TI TPS65471RHAR

TPS65471
www.ti.com
SLVSBE8 – JUNE 2012
SINGLE-CHIP POWER AND BATTERY MANAGEMENT IC FOR
Li-ION POWERED SYSTEMS
Check for Samples: TPS65471
FEATURES
1
•
2
•
•
•
•
•
•
•
40-Pin QFN package (6 mm x 6 mm) With
PowerPAD™
Integrated Dynamic Power Path Circuitry
(VBUS, VAC, VBAT) With Power Good Signal
Outputs and Reverse Current Protection
550-mA Li-Ion Battery Charger With 2 State
Pins and Safety Timers
Integrated 4.25-V Synchronous Boost
Converter (PWM) and LDO to Provide Voltage
Source for LEDs
4 LDOs for Each Function in the System
USB Suspend Mode
Reset Output
3 LED Drivers With PWM Control
•
•
•
•
•
•
Integrated 3.0-V LDO Regulators
Integrated 3.2-V LDO Regulators
A Motor Driver Control
LDO Regulators and Boost Converter On/Off
Control
Status Outputs to Indicate the Status of the
Linear Charger
Reverse Current Prevention and Thermal Shut
Down Circuitry
APPLICATIONS
•
Handheld Devices
DESCRIPTION/ORDERING INFORMATION
TPS65471 integrates a Li-ion linear charger, power path management, four LDO regulators, 4.25-V synchronous
boost converter and 4.25-V LDO regulator, three LED drivers and one motor driver.
With the power path circuitry, USB-port, AC-DC adapter and Li-ion battery power can be switched seamlessly as
the power source of 3.2-V LDO output regulators. This prevents instability in the system.
The TPS65471 charger automatically selects the USB port or the AC-DC adapter.
The EN_VLDO digital input is used to turn the output of VLED4P25, VLD02 and VLD04 on or off.
The EN_VLDO3 digital input is used to turn the output of VLDO3 on or off.
The TPS65471 is available in a 40-pin QFN package with PowerPAD™.
ORDERING INFORMATION (1)
(1)
(2)
TJ
PACKAGE (2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
–10°C to 125°C
RHA (QFN)
TPS65471RHA
TPS65471
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012, Texas Instruments Incorporated
TPS65471
SLVSBE8 – JUNE 2012
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
TYPICAL APPLICATION
VLDO1
100 kW
100 kW
VBUS_PG
STAT1
VAC_PG
STAT2
VBUS
VBAT
1.0 µF
X5R
7V
VAC
Dynamic PowerPath
Circuitry with Li-ion
Charger
1.0 µF
X5R
Battery
1.0 µF
X5R
7V
VIN
nCHEN
USB_SUSPEND
L
ISET1
RSET1
2.1 kW
Note1
ISET2
RSET2
8.2 kW
Note1
4.25-V
Boost /
LDO
PWR
22 µF
X5R
6.8 µH
Note2
SW
VLED4P25
0.01 µF
22 µF
X5R
10 µF
X5R
PGND
B
CTL_B
LED
Driver
CTL_G
CTL_R
VLDO4
CTL_MTR
MTRIN
G
R
LEDGND
Motor
Driver
M
VLDO1
LDO1
MTRGND
1.0 µF
X5 R
Reset
nRST_OUT
VLDO2
LDO2
EN_VLDO
1.0 µF
X5R
LDO3
EN_VLDO3
1.0 µF
X5R
LDO4
VLDO3
VLDO4
1.0 µF
X5R
Thermal Pad
(AGND)
2
DGND
Note 1: RSET1 = 2.1 kW, RSET2 = 8.2 kW;
380-mA CHARGE CURRENT
Power input from USB-port:
38-mA PRE-CHARGE CURRENT
Power input from AC-DC adaptor: 480-mA CHARGE CURRENT
48-mA PRE-CHARGE CURRENT
Note 2: TAIYO YUDEN NR4018T6R8M or equivalent
These logic inputs and outputs interface are based on 3.2-V system.
