TOSHIBA TLP290-4

TLP290-4
TOSHIBA PHOTOCOUPLER GaAs IRED & PHOTO-TRANSISTOR
TLP290-4
Programmable Controllers
Power Supplies
Unit in mm
The Toshiba TLP290-4 consists of photo transistor, optically coupled to a
gallium arsenide infrared emitting diode. TLP290-4 is housed in the SO16
package, very small and thin coupler.
Since TLP290-4 are guaranteed wide operating temperature (Ta=-55 to 110
˚C), it’s suitable for high-density surface mounting applications such as
programmable controllers and hybrid ICs.
Collector-Emitter Voltage
: 80 V (min)
Current Transfer Ratio
Rank GB
: 50% (min)
: 100% (min)
Isolation Voltage
: 2500 Vrms (min)
Guaranteed performance over -55 to 110 ˚C
UL approved
cUL approved
No.5A
: UL1577 , File No. E67349
: CSA Component Acceptance Service
TOSHIBA
11-11F1
Weight: 0.19 g (typ.)
Option (V4) type
VDE approved
Pin Configuration
: EN60747-5-2
(Note) : When a EN60747-5-2 approved type is needed,
Please designate “Option(V4)”
Construction mechanical rating
Creepage distance
Clearance
Insulation thickness
: 5.0 mm(min)
: 5.0 mm(min)
: 0.1 mm(min)
TLP290-4
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
1,3,5,7
:ANODE, CATHODE
2,4,6,8
:CATHODE, ANODE
9,11,13,15 :EMITTER
10,12,14,16 :COLLECTOR
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TLP290-4
Current Transfer Ratio
TYPE
TLP290-4
Classification
(Note1)
Current Transfer Ratio (%)
(IC / IF)
Marking of Classification
IF = 5 mA, V CE = 5 V, Ta = 25℃
Min
Max
Blank
50
400
Blank
Rank GB
100
400
GB
Note1: ex. Rank GB: TLP290-4 (GB)
Application type name for certification test, please use standard product type name, i.e.
TLP290 4 (GB,E: TLP290-4
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Absolute Maximum Ratings (Ta = 25℃)
SYMBOL
RATING
UNIT
Forward Current
IF(RMS)
±50
mA
Forward Current Derating
∆IF /°C
−0.67 (Ta≥50°C)
mA /°C
IFP
±1
A
Tj
125
°C
Collector-Emitter Voltage
VCEO
80
V
Emitter-Collector Voltage
VECO
7
V
IC
50
mA
PC
100
mW
∆PC /°C
−1.0
mW /°C
Junction Temperature
Tj
125
°C
Operating Temperature Range
Topr
−55 to 110
°C
Storage Temperature Range
Tstg
−55 to 125
°C
Lead Soldering Temperature
Tsol
260 (10s)
°C
PT
170
mW
∆PT /°C
−1.7
mW /°C
BVS
2500
Vrms
LED
CHARACTERISTIC
Pulse Forward Current
(Note2)
DETECTOR
Junction Temperature
Collector Current
Collector Power Dissipation
(1 Circuit)
Collector Power Dissipation
Derating(Ta≥25°C)
(1 Circuit)
Total Package Power Dissipation
(1 Circuit)
Total Package Power Dissipation
Derating (Ta≥25°C)
(1 Circuit)
Isolation Voltage
(Note3)
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note2: Pulse width
100μs, frequency 100Hz
Note3: AC, 1 minute, R.H.≤60%, Device considered a two terminal device : LED side pins shorted together and
DETECTOR side pins shorted together.
Individual Electrical Characteristics (Ta = 25℃)
DETECTOR
LED
CHARACTERISTIC
SYMBOL
TEST CONDITION
MIN
TYP.
