STTH5R06D/FP/B/G ® TURBO 2 ULTRAFAST HIGH VOLTAGE RECTIFIER K MAIN PRODUCT CHARACTERISTICS IF(AV) 5A VRRM 600 V IRM (typ.) 5A Tj (max) 175 °C VF (max) 1.8 V trr (max) 40 ns A TO-220FPAC STTH5R06FP FEATURES AND BENEFITS ■ ■ ■ ■ A K TO-220AC STTH5R06D K K Ultrafast switching Low reverse recovery current Reduces switching losses Low thermal resistance K A A NC DESCRIPTION The STTH5R06D/FP/B/G, which is using ST Turbo 2 600V technology, is specially suited as boost diode in continuous mode power factor corrections and hard switching conditions. The device (available in TO-220AC, TO-220FPAC, D2PAK and DPAK) is also intended for use as a free wheeling diode in power supplies and other power switching applications. DPAK STTH5R06B NC 2 D PAK STTH5R06G ABSOLUTE RATINGS (limiting values) Symbol Parameter Value Unit 600 V TO-220AC / TO-220FPAC / D2PAK 20 A DPAK 10 A TO-220AC Tc = 105°C δ = 0.5 TO-220FPAC DPAK / D2PAK 5 A 50 A - 65 + 175 °C 175 °C VRRM Repetitive peak reverse voltage IF(RMS) RMS forward current IF(AV) Average forward current IFSM Surge non repetitive forward current Tstg Storage temperature range Tj Maximum operating junction temperature October 2002 - Ed: 3B tp = 10 ms Sinusoidal 1/8 STTH5R06D/FP/B/G THERMAL RESISTANCES Symbol Rth (j-c) Parameter Value Unit TO-220AC / DPAK / D PAK 3.0 °C/W TO-220FPAC 5.5 2 Junction to case STATIC ELECTRICAL CHARACTERISTICS Symbol IR VF Parameter Tests conditions Reverse leakage current VR = 600V Forward voltage drop IF = 5 A Min. Typ. Max. Unit 20 µA Tj = 25°C Tj = 125°C 25 250 Tj = 25°C 2.9 Tj = 125°C 1.4 V 1.8 To evaluate the maximum conduction losses use the following equation : P = 1.16 x IF(AV) + 0.128 IF2(RMS) DYNAMIC ELECTRICAL CHARACTERISTICS Symbol Tests conditions IF = 0.5 A Irr = 0.25 A IR = 1A trr Min. Typ. Tj = 25°C IF = 1 A dIF/dt = - 50 A/µs VR = 30V IRM S factor Max. Unit 25 ns 40 VR = 400 V IF = 5A dIF/dt = - 200A/µs Tj = 125°C 5.0 6.0 A 0.35 Qrr 110 tfr IF = 5 A dIF/dt = 40 A/µs VFR = 1.1 x VFmax VFP nC Tj = 25°C Fig. 1: Conduction losses versus average current. 150 ns 4.5 V Fig. 2: Forward voltage drop versus forward current. IFM(A) P(W) 13 δ = 0.1 δ = 0.05 12 δ = 0.2 50 δ = 0.5 45 11 40 δ=1 10 9 35 8 30 7 Tj=125°C (Maximum values) 25 6 Tj=125°C (Typical values) 20 5 4 15 T 3 Tj=25°C (Maximum values) 10 2 IF(av)(A) 1 δ=tp/T 0 0 2/8 1 2 3 4 5 6 5 VFM(V) tp 0 7 0 1 2 3 4 5 6 STTH5R06D/FP/B/G Fig. 3-1: Relative variation of thermal impedance junction to case versus pulse duration (TO-220AC, DPAK, D2PAK). Fig. 3-2: Relative variation of thermal impedance junction to case versus pulse duration (TO-220FPAC). Zth(j-c)/Rth(j-c) Zth(j-c)/Rth(j-c) 1.0 1.0 0.9 0.9 0.8 0.8 0.7 0.7 δ = 0.5 0.6 0.6 0.5 δ = 0.5 0.5 0.4 δ = 0.2 0.3 δ = 0.1 0.4 δ = 0.2 0.3 T 0.2 Single pulse 0.1 tp(s) δ=tp/T 0.0 1.E-03 1.E-02 0.1 tp 1.E-01 T δ = 0.1 0.2 tp(s) Single pulse 1.E+00 Fig. 4: Peak reverse recovery current versus dIF/dt (90% confidence). δ=tp/T 0.0 1.E-03 1.E-02 1.E-01 tp 1.E+00 1.E+01 Fig. 5: Reverse recovery time versus dIF/dt (90% confidence). IRM(A) trr(ns) 22 80 VR=400V Tj=125°C 20 IF=2 x IF(av) VR=400V Tj=125°C 70 18 60 16 IF=2 x IF(av) IF=IF(av) 14 50 IF=0.5 x IF(av) IF=IF(av) 12 IF=0.5 x IF(av) 40 IF=0.25 x IF(av) 10 30 8 6 20 4 2 10 dIF/dt(A/µs) dIF/dt(A/µs) 0 0 0 200 400 600 800 1000 Fig. 6: Reverse recovery charges versus dIF/dt (90% confidence). 0 200 400 600 800 1000 Fig. 7: Softness factor versus dIF/dt (typical values). Qrr(nC) S factor 0.70 350 VR=400V Tj=125°C 300 IF=IF(av) VR=400V Tj=125°C 0.65 IF=2 x IF(av) 0.60 0.55 250 IF=IF(av) 200 0.50 0.45 IF=0.5 x IF(av) 0.40 150 0.35 0.30 100 0.25 0.20 50 dIF/dt(A/µs) 0.15 dIF/dt(A/µs) 0.10 0 0 200 400 600 800 1000 0 200 400 600 800 1000 3/8 STTH5R06D/FP/B/G Fig. 8: Relative variation of dynamic parameters versus junction temperature. Fig. 9: Transient peak forward voltage versus dIF/dt (90% confidence). 