TOSHIBA TIM1213-5

MICROWAVE POWER GaAs FET
TIM1213-5
PRELIMINARY
MICROWAVE SEMICONDUCTOR
TECHNICAL DATA
FEATURES
n HIGH POWERT
n BROAD BAND INTERNALLY MATCHED
P1dB=37.0dBm at 12.7GHz to 13.2GHz
n HERMETICALLY SEALED PACKAGE
n HIGH GAIN
G1dB=7.0dB at 12.7GHz to 13.2GHz
RF PERFORMANCE SPECIFICATIONS ( Ta= 25° C )
CHARACTERISTICS
SYMBOL
CONDITION
Output Power at 1dB
P1dB
Compression Point
VDS= 9V
Power Gain at 1dB
G1dB
f= 12.7 to 13.2GHz
Compression Point
Drain Current
IDS1
ηadd
Power Added Efficiency
∆Tch
Channel Temperature Rise
VDS X IDS X Rth(c-c)
UNIT
dBm
MIN.
37.0
TYP. MAX.

37.5
dB
6.0
7.0

A
%
°C



2.0
25

2.5

80
UNIT
TYP.
mS
MIN.

1400
MAX.

V
-2.0
-3.5
-5.0
A

5.0
5.7
V
-5


°C/W

3.0
3.7
ELECTRICAL CHARACTERISTICS ( Ta= 25° C )
CHARACTERISTICS
Transconductance
Pinch-off Voltage
SYMBOL
gm
VGSoff
Saturated Drain Current
IDSS
Gate-Source Breakdown
Voltage
Thermal Resistance
VGSO
Rth(c-c)
CONDITION
VDS = 3V
IDS = 2.4A
VDS = 3V
IDS = 72mA
VDS = 3V
VGS= 0V
IGS= -72µA
Channel to Case
u The information contained herein is presented only as a guide for the applications of our products. No responsibility is
assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may results from its use,
No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others.
The information contained herein is subject to change without prior notice. It is therefor advisable to contact TOSHIBA
before proceeding with design of equipment incorporating this product.
Jun. 2002
TIM1213-5
ABSOLUTE MAXIMUM RATINGS ( Ta= 25° C )
CHARACTERISTICS
SYMBOL
UNIT
RATING
Drain-Source Voltage
VDS
V
15
Gate-Source Voltage
VGS
V
-5
Drain Current
IDS
A
5.7
Total Power Dissipation (Tc= 25 °C)
PT
W
30
Channel Temperature
Tch
°C
175
Storage Temperature
Tstg
°C
-65 to +175
4-R2.4
2.0MIN.
PACKAGE OUTLINE (2-9D1B)
•
‚ Source
‚
.
1.8±0.3
0.2MAX
8.5 MAX.
3.2MAX
+0.1
0.1 -0.05
13.0±0.3
17.0 MAX
ƒ Drain
2.0MIN
0.5±0.15
1.2±0.3
ƒ
9.7±0.3
2.5±0.3
‚
• Gate
HANDLING PRECAUTIONS FOR PACKAGED TYPE
Soldering iron should be grounded and the operating time should not exceed 10 seconds
at 260°C.
2