MAX
UNIT
Forward Voltage
VF
IF = 10 mA
1.1
1.20
1.4
V
Capacitance
CT
V = 0, f = 1 MHz
—
30
—
pF
Collector-Emitter Breakdown Voltage
V(BR) CEO
IC = 0.5 mA
80
—
—
V
Emitter-Collector Breakdown Voltage
V(BR) ECO
IE = 0.1 mA
7
—
—
V
VCE = 48 V,
—
0.01
0.1
μA
VCE = 48 V, Ta = 85°C
—
2
50
μA
V = 0, f = 1 MHz
—
10
—
pF
Collector Dark Current
(Note5)
Capacitance
(Collector to Emitter)
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TLP290-4
Coupled Electrical Characteristics (Ta = 25℃)
CHARACTERISTIC
SYMBOL
Current Transfer Ratio
IC / IF
Saturated CTR
IC / IF (sat)
Collector-Emitter Saturation Voltage
VCE (sat)
TEST CONDITION
MIN
TYP.
MAX
50
—
400
100
—
400
—
60
—
30
—
—
IC = 2.4 mA, IF = 8 mA
—
—
0.4
IC = 0.2 mA, IF = 1 mA
—
0.2
—
—
—
0.4
—
—
10
μA
0.33
—
3
—
MIN
TYP.
MAX
UNIT
—
0.8
—
pF
—
Ω
IF = 5 mA, VCE = 5 V
Rank GB
IF = 1 mA, VCE = 0.4 V
Rank GB
Rank GB
Off-State Collector Current
IC (off)
CTR symmetry
IC (ratio)
VF = 0.7 V, VCE = 48 V
IC (IF = −5 mA) / IC (IF = 5 mA)
Note5
UNIT
%
%
V
Note5:
IC(ratio )
IC2 (IF
IC1(IF
IF2 , VCE
IF1, VCE
5V)
5V)
Isolation Characteristics (Ta = 25℃)
CHARACTERISTIC
SYMBOL
Capacitance
(Input to Output)
CS
Isolation Resistance
RS
TEST CONDITION
VS = 0 V, f = 1 MHz
12
VS = 500 V, R.H.≤60%
1×10
AC , 1 minute
Isolation Voltage
BVS
14
10
2500
—
—
AC , 1 second, in OIL
—
5000
—
DC , 1 minute, in OIL
—
5000
—
Vdc
MIN
TYP.
MAX
UNIT
—
2
—
—
3
—
—
3
—
—
3
—
—
2
—
—
25
—
—
40
—
Vrms
Switching Characteristics (Ta = 25℃)
CHARACTERISTIC
SYMBOL
Rise Time
tr
Fall Time
tf
Turn-On Time
ton
Turn-Off Time
toff
Turn-On Time
tON
Storage Time
ts
Turn-Off Time
tOFF
TEST CONDITION
VCC = 10 V, IC = 2 mA
RL = 100Ω
RL = 1.9 kΩ
VCC = 5 V, IF = 16 mA
(Fig.1)
μs
μs
(Fig.1) Switchin Time Test Circuit
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TLP290-4
Soldering and Storage
1. Soldering
1.1 Soldering
When using a soldering iron or medium infrared ray/hot air reflow, avoid a rise in device temperature as
much as possible by observing the following conditions.
1) Using solder reflow
∙Temperature profile example of lead (Pb) solder
(°C)
This profile is based on the device’s
maximum heat resistance guaranteed
value.
Set the preheat temperature/heating
temperature to the optimum temperature
corresponding to the solder paste
type used by the customer within the
described profile.
Package surface temperature
240
210
160
140
less than 30s
60 to 120s
Time
(s)
∙Temperature profile example of using lead (Pb)-free solder
(°C)
This profile is based on the device’s
maximum heat resistance guaranteed
value.
Set the preheat temperature/heating
temperature to the optimum temperature
corresponding to the solder paste
type used by the customer within the
described profile.
Package surface temperature
260
230
190
180
60 to 120s
30 to 50s
Time
(s)
Reflow soldering must be performed once or twice.
The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
2) Using solder flow (for lead (Pb) solder, or lead (Pb)-free solder)
・Please preheat it at 150°C between 60 and 120 seconds.