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s): TPS65471
TPS65471
www.ti.com
SLVSBE8 – JUNE 2012
PIN OUT
VAC_PG
TEST
VBUS
VBUS
VAC
VAC
B
G
R
LEDGND
31
32
33
34
35
36
37
38
39
40
22 MTRIN
21 VLDO4
23 MTRGND
24 VLDO3
26 nRST_OUT
25 DGND
27 nCHEN
28 VLDO1
30 VBUS_PG
29 VLDO2
RHA PACKAGE
(TOP VIEW)
20
19
18
17
16
15
14
13
12
11
Thermal
Pad (AGND)
USB_SUSPEND
EN_VLDO
EN_VLDO3
CTL_MTR
CTL_R
CTL_G
CTL_B
PWR
PWR
ISET1
5
6
7
8
9
10
VBAT
VBAT
STAT2
STAT1
ISET2
4
SW
L
3
PGND
VIN
1
2
VLED4P25
○
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s): TPS65471
3
TPS65471
SLVSBE8 – JUNE 2012
www.ti.com
TERMINAL FUNCTIONS
NAME
NO.
EXTERNAL REQUIRED COMPONENTS
(SEE TYPICAL APPLICATION)
DESCRIPTION
VAC
35, 36
Power input from AC-DC adapter
1-µF capacitor to AGND to minimize overvoltage transients
during AC power hot-plug events. Also Zener diode for
surge protection is connected.
VBUS
33, 34
Power input from USB-port
1-µF capacitor to AGND to minimize overvoltage transients
during BUS power hot-plug events. Also Zener diode for
surge protection is connected.
Can be used to indicate Power Good signal to system.
VBUS_PG
30
VBUS power-good status output. (CMOS
output)
VAC_PG
31
VAC power-good status output (CMOS output) Can be used to indicate Power Good signal to system.
STAT1
9
Charge status output 1 (open-drain output)
Connect 100-kΩ external pullup resistor between STAT1
and VLDO1.
STAT2
8
Charge status output 2 (open-drain output)
Connect 100-kΩ external pullup resistor between STAT2
and VLDO1.
ISET1
11
Charge current set point for VBUS input
External resistor from ISET1 pin and AGND pin sets charge
current value when the power input from USB-port.
ISET2
10
Charge current set point for VAC input
External resistor from ISET1 pin and ISET2 pin sets charge
current value when the power input from AC-DC adapter.
nCHEN
27
Charge enable input (active low)
Charge enable signal from system.
VIN
5
Power input for boost regulator. It is connected Connect to Li-ion battery positive terminal. Connect 22-µF
to the Li-ion battery.
capacitor from VIN pin to PGND.
L
4
The inductor is connected between this pin
and the SW pin
SW
3
Switching node of the IC. Connect the inductor 6.8-µH inductor to L pin.
between this pin and the L pin.
VLED4P25
1
LDO and synchronous boost converter output
22-µF capacitor to PGND. Connect series resistor for
current limitation to each LED (R,G,B).
PGND
2
Synchronous boost converter power ground
Connect to ground plane.
VBAT
6, 7
Power input and output for Li-ion battery
Connect to Li-ion battery positive terminal. Connect 1-µF
capacitor from VBAT pin to AGND.
R
39
Output for Red LED driver. The open-drain
output pulls low when the CTL_R pin goes to
H level. RON = 1 Ω (typical)
Connect to RED input of Red LED.
G
38
Output for Green LED driver. The open-drain
output pulls low when the CTL_G pin goes to
H level. RON = 1 Ω (typical)
Connect to GREEN input of Green LED.
B
37
Output for Blue LED driver. The open-drain
output pulls low when the CTL_B pin goes to
H level. RON = 1 Ω (typical)
Connect to BLUE input of Blue LED.
LEDGND
40
LED drivers power ground
Connect to ground plane.
VLDO1
28
LDO output, fixed 3.2 V. The output current of 1-µF capacitor to AGND
VLOD1 is limited to 20 mA (maximum), when
both EN_VLDO and EN_VLDO3 input pins are
low level.
VLDO2
29
LDO output, fixed 3.2 V
1-µF capacitor to AGND
VLOD3
24
LDO output, fixed 3.2 V
1-µF capacitor to AGND
VLDO4
21
LDO output, fixed 3.0 V
1-µF capacitor to AGND
nRST_OUT
26
System reset output, generated according to
Can be used to indicate the reset output signal to system.
the VLDO1 output voltage (open-drain output).
