STTH208/U ® HIGH VOLTAGE ULTRAFAST RECTIFIER MAIN PRODUCT CHARACTERISTICS IF(AV) 2A VRRM 800 V Tj (max) 175 °C VF (max) 1.25 V FEATURES AND BENEFITS ■ ■ ■ ■ ■ Low forward voltage drop High reliability High surge current capability Soft switching for reduced EMI disturbances Planar technology DO-15 STTH208 DESCRIPTION The STTH208, which is using ST ultrafast high voltage planar technology, is specially suited for free-wheeling, clamping, snubbering, demagnetization in power supplies and other power switching applications. SMB STTH208U ABSOLUTE RATINGS (limiting values) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 800 V V(RMS) RMS voltage 560 V IF(AV) Average forward current DO-15 2 A SMB 2 DO-15 45 SMB 35 Tl = 60°C Tl = 100°C IFSM Tstg Tj Forward surge current t = 8.3 ms Storage temperature range Maximum operating junction temperature January 2003 - Ed: 1 δ =0.5 δ =0.5 A - 50 + 175 °C + 175 °C 1/5 STTH208/U THERMAL PARAMETERS Symbol Rth (j-l) Rth (j-a) Parameter Junction to lead L = 10 mm Junction to ambient L = 10 mm Value Unit DO-15 40 °C/W SMB 25 DO-15 110 STATIC ELECTRICAL CHARACTERISTICS Symbol Parameter IR Reverse leakage current VF Forward voltage drop Tests conditions VR = 800V IF = 2 A Min. Max. Unit Tj = 25°C 5 µA Tj = 125°C 50 Tj = 25°C 1.65 Tj = 150°C Typ. 0.89 V 1.25 To evaluate the maximum conduction losses use the following equation : P = 1.05 x IF(AV) + 0.10 x IF2(RMS) DYNAMIC ELECTRICAL CHARACTERISTICS Symbol Tests conditions Min. Typ. Max. Unit trr Reverse recovery time IF = 0.5 A Irr = 0.25 A IR = 1A Tj = 25°C 75 ns tfr Forward recovery time IF = 2 A dIF/dt = 50 A/µs VFR = 1.1 x VF max Tj = 25°C 200 ns 9 V VFP 2/5 Parameter Forward recovery voltage STTH208/U Fig. 1: Conduction losses versus average current. Fig. 2: Forward voltage drop versus forward current. IFM(A) P(W) 100.0 3.5 δ = 0.1 3.0 δ = 0.2 δ = 0.5 Tj=150°C (maximum values) δ = 0.05 2.5 Tj=150°C (typical values) 10.0 δ=1 2.0 1.5 Tj=25°C (maximum values) 1.0 1.0 T 0.5 IF(AV)(A) δ=tp/T 0.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0.1 2.2 2.4 Fig. 3-1: Relative variation of thermal impedance junction ambient versus pulse duration (epoxy FR4, Lleads = 10mm) (DO-15). 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50 2.75 3.00 Fig. 3-2: Relative variation of thermal impedance junction ambient versus pulse duration (epoxy FR4, S=1cm2) (SMB). Zth(j-c)/Rth(j-c) Zth(j-c)/Rth(j-c) 1.0 1.0 0.9 0.9 0.8 0.8 0.7 0.7 0.6 VFM(V) tp 0.6 δ = 0.5 δ = 0.5 0.5 0.5 0.4 0.4 0.3 0.3 δ = 0.2 0.2 T δ = 0.1 0.1 tp(s) Single pulse 0.0 1.E-01 1.E+00 δ=tp/T 1.E+01 0.2 δ = 0.2 δ = 0.1 0.1 tp T tp(s) Single pulse 0.0 1.E+02 1.E+03 1.E-01 1.E+00 1.E+01 δ=tp/T 1.E+02 tp 1.E+03 Fig. 4: Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed circuit board FR4, copper thickness: 35µm). Rth(j-a)(°C/W) 110 100 90 80 SMB 70 60 DO-15 Lleads=10mm 50 40 30 20 10 S(cm²) 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 3/5 STTH208/U PACKAGE MECHANICAL DATA SMB DIMENSIONS REF. E1 D E A1 A2 C L b FOOTPRINT (in millimeters) 2.3 1.52 4/5 2.75 1.52 Millimeters Inches Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.41 0.006 0.016 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 D 3.30 3.95 0.130 0.156 L 0.75 1.60 0.030 0.063 STTH208/U PACKAGE MECHANICAL DATA DO-15 DIMENSIONS C D ■ REF. C A B Millimeters Inches Min. Max. Min. Max. A 6.05 6.75 0.238 0.266 B 2.95 3.53 0.116 0.139 C 26 31 1.024 1.220 D 0.71 0.88 0.028 0.035 Ordering code Marking Package Weight Base qty Delivery mode STTH208 STTH208 DO-15 0.4 g 1000 Ammopack STTH208U U08 SMB 0.11 g 2500 Tape & reel STTH208RL STTH208 DO-15 0.4 g 6000 Tape & reel Epoxy meets UL 94,V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics © 2003 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com 5/5