TGA4031-SM 17 – 40 GHz MPA/Multiplier Key Features • • • • • • RF Output Frequency Range: 17 - 40 GHz 22 dB Nominal Gain 22 dBm Nominal Output Maximum Power 2x and 3x Multiplier Function Bias: Vd = 5V, Id = 140mA Package Dimensions: 3.0 x 3.0 x 1.17 mm Primary Applications • • • • Measured Performance Bias at Vd = 5V, Id = 140mA and Vg = -0.75V (Typical) 25 15 10 S21 S11 S22 S21 (dB) 15 10 5 0 5 -5 0 -10 -5 -15 -10 -20 -15 -25 16 20 24 28 32 36 40 Frequency (GHz) Bias at Vd = 5V, Id = 140mA and Vg = -0.75V (Typical) S11 & S22 (dB) 20 Point-to-Point Radio EW Instrumentation Frequency Multiplier Product Description The TriQuint TGA4031-SM is an Medium Power Amplifier and Multiplier for wide band for 17 – 40 GHz applications. The part is designed using TriQuint’s power pHEMT production process. The TGA4031-SM provides a nominal 22 dB small signal gain with 22 dBm output maximum power. For 2x and 3x Multiplier function, TGA4031-SM provides 15 dBm typical output power @ 9 dBm Pin. This part is ideally suited for applications such as Point-to-Point Radio, EW, instrumentation and frequency multipliers. Evaluation boards are available upon request. Lead-free and RoHS compliant Datasheet subject to change without notice. TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 [email protected] April 2012 © Rev D 1 TGA4031-SM Table I Absolute Maximum Ratings 1/ Symbol 1/ Parameter Value Vd-Vg Drain to Gate Voltage range 8V Vd Drain Supply Voltage Range 6V Vg Gate Supply Voltage Range -3 – 0 V Id Drain Current 400 mA |Ig| Gate Current 1.38 mA Pin Input Continuous Wave Power 20 dBm Notes These ratings represent the maximum operable values for this device. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device and / or affect device lifetime. These are stress ratings only, and functional operation of the device at these conditions is not implied. Table II Recommended Operating Conditions Symbol Parameter Value Vd Drain Voltage 5V Id Drain Current 140 mA Vg Gate Voltage (Typical) -0.75 V Vd1 Drain Voltage 1V Vg1 Gate Voltage -1.1 V See bias plan on page 14 for amplifier and 2x multiplier, page 15 for 3x multiplier TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 [email protected] April 2012 © Rev D 2 TGA4031-SM Table III RF Characterization Table Bias: Vd=5V, Id= 140mA, Vg = -0.75V (typical), TA= 25 °C PARAMETER AMPLIFIER 2X MULTIPLIER 3x MULTIPLIER UNITS RF Output Frequencies 17 - 40 22 - 38 23 - 31 GHz S21, Small Signal Gain 22 - - dB S11, Input Return Loss 10 - - dB S22, Output Return Loss 5 5 5 dB Psat, Maximum Output Power 22 dBm P1dB, Output Power @ 1 dB Gain Compression 18 dBm IMD3@ 11 dBm Pout/Tone 28 dBc Output Power @ Pin = 9 dBm - 15 15 dBm Conversion Gain - 9 5 dB Gain Temperature coefficient -0.04 dB/oC TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 [email protected] April 2012 © Rev D 3 TGA4031-SM Table IV Power Dissipation and Thermal Properties Parameter Test Conditions Value Maximum Power Dissipation Tbaseplate = 70 ºC Pd = 1.2 W Tchannel = 150 ºC Tm = 1.0E+6 Hrs Thermal Resistance, θjc Vd = 5V Id = 140mA Pd = 0.7W θjc = 66.7 (ºC/W) Tchannel = 116 ºC Tm = 2.4E+7 Hrs 30 seconds 260 ºC Max Mounting Temperature Storage Temperature 1/ Notes 1/ 2/ -65 to 150 ºC For a median life, Tm, of 1E+6 hours, power dissipation is limited to Pd(max) = (Tchannel ºC – Tbase ºC)/θjc. 2/ Channel operating temperature will directly affect the device median time to failure (MTTF). For maximum life, it is recommended that channel temperatures be maintained at the lowest possible levels. TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 [email protected] April 2012 © Rev D 4 TGA4031-SM Measured Data Bias Conditions: Vd = 5V, Idq = 140 mA, Vg = -0.75 V (Typical) This is device s-parameter This is evaluation board s-parameter TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 [email protected] April 2012 © Rev D 5 TGA4031-SM Measured Data Bias Conditions: Vd = 5V, Idq = 140 mA, Vg = -0.75 V (Typical) TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 [email protected] April 2012 © Rev D 6 TGA4031-SM Measured Data Bias Conditions: Vd = 5V, Idq = 140 mA, Vg = -0.75 V (Typical) TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 [email protected] April 2012 © Rev D 7 TGA4031-SM Measured Data Bias Conditions: Vd = 5V, Idq = 140 mA, Vg = -0.75 V (Typical) TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 [email protected] April 2012 © Rev D 8 TGA4031-SM Measured Data Bias Conditions: Vd = 5V, Idq = 140 mA, Vg = -0.75 V (Typical) TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 [email protected] April 2012 © Rev D 9 TGA4031-SM Measured 2X Multiplier Data Bias Conditions: Vd = 5 V, Idq = 120 mA, Vg1 = -1.1 V, Pin = 9 dBm TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 [email protected] April 2012 © Rev D 10 TGA4031-SM Measured 3X Multiplier Data Bias Conditions: Vd = 5 V, Vd1 = 1 V, Idq = 160 mA, Pin = 9 dBm TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 [email protected] April 2012 © Rev D 11 TGA4031-SM Mechanical Drawing Top View Bottom View 13 Vd Vd1 16 PIN 1 12 17 GND RF OUT RF IN 4 9 8 Vg 5 Vg1 Pin Symbol Description 1, 4, 9, 12 2, 11 3 5 6, 8, 13, 15 7 10 14 16 17 GND N/C RF IN Vg1 GND Vg RF OUT Vd Vd1 GND Internal grounding; must be grounded on PCB No internal connection; must be grounded on PCB Input, matched to 50 ohms Gate 1 voltage. Bias network is required; see Evaluation Board on page 14 as an example No internal connection; can be grounded on PCB or left open Gate voltage. Bias network is required; see Evaluation Board on page 14 as an example Output, matched to 50 ohms Drain voltage. Bias network is required; see Evaluation Board on page 14 as an example Drain 1 voltage. Bias network is required; see Evaluation Board on page 14 as an example Backside Paddle. Multiple vias should be employed to minimize inductance and thermal resistance. This package is lead-free/RoHS-compliant. The package base is copper alloy and the plating material on the leads is NiPdAu. It is compatible with both lead-free (maximum 260 °C reflow temperature) and tin-lead (maximum 245 °C reflow temperature) soldering processes. The TGA44031-SM will be marked with the “4031” designator and a lot code marked below the part designator. The “YY” represents the last two digits of the year the part was manufactured, the “WW” is the work week, and the “XXXXZ” is the lot wafer code. GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during handling, assembly and test. TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 [email protected] April 2012 © Rev D 12 Mechanical Drawing (Cont) TGA4031-SM Units: Millimeters GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during handling, assembly and test. TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 [email protected] April 2012 © Rev D 13 TGA4031-SM Evaluation Board 0402 0.01 uF capacitors Board material is 8 mil ROGERS RO4003 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 [email protected] April 2012 © Rev D 14 TGA4031-SM Recommended Power Supply Connection Diagram Amplifier & 2X Multiplier Vd Bias Procedure Powering up: Set Vg (starting from 0V) to –1.5V Increase Vd (starting from 0V) to desired voltage 5V Make Vg more positive, ending up at approx –0.75V. Id ~140mA. Apply RF (max input level +20dBm). Powering down: Remove RF Reduce Vd to 0V Set Vg to -1.5V. Amplifier Vg Set Vd = 5.0V Vary (Vg + Vg1) to achieve Id = 140mA Vd 2x Multiplier Set Vd = 5.0V Set Vg1 = -1.1V Vary Vg to achieve Id = 120mA Vg1 Vg TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 [email protected] April 2012 © Rev D 15 TGA4031-SM Recommended Power Supply Connection Diagram 3X Multiplier Vd1 Vd 3x Multiplier Set Vd = 5.0V Set Vd1 = 1.0V Vary (Vg + Vg1) to achieve (Id + Id1) = 160mA Vg TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 [email protected] April 2012 © Rev D 16 TGA4031-SM Recommended Surface Mount Package Assembly Proper ESD precautions must be followed while handling packages. TriQuint recommends using a conductive solder paste for attachment. Follow solder paste and reflow oven vendors’ recommendations when developing a solder reflow profile. Typical solder reflow profiles are listed in the table below. Hand soldering is not recommended. Solder paste can be applied using a stencil printer or dot placement. The volume of solder paste depends on PCB and component layout and should be well controlled to ensure consistent mechanical and electrical performance. Solder attach process requires the use of no clean flux. Typical Solder Reflow Profiles Reflow Profile SnPb Pb Free Ramp-up Rate 3 °C/sec 3 °C/sec Activation Time and Temperature 60 – 120 sec @ 140 – 160 °C 60 – 180 sec @ 150 – 200 °C Time above Melting Point 60 – 150 sec 60 – 150 sec Max Peak Temperature 240 °C 260 °C Time within 5 °C of Peak Temperature 10 – 20 sec 10 – 20 sec Ramp-down Rate 4 – 6 °C/sec 4 – 6 °C/sec Ordering Information Part Package Style TGA4031-SM 3X3 QFN TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 [email protected] April 2012 © Rev D 17