Connect 100-kΩ internal pullup resistor
between nRST_OUT and VLDO1.
MTRIN
22
Motor driver output. The open-drain output
pulls low when the CTL_MTR pin goes to H
level. RON = 1 Ω (typical)
Can be used to drive motor.
CTL_MTR
17
Control input for motor driver (active H)
Motor driver control input signal from system
MTRGND
23
Motor driver power ground
Connect ground plane
4
6.8-µH inductor to SW pin.
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s): TPS65471
TPS65471
www.ti.com
SLVSBE8 – JUNE 2012
TERMINAL FUNCTIONS (continued)
NAME
NO.
EXTERNAL REQUIRED COMPONENTS
(SEE TYPICAL APPLICATION)
DESCRIPTION
CTL_B
14
Control input for (B pin) Blue LED driver
(active H)
Blue LED driver control input signal from system
CTL_G
15
Control input for (G pin) Green LED driver
(active H)
Green LED driver control input signal from system
CTL_R
16
Control input for (R pin) Red LED driver
(active H)
Red LED driver control input signal from system
DGND
25
Digital ground
Connect to ground plane.
Power path output. The power supply for each
LDO.
10-µF capacitor to AGND. Regarding an effect of DC bias
on capacitor, select a capacitor that can secure at least
4.7-µF in worse case.
PWR
12,13
EN_VLDO
19
Enable input for VLDO2, VLDO4 and
VLED4P25 (active H)
LDO2, LDO4 and 4.25 VLDO control input signal from
system
EN_VLDO3
18
Enable input for VLDO3
LDO3 control input signal from system
TEST
32
Test pin. Normally open.
USB_SUSPEND
20
Control input for USB suspended mode. To
reduce supply current from VBUS (active H).
USB suspended input signal from system
Analog ground (AGND) input. Thermal ground
should be soldered to the analog ground, use
thermal via to connect to ground plane for
ideal power dissipation.
Connect the PowerPAD to ground plane.
Thermal Pad
(AGND)
ABSOLUTE MAXIMUM RATINGS
(1)
over operating free-air temperature range (unless otherwise noted)
VBUS, VAC, PWR, SW, ISET1, ISET2
Input
voltage
–0.3 to 5.5
nCHEN, USB_SUSPEND, CTL_R, CTL_G, CTL_B, CTL_MTR, EN_VLDO, EN_VLDO3,
nRST_OUT, VBUS_PG, VAC_PG, STAT1, STAT2
–0.3 to 3.6
Output
sink/source
current
VBUS_PG, VAC_PG, nRST_OUT, STAT1, STAT2
TJ
TSTG
(1)
–0.3 to 7
VBAT, VLDO1, VLDO2, VDLO3, VDLO4, VLED4P25, VIN, L, R, G, B, MTRIN
V
15
mA
Junction temperature range
–40 to 150
°C
Storage temperature range
–65 to 150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS (1) (2) (3)
MIN
NOM
MAX
UNIT
VVBUS
Supply voltage (VBUS)
4.75
5.25
V
VVAC
Supply voltage (VAC)
4.75
5.75
V
VVBAT1
Supply voltage (VBAT) for linear charger
2.7
4.3
V
VVBAT2
Supply voltage (VBAT) for 4.25-V boost output
3.2
4.3
V
TA
Operating ambient temperature
-10
85
°C
TJ
Operating junction temperature
–10
125
°C
(1)
(2)
(3)
Current dissipation and junction temperature must be confirmed on maximum VVBUS, VVAC and VVBAT.
If any VVBUS or VVAC or VVBAT is a recommended operating condition, this device can operate. Refer to Table 1.
LDO1 operates when the output voltage of LDO1 is less than VRST.
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s): TPS65471
5
TPS65471
SLVSBE8 – JUNE 2012
www.ti.com
PACKAGE DISSIPATION RATINGS (1)
(1)
PACKAGE
θJA (°C/W)
TA < 40°C
POWER RATING (W)
DERATING FACTOR
ABOVE TA = 40°C (mW/°C)
RHA
30.1
2.82
33.2
This data is based on using the JEDEC High-K board and exposed die pad is connected to a Cu pad on the board.
