STPS30H60C-Y Automotive power Schottky rectifier Features A1 ■ Very small conduction losses ■ Negligible switching losses ■ Extremely fast switching ■ AEC-Q101 qualified K A2 Pin 10 K Description K 30 A dual center tab Schottky rectifier suitable for automotive applications. Pin 11 K Pin 1 A1 Package in PowerSO-20 (slug up), this device is especially intented for use in a low voltage applications. A2 Pin 20 K PowerSO-20 (slug up) STPS30H60CKY-TR Table 1. December 2010 Doc ID 18295 Rev 1 Device summary Symbol Value IF(AV) 2 x 15 A VRRM 60 V Tj(max) 150 °C VF(max) 0.645 V 1/7 www.st.com 7 Characteristics 1 STPS30H60C-Y Characteristics Table 2. Absolute rating (limiting value, per diode) Symbol VRRM Parameter Repetitive peak reverse voltage IF(RMS)(1) Forward rms current IF(AV) (1) IFSM(1) Average forward current Value Unit 60 V 45 A Tc = 140 °C, δ = 0.5 Per diode square pulse 15 Tc = 135 °C, δ = 0.5 Per device square pulse 30 250 A Storage temperature range -65 to +175 °C Tj Operating junction temperature range -40 to +150 °C TR Recommended reflow soldering temperature range 245 +0/-5 °C Value Unit 0.95 0.61 °C/W 0.27 °C/W Tstg Surge non repetitive forward current A tp = 10 ms Sinusoidal 1. All anode pins (A1, A2) must be connected Table 3. Thermal parameters Symbol Parameter Rth(j-c) Junction to case Rth(c) Coupling Per diode Per device When diodes 1 and 2 are used simultaneously: ΔTj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c) Table 4. Symbol IR(1) VF(1) (2) Static electrical characteristics (per diode) Parameter Reverse leakage current Forward voltage drop Test conditions Tj = 25 °C Tj = 125 °C Min. Typ. VR = VRRM Unit 150 µA 45 mA Tj = 25 °C IF = 15 A 0.580 Tj = 125 °C IF = 15 A 0.515 Tj = 25 °C IF = 30 A 0.700 Tj = 125 °C IF = 30 A 0.645 1. Pulse test : tp = 380 µs, d < 2% 2. All anode pins (A1, A2) must be connected To evaluate the maximum conduction losses use the following equation: P = 0.385 x IF(AV) + 0.00867 x IF2(RMS) 2/7 Max. Doc ID 18295 Rev 1 V STPS30H60C-Y Figure 1. 12 Characteristics Average forward power dissipation Figure 2. versus average forward current (per diode, all anode pins connected) PF(AV)(W) 18 δ = 0.2 δ = 0.1 δ = 0.05 δ=1 δ = 0.5 Average forward current versus ambient temperature (per diode, all anode pins connected) (δ = 0.5) IF(AV)(A) Rth(j-a) = Rth(j-c) 16 10 14 12 8 10 6 Rth(j-a) = 10 °C/W 8 6 4 4 T 2 T 2 δ = tp / T 0 0 2 4 Figure 3. 300 6 8 10 12 IF(AV)(A) tp 14 16 18 IM(A) (per diode, all anode pins connected) Tamb(°C) tp 25 Figure 4. 1.0 50 75 100 125 150 Relative variation of thermal impedance junction to case versus pulse duration Zth(j-c)/Rth(j-c) (per diode, all anode pins connected) 0.9 250 0.8 0.7 200 0.6 Tc = 25 °C 150 0.5 Tc = 75 °C 0.4 100 0.2 IM 0 1.E-03 0.1 t δ = 0.5 t(s) 1.E-02 Figure 5. 1.E+02 Single pulse 0.3 Tc = 125 °C 50 0 20 Non repetitive surge peak forward current versus overload duration (maximum values) δ = tp / T 0 1.E-01 1.E+00 0.0 1.E-04 Reverse leakage current versus Figure 6. reverse voltage applied (per diode) (typical values) IR(mA) 10.0 Tj = 150 °C tp(s) 1.E-03 1.E-02 1.E-01 1.E+01 Junction capacitance versus reverse voltage applied (per diode) (typical values) C(nF) F = 1 MHz Vosc = 30 mVRMS Tj = 25 °C Tj = 125 °C 1.E+01 1.E+00 Tj = 100 °C 1.E+00 Tj = 75 °C 1.E-01 1.0 Tj = 50 °C Tj = 25 °C 1.E-02 VR(V) 1.E-03 0 5 10 15 20 25 30 35 40 45 50 55 60 VR(V) 0.1 1 Doc ID 18295 Rev 1 10 100 3/7 Characteristics Figure 7. 30 STPS30H60C-Y Forward voltage drop versus forward current (per diode, all anode pins connected, low level) IFM(A) Figure 8. 100.0 IFM(A) Tj = 125 °C (Maximum values) Tj = 125 °C (Maximum values) 25 10.0 Tj = 125 °C (Typical values) 20 Forward voltage drop versus forward current (per diode, all anode pins connected, high level) Tj = 125 °C (Typical values) 15 Tj = 25 °C (Maximum values) 10 Tj = 25 °C (Maximum values) 1.0 5 0 0.0 4/7 VFM(V) 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.1 0.0 VFM(V) 0.1 Doc ID 18295 Rev 1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 STPS30H60C-Y Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 5. PowerSO-20 (slug up) dimensions Dimensions Ref Millimeter C ( C O P L A N A R IT Y ) - C - G S 0 .3 5 P SO 20D M E G a g e P la n e D E T A IL A Max Min 3.5 0.128 3.3 0.118 1 0.031 0.25 0.006 Typ Max 3.25 A2 3 A4 0.8 A5 0.15 a1 0.03 -0.04 0.0012 -0.0016 b 0.4 0.53 0.016 0.021 c 0.23 0.32 0.009 0.012 D(1) 15.8 16 0.622 0.63 D1 9.4 9.8 0.37 0.385 3.15 0.2 1 0.138 0.124 0.13 0.039 0.008 0.01 0.039 E 13.9 14.5 0.547 0.57 E1(1) 10.9 11.1 0.429 0.437 10 11 M Typ Inch A D2 E1 D 2 (x 2 ) A2 A A5 D E T A IL A L E E2 E3 V R a1 c A4 S E A T IN G P L A N E Min 2.9 0.114 D D1 e3 H e E2 E3 5.8 e 1.12 E2 h x 45° b N 1 20 e3 N 2 Package information 1.27 6.2 0.228 1.42 0.044 11.43 0.244 0.05 0.056 0.45 G 0 0.1 0 0.004 H 15.5 15.9 0.61 0.625 h L 1.1 0.8 1.1 N 0.043 0.031 0.043 10° R 10° 0.6 0.024 S 0° 8° 0° 8° V 5° 7° 5° 7° 1. These measurements do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm (0.006”). Critical dimensions: E, a1, e, and G. Doc ID 18295 Rev 1 5/7 Ordering information 3 Ordering information Table 6. 4 Ordering information Order code Marking Package Weight Base qty Delivery mode STPS30H60CKY-TR PS30H60CY PowerSO-20 1.93 g 600 Tape and reel Revision history Table 7. 6/7 STPS30H60C-Y Document revision history Date Revision 02-Dic-2010 1 Changes First issue. Doc ID 18295 Rev 1 STPS30H60C-Y Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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