-emitter voltage ±20 V PTOT Total dissipation at TC = 25°C 56 W Tstg Storage temperature ICM(2) – 55 to 150 °C Tj Operating junction temperature Tl Maximum lead temperature for soldering purpose (for 10sec. 1.6 mm from case) 300 °C Value Unit 2 °C/W 62.5 °C/W 1. Calculated according to the iterative formula:: T –T JMAX C I ( T ) = -----------------------------------------------------------------------------------------------------C C R × V (T , I ) THJ – C CESAT ( MAX ) C C 2. Pulse width limited by max junction temperature Table 2. Symbol Thermal resistance Parameter Rthj-case Thermal resistance junction-case max Rthj-amb Thermal resistance junction-ambient max 3/14 Electrical characteristics 2 STGB6NC60H Electrical characteristics (TCASE=25°C unless otherwise specified) Table 3. Symbol Parameter VBR(CES) Collector-emitter breakdown voltage VCE(sat) Collector-emitter saturation VGE = 15V, IC= 3A voltage VGE= 15V, IC= 3A, Tc= 125°C VGE(th) Gate threshold voltage VCE= VGE, IC= 250 µA ICES Collector cut-off current (VGE = 0) VCE = Max rating,TC= 25°C IGES Gate-emitter leakage current (VCE = 0) VGE = ±20V , VCE= 0 Forward transconductance VCE = 15V, IC= 3A gfs Table 4. Symbol Cies Coes Cres Qg Test conditions IC = 1mA, VGE = 0 Min. Typ. Max. 600 Unit V 1.9 1.7 3.75 VCE = Max rating,TC= 125°C 2.5 V V 5.75 V 10 1 µA mA ±100 nA 3 S Dynamic Parameter Input capacitance Output capacitance Reverse transfer capacitance Test conditions VCE = 25V, f = 1MHz, VGE = 0 VCE = 390V, IC = 3A, Qgc Total gate charge Gate-emitter charge Gate-collector charge ICL Turn-off SOA minimum current Vclamp = 390V, Tj = 150°C, RG = 10Ω, VGE = 15V Qge 4/14 Static VGE = 15V, (see Figure 16) Min. Typ. Max. Unit 205 32 5.5 pF pF pF 13.6 3.4 5.1 nC nC nC 19 A STGB6NC60H Electrical characteristics Table 5. Symbol td(on) tr (di/dt)on td(on) tr (di/dt)on tr(Voff) td(off) tf tr(Voff) td(off) tf Table 6. Symbol Eon(1) Eoff(2) Ets Eon(1) Eoff(2) Ets Switching on/off (inductive load) Parameter Test conditions Turn-on delay time Current rise time Turn-on current slope VCC = 390V, IC = 3A Turn-on delay time Current rise time Turn-on current slope VCC = 390V, IC = 3A Off voltage rise time Turn-off delay time Current fall time VCC = 390V, IC = 3A, Off voltage rise time Turn-off delay time Current fall time VCC = 390V, IC = 3A, Min. RG= 10Ω, VGE = 15V, Tj = 25°C (see Figure 17) RG = 10Ω, VGE = 15V, Tj =125°C (see Figure 17) RGE = 10Ω , VGE = 15V, TJ = 25°C (see Figure 17) RGE = 10Ω , VGE =15V, Tj = 125°C (see Figure 17) Typ. Max. Unit 12 5 612 ns ns A/µs 13 4.3 560 ns ns A/µs 40 76 100 ns ns ns 60 98 124 ns ns ns Switching energy (inductive load) Parameter Test condictions Turn-on switching losses Turn-off switching losses Total switching losses VCC = 390V, IC = 3A Turn-on switching losses Turn-off switching losses Total switching losses VCC = 390V, IC = 3A RG = 10Ω, VGE=15V, Tj =25°C (see Figure 17) RG = 10Ω, VGE = 15V, Tj = 125°C (see Figure 17) Min. Typ. Max. Unit 20 68 88 µJ µJ µJ 37 93 130 µJ µJ µJ 1. Eon is the tun-on losses when a typical diode is used in the test circuit in figure 17. If the IGBT is offered in a package with a co-pak diode, the co-pack diode is used as external diode. IGBTs & Diode are at the same temperature (25°C and 125°C) 2. Turn-off losses include also the tail of the collector current 5/14 Electrical characteristics STGB6NC60H 2.1 Electrical characteristics (curves) Figure 1. Output characterisics Figure 2. Transfer characteristics Figure 3. Transconductance Figure 4. Collector-emitter on voltage vs temperature Figure 5. Gate charge vs gate-source voltage Figure 6. 6/14 Capacitance variations STGB6NC60H Electrical characteristics Figure 7. Normalized gate threshold voltage vs temperature Figure 8. Collector-emitter on voltage vs collector current Figure 9. Normalized breakdown voltage vs temperature Figure 10. Switching losses vs temperature Figure 11. Switching losses vs gate resistance Figure 12. Switching losses vs collector current 7/14 Electrical characteristics Figure 13. Thermal impedance 8/14 STGB6NC60H Figure 14. Turn-off SOA STGB6NC60H 3 Test circuit Test circuit Figure 15. Test circuit for inductive load switching Figure 16. Gate charge test circuit Figure 17. Switching waveform Figure 18. Diode recovery time waveform 9/14 Package mechanical data 4 STGB6NC60H Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com 10/14 STGB6NC60H Package mechanical data D2PAK MECHANICAL DATA TO-247 MECHANICAL DATA mm. inch DIM. MAX. MIN. A MIN. 4.4 TYP 4.6 0.173 TYP. 0.181 MAX. A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.7 0.93 0.027 0.036 B2 1.14 1.7 0.044 0.067 C 0.45 0.6 0.017 0.023 C2 1.23 1.36 0.048 0.053 D 8.95 9.35 0.352 D1 E 8 10 10.4 0.393 4.88 5.28 0.192 0.208 E1 G 0.368 0.315 8.5 0.334 L 15 15.85 0.590 0.625 L2 1.27 1.4 0.050 0.055 L3 1.4 1.75 0.055 0.068 M 2.4 3.2 0.094 0.126 R 0.4 0º 0.015 4º 3 V2 1 11/14 Packaging mechanical data 5 STGB6NC60H Packaging mechanical data D2PAK FOOTPRINT TAPE AND REEL SHIPMENT REEL MECHANICAL DATA DIM. mm MIN. A B 1.5 C 12.8 D 20.2 G 24.4 N 100 T TAPE MECHANICAL DATA DIM. mm MIN. MAX. MIN. A0 10.5 10.7 0.413 0.421 B0 15.7 15.9 0.618 0.626 D 1.5 1.6 0.059 0.063 D1 1.59 1.61 0.062 0.063 E 1.65 1.85 0.065 0.073 F 11.4 11.6 0.449 0.456 K0 4.8 5.0 0.189 0.197 P0 3.9 4.1 0.153 0.161 P1 11.9 12.1 0.468 0.476 P2 1.9 2.1 0.075 0.082 MAX. R 50 1.574 T 0.25 0.35 0.0098 0.0137 W 23.7 24.3 * on sales type 12/14 inch 0.933 0.956 inch MAX. MIN. MAX. 330 12.992 13.2 0.504 0.520 26.4 0.960 1.039 0.059 0795 3.937 30.4 1.197 BASE QTY BULK QTY 1000 1000 STGB6NC60H 6 Revision history Revision history Table 7. Revision history Date Revision Changes 18-Nov-2005 1 First Release 27-jul-2006 2 New template 13/14 STGB6NC60H Please Read Carefully: Information in this document is provided solely in connection with ST products. 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