ELECTRICAL CHARACTERISTICS
over -10°C < TJ < 125°C and recommended supply voltage (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
INPUT CURRENT
IVAC
Active supply current from VAC
No load, EN_VLDO = H, EN_VLDO3 = H,
nCHEN = H, USB_SUSPEND = L,
VBAT = 3.8 V, VAC = 5.25 V
237
µA
IVBUS
Active supply current from VBUS
No load, EN_VLDO = H, EN_VLDO3 = H,
nCHEN = H, USB_SUSPEND = L,
VBAT = 3.8 V, VAC = 5 V
237
µA
IVBUS(USPND)
VBUS current at USB suspend
mode
No load, EN_VLDO = H, EN_VLDO3 = H,
nCHEN = H, USB_SUSPEND = H,
VBAT = 2.8 V, VAC = 5.25 V
207
IVBAT
Active supply current from VBAT
No load, EN_VLDO = H, EN_VLDO3 = H,
nCHEN = H, USB_SUSPEND = L,
VBAT = 4.2 V
1.4
IVBAT(STBY)
VBAT standby current
No load, EN_VLDO = L, EN_VLDO3 = L,
nCHEN = H, USB_SUSPEND = L,
VBAT = 4.2 V, TJ = 60°C
56
IVBAT(SUP)
Sleep current at VBAT
Sum of current into VBAT pin.
VBAT = 2.5 V < V(BATUVLO)
At nCHEN=H and
state #01, 02, 03, 04, 09, 10, TJ = 60°C
290
µA
mA
88
3
µA
µA
UVLO/PG COMPARATOR/OVER DISCHARGE PROTECTION FOR LI-ION
V(VBUSPG)
Power good threshold voltage for
VBUS
At VBUS pin, L to H
V(VBUSPGHYS)
Hysteresis voltage on V(VBUSPG)
At VBUS pin, V(VBUSPG) - V(VBUSPGHYS) is
threshold voltage for H to L
V(VACPG)
Power good threshold voltage for
VAC
At VAC pin, L to H
V(VACPGHYS)
Hysteresis voltage on V(VACPG)
At VAC pin, V(VAC) - V(VACHYS) is threshold
voltage for H to L
V(BATUVLO)
Under voltage lock out voltage for
Li-ion
At VBAT pin
VBATmin(BATUVLO)
Minimum VBAT for over discharge
protection
At VBAT pin (1)
1.5
V
tdly(BATUVLO)
Li-ion UVLO deglitch time
Only for falling edge (H to L)
420
µs
RON(BUS)
Resistance of a FET between
VBUS and PWR
VBUS = 4.75 V
130
mΩ
RON(AC)
Resistance of a FET between
VAC and PWR
VAC = 4.75 V
130
mΩ
Resistance of a FET between
VBAT and PWR
VABT = 3.3 V
50
mΩ
RON(BAT)
5
Ω
4.08
4.25
4.42
100
4.08
4.25
mV
4.42
100
2.6
2.7
V
V
mV
2.8
V
POWER PATH
(1)
6
VBAT = 3.3 V, EN_VLDO = L,
EN_VLDO3 = L
Not tested in production.
