INFINEON TLE4274V10

Low-Drop Voltage Regulator
TLE 4274
Features
•
•
•
•
•
•
Output voltage tolerance ≤ ± 4 %
Low-drop voltage
Very low current consumption
Short-circuit proof
Reverse polarity proof
Suitable for use in automotive electronics
P-TO220-3-1
Type
Ordering Code
Package
TLE 4274 V10
Q67000-A9258
P-TO220-3-1
TLE 4274 V85
Q67000-A9257
P-TO220-3-1
TLE 4274 V50
Q67000-A9256
P-TO220-3-1
TLE 4274 D V50
Q67006-A9331
P-TO252-3-1
TLE 4274 G V10 Q67006-A9261
P-TO263-3-1
TLE 4274 G V50 Q67006-A9259
P-TO263-3-1
TLE 4274 G V85 Q67006-A9260
P-TO263-3-1
P-TO252-3-1
SMD = Surface Mounted Device
Functional Description
The TLE 4274 is a low-drop voltage regulator in a
TO220 package. The IC regulates an input voltage up
to 40 V to VQrated = 5.0 V (V50), 8.5 V (V85) and 10 V
(V10). The maximum output current is 400 mA. The IC
is short-circuit proof and incorporates temperature
protection that disables the IC at over temperature.
Dimensioning Information on External Components
P-TO263-3-1
The input capacitor CI is necessary for compensating line influences. Using a resistor of
approx. 1 Ω in series with CI, the oscillating of input inductivity and input capacitance can
be damped. The output capacitor CQ is necessary for the stability of the regulation circuit.
Stability is guaranteed at values CQ ≥ 22 µF and an ESR of ≤ 3 Ω within the operating
temperature range.
Semiconductor Group
1
1998-11-01
TLE 4274
Circuit Description
The control amplifier compares a reference voltage to a voltage that is proportional to the
output voltage and drives the base of the series transistor via a buffer. Saturation control
as a function of the load current prevents any oversaturation of the power element. The
IC also incorporates a number of internal circuits for protection against:
• Overload
• Overtemperature
• Reverse polarity
Pin Configuration (top view)
P-TO220-3-1
P-TO252-3-1
P-TO263-3-1
GND
Ι
Q
AEP02512
Ι GND Q
AEP02281
Ι GND Q
AEP01957
Figure 1
Pin Definitions and Functions
Pin No.
Symbol
Function
1
I
Input; block to ground directly at the IC with a ceramic
capacitor.
2
GND
Ground
3
Q
Output; block to ground with a ≥ 22 µF capacitor.
Semiconductor Group
2
1998-11-01
TLE 4274
Saturation
Control and
Protection
Circuit
Temperature
Sensor
Ι
1
3
Control
Amplifier
Q
Buffer
Bandgap
Reference
2
GND
AEB01959
Figure 2
Block Diagram
Semiconductor Group
3
1998-11-01
TLE 4274
Absolute Maximum Ratings
Tj = – 40 to 150 °C
Parameter
Symbol
Limit Values
min.
max.
Unit Test Condition
Voltage Regulator
Input
Voltage
VI
– 42
45
V
–
Current
II
–
–
–
Internally limited
VQ
IQ
– 1.0
40
V
–
–
–
–
Internally limited
IGND
–
100
mA
–
Tj
Tstg
–
150
°C
–
– 50
150
°C
–
Output
Voltage
Current
Ground
Current
Temperature
Junction temperature
Storage temperature
Note: Maximum ratings are absolute ratings; exceeding any one of these values may
cause irreversible damage to the integrated circuit.
Operating Range
Parameter
Symbol
Limit Values
min.
max.
Unit Remarks
Input voltage
VI
5.5
9.0/10.5
40
40/40
V
V50
V85/V10
Junction temperature
Tj
– 40
150
°C
–
Rthja
Rthja
Rthjc
–
65
K/W TO220
–
70
K/W TO2521), TO263
–
4
K/W –
Thermal Resistance
Junction ambient
Junction ambient
Junction case
1)
Soldered in, min. footprint
Semiconductor Group
4
1998-11-01
TLE 4274
Characteristics
VI = 13.5 V; – 40 °C < Tj < 150 °C (unless otherwise specified)
Parameter
Symbol
Limit Values
min.
typ.
max.
