TAS5631B www.ti.com SLES263 – NOVEMBER 2010 300-W STEREO / 600-W MONO PurePath™ HD DIGITAL-INPUT POWER STAGE Check for Samples: TAS5631B FEATURES APPLICATIONS • • • • • 1 23 • • • • • • PurePath™ HD Enabled Integrated Feedback Provides: – Signal Bandwidth up to 80 kHz for High-Frequency Content From HD Sources – Ultralow 0.03% THD at 1 W Into 4 Ω – Flat THD at All Frequencies for Natural Sound – 80-dB PSRR (BTL, No Input Signal) – >100-dB (A-weighted) SNR – Click- and Pop-Free Start-Up Multiple Configurations Possible on the Same PCB With Stuffing Options: – Mono Parallel Bridge-Tied Load (PBTL) – Stereo Bridge-Tied Load (BTL) – 2.1 Single-Ended Stereo Pair and Bridge-Tied Load Subwoofer – Quad Single-Ended Outputs Total Output Power at 10% THD+N – 600 W in Mono PBTL Configuration – 300 W per Channel in Stereo BTL Configuration – 145 W per Channel in Quad Single-Ended Configuration High-Efficiency Power Stage (>88%) With 60-mΩ Output MOSFETs Two Thermally Enhanced Package Options: – PHD (64-Pin QFP) – DKD (44-Pin PSOP3) Self-Protection Design (Including Undervoltage, Overtemperature, Clipping, and Short-Circuit Protection) With Error Reporting EMI Compliant When Used With Recommended System Design Mini Combo System AV Receivers DVD Receivers Active Speakers DESCRIPTION The TAS5631B is a high-performance PWM input class-D amplifier with integrated closed-loop feedback technology (known as PurePath HD technology) with the ability to drive up to 300 W (1) stereo into 4-Ω to 8-Ω speakers from a single 50-V supply. PurePath HD technology enables traditional AB-amplifier performance (<0.03% THD) levels while providing the power efficiency of traditional class-D amplifiers. Unlike traditional class-D amplifiers, the distortion curve does not increase until the output levels move into clipping. PurePath HD™ PurePath HD technology enables lower idle losses, making the device even more efficient. Note 1. Achievable output power levels are dependent on the thermal configuration of the target application. A high-performance thermal interface material between the package exposed heat slug and the heat sink should be used to achieve high output-power levels. ♫♪ DIGITAL AUDIO INPUT TAS5518C Digital PWM Processor TM PurePath HD TAS5630 TAS5631B ♫♪ 1 2 3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PurePath HD is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2010, Texas Instruments Incorporated TAS5631B SLES263 – NOVEMBER 2010 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. DEVICE INFORMATION Terminal Assignment Both package types contains a heat slug that is located on the top side of the device for convenient thermal coupling to the heat sink. DKD PACKAGE (TOP VIEW) 64-pins QFP package 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 GND_A GND_B GND_B OUT_B OUT_B PVDD_B PVDD_B BST_B BST_C PVDD_C PVDD_C OUT_C OUT_C GND_C GND_C _ GND_D OTW2 CLIP READY M1 M2 M3 GND GND GVDD_C GVDD_D BST_D OUT_D OUT_D PVDD_D PVDD_D GND_D 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 PSU_REF VDD OC_ADJ RESET C_STARTUP INPUT_A INPUT_B VI_CM GND AGND VREG INPUT_C INPUT_D TEST NC NC SD OTW READY M1 M2 M3 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 44 pins PACKAGE (TOP VIEW) OC_ADJ RESET C_STARTUP INPUT_A INPUT_B VI_CM GND AGND VREG INPUT_C INPUT_D TEST NC NC SD OTW1 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 VDD PSU_REF NC NC NC NC GND GND GVDD_B GVDD_A BST_A OUT_A OUT_A PVDD_A PVDD_A GND_A PHD PACKAGE (TOP VIEW) 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 GVDD_AB BST_A PVDD_A PVDD_A OUT_A OUT_A GND_A GND_B OUT_B PVDD_B BST_B BST_C PVDD_C OUT_C GND_C GND_D OUT_D OUT_D PVDD_D PVDD_D BST_D GVDD_CD PIN ONE LOCATION PHD PACKAGE Electrical Pin 1 Pin 1 Marker White Dot 2 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TAS5631B TAS5631B www.ti.com SLES263 – NOVEMBER 2010 MODE SELECTION PINS MODE PINS PWM INPUT (1) OUTPUT CONFIGURATION 2N 2 × BTL AD mode — — Reserved 2N 2 × BTL BD mode 1N 1 × BTL +2 × SE AD mode 0 1N 4 × SE AD mode 1 2N 1N M3 M2 M1 0 0 0 0 0 1 0 1 0 0 1 1 1 0 1 (1) (2) 0 1 1 0 1 1 1 1 × PBTL DESCRIPTION INPUT_C (2) INPUT_D (2) 0 0 AD mode 1 0 BD mode Reserved The 1N and 2N naming convention is used to indicate the number of PWM lines to the power stage per channel in a specific mode. INPUT_C and INPUT_D are used to select between a subset of AD and BD mode operations in PBTL mode. PACKAGE HEAT DISSIPATION RATINGS (1) PARAMETER TAS5631BPHD RqJC (°C/W) – 2 BTL or 4 SE channels 2.63 1.4 RqJC (°C/W) – 1 BTL or 2 SE channel(s) 4.13 2.04 RqJC (°C/W) – 1 SE channel 6.45 Pad area (1) (2) TAS5631BDKD (2) 3.45 2 64 mm 80 mm2 RqJC is junction-to-case; RqCH is case-to-heatsink. RqCH is an important consideration. Assume a 2-mil (0.051-mm) thickness of thermal grease with a thermal conductivity of 2.5 W/mK between the pad area and the heat sink and both channels active. The RqCH with this condition is 1.1°C/W for the PHD package and 0.44°C/W for the DKD package. Table 1. ORDERING INFORMATION (1) (1) TA PACKAGE DESCRIPTION 0°C–70°C TAS5631BPHD 64-pin HTQFP 0°C–70°C TAS5631BDKD 44-pin PSOP3 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TAS5631B 3 TAS5631B SLES263 – NOVEMBER 2010 www.ti.com ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range unless otherwise noted (1) TAS5631B UNIT VDD to AGND –0.3 to 13.2 V GVDD to AGND –0.3 to 13.2 V PVDD_X to GND_X (2) –0.3 to 69 V OUT_X to GND_X (2) –0.3 to 69 V BST_X to GND_X (2) –0.3 to 82.2 V BST_X to GVDD_X (2) –0.3 to 69 V VREG to AGND –0.3 to 4.2 V GND_X to GND –0.3 to 0.3 V GND_X to AGND –0.3 to 0.3 V GND to AGND –0.3 to 0.3 V OC_ADJ, M1, M2, M3, OSC_IO+, OSC_IO–, FREQ_ADJ, VI_CM, C_STARTUP, PSU_REF to GND –0.3 to 4.2 V INPUT_X, RESET, SD, OTW1, OTW2, CLIP, READY to GND Maximum continuous sink current (SD, OTW1, OTW2, CLIP, READY) Maximum operating junction temperature range, TJ Storage temperature, Tstg Human-body model (3) (all pins) Electrostatic discharge (1) (2) (3) Charged-device model (3) (all pins) –0.3 to 7 V 9 mA 0 to 150 °C –40 to 150 °C ±2 kV ±500 V Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. These voltages represents the dc voltage + peak ac waveform measured at the terminal of the device in all conditions. Failure to follow good anti-static ESD handling during manufacture and rework contributes to device malfunction. Make sure the operators handling the device are adequately grounded through the use of ground straps or alternative ESD protection. RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range (unless otherwise noted) MAX UNIT PVDD_x Half-bridge supply DC supply voltage MIN NOM 25 50 52.5 V GVDD_x Supply for logic regulators and gate-drive circuitry DC supply voltage 10.8 12 13.2 V VDD Digital regulator supply voltage DC supply voltage 10.8 12 13.2 V 3.5 4 Load impedance Output filter according to schematics in the application information section. 1.8 2 1.6 2 7 10 7 15 7 10 352 384 RL(BTL) RL(SE) RL(PBTL) LOUTPUT(BTL) LOUTPUT(SE) Output filter inductance Minimum output inductance at IOC LOUTPUT(PBTL) fPWM PWM frame rate TJ Junction temperature 0 Ω mH 500 kHz 125 °C TERMINAL FUNCTIONS TERMINAL NAME Function (1) DESCRIPTION 10 P Analog ground 43 P HS bootstrap supply (BST); external 0.033-mF capacitor to OUT_A required 41 34 P HS bootstrap supply (BST); external 0.033-mF capacitor to OUT_B required 40 33 P HS bootstrap supply (BST); external 0.033-mF capacitor to OUT_C required PHD NO. DKD NO. AGND 8 BST_A 54 BST_B BST_C (1) 4 I = Input, O = Output, P = Power Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TAS5631B TAS5631B www.ti.com SLES263 – NOVEMBER 2010 TERMINAL FUNCTIONS (continued) TERMINAL Function (1) DESCRIPTION NAME PHD NO. DKD NO. BST_D 27 24 P HS bootstrap supply (BST); external 0.033-mF capacitor to OUT_D required CLIP 18 — O Clipping warning; open drain; active-low C_STARTUP 3 5 O Start-up ramp requires a charging capacitor of 4.7 nF to AGND. TEST 12 14 I Connect to VREG node GND 7, 23, 24, 57, 58 9 P Ground GND_A 48, 49 38 P Power ground for half-bridge A GND_B 46, 47 37 P Power ground for half-bridge B GND_C 34, 35 30 P Power ground for half-bridge C GND_D 32, 33 29 P Power ground for half-bridge D GVDD_A 55 — P Gate drive voltage supply requires 0.1-mF capacitor to AGND. GVDD_B 56 — P Gate drive voltage supply requires 0.1-mF capacitor to AGND. GVDD_C 25 — P Gate drive voltage supply requires 0.1-mF capacitor to AGND. GVDD_D 26 — P Gate drive voltage supply requires 0.1-mF capacitor to AGND. GVDD_AB — 44 P Gate drive voltage supply requires 0.22-mF capacitor to AGND. GVDD_CD — 23 P Gate drive voltage supply requires 0.22-mF capacitor to AGND. INPUT_A 4 6 I Input signal for half-bridge A INPUT_B 5 7 I Input signal for half-bridge B INPUT_C 10 12 I Input signal for half-bridge C INPUT_D 11 13 I Input signal for half-bridge D M1 20 20 I Mode selection M2 21 21 I Mode selection M3 22 22 I Mode selection NC 59–62 – — No connect; pins may be grounded. NC 13, 14 15, 16 — No connect; pins may be grounded. OC_ADJ 1 3 O Analog overcurrent programming pin requires resistor to ground. OTW — 18 O Overtemperature warning signal, open-drain, active-low OTW1 16 — O Overtemperature warning signal, open-drain, active-low OTW2 17 — O Overtemperature warning signal, open-drain, active-low OUT_A 52, 53 39, 40 O Output, half-bridge A OUT_B 44, 45 36 O Output, half-bridge B OUT_C 36, 37 31 O Output, half-bridge C OUT_D 28, 29 27, 28 O Output, half-bridge D 63 1 P PSU reference requires close decoupling of 4.7 mF to AGND. PVDD_A 50, 51 41, 42 P Power-supply input for half-bridge A requires close decoupling of 0.01-mF capacitor in parallel with 1-mF capacitor to GND_A. PVDD_B 42, 43 35 P Power-supply input for half-bridge B requires close decoupling of 0.01-mF capacitor in parallel with 1-mF capacitor to GND_B. PVDD_C 38, 39 32 P Power-supply input for half-bridge C requires close decoupling of 0.01-mF capacitor in parallel with 1-mF capacitor to GND_C. PVDD_D 30, 31 25, 26 P Power-supply input for half-bridge D requires close decoupling of 0.01-mF capacitor in parallel with 1-mF capacitor to GND_D. READY 19 19 O Normal operation; open-drain; active-high RESET 2 4 I Device reset input; active-low SD 15 17 O Shutdown signal; open-drain, active-low VDD 64 2 P Power supply for digital voltage regulator requires a 47-mF capacitor in parallel with a 0.1-mF capacitor to GND for decoupling. VI_CM 6 8 O Analog comparator reference node requires close decoupling of 4.7 mF to AGND. VREG 9 11 P Digital regulator supply filter pin requires 0.1-mF capacitor to AGND. PSU_REF Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TAS5631B 5 TAS5631B SLES263 – NOVEMBER 2010 www.ti.com TYPICAL SYSTEM BLOCK DIAGRAM Caps for External Filtering and Startup/Stop System microcontroller (2) AMP RESET LeftChannel Output PWM_A C_STARTUP VI_CM PSU_REF RESET VALID /CLIP *NOTE1 READY /SD TAS5518/ TAS5508/ TAS5086 /OTW1, /OTW2, /OTW I2C BST_A BST_B OUT_A INPUT_A PWM_B Input H-Bridge 1 INPUT_B Output H-Bridge 1 2 OUT_B 2 Bootstrap Caps 2nd Order L-C Output Filter for each H-Bridge 2-CHANNEL H-BRIDGE BTL MODE PWM_C INPUT_C PWM_D OUT_C Input H-Bridge 2 INPUT_D Output H-Bridge 2 2 OUT_D 8 50V PVDD 12V PVDD Power Supply Decoupling SYSTEM Power Supplies GND 8 BST_D OC_ADJ TEST VREG AGND M3 2nd Order L-C Output Filter for each H-Bridge BST_C VDD M2 GND M1 GND_A, B, C, D Hardwire Mode Control GVDD_A, B, C, D 2 PVDD_A, B, C, D RightChannel Output Bootstrap Caps 4 GVDD, VDD, and VREG Power Supply Decoupling Hardwire OverCurrent Limit GND GVDD (12V)/VDD (12V) VAC (1) 6 Logic AND is inside or outside the microcontroller. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TAS5631B TAS5631B www.ti.com SLES263 – NOVEMBER 2010 FUNCTIONAL BLOCK DIAGRAM CLIP READY OTW1 OTW2 SD PROTECTION & I/O LOGIC M1 M2 M3 RESET STARTUP CONTROL C_STARTUP VDD POWER-UP RESET UVP VREG VREG AGND TEMP SENSE GVDD_A GVDD_C GVDD_B OVER-LOAD PROTECTION PPSC CURRENT SENSE CB3C 4 4 4 GND GVDD_D OC_ADJ PVDD_X OUT_X GND_X GVDD_A PWM ACTIVITY DETECTOR BST_A PVDD_A PWM RECEIVER CONTROL TIMING CONTROL GATE-DRIVE OUT_A GND_A PSU_REF GVDD_B VI_CM - ANALOG LOOP FILTER PVDD_X GND INPUT_C INPUT_D ANALOG LOOP FILTER ANALOG LOOP FILTER ANALOG INPUT MUX 4 AGC PVDD_B PWM RECEIVER + ANALOG LOOP FILTER INPUT_B BST_B + + ANALOG COMPARATOR MUX INPUT_A CONTROL TIMING CONTROL GATE-DRIVE OUT_B GND_B GVDD_C BST_C PVDD_C PWM RECEIVER CONTROL TIMING CONTROL GATE-DRIVE + OUT_C GND_C - GVDD_D BST_D PVDD_D PWM RECEIVER CONTROL TIMING CONTROL GATE-DRIVE OUT_D GND_D Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TAS5631B 7 TAS5631B SLES263 – NOVEMBER 2010 www.ti.com AUDIO CHARACTERISTICS (BTL) Audio performance is recorded as a chipset consisting of a TAS5518 PWM processor (modulation index limited to 97.7%) and a TAS5631B power stage. PCB and system configurations are in accordance with recommended guidelines. Audio frequency = 1 kHz, PVDD_X = 50 V, GVDD_X = 12 V, RL = 4 Ω, fS = 384 kHz, ROC = 22 kΩ, TC = 75°C; output filter: LDEM = 7 mH, CDEM = 680 nF, MODE = 000, unless otherwise noted. PARAMETER PO Power output per channel TEST CONDITIONS MIN TYP MAX UNIT RL = 4 Ω, 10% THD+N, clipped input signal 300 RL = 6 Ω, 10% THD+N, clipped input signal 210 RL = 8 Ω, 10% THD+N, clipped input signal 160 RL = 4 Ω, 1% THD+N, unclipped input signal 240 RL = 6 Ω, 1% THD+N, unclipped input signal 160 RL = 8 Ω, 1% THD+N, unclipped input signal W 125 THD+N Total harmonic distortion + noise 1W Vn Output integrated noise A-weighted, TAS5518 modulator |VOS| Output offset voltage No signal SNR Signal-to-noise ratio (1) A-weighted, TAS5518 modulator 103 dB DNR Dynamic range A-weighted, input level –60 dBFS using TAS5518 modulator 103 dB Pidle Power dissipation due to idle losses (IPVDD_X) PO = 0, four channels switching (2) 3.9 W (1) (2) 0.03% 180 20 mV 50 mV SNR is calculated relative to 1% THD-N output level. Actual system idle losses also are affected by core losses of output inductors. AUDIO SPECIFICATION (Single-Ended Output) Audio performance is recorded as a chipset consisting of a TAS5086 PWM processor (modulation index limited to 97.7%) and a TAS5631B power stage. PCB and system configurations are in accordance with recommended guidelines. Audio frequency = 1 kHz, PVDD_X = 50 V, GVDD_X = 12 V, RL = 2 Ω, fS = 384 kHz, ROC = 22 kΩ, TC = 75°C; output filter: LDEM = 7 mH, CDEM = 470 nF, MODE = 100, unless otherwise noted. PARAMETER PO TEST CONDITIONS Power output per channel MIN TYP MAX RL = 2 Ω, 10%, THD+N, clipped input signal 145 RL = 3 Ω, 10%, THD+N, clipped input signal 100 RL = 4 Ω, 10%, THD+N, clipped input signal 75 RL = 2 Ω, 1% THD+N, unclipped input signal 110 RL = 3 Ω, 1% THD+N, unclipped input signal 75 RL = 4 Ω, 1% THD+N, unclipped input signal UNIT W 55 THD+N Total harmonic distortion + noise 1W Vn Output integrated noise A-weighted, TAS5086 modulator 140 mV SNR Signal-to-noise ratio (1) A-weighted, TAS5086 modulator 100 dB DNR Dynamic range A-weighted, input level –60 dBFS using TAS5086 modulator 100 dB Pidle Power dissipation due to idle losses (IPVDD_X) PO = 0, 4 channels switching (2) 3 W (1) (2) 8 0.04% SNR is calculated relative to 1% THD-N output level. Actual system idle losses are affected by core losses of output inductors. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TAS5631B TAS5631B www.ti.com SLES263 – NOVEMBER 2010 AUDIO SPECIFICATION (PBTL) Audio performance is recorded as a chipset consisting of a TAS5518 PWM processor (modulation index limited to 97.7%) and a TAS5631B power stage. PCB and system configurations are in accordance with recommended guidelines. Audio frequency = 1 kHz, PVDD_X = 50 V, GVDD_X = 12 V, RL = 2 Ω, fS = 384 kHz, ROC = 22 kΩ, TC = 75°C; output filter: LDEM = 7 mH, CDEM = 1 mF, MODE = 101-00, unless otherwise noted. PARAMETER PO TEST CONDITIONS Power output per channel MIN TYP MAX RL = 2 Ω, 10%, THD+N, clipped input signal 600 RL = 3 Ω, 10%, THD+N, clipped input signal 400 RL = 4 Ω, 10%, THD+N, unclipped input signal 300 RL = 2 Ω, 1% THD+N, unclipped input signal 480 RL = 3 Ω, 1% THD+N, unclipped input signal 310 RL = 4 Ω, 1% THD+N, unclipped input signal UNIT W 230 THD+N Total harmonic distortion + noise 1W Vn Output integrated noise A-weighted, TAS5518 modulator 170 mV SNR Signal-to-noise ratio (1) A-weighted, TAS5518 modulator 103 dB DNR Dynamic range A-weighted, input level –60 dBFS using TAS5518 modulator 103 dB Pidle Power dissipation due to idle losses (IPVDD_X) PO = 0, 4 channels switching (2) 3.7 W (1) (2) 0.03% SNR is calculated relative to 1% THD-N output level. Actual system idle losses are affected by core losses of output inductors. ELECTRICAL CHARACTERISTICS PVDD_X = 50V, GVDD_X = 12 V, VDD = 12V, TC (case temperature) = 75°C, fS = 384 kHz, unless otherwise specified. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT INTERNAL VOLTAGE REGULATOR AND CURRENT CONSUMPTION VREG Voltage regulator, only used as reference node, VREG VI_CM Analog comparator reference node, VI_CM IVDD VDD supply current IGVDD_x Gate-supply current per half-bridge IPVDD_x Half-bridge idle current VDD = 12 V 3 3.3 3.6 V 1.5 1.75 1.9 V Operating, 50% duty cycle 22.5 Idle, reset mode 22.5 50% duty cycle 12.5 Reset mode mA mA 1.5 50% duty cycle without output filter or load 19.5 mA Reset mode, no switching 750 mA OUTPUT-STAGE MOSFETs Drain-to-source resistance, low side (LS) RDS(on) Drain-to-source resistance, high side (HS) TJ = 25°C, excludes metallization resistance, GVDD = 12 V 60 100 mΩ 60 100 mΩ Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TAS5631B 9 TAS5631B SLES263 – NOVEMBER 2010 www.ti.com ELECTRICAL CHARACTERISTICS (continued) PVDD_X = 50V, GVDD_X = 12 V, VDD = 12V, TC (case temperature) = 75°C, fS = 384 kHz, unless otherwise specified. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT I/O PROTECTION Vuvp,G Undervoltage protection limit, GVDD_X Vuvp,hyst 10 (1) V 0.6 V OTW1 (1) Overtemperature warning 1 95 100 105 °C OTW2 (1) Overtemperature warning 2 115 125 135 °C OTWhyst (1) Temperature drop needed below OTW temperature for OTW to be inactive after OTW event 25 Overtemperature error OTE (1) 145 155 °C 165 °C OTE-OTW differential 30 °C A reset must occur for SD to be released following an OTE event 25 °C fPWM = 384 kHz 2.6 ms Resistor – programmable, nominal peak current in 1-Ω load, 64-pin QFP package (PHD) ROCP = 22 kΩ 19 A Resistor – programmable, nominal peak current in 1-Ω load, 44-pin PSOP3 package (DKD) ROCP = 24 kΩ 19 A Overcurrent response time, latched Resistor – programmable, nominal peak current in 1-Ω load, ROCP = 47 kΩ 19 A IOCT Overcurrent response time Time from application of short condition to Hi-Z of affected half-bridge 150 ns IPD Internal pulldown resistor at output of each half-bridge Connected when RESET is active to provide bootstrap charge. Not used in SE mode. 3 mA OTEHYST OLPC (1) Overload protection counter Overcurrent limit response IOC STATIC DIGITAL SPECIFICATIONS VIH High-level input voltage VIL Low-level input voltage Ilkg Input leakage current INPUT_X, M1, M2, M3, RESET 1.9 V 1.45 V 100 mA kΩ OTW/SHUTDOWN (SD) RINT_PU Internal pullup resistance, OTW1 to VREG, OTW2 to VREG, SD to VREG VOH High-level output voltage VOL Low-level output voltage IO = 4 mA FANOUT Device fanout OTW1, OTW2, SD, CLIP, READY No external pullup (1) 10 Internal pullup resistor External pullup of 4.7 kΩ to 5 V 20 26 33 3 3.3 3.6 4.5 5 200 30 500 V mV devices Specified by design Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TAS5631B TAS5631B www.ti.com SLES263 – NOVEMBER 2010 TYPICAL CHARACTERISTICS, BTL CONFIGURATION TOTAL HARMONIC DISTORTION + NOISE vs OUTPUT POWER OUTPUT POWER vs SUPPLY VOLTAGE 320 THD+N - Total Harmonic Distortion + Noise - % 10 5 TC = 75°C 300 280 260 PO - Output Power - W 2 1 0.5 0.2 0.1 4W 6W 0.05 0.005 20m 8W 100m200m 1 2 5 10 20 50 100 PO - Output Power - W 400 120 100 80 30 35 40 45 PVDD - Supply Voltage - V UNCLIPPED OUTPUT POWER vs SUPPLY VOLTAGE SYSTEM EFFICIENCY vs OUTPUT POWER TC = 75°C 4W 200 180 Efficiency - % PO - Output Power - W 8W 140 Figure 2. 220 6W 160 140 8W 100 80 60 40 20 0 25 6W Figure 1. 240 120 4W 20 0 25 280 260 240 220 200 180 160 60 40 0.02 0.01 TC = 75°C THD+N at 10% 30 35 40 45 50 100 95 90 85 80 75 70 65 60 55 50 45 40 35 30 25 20 15 10 5 0 8W 6W 50 4W TC = 25°C THD+N at 10% 0 Figure 3. 100 400 200 300 500 2 Channel Output Power - W 600 650 Figure 4. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TAS5631B 11 TAS5631B SLES263 – NOVEMBER 2010 www.ti.com TYPICAL CHARACTERISTICS, BTL CONFIGURATION (continued) 100 95 90 85 80 75 70 65 60 55 50 45 40 35 30 25 20 15 10 5 0 OUTPUT POWER vs CASE TEMPERATURE TC = 25°C THD+N at 10% PO - Output Power - W Power Loss - W SYSTEMS POWER LOSS vs OUTPUT POWER 4W 6W 8W 0 100 200 300 400 500 2 Channel Output Power - W 600 650 360 340 320 300 280 260 240 220 200 180 160 140 120 100 80 60 40 20 0 10 4W 6W 8W THD+N at 10% 20 30 40 50 60 70 80 90 100 110 120 TC - Case Temperature - °C Figure 5. Figure 6. NOISE AMPLITUDE vs FREQUENCY +0 -10 -20 Noise Amplitude - dB -30 -40 -50 TC = 75°C, VREF = 31.7 V, Sample Rate = 48 kHz, FFT Size = 16384 -60 -70 -80 -90 -100 -110 -120 4W -130 -140 -150 -160 0k 12 2k 4k 6k 8k 10k 12k 14k 16k 18k 20k 22k f - Frequency - Hz Figure 7. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TAS5631B TAS5631B www.ti.com SLES263 – NOVEMBER 2010 TYPICAL CHARACTERISTICS, SE CONFIGURATION TOTAL HARMONIC DISTORTION + NOISE vs OUTPUT POWER OUTPUT POWER vs SUPPLY VOLTAGE 5 160 TC = 75°C 150 140 130 4W 2 1 PO - Output Power - W THD+N - Total Harmonic Distortion + Noise - % 10 3W 0.5 2W 0.2 0.1 0.05 2W 120 110 100 3W 90 80 70 4W 60 50 40 30 20 0.02 0.01 0.005 20m TC = 75°C THD+N at 10% 200m 1 2 10 20 PO - Output Power - W 100 200 10 0 25 30 35 40 45 PVDD - Supply Voltage - V Figure 8. 50 Figure 9. OUTPUT POWER vs CASE TEMPERATURE PO - Output Power - W 170 160 150 140 130 120 110 100 90 80 70 60 50 40 30 20 10 0 10 3W 2W 4W THD+N at 10% 20 30 40 50 60 70 80 90 100 110 120 TC - Case Temperature - °C Figure 10. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TAS5631B 13 TAS5631B SLES263 – NOVEMBER 2010 www.ti.com TYPICAL CHARACTERISTICS, PBTL CONFIGURATION TOTAL HARMONIC DISTORTION + NOISE vs OUTPUT POWER 5 650 T TC = 75°C 2 W (TC = 50 C) 1 550 3W 2 2 W (TC = 50oC) 500 4W 0.5 6W 0.2 TC = 75°C THD+N at 10% 600 o PO - Output Power - W THD+N - Total Harmonic Distortion + Noise - % 10 OUTPUT POWER vs SUPPLY VOLTAGE 8W 0.1 0.05 3W 450 400 4W 350 6W 300 8W 250 200 150 0.02 100 0.01 0.005 20m 50 100m 200m 1 2 5 10 20 50 100 200 700 PO - Output Power - W 0 25 30 35 40 45 PVDD - Supply Voltage - V Figure 11. 50 Figure 12. OUTPUT POWER vs CASE TEMPERATURE 700 2W 650 THD+N at 10% 600 PO - Output Power - W 550 500 3W 450 400 4W 350 300 6W 250 8W 200 150 100 50 0 10 14 20 30 40 50 60 70 80 90 100 110 120 TC - Case Temperature - °C Figure 13. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TAS5631B TAS5631B www.ti.com SLES263 – NOVEMBER 2010 APPLICATION INFORMATION PCB MATERIAL RECOMMENDATION FR-4 2-oz. (70 mm) glass epoxy material is recommended for use with the TAS5631B. The use of this material can provide for higher power output, improved thermal performance, and better EMI margin (due to lower PCB trace resistance). PVDD CAPACITOR RECOMMENDATION The large capacitors used in conjunction with each full bridge are referred to as the PVDD capacitors. These capacitors should be selected for proper voltage margin and adequate capacitance to support the power requirements. In practice, with a well-designed system power supply, 1000 mF, 63 V support more applications. The PVDD capacitors should be the low-ESR type because they are used in a circuit associated with high-speed switching. DECOUPLING CAPACITOR RECOMMENDATION To design an amplifier that has robust performance, passes regulatory requirements, and exhibits good audio performance, good-quality decoupling capacitors should be used. In practice, X7R should be used in this application. The voltage of the decoupling capacitors should be selected in accordance with good design practices. Temperature, ripple current, and voltage overshoot must be considered. This fact is particularly true in the selection of the 0.1-mF capacitor that is placed on the power supply to each half-bridge. It must withstand the voltage overshoot of the PWM switching, the heat generated by the amplifier during high power output, and the ripple current created by high power output. A minimum voltage rating of 63 V is required for use with a 50-V power supply. SYSTEM DESIGN RECOMMENDATIONS The following schematics and PCB layouts illustrate best practices in the use of the TAS5631B. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TAS5631B 15 R_RIGHT_N IN_RIGHT_P IN_LEFT_N IN_LEFT_P /RESET 100R R13 100R R12 100R R11 100R R10 100R Submit Documentation Feedback Product Folder Link(s): TAS5631B GND READY /CLIP /OTW2 /OTW1 /SD C18 100pF GND R19 47k GND GND GND GND 100nF C22 VREG GND VREG 4.7uF C21 4.7nF 22.0k C20 R20 4.7uF /OTW1 /SD NC NC TEST INPUT_D INPUT_C VREG AGND GND VI_CM INPUT_B INPUT_A C_STARTUP /RESET OC_ADJ PSU_REF /CLIP R18 VREG GND NC READY GND NC M1 U10 TAS5631PHD VREG NC M2 VDD /OTW2 GND GND GND C33 100nF GND GND NC M3 C31 100nF GND GND C30 100nF GVDD_B C32 100nF GND GND GVDD_C 3.3R GVDD_A GVDD_D C26 100nF 3.3R 3.3R R33 R32 C43 33nF BST_A BST_D C23 C25 10uF OUT_A OUT_D C40 33nF OUT_A OUT_D R31 C63 2.2uF GND_D GND_C GND_C OUT_C OUT_C PVDD_C PVDD_C BST_C BST_B PVDD_B PVDD_B OUT_B OUT_B GND_B GND_B GND_A GND C60 2.2uF PVDD_A PVDD_D 3.3R GND_A PVDD_A PVDD_D 16 GND_D R30 GND C62 2.2uF C61 2.2uF GND L13 7uH 7uH L12 C42 33nF C41 33nF L11 7uH L10 7uH 1000uF C65 C53 680nF C52 680nF GND C51 680nF C50 680nF C72 1nF GND C73 1nF GND 1000uF C66 C71 1nF GND C70 1nF R73 3.3R C77 10nF C76 10nF R72 3.3R GND GND GND C68 47uF 63V R71 3.3R C75 10nF C74 10nF R70 3.3R C67 1000uF GND GND C69 2.2uF GND C64 1000uF GND GND PVDD GVDD/VDD (+12V) PVDD OUT_RIGHT_R - + GND OUT_RIGHT_P C78 10nF R74 3.3R OUT_LEFT_M - + OUT_LEFT_P PVDD GVDD/VDD (+12V) TAS5631B SLES263 – NOVEMBER 2010 www.ti.com Figure 14. Typical Differential (2N) BTL Application With BD Modulation Filters Copyright © 2010, Texas Instruments Incorporated READY /CLIP /OTW2 /OTW1 /SD IN_N IN_P /RESET 100R 100R 100R GND 100pF GND VREG 47k GND GND GND GND 100nF 4.7uF 4.7nF 22.0k VREG VREG GND GND 1 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 /OTW1 /SD NC NC TEST INPUT_D INPUT_C VREG AGND GND VI_CM INPUT_B INPUT_A C_STARTUP /RESET OC_ADJ 4.7uF GND GND 100nF GND 100nF GND GND GND 58 VREG 100nF 64 VDD /OTW2 17 63 PSU_REF /CLIP 18 10uF NC READY 19 62 20 57 GND GND 100nF GND GND 100nF TAS5631PHD VREG 33nF 3.3R 3.3R 3.3R 3.3R 33nF GND 24 54 GVDD_C 25 61 NC M1 56 GVDD_B GVDD_D 26 53 BST_A BST_D 27 60 NC M2 55 GVDD_A OUT_A OUT_D 28 52 OUT_A OUT_D 29 51 PVDD_A PVDD_D 30 50 PVDD_A PVDD_D 31 59 NC M3 22 Product Folder Link(s): TAS5631B 23 Copyright © 2010, Texas Instruments Incorporated 21 GND GND 49 GND_A GND_D 32 VDD (+12V) 2.2uF GND_D GND_C GND_C OUT_C OUT_C PVDD_C PVDD_C BST_C BST_B PVDD_B PVDD_B OUT_B OUT_B GND_B GND_B GND_A GND 2.2uF 48 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 GND 2.2uF 2.2uF GND 33nF 33nF 7uH 7uH 7uH 7uH 1uF 1000uF 1000uF GND 1uF 1000uF 1000uF GND GND 1nF 1nF GND GND 47uF GND 3.3R 10nF 10nF 3.3R GND + - GVDD (+12V) PVDD OUT_LEFT_M GND OUT_LEFT_P 10nF 3.3R GND 2.2uF PVDD GVDD (+12V) TAS5631B www.ti.com SLES263 – NOVEMBER 2010 Figure 15. Typical (2N) PBTL Application With AD Modulation Filters Submit Documentation Feedback 17 READY /CLIP /OTW2 /OTW1 /SD IN_D IN_C IN_B IN_A /RESET Submit Documentation Feedback Product Folder Link(s): TAS5631B 150 kOhm 169 kOhm 191 kOhm 191 kOhm 196 kOhm 50 V 49 V 48 V 47 V <47 V R_COMP PVDD 100R 100R 100R 100R GND 100pF PVDD PVDD C A 47k 10k 470uF R_COMP 10k 10k 10k GND GND R_COMP 100nF 4.7uF 10nF 470uF 470uF 470uF GND GND GND GND 22.0k VREG 10k 10k VREG GND GND 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 470nF 470nF /OTW1 /SD NC NC TEST INPUT_D INPUT_C VREG AGND GND VI_CM INPUT_B INPUT_A 100nF 100nF 100nF 100nF C_STARTUP /RESET OC_ADJ 4.7uF 62 NC 100R 61 100nF NC GND GND 100nF GND GND 10nF 10nF 3.3R 3.3R 10nF 10nF 3.3R 3.3R GND 60 NC GND GND GND 100nF 54 GND GND OUT_C_M - + OUT_C_P GND GND OUT_A_M - + OUT_A_P 100nF VREG GND PVDD PVDD D B GND GND 100nF TAS5631PHD 33nF 52 3.3R 3.3R 53 470uF 470uF 470uF 470uF 3.3R 3.3R 33nF 50 PVDD_A VREG 10uF 64 VDD /OTW2 17 63 PSU_REF /CLIP 18 59 NC M3 22 READY 19 58 GND GND 23 M1 20 57 GND GND 24 M2 21 56 GVDD_B GVDD_C 25 51 GND GND 49 GND_A GND_D 55 GVDD_A GVDD_D 26 BST_A BST_D 27 OUT_A OUT_D 28 OUT_A OUT_D 29 PVDD_A PVDD_D 30 PVDD_D 10k 10k R_COMP 10k 10k R_COMP 31 18 32 VDD (+12V) 2.2uF GND_D GND_C GND_C 10k 10k OUT_C OUT_C PVDD_C PVDD_C BST_C BST_B PVDD_B PVDD_B OUT_B OUT_B GND_B GND_B GND_A GND 2.2uF 48 47 33 34 35 36 37 38 39 40 41 42 43 44 45 46 470nF 470nF GND 100nF 100nF 100nF 100nF GND 2.2uF 2.2uF 33nF 33nF GND GND 10nF 47uF 10nF 3.3R 3.3R 10nF 10nF 3.3R 3.3R 7uH 7uH 7uH 7uH GND GND OUT_D_M - + OUT_D_P GND GND OUT_B_M - + OUT_B_P GND GND 2.2uF GND 10nF 3.3R GVDD (+12V) D PVDD C PVDD B PVDD A GVDD (+12V) TAS5631B SLES263 – NOVEMBER 2010 www.ti.com Figure 16. Typical SE Application Copyright © 2010, Texas Instruments Incorporated Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TAS5631B READY /CLIP /OTW2 /OTW1 /SD IN_RIGHT IN_LEFT IN_CENTER /RESET 100R 100R 100R 100R GND 100pF 47k VREG GND GND GND GND 100nF VREG 4.7uF 10nF 22.0k GND 1 191 kOhm 191 kOhm 196 kOhm 47 V <47 V 169 kOhm 49 V 48 V R_COMP 150 kOhm /OTW1 /SD NC NC TEST INPUT_D INPUT_C VREG AGND GND VI_CM INPUT_B INPUT_A C_STARTUP /RESET OC_ADJ PVDD 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 4.7uF GND GND 100nF 50 V VREG VREG GND 10uF 64 VDD /OTW2 17 63 PSU_REF /CLIP 18 62 19 61 100nF NC READY 60 NC VREG 100nF GND