2.50 20 VFP(V) IF=IF(av) VR=400V Tj=125°C 2.25 IF=IF(av) Tj=125°C 18 S factor 2.00 16 1.75 14 1.50 12 1.25 10 1.00 8 0.75 IRM 6 0.50 4 0.25 Tj(°C) Qrr 2 Reference: Tj=125°C dIF/dt(A/µs) 0.00 25 50 75 100 125 0 0 Fig. 10: Forward recovery time versus dIF/dt (90% confidence). 100 200 300 400 500 Fig. 11: Junction capacitance versus reverse voltage applied (typical values). C(pF) tfr(ns) 120 100 IF=IF(av) VFR=1.1 x VF max. Tj=125°C 100 F=1MHz Vosc=30mV Tj=25°C 80 60 40 20 dIF/dt(A/µs) VR(V) 0 10 0 100 200 300 400 500 Fig. 12: Thermal resistance junction to ambient versus copper surface under tab (epoxy printed circuit board FR4, Cu=35µm) (DPAK and D2PAK). Rth(j-a)(°C/W) 100 90 80 70 60 50 40 30 20 10 S(cm²) 0 0 4/8 2 4 6 8 10 12 14 16 18 20 1 10 100 1000 STTH5R06D/FP/B/G PACKAGE MECHANICAL DATA TO-220FPAC DIMENSIONS REF. Millimeters Inches A B D E F F1 G G1 H L2 L3 L4 L5 L6 L7 Dia. Min. Max. 4.4 4.6 2.5 2.7 2.5 2.75 0.45 0.70 0.75 1 1.15 1.70 4.95 5.20 2.4 2.7 10 10.4 16 Typ. 28.6 30.6 9.8 10.6 2.9 3.6 15.9 16.4 9.00 9.30 3.00 3.20 Min. Max. 0.173 0.181 0.098 0.106 0.098 0.108 0.018 0.027 0.030 0.039 0.045 0.067 0.195 0.205 0.094 0.106 0.393 0.409 0.63 Typ. 1.126 1.205 0.386 0.417 0.114 0.142 0.626 0.646 0.354 0.366 0.118 0.126 REF. Millimeters A H B Dia L6 L2 L7 L3 L5 D F1 L4 F E G1 G PACKAGE MECHANICAL DATA TO-220AC DIMENSIONS A H2 C L5 L7 ØI L6 L2 D L9 F1 M F E G Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 H2 10.00 10.40 0.393 0.409 L2 L4 Inches 16.40 typ. 0.645 typ. L4 13.00 14.00 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 M Diam. I 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 5/8 STTH5R06D/FP/B/G PACKAGE MECHANICAL DATA DPAK DIMENSIONS REF. 6.7 6.7 3 3 1.6 1.6 2.3 6/8 2.3 Inches Max Min. Max. A 2.20 2.40 0.086 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 B 0.64 0.90 0.025 0.035 B2 5.20 5.40 0.204 0.212 C 0.45 0.60 0.017 0.023 C2 0.48 0.60 0.018 0.023 D 6.00 6.20 0.236 0.244 E 6.40 6.60 0.251 0.259 G 4.40 4.60 0.173 0.181 H 9.35 10.10 0.368 0.397 L2 FOOT PRINT DIMENSIONS (in millimeters) DPAK Millimeters Min. 0.80 typ. 0.031 typ. L4 0.60 1.00 0.023 0.039 V2 0° 8° 0° 8° STTH5R06D/FP/B/G PACKAGE MECHANICAL DATA D2PAK DIMENSIONS REF. A E C2 L2 D L L3 A1 B2 R C B G A2 M * V2 Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.14 1.70 0.045 0.067 C 0.45 0.60 0.017 0.024 C2 1.23 1.36 0.048 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.40 0.393 0.409 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 M 2.40 3.20 0.094 0.126 R * FLAT ZONE NO LESS THAN 2mm Millimeters V2 0.40 typ. 0° 8° 0.016 typ. 0° 8° FOOT PRINT DIMENSIONS (in millimeters) 16.90 10.30 5.08 1.30 3.70 8.90 7/8 STTH5R06D/FP/B/G Ordering code Marking Package Weight Base qty Delivery mode STTH5R06D STTH5R06D TO-220AC 1.9 g 50 Tube STTH5R06FP STTH5R06FP TO-220FPAC 1.7 g 50 Tube STTH5R06B STTH5R06B DPAK 0.3 g 75 Tube STTH5R06B-TR STTH5R06B DPAK 0.3 g 2500 Tape & reel STTH5R06G STTH5R06G D2PAK 1.48 g 50 Tube 1.48 g 1000 Tape & reel STTH5R06G-TR ■ ■ ■ ■ STTH5R06G 2 D PAK Cooling method: by conduction (C) Recommended torque value (TO-220AC): 0.55 Nm Maximum torque value (TO-220AC / TO-220FPAC): 0.7 Nm Epoxy meets UL 94,V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics © 2002 STMicroelectronics - Printed in Italy - All rights reserved. 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