Unit
Measuring Conditions
Output voltage
V50-Version
VQ
4.8
5
5.2
V
5 mA < IQ < 400 mA
6 V < VI < 40 V
Output voltage
V85-Version
VQ
8.16
8.5
8.84
V
5 mA < IQ < 400 mA
9.5 V < VI < 40 V
Output voltage
V10-Version
VQ
9.6
10
10.4
V
5 mA < IQ < 400 mA
11 V < VI < 40 V
Output current
limitation1)
IQ
400
600
–
mA
–
Current
consumption;
Iq = II – IQ
Iq
–
100
220
µA
IQ = 1 mA
Current
consumption;
Iq = II – IQ
Iq
–
8
15
mA
IQ = 250 mA
–
20
30
mA
Drop voltage1)
Iq
Vdr
–
250
500
mV
Load regulation
∆VQ
–
20
50
mV
IQ = 400 mA
IQ = 250 mA
Vdr = VI – VQ
IQ = 5 mA to
400 mA
∆Vl = 12 V to 32 V
IQ = 5 mA
fr = 100 Hz;
Vr = 0.5 VSS
Line regulation
∆VQ
–
10
25
mV
Power supply
ripple rejection
PSRR
–
60
–
dB
Temperature
output voltage
drift
dV Q
----------dT
–
0.5
–
mV/K –
1)
Measured when the output voltage VQ has dropped 100 mV from the nominal value obtained at VI = 13.5 V.
Semiconductor Group
5
1998-11-01
TLE 4274
ΙΙ
1
Input
3
CΙ
100 nF
100 µ F
ΙQ
Output
CQ
22 µF
TLE 4274
VΙ
VQ
2
RL
AES01960
Figure 3
Measuring Circuit
3
1
Input
Output
TLE 4274
CΙ
CQ
2
AES01961
Figure 4
Application Circuit
Semiconductor Group
6
1998-11-01
TLE 4274
Typical Performance Characteristics (V50, V85 and V10):
Drop Voltage Vdr versus
Output Current IQ
Output Current IQ versus
Input Voltage VI
AED01962
600
V dr
AED01963
800
mA
mV
ΙQ
600
T j = 125 C
400
T j = 25 C
VQ = 0 V
400
300
200
100
0
200
T j = 25 C
Vdr = V QNOM-0.1 V
0
0
100
200
300 mA 400
ΙQ
Current Consumption Iq versus
Output Current IQ (high load)
Ιq
Ιq
T j = 25 C
V Ι = 13.5 V
30
0.3
20
0.2
10
0.1
0
200
Semiconductor Group
300
400
mA
ΙQ
AED02268
T j = 25 C
V Ι = 13.5 V
0.4
100
40 V 50
VΙ
30
mA
40
0
20
0.6
mA
0
10
Current Consumption Iq versus
Output Current IQ (low load)
AED02267
60
0
600
7
0
10
20
30
40
mA
ΙQ
60
1998-11-01
TLE 4274
Typical Performance Characteristics (V50):
Current Consumption Iq versus
Input Voltage VI
Output Voltage VQ versus
Junction Temperature Tj
AED01966
5.20
AED02269
30
V
VQ
Ιq
5.10
mA
V Ι = 13.5 V
5.00
20
T j = 25 C
R L = 20 Ω
4.90
4.80
10
4.70
4.60
-40
0
40
80
0
120 C 160
Tj
Output Voltage VQ versus
Input Voltage VI
AED01968
V
20
30
50
V
VΙ
AED01977
3.5
mA
Ι Ι 3.0
VQ
5
10
Input Current II versus
Input Voltage VI
6
VQ
0
2.5
4
2.0
VΙ =VQ
1.5
3
T j = 25 C
R L = 20 Ω
T j = 25 C
R L = 10 k Ω
1.0
2
0.5
1
0
0
0
2
Semiconductor Group
4
6
-2
-50
8 V 10
VΙ
-25
0
25
V
50
VΙ
8
1998-11-01
TLE 4274
Typical Performance Characteristics for V85:
Current Consumption Iq versus
Input Voltage VI
Output Voltage VQ versus