GND GND 59 GND 100nF GND 3.3R 33nF GND GND 100nF TAS5631PHD NC M3 22 M1 20 58 GND GND 23 NC 57 GND GND 24 3.3R 3.3R 3.3R 33nF GVDD_D 26 54 BST_A BST_D 53 28 27 VDD (+12V) 25 M2 21 55 GVDD_A OUT_A OUT_D 52 OUT_A OUT_D 29 51 PVDD_A PVDD_D 30 50 PVDD_A PVDD_D 31 56 GVDD_B GVDD_C 49 GND_A GND_D 32 2.2uF GND_D GND_C GND_C OUT_C OUT_C PVDD_C PVDD_C BST_C BST_B PVDD_B PVDD_B OUT_B OUT_B GND_B GND_B GND_A GND 2.2uF 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 GND 2.2uF 2.2uF GND 7uH PVDD 7uH PVDD 33nF 33nF 470uF 470uF 470uF 470uF 1000uF GND GND 10k 10k R_COMP GND 10k 10k R_COMP GND 47uF GND 10k 10k 10nF 3.3R GND 2.2uF 7uH 680nF GND 680nF 7uH GND 470nF GND GND 470nF GND 10nF 100nF 100nF 10nF 10nF 100nF 100nF 10nF 1nF 1nF 1000uF 3.3R GND 3.3R 3.3R GND 3.3R 3.3R 10nF 10nF 3.3R GND + - www.ti.com GVDD (+12V) PVDD OUT_RIGHT_M - + OUT_RIGHT_P OUT_LEFT_M - + OUT_LEFT_P PVDD OUT_CENTER_M GND OUT_CENTER_P PVDD GVDD (+12V) TAS5631B SLES263 – NOVEMBER 2010 Figure 17. Typical 2.1 System (2N) Input BTL and (1N) Input SE Application Submit Documentation Feedback 19 20 Submit Documentation Feedback Product Folder Link(s): TAS5631B READY /OTW /SD IN_RIGHT_N IN_RIGHT_P IN_LEFT_N IN_LEFT_P /RESET VDD (+12V) 100R 100R 100R 100R 100R GND 100pF VREG 47k GND GND GND GND GND 100nF 4.7uF 4.7nF 24k 4.7uF VREG 10uF GND GND GND VREG VREG GND 100nF 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 M3 M2 M1 READY /OTW /SD NC NC TEST INPUT_D INPUT_C VREG AGND GND VI_CM INPUT_B INPUT_A TAS5631DKD C_STARTUP /RESET OC_ADJ VDD PSU_REF GVDD_CD BST_D PVDD_D PVDD_D OUT_D OUT_D GND_D GND_C OUT_C PVDD_C BST_C BST_B PVDD_B OUT_B GND_B GND_A OUT_A OUT_A PVDD_A PVDD_A BST_A GVDD_AB 100nF 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 GND 100nF 33nF 1.5R 33nF GND 100nF GND 33nF GND 33nF 100nF 1.5R 2.2uF 2.2uF 2.2uF 2.2uF GND 7uH 680nF GND GND 1000uF 680nF 7uH GND 1000uF 7uH 680nF GND 680nF 7uH 1nF 1nF GND 1000uF 47uF 1nF 1nF 1000uF GND 3.3R 10nF 10nF 3.3R GND GND + - OUT_RIGHT_M GND OUT_RIGHT_P 10nF 3.3R OUT_LEFT_M - + OUT_LEFT_P GND 2.2uF 3.3R 10nF 10nF 3.3R GND GVDD (+12V) PVDD PVDD PVDD GVDD (+12V) TAS5631B SLES263 – NOVEMBER 2010 www.ti.com Figure 18. Typical Differential Input BTL Application With BD Modulation Filters, DKD Package Copyright © 2010, Texas Instruments Incorporated TAS5631B www.ti.com SLES263 – NOVEMBER 2010 THEORY OF OPERATION POWER SUPPLIES To facilitate system design, the TAS5631B needs only a 12-V supply in addition to the (typical) 50-V power-stage supply. An internal voltage regulator provides suitable voltage levels for the digital and low-voltage analog circuitry. Additionally, all circuitry requiring a floating voltage supply, e.g., the high-side gate drive, is accommodated by built-in bootstrap circuitry requiring only an external capacitor for each half-bridge. To provide outstanding electrical and acoustical characteristics, the PWM signal path, including gate drive and output stage, is designed as identical, independent half-bridges. For this reason, each half-bridge has separate gate-drive supply pins (GVDD_X), bootstrap pins (BST_X), and power-stage supply pins (PVDD_X). Furthermore, an additional pin (VDD) is provided as a supply for all common circuits. Although supplied from the same 12-V source, it is highly recommended to separate GVDD_A, GVDD_B, GVDD_C, GVDD_D, and VDD on the printed-circuit board (PCB) by RC filters (see application diagram for details). These RC filters provide the recommended high-frequency isolation. Special attention should be paid to placing all decoupling capacitors as close to their associated pins as possible. In general, inductance between the power supply pins and decoupling capacitors must be avoided. (See reference board documentation for additional information.) For a properly functioning bootstrap circuit, a small ceramic capacitor must be connected from each bootstrap pin (BST_X) to the power-stage output pin (OUT_X). When the power-stage output is low, the bootstrap capacitor is charged through an internal diode connected between the gate-drive power-supply pin (GVDD_X) and the bootstrap pin. When the power-stage output is high, the bootstrap capacitor potential is shifted above the output potential and thus provides a suitable voltage supply for the high-side gate driver. In an application with PWM switching frequencies in the range from 300 kHz to 4000 kHz, it is recommended to use 33-nF ceramic capacitors, size 0603 or 0805, for the bootstrap supply. These 33-nF capacitors ensure sufficient energy storage, even during minimal PWM duty cycles, to keep the high-side power stage FET (LDMOS) fully turned on during the remaining part of the PWM cycle. Special attention should be paid to the power-stage power supply; this includes component selection, PCB placement, and routing. As indicated, each half-bridge has independent power-stage supply pins (PVDD_X). For optimal electrical performance, EMI compliance, and system reliability, it is important that each PVDD_X pin is decoupled with a 2.2-mF ceramic capacitor placed as close as possible to each supply pin. It is recommended to follow the PCB layout of the TAS5631B reference design. For additional information on recommended power supply and required components, see the application diagrams in this data sheet. The 12-V supply should be from a low-noise, low-output-impedance voltage regulator. Likewise, the 50-V power-stage supply is assumed to have low output impedance and low noise. The power-supply sequence is not critical as facilitated by the internal power-on-reset circuit. Moreover, the TAS5631B is fully protected against erroneous power-stage turnon due to parasitic gate charging. Thus, voltage-supply ramp rates (dV/dt) are non-critical within the specified range (see the Recommended Operating Conditions table of this data sheet). SYSTEM POWER-UP/POWER-DOWN SEQUENCE Powering Up The TAS5631B does not require a power-up sequence. The outputs of the