・Complete soldering within 10 seconds below 260°C. Each pin may be heated at most once.
3) Using a soldering iron
Complete soldering within 10 seconds below 260°C, or within 3 seconds at 350°C. Each pin may
be heated at most once.
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2. Storage
1) Avoid storage locations where devices may be exposed to moisture or direct sunlight.
2) Follow the precautions printed on the packing label of the device for transportation and storage.
3) Keep the storage location temperature and humidity within a range of 5°C to 35°C and 45% to 75%,
respectively.
4) Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty
conditions.
5) Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during
storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the
solderability of the leads.
6) When restoring devices after removal from their packing, use anti-static containers.
7) Do not allow loads to be applied directly to devices while they are in storage.
8) If devices have been stored for more than two years under normal storage conditions, it is recommended
that you check the leads for ease of soldering prior to use.
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TLP290-4
Option:Specification for Embossed-Tape Packing
(TP) for Mini-Flat Coupler
1. Applicable Package
Package Name
Product Type
SO16
Mini-Flat Coupler
2. Product Naming System
Type of package used for shipment is denoted by a symbol suffix after a product number. The method of
classification is as below.
（Example）
ＴＬＰ２９０－４（ＧＢ－ＴＰ，E
[[G]]/RoHS COMPATIBLE (Note6)
Tape type
CTR rank
Device name
3. Tape Dimensions
3.1 Orientation of Device in Relation to Direction of Tape Movement
Device orientation in the recesses is as shown in Figure 1.
Tape feed
TLP290－4
Figure１
Device Orientation
3.2 Tape Packing Quantity：2000 devices per reel
3.3 Empty Device Recesses are as Shown in Table 1.
Table１ Empty Device Recesses
Occurrences of 2 or more
successive empty device
recesses
Single empty device
recesses
Standard
Remarks
0
Within any given 40-mm section of
tape, not including leader and trailer
6 device (max) per reel
Not including leader and trailer
3.4 Start and End of Tape
The start of the tape has 50 or more empty holes. The end of tape has 50 or more empty holes and two
empty turns only for a cover tape.
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TLP290-4
3.5 Tape Specification
(1) Tape material: Plastic (protection against electrostatics)
(2) Dimensions: The tape dimensions are as shown in Figure 2 and table 2.
2.0
0.05
0.1
1.5 0
F
0.1
G
K0
0.3
A
1.5
2.6
16.0
B
D
E
0.3
0.1
0.2
Figure2 Tape Forms
Table2 Tape Dimensions
Unit: mm
Unless otherwise specified: ±0.1
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Symbol
Dimension
Remark
A
7.5
―
B
10.5
―
D
7.5
Center line of indented square hole and sprocket hole
E
1.75
Distance between tape edge and hole center
F
12.0
G
4.0
K0
2.2
Cumulative error +0.1 (max) per 10 feed holes
-0.3
Cumulative error +0.1 (max) per 10 feed holes
-0.3
Internal space
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TLP290-4
3.6
Reel
(1)
(2)
Material: Plastic
Dimensions: The reel dimensions are as shown in Figure 3 and Table 3.
Table 3 Reel Dimensions
Unit: mm
Symbol
A
B
C
U
E
Dimension
A
330
2
B
80
1
C
13
0.5
E
2.0
0.5
U
4.0
0.5
W1
17.5
0.5
W2
21.5
1.0
W1
W2
Figure 3 Reel Forms
4.
Packing
Either one reel or five reels of photocouplers are packed in a shipping carton.
5.
Label Indication
The carton bears a label indicating the product number, the symbol representing classification of
standard, the quantity, the lot number and the Toshiba company name.
6.
Ordering Method
When placing an order, please specify the product number, the CTR rank, the tape type and the quantity
as shown in the following example.