Junction Temperature Tj
AED01970
9.0
VQ
AED02270
30
V
Ιq
mA
V Ι = 13.5 V
8.5
20
T j = 25 C
R L = 20 Ω
8.0
10
7.5
-40
0
40
80
0
120 C 160
Tj
Output Voltage VQ versus
Input Voltage VI
10
20
30
50
V
VΙ
Input Current II versus
Input Voltage VI
AED01972
12
VQ
0
AED01973
3.5
mA
Ι Ι 3.0
V
10
VQ
2.5
8
2.0
VΙ =VQ
1.5
6
T j = 25 C
R L = 34 Ω
T j = 25 C
R L = 8.5 k Ω
1.0
4
0.5
2
0
0
0
4
Semiconductor Group
8
12
-2
-50
16 V 20
VΙ
-25
0
25
V
50
VΙ
9
1998-11-01
TLE 4274
Typical Performance Characteristics for V10:
Current Consumption Iq versus
Input Voltage VI
Output Voltage VQ versus
Junction Temperature Tj
AED01974
10.5
VQ
AED02270
30
V
Ιq
mA
V Ι = 13.5 V
10.0
20
T j = 25 C
R L = 20 Ω
9.5
10
9.0
-40
0
40
80
0
120 C 160
Tj
Output Voltage VQ versus
Input Voltage VI
VQ
V
20
30
50
V
VΙ
AED01977
3.5
mA
Ι Ι 3.0
VQ
10
10
Input Current II versus
Input Voltage VI
AED01976
12
0
2.5
8
2.0
VΙ =VQ
1.5
6
T j = 25 C
R L = 34 Ω
T j = 25 C
R L = 10 k Ω
1.0
4
0.5
2
0
0
0
4
Semiconductor Group
8
12
-2
-50
16 V 20
VΙ
-25
0
25
V
50
VΙ
10
1998-11-01
TLE 4274
Package Outlines
P-TO220-3-1
(Plastic Transistor Outline)
10 ±0.2
A
9.8 ±0.15
B
4.4
C
0...0.15
13.5 ±0.5
4.55 ±0.2
0.05
9.25 ±0.2
1.27±0.1
2.8 ±0.2
1)
13.4
15.65 ±0.3
17±0.3
8.5 1)
3.7 -0.15
0.5 ±0.1
3x
0.75 ±0.1
2.4
1.05
2.54
1)
0.25
M
A B C
GPT05155
Typical
All metal surfaces tin plated, except area of cut.
Sorts of Packing
Package outlines for tubes, trays etc. are contained in our
Data Book “Package Information”
Dimensions in mm
Semiconductor Group
11
1998-11-01
TLE 4274
P-TO252-3-1
(Plastic Transistor Single Outline)
6.5 +0.15
-0.10
2.3 +0.05
-0.10
4.57
0.51 min
0.15 max
per side
0.9 +0.08
-0.04
B
0.8 ±0.15
9.9 ±0.5
6.22 -0.2
1 ±0.1
A
5.4 ±0.1
3x
0.75 ±0.1
0...0.15
0.5 +0.08
-0.04
2.28
1 ±0.1
0.25
M
A B
0.1
GPT09051
All metal surfaces tin plated, except area of cut.
Sorts of Packing
Package outlines for tubes, trays etc. are contained in our
Data Book “Package Information”
SMD = Surface Mounted Device
Semiconductor Group
12
Dimensions in mm
1998-11-01
TLE 4274
P-TO263-3-1
(Plastic Transistor Single Outline)
10 ±0.2
4.4
9.8 ±0.15
1.27 ±0.1
B
0.1
0.05
2.4
2.7 ±0.3
8 1)
8.5
4.7 ±0.5
(15)
9.25 ±0.2
1±0.3
A
1)
0...0.15
0.75 ±0.1
0.5 ±0.1
1.05
8˚ max.
2.54
5.08
M
A B
Typical
All metal surfaces tin plated, except area of cut.
Sorts of Packing
Package outlines for tubes, trays etc. are contained in our
Data Book “Package Information”
SMD = Surface Mounted Device
Semiconductor Group
0.1
13
GPT09057
1)
0.25
Dimensions in mm
1998-11-01