T2035H Series Snubberless™ high temperature 20 A Triacs Main features Symbol Value Unit IT(RMS) 20 A VDRM/VRRM 600 V IGT (Q1) 35 mA Tj MAX 150 °C A2 G Description A1 Specifically designed to operate at 150° C, the new 20 A T2035H Triacs provide an enhanced performance in terms of power loss and thermal dissipation. This facilitates the optimization of heatsink dimensioning, leading to improved space and cost effectiveness when compared to electromechanical solutions. A2 TO-220AB T2035H-T A2 G A1 A2 D2PAK T2035H-G Based on ST Snubberless™ technology, the T2035H series offers high commutation switching capabilities and high noise immunity levels on the full range of Tj. The T2035H series facilitates the optimization of the control of universal motors and inductive loads found in appliances such as vacuum cleaners, and washing machines. Order code The T2035H Triacs are also suitable for use in high temperature environment found in hot appliances such as cookers, ovens, hobs, electric heaters, and coffee machines. Part number Marking T2035H-600G T2035H-600G T2035H-600G-TR T2035H-600G T2035H-600TRG T2035H-600T TM: Snubberless is a trademark of STMicroelectronics July 2006 Rev 1 1/10 www.st.com 10 Characteristics T2035H Series 1 Characteristics Table 1. Absolute maximum ratings Symbol IT(RMS) Parameter I²t Tc = 127° C 20 A F = 60 Hz t = 16.7 ms 210 F = 50 Hz t = 20 ms 200 A I²t Value for fusing Critical rate of rise of on-state current IG = 2xIGT, tr ≤100 ns dI/dt VDSM/VRSM IGM F = 120 Hz tp = 20 µs Average gate power dissipation Tstg Tj 283 A2s Tj = 125° C 50 A/µs Tj = 25° C 700 V Tj = 150° C 4 A Tj = 150° C 1 W -40 to +150 -30 to +150 °C 260 °C tp = 10 ms Non repetitive surge peak off state voltage Peak gate current PG(AV) Storage junction temperature range Operating junction temperature range TI Maximum leads soldering temperature during 10 s Table 2. Electrical characteristics (Tj = 25° C, unless otherwise specified) Symbol IGT (1) VGT VGD IH Unit RMS on-state current (full sine wave) Non repetitive surge peak on-state current (full cycle sine wave, Tj initial = 25° C) ITSM Value Test conditions VD = 12 V, RL = 33 Ω VD = VDRM, RL =3.3 kΩ, Tj = 150° C (2) Quadrant Value I - II - III MAX 35 mA I - II - III MAX 1.3 V I - II - III MIN 0.15 V MAX 35 mA 50 mA IT = 100 mA I - III IL IG = 1.2 x IGT dV/dt (2) (dI/dt)c (2) MAX II 80 VD = 67% VDRM, gate open, Tj = 150° C MIN 300 V/µs Without snubber, Tj = 150° C MIN 8.9 A/ms 1. minimum IGT is guaranteed at 5% of IGT max 2. for both polarities of A2 referenced to A1 2/10 Unit T2035H Series Table 3. Characteristics Static electrical characteristics Symbol Test conditions VTM (1) ITM= 28 A, tp = 380 µs Value Unit Tj = 25° C MAX 1.5 V VTO (1) Tj = 150° C MAX 0.80 V RD (1) Tj = 150° C MAX 21 mΩ 5 µA Tj = 25° C VDRM = VRRM IDRM IRRM Tj = 150° C MAX 7.4 mA VD/VR = 400 V (at peak mains voltage) Tj = 150° C 4.8 1. for both polarities of A2 referenced to A1 Table 4. Thermal resistance Symbol Parameter Value Junction to case for full (AC) Rth (j-c) S = 1 cm² Rth (j-a) Figure 1. D2PAK TO-220AB 1 D2PAK 45 TO-220AB 60 Unit °C/W Junction to ambient Maximum power dissipation vs RMS on-state current (full cycle) Figure 2. RMS on-state current versus case temperature IT(RMS) (A) P(W) 24 22 α=180° 22 α=180° 20 20 18 18 16 16 14 14 12 12 10 10 8 8 6 6 180° 4 2 4 2 IT(RMS)(A) 0 TC(°C) 0 0 2 4 6 8 10 12 14 16 18 20 0 25 50 75 100 125 150 3/10 Characteristics Figure 3. T2035H Series RMS on-state current vs ambient temperature (epoxy printed circuit board FR4 ecu = 35 µm) Figure 4. Relative variation of thermal impedance vs pulse duration K=[Zth/Rth] IT(RMS) (A) 4.5 1.E+00 α=180° SCU=1cm² 4.0 Zth(j-c) 3.5 3.0 1.E-01 Zth(j-a) 2.5 2.0 1.5 1.E-02 1.0 0.5 Tamb(°C) tP(s) 0.0 0 25 Figure 5. 