（Example）
TLP291-4(GB-TP,E 2000 Pcs
Quantity (must be a multiple of 2000)
[[G]]/RoHS COMPATIBLE (Note6)
Tape type
CTR rank
Device name
Note6 : Please contact your TOSHIBA sales representative for details as to environmental matters such as the
RoHS compatibility of Product.
The RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003
on the restriction of the use of certain hazardous substances in electrical and electronics equipment.
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TLP290-4
PC - Ta
IF － Ta
120
Allowable collector
power dissipation PC (mW)
Allowance ｆorward current
IF (mA)
100
80
60
40
20
100
80
60
40
20
0
0
-20
0
20
40
60
80
100
-20
120
0
20
60
80
100
120
Ambient temperature Ta （℃）
Ambient temperature Ta （℃）
IFP － DR
IF - VF
100
Forward current IF (mA)
10000
Pulse ｆorward current　IFP (mA)
40
1000
100
100℃
75℃
50℃
25℃
0℃
-25℃
-50℃
10
1
0.1
10
0.001
0.01
0.1
0.6
1
0.8
1
1.2
1.4
1.6
1.8
Forward voltage VF (V)
Duty cycle ratio　DR
IFP－VFP
⊿VF/⊿Ta－IF
1000
Pulse forward current IFP (mA)
Forward voltage temperature
cofficient ΔVF/ΔTa (mV/℃)
-3.2
-2.8
-2.4
-2
-1.6
-1.2
-0.8
10
Pulse width≦10us
Repeative frequency=100Hz
Ta=25 ℃
1
-0.4
0.1
1
10
100
0.6
1
1.4
1.8
2.2
2.6
3
3.4
Pulse forward voltage VFP (V)
Forward current IF (mA)
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TLP290-4
IC－VCE
IC－VCE
30
50
Ta=25℃
Collector current IC (mA)
Collector current IC (mA)
Ta=25℃
40
50
30
30
20
15
20
10
PC(max)
10
25
20
15
50
40
30
20
10
10
5
5
IF=2mA
IF=5mA
0
0
0
2
4
6
8
10
0
0.2
Collector-emitter voltage VCE (V)
0.4
0.8
1
Collector-emitter voltage VCE (V)
IC－IF
ICEO－Ta
100
10
Collector dark current ICEO (uA)
Collector current IC (mA)
0.6
10
1
1
0.1
VCE=48V
24V
10V
5V
0.01
0.001
0.0001
0
20
40
60
80
100
120
Ambient temperature Ta (℃)
VCE=10V
VCE=5V
VCE=0.4V
0.1
0.1
1
10
IC/IF - IF
100
1000
Current transfer ratio IC/IF (%)
Forward current IF (mA)
VCE=10V
VCE=5V
VCE=0.4V
100
10
0.1
1
10
100
Forward current IF (mA)
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TLP290-4
IC-Ta
VCE(sat) - Ta
100
25
0.20
Collector current IC（ｍA)
Collector-emitter saturation
voltage VCE(sat) (V)
0.24
0.16
0.12
0.08
0.04
0.00
10
10
5
1
1
IF=0.5mA
VCE=5V
0.1
-40
0
40
80
120
-40
Ambient temperature Ta (℃)
-20
20
40
60
80
100
120
Ambient temperature Ta (℃)
Switching time－Ta
Switchingtime － RL
1000
10000
Ta=25 ℃
IF =16mA
tOFF
1000
Switching time　(μs)
Vcc=5V
Switching time （μs）
0
ｔOFF
100
ｔs
100
tｓ
10
1
tON
IF=16mA,
VCC =5V,
R L=1.9kΩ
0.1
10
-40
-20
0
20
40
60
80
100
120
Ambient temperature　Ta (℃)
ｔON
1
1
10
100
Load resistance RL (kΩ)
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TLP290-4
RESTRICTIONS ON PRODUCT USE
Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR
APPLICATIONS.
Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious
public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used
in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this
document.
Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or
vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
Do not use or otherwise make available Product or related software or technology for any military purposes, including without
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product
or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
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