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s): TPS65471
TPS65471
www.ti.com
SLVSBE8 – JUNE 2012
ELECTRICAL CHARACTERISTICS
over -10°C < TJ < 125°C and recommended supply voltage (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
2.9
3
MAX
UNIT
LDO REGULATORS
LDO4 (COUT = 1 µF, 3.4 V < PWR < 5.75 V)
V(VLDO4)
VLDO4 output voltage
I(VLDO4)
VLDO4 output current
VDO(VLDO4)
VLDO4 dropout voltage
I(VLDO4_ILMT)
VLDO4 output current limit
PSRR(VLDO4)
Power supply rejection ratio
3.4 V < PWR < 5.75 V
1
IO = 150 mA
3.1
V
150
mA
0.14
V
350
mA
-60
dB
LDO1 (COUT = 1 µF, 3.4 V < PWR < 5.75 V)
V(VLDO1)
VLDO1 output voltage
I(VLDO1)
VLDO1 output current
VDO(VLDO1)
VLDO1 dropout voltage
I(VLDO1_ILMT)
VLDO1 output current limit
PSRR(VLDO1)
RON(VLDO1_dichg)
3.4 V < PWR < 5.75 V
3.136
3.2
1
IO = 100 mA
3.264
100
V
mA
0.12
V
250
mA
Power supply rejection ratio
-60
dB
Discharge resistance on VLDO1
630
Ω
RESET CIRCUIT
V(RST)
V(RSTHYS)
Reset threshold voltage
At VLDO1, H to L
Hysteresis voltage for reset
At VLDO1, V(RST) + V(RSTHYS) is threshold
voltage for L to H
2.7
2.8
2.9
140
V
mV
LDO2 (COUT = 1 µF, 3.4 V < PWR < 5.75 V)
V(VLDO2)
VLDO2 output voltage
I(VLDO2)
VLDO2 output current
3.4 V < PWR < 5.75 V
3.136
3.2
VDO(VLDO2)
VLDO2 dropout voltage
0.03
V
I(VLDO2_ILMT)
VLDO2 output current limit
250
mA
PSRR(VLDO2)
Power supply rejection ratio
-60
dB
1
IO = 30 mA
3.232
30
V
mA
LDO3 (COUT = 1 µF, 3.4 V < PWR < 5.75 V)
V(VLDO3)
VLDO3 output voltage
I(VLDO3)
VLDO3 output current
3.4 V < PWR < 5.75 V
3.136
3.2
VDO(VLDO3)
VLDO3 dropout voltage
0.13
V
I(VLDO3_ILMT)
VLDO3 output current limit
250
mA
PSRR(VLDO3)
Power supply rejection ratio
-60
dB
1
IO = 150 mA
3.264
150
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s): TPS65471
V
mA
7
TPS65471
SLVSBE8 – JUNE 2012
www.ti.com
ELECTRICAL CHARACTERISTICS
over -10°C < TJ < 125°C and recommended supply voltage (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
LINEAR CHARGER
VOLTAGE REGULATION (VO(REG) + V(DO_MAX) < VPWR, I(TERM) < IO(OUT) < 550 mA)
VO(REG)
Output voltage
ACC(REG)
Voltage regulation accuracy
V(DO)
Dropout voltage (V(PWR) - V(OUT))
4.2
TA = 25°C, IO(OUT) = 50 mA
See
(1)
V
-0.35
0.35
-1
1
350
%
500
mV
550
mA
CURRENT REGULATION
IO(OUT)
Output current range
VPWR > V(LOWV)
VPWR - VVBAT > V(DO)
VPWR > 4.6 V
V(SET)
Output current set voltage
Voltage on ISET1 pin,
VPWR = 4.85 V, IO(OUT) = 550 mA
VBAT = 4 V
K(SET)
Output current set factor
50
2.463
2.5
2.538
VPWR = 4.85 V, IO(OUT) = 60 mA
VBAT = 2.8 V, Pre-charge mode
299
319
339
VPWR = 4.85 V, IO(OUT) = 60 mA
VBAT = 4 V, CC mode
285
321
357
VPWR = 4.85 V, IO(OUT) = 550 mA
VBAT = 4 V, CC mode
307
322
337
V
PRECHARGE AND SHORT-CIRCUIT CURRENT REGULATION
V(LOWV)
Precharge to fast-charge
transition threshold
Voltage on VBAT pin
2.8
3
3.2
V
t(DEG-FtoP)
Deglitch time for fast-charge to
precharge transition
VPWR(min) > 4.6 V, tFALL = 100 ns,
10-mV overdrive,
VBAT decreasing below threshold.