H-bridges remain in a high-impedance state until the gate-drive supply voltage (GVDD_X) and VDD voltage are above the undervoltage protection (UVP) voltage threshold (see the Electrical Characteristics table of this data sheet). Although not specifically required, it is recommended to hold RESET in a low state while powering up the device. This allows an internal circuit to charge the external bootstrap capacitors by enabling a weak pulldown of the half-bridge output. Powering Down The TAS5631B does not require a power-down sequence. The device remains fully operational as long as the gate-drive supply (GVDD_X) voltage and VDD voltage are above the undervoltage protection (UVP) voltage threshold (see the Electrical Characteristics table of this data sheet). Although not specifically required, it is a good practice to hold RESET low during power down, thus preventing audible artifacts including pops or clicks. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TAS5631B 21 TAS5631B SLES263 – NOVEMBER 2010 www.ti.com ERROR REPORTING The SD, OTW, OTW1, and OTW2 pins are active-low, open-drain outputs. Their function is for protection-mode signaling to a PWM controller or other system-control device. Any fault resulting in device shutdown is signaled by the SD pin going low. Likewise, OTW and OTW2 go low when the device junction temperature exceeds 125°C and OTW1 goes low when the junction temperature exceeds 100°C (see the following table). SD OTW1 OTW2, OTW 0 0 0 Overtemperature (OTE) or overload (OLP) or undervoltage (UVP) 0 0 1 Overload (OLP) or undervoltage (UVP). Junction temperature higher than 100°C (overtemperature warning) 0 1 1 Overload (OLP) or undervoltage (UVP) 1 0 0 Junction temperature higher than 125°C (overtemperature warning) 1 0 1 Junction temperature higher than 100°C (overtemperature warning) 1 1 1 Junction temperature lower than 100°C and no OLP or UVP faults (normal operation) DESCRIPTION Note that asserting RESET low forces the SD signal high, independent of faults being present. TI recommends monitoring the OTW signal using the system microcontroller and responding to an overtemperature warning signal by, e.g., turning down the volume to prevent further heating of the device resulting in device shutdown (OTE). To reduce external component count, an internal pullup resistor to 3.3 V is provided on both SD and OTW outputs. Level compliance for 5-V logic can be obtained by adding external pullup resistors to 5 V (see the Electrical Characteristics table of this data sheet for further specifications). DEVICE PROTECTION SYSTEM The TAS5631B contains advanced protection circuitry carefully designed to facilitate system integration and ease of use, as well as to safeguard the device from permanent failure due to a wide range of fault conditions such as short circuits, overload, overtemperature, and undervoltage. The TAS5631B responds to a fault by immediately setting the power stage in a high-impedance (Hi-Z) state and asserting the SD pin low. In situations other than overload and overtemperature error (OTE), the device automatically recovers when the fault condition has been removed, i.e., the supply voltage has increased. The device functions on errors, as shown in the following table. BTL Mode Local Error In A B C D PBTL Mode Turns Off A+B C+D Local Error In SE Mode Turns Off A B C Local Error In A A+B+C+D D B C D Turns Off A+B C+D Bootstrap UVP does not shut down according to the table; it shuts down the respective half-bridge. PIN-TO-PIN SHORT-CIRCUIT PROTECTION (PPSC) The PPSC detection system protects the device from permanent damage if a power output pin (OUT_X) is shorted to GND_X or PVDD_X. For comparison, the OC protection system detects an overcurrent after the demodulation filter, whereas PPSC detects shorts directly at the pin before the filter. PPSC detection is performed at startup, i.e., when VDD is supplied; consequently, a short to either GND_X or PVDD_X after system startup does not activate the PPSC detection system. When PPSC detection is activated by a short on the output, all half-bridges are kept in a Hi-Z state until the short is removed; the device then continues the start-up sequence and starts switching. The detection is controlled globally by a two-step sequence. The first step ensures that there are no shorts from OUT_X to GND_X; the second step tests that there are no shorts from OUT_X to PVDD_X. The total duration of this process is roughly proportional to the capacitance of the 22 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TAS5631B TAS5631B www.ti.com SLES263 – NOVEMBER 2010 output LC filter. The typical duration is <15 ms/mF. While the PPSC detection is in progress, SD is kept low, and the device does not react to changes applied to the RESET pin. If no shorts are present, the PPSC detection passes, and SD is released. A device reset does not start a new PPSC detection. PPSC detection is enabled in BTL and PBTL output configurations; the detection is not performed in SE mode. To make sure not to trip the PPSC detection system, it is recommended not to insert resistive load between OUT_X and GND_X or PVDD_X. OVERTEMPERATURE PROTECTION The two different package options have individual overtemperature protection schemes. PHD Package The TAS5631B PHD package option has a three-level temperature-protection system that asserts an active-low warning signal (OTW1) when the device junction temperature exceeds 100°C (typical), (OTW2) when the device junction temperature exceeds 125°C (typical) and, if the device junction temperature exceeds 155°C (typical), the device is put into thermal shutdown, resulting in all half-bridge outputs being set in the high-impedance (Hi-Z) state and SD being asserted low. OTE is latched in this case. To clear the OTE latch, RESET must be asserted. Thereafter, the device resumes normal operation. DKD Package The TAS5631B DKD package option has a two-level temperature-protection