50 75 100 125 150 On-state characteristics (maximum values) 1.E-03 1.E-03 1.E-02 Figure 6. ITM(A) 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Surge peak on-state current vs number of cycles ITSM(A) 100 220 200 180 Tj=150°C t=20ms Non repetitive Tj initial=25°C 160 One cycle 140 Tj=25°C 120 10 100 Repetitive Tc=127°C 80 60 Tj max. : VT0 = 0.80 V RD = 21 mW VTM(V) 40 20 Number of cycles 0 1 0.0 0.5 Figure 7. 1.0 1.5 2.0 2.5 1 3.0 Non repetitive surge peak on-state current (sinusoidal pulse width tp<10 ms) and value of I²t 10 Figure 8. 100 1000 Relative variation of gate trigger current, holding current and latching current vs junction temperature (typical values) IGT, IH, IL [T j] / IGT, IH, IL [T j=25°C] ITSM(A), I²t (A²s) 2.5 10000 Tj initial=25°C IGT 2.0 dI/dt limitation: 50A/µs 1.5 1000 IH & IL ITSM 1.0 I²t 0.5 tP(ms) 100 0.01 4/10 Tj(°C) 0.0 0.10 1.00 10.00 -40 -20 0 20 40 60 80 100 120 140 160 T2035H Series Relative variation of critical rate of Figure 10. Relative variation of critical rate of decrease of main current (di/dt)c decrease of main current (di/dt)c vs versus junction temperature reapplied (dV/dt)c Figure 9. 2.0 Characteristics (dI/dt)c [ (dV/dt) c ] / Specified (dI/dt) c (dI/dt)c [T j] / (dI/dt)c [T j=125°C] 8 1.8 7 1.6 6 1.4 1.2 5 1.0 4 0.8 3 0.6 2 0.4 0.2 1 dV/dt (V/µs) 0.0 0.1 1.0 10.0 100.0 Figure 11. Leakage current versus junction temperature for different values of blocking voltage (typical values) Tj(°C) 0 25 50 75 100 125 150 Figure 12. Acceptable repetitive peak off-state voltage versus case-ambient thermal resistance Rth(c-a) (°C/W) IDRM/IRRM(mA) 10 1.E+01 9 VDRM=VRRM=600 V Rth(j-c)=1°C/W TJ=150°C 8 1.E+00 7 VDRM=VRRM=400 V 6 1.E-01 VDRM=VRRM=200 V 5 4 1.E-02 3 2 1.E-03 1 T j(°C) 0 300 1.E-04 50 75 100 125 VDRM/VRRM(V) 350 400 450 500 550 600 150 Figure 13. D2PAK junction to ambient thermal resistance versus copper surface under tab (PCB FR4, copper thickness 35 µm) Rth(j-a) (°C/W) 80 D²PAK 70 60 50 40 30 20 10 SCU(cm²) 0 0 5 10 15 20 25 30 35 40 5/10 Ordering information scheme 2 T2035H Series Ordering information scheme T Triac series Current 20 = 20 A Sensitivity 35 = 35 mA High temperature Voltage 600 = 600 V Package G = D2PAK T = TO-220AB Packing mode Blank = Tube (D2PAK) -TR = Tape and reel (D2PAK) RG = Tube (TO-220AB) 6/10 20 35 H - 600 T (-TR) T2035H Series 3 Package information Package information Table 5. TO-220AB dimensions DIMENSIONS REF. Millimeters Min. A ØI 15.20 a1 C B b2 L Typ. Max. Inches Min. Typ. 15.90 0.598 3.75 Max. 0.625 0.147 a2 13.00 14.00 0.511 0.551 B 10.00 10.40 0.393 0.409 b1 0.61 0.88 0.024 0.034 b2 1.23 1.32 0.048 0.051 C 4.40 4.60 0.173 0.181 c1 0.49 0.70 0.019 0.027 c2 2.40 2.72 0.094 0.107 e 2.40 2.70 0.094 0.106 F 6.20 6.60 0.244 0.259 ØI 3.75 3.85 0.147 0.151 I4 15.80 16.40 16.80 0.622 0.646 0.661 L 2.65 2.95 0.104 0.116 l2 1.14 1.70 0.044 0.066 l3 1.14 1.70 0.044 0.066 F A I4 l3 c2 a1 l2 a2 M b1 e c1 M 2.60 0.102 7/10 Package information Table 6. T2035H Series D2PAK dimensions DIMENSIONS REF. A E C2 L2 D Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.14 1.70 0.045 0.067 C 0.45 0.60 0.017 0.024 C2 1.23 1.36 0.048 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.40 0.393 0.409 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 M 2.40 3.20 0.094 0.126 L L3 A1 B2 R C B G A2 2mm min. FLAT ZONE V2 R V2 0.40 typ. 0° 8° 0.016 typ. 0° 8° Figure 14. D2PAK Footprint 16.90 10.30 5.08 1.30 8.90 3.70 All dimensions in mm In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 8/10 T2035H Series 4 5 Ordering information Ordering information Part number Marking Package Weight Base Qty Packing mode T2035H-600G T2035H-600G D2PAK 1.5 g 50 Tube 2 T2035H-600G-TR T2035H-600G D PAK 1.5 g 1000 Tape and Reel T2035H-600TRG T2035H-600T TO-220AB 2.3 g 50 Tube Revision history Date Revision 13-Jul-2006 1 Changes Initial release. 9/10 T2035H Series Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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