system that asserts an active-low warning signal (OTW) when the device junction temperature exceeds 125°C (typical) and, if the device junction temperature exceeds 155°C (typical), the device is put into thermal shutdown, resulting in all half-bridge outputs being set in the high-impedance (Hi-Z) state and SD being asserted low. OTE is latched in this case. To clear the OTE latch, RESET must be asserted. Thereafter, the device resumes normal operation. UNDERVOLTAGE PROTECTION (UVP) AND POWER-ON RESET (POR) The UVP and POR circuits of the TAS5631B fully protect the device in any power-up/down and brownout situation. While powering up, the POR circuit resets the overload circuit (OLP) and ensures that all circuits are fully operational when the GVDD_X and VDD supply voltages reach values stated in the Electrical Characteristics table. Although GVDD_X and VDD are independently monitored, a supply-voltage drop below the UVP threshold on any VDD or GVDD_X pin results in all half-bridge outputs immediately being set in the high-impedance (Hi-Z) state and SD being asserted low. The device automatically resumes operation when all supply voltages have increased above the UVP threshold. DEVICE RESET When RESET is asserted low, all power-stage FETs in the four half-bridges are forced into a high-impedance (Hi-Z) state. In BTL modes, to accommodate bootstrap charging prior to switching start, asserting the reset input low enables weak pulldown of the half-bridge outputs. In the SE mode, the output is forced into a high-impedance state when asserting the reset input low. Asserting the reset input low removes any fault information to be signaled on the SD output, i.e., SD is forced high. A rising-edge transition on the reset input allows the device to resume operation after an overload fault. To ensure thermal reliability, the rising edge of reset must occur no sooner than 4 ms after the falling edge of SD. SYSTEM DESIGN CONSIDERATIONS A rising-edge transition on the reset input allows the device to execute the startup sequence and start switching. Apply only audio when the state of READY is high; that starts and stops the amplifier without having audible artifacts that are heard in the output transducers. If an overcurrent protection event is introduced, the READY signal goes low; hence, filtering is needed if the signal is intended for audio muting in non-microcontroller systems. The CLIP signal indicates that the output is approaching clipping. The signal can be used either to activate a volume decrease or to signal an intelligent power supply to increase the rail voltage from low to high for optimum efficiency.. The device inverts the audio signal from input to output. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TAS5631B 23 TAS5631B SLES263 – NOVEMBER 2010 www.ti.com The VREG pin is not recommended to be used as a voltage source for external circuitry. PRINTED CIRCUIT BOARD RECOMMENDATION Use an unbroken ground plane to have good low-impedance and -inductance return path to the power supply for power and audio signals. PCB layout, audio performance and EMI are linked closely together. The circuit contains high, fast-switching currents; therefore, care must be taken to prevent damaging voltage spikes. Routing for the audio input should be kept short and together with the accompanying audio source ground. It is important to keep a solid local ground area underneath the device to minimize ground bounce. It is always good practice fo follow the EVM layout as a guideline, Netlist for this printed circuit board is generated from the schematic in Figure 14. Note T1: PVDD decoupling bulk capacitors C60–C64 should be as close as possible to the PVDD and GND_X pins; the heat sink sets the distance. Wide traces should be routed on the top layer with direct connection to the pins and without going through vias. No vias or traces should be blocking the current path. Note T2: Close decoupling of PVDD with low-impedance X7R ceramic capacitors is placed under the heat sink and close to the pins. This is valid for C60, C61, C62, and C63. Note T3: Heat sink must have a good connection to PCB ground. Note T4: Output filter capacitors must be linear in the applied voltage range, and preferably metal film types. Figure 19. Printed Circuit Board – Top Layer 24 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TAS5631B TAS5631B www.ti.com SLES263 – NOVEMBER 2010 Note B1: It is important to have a direct, low-impedance return path for high current back to the power supply. Keep impedance low from top to bottom side of PCB through a lot of ground vias. Note B2: Bootstrap low-impedance X7R ceramic capacitors placed on bottom side provide a short low-inductance current loop. Note B3: Return currents from bulk capacitors and output filter capacitors Figure 20. Printed Circuit Board – Bottom Layer Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TAS5631B 25 PACKAGE OPTION ADDENDUM www.ti.com 23-Apr-2011 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) TAS5631BDKD PREVIEW HSSOP DKD 44 29 TBD Call TI Call TI TAS5631BDKDR PREVIEW HSSOP DKD 44 500 TBD Call TI Call TI TAS5631BPHD ACTIVE HTQFP PHD 64 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-4-260C-72 HR TAS5631BPHDR ACTIVE HTQFP PHD 64 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-4-260C-72 HR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 18-Apr-2011 TAPE AND REEL INFORMATION *All dimensions are nominal Device TAS5631BPHDR Package Package Pins Type Drawing HTQFP PHD 64 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 1000 330.0 24.4 Pack Materials-Page 1 17.0 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 17.0 1.5 20.0 24.0 Q2 PACKAGE MATERIALS INFORMATION www.ti.com 18-Apr-2011 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TAS5631BPHDR HTQFP PHD 64 1000 346.0 346.0 41.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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