250
375
500
ms
IO(PRECHARGE)
Precharge range
0 V < VPWR < V(LOWV), t < t(PRECHG)
5
55
mA
Precharge set voltage
Voltage on ISET1 pin,
VO(REG) = 4.2 V,
0 V < VPWR > V(LOWV), t < t(PRECHG)
235
265
mV
55
mA
V(PRECHG)
250
TERMINATION DETECTION
I(TERM)
Charge termination detection
range
VBAT > V(RCH), t < t(TRMDET)
5
V(TERM)
Charge termination detection set
voltage
Voltage on ISET1 pin,
VO(REG) = 4.2 V
VBAT > V(RCH), t < t(TRMDET)
235
250
265
mV
t(TRMDET)
Deglitch time for termination
detection
VPWR(min) > 4.6 V, tFALL = 100 ns,
Charging current decreasing below
10-mV overdrive
250
375
500
ms
VO(REG) 0.115
VO(REG) - 0.10
VO(REG) 0.085
250
375
500
ms
s
BATTERY RECHARGE THRESHOLD
V(RCH)
Recharge threshold
TA = 25°C
t(DEGL)
Deglitch time for recharge detect
VPWR(min) > 4.6 V, tFALL = 100 ns,
Decreasing below or increasing above
threshold, 10-mV overdrive
V
TIMERS
t(PRECHG)
Precharge time
t(CHG)
Charge time
I(FAULT)
Timer fault recovery current
t(TMRRST)
Deglitch time to reset timers
when disabling charger
1620
1800
1989
22680
25200
27720
200
250
375
s
µA
500
ms
BATTERY CHARGER ON/OFF COMPARATOR
V(CHGOFF)
Charger off threshold voltage
2.7 V < VBAT < VO(REG)
VPWR < VBAT + 80 mV
V
V(CHGON)
Charger on threshold voltage
2.7 V < VBAT < VO(REG)
VPWR > VBAT + 110 mV
V
N-channel MOSFET onresistance between ISET2 and
GND
VAC = 4.75 V
ISET2
RON(ISET2)
(1)
8
4
Ω
Specified by characterization. Not tested in production.
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s): TPS65471
TPS65471
www.ti.com
SLVSBE8 – JUNE 2012
ELECTRICAL CHARACTERISTICS
over -10°C < TJ < 125°C and recommended supply voltage (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
4.165
4.25
4.335
V
4.25-V BOOST AND LDO (COUT = 22 µF, L = 6.8 µH, CIN = 22 µF)
V(VLED4P25)
VLED4P25 output voltage
I(VLED4P25)
VLED4P25 output current
3.2 V < VBAT < 4.3 V for boost or
4.6 V < PWR < 5.75 V for LDO
1
140
mA
4.25-V LDO
I(VLED4P25_ILMT)
4.25-V LDO output current limit
4.6 V < PWR < 5.75 V
VDO(VLED4P25)
4.25-V LDO dropout voltage
IO = 140 mA
250
mA
PSRR(VLED4P25)
Power supply rejection ratio
-60
dB
fOSC_VLED4P25
4.25-V boost switching frequency
555
kHz
I(VLED4P25_Boost_
4.25-V boost output current limit
3.2 V < VBAT < 4.3 V
800
mA
Isolation MOSFET on-resistance
between VIN and L
VBAT = 3.2 V
300
mΩ
0.35
V
4.25-V BOOST
ILMT)
RON(ISO)
R, G, B OUTPUTS
RON(R)
N-channel MOSFET on-resistance
between R and LEDGND
1
Ω
RON(G)
N-channel MOSFET on-resistance
between G and LEDGND
1
Ω
RON(B)
N-channel MOSFET on-resistance
between B and LEDGND
1
Ω
N-channel MOSFET on-resistance
between MTRIN and MTRGND
1
Ω
MTRIN OUTPUT
RON(MTR)
CTR_R, CTL_G, CTL_B, CTL_MTR, EN_VLDO, EN_VLDO3, USB_SUSPEND AND nCHEN INPUTS
VIL
Low level input voltage
VLDO1 = 3.2 V
VIH
High level input voltage
VLDO1 = 3.2 V
0.3 x VLDO1
V
RPD(CTL_R)
Pull-down resistor (CTL_R)
1000
kΩ
RPD(CTL_G)
Pull-down resistor (CTL_G)
1000
kΩ
RPD(CTL_B)
Pull-down resistor (CTL_B)
1000
kΩ
RPD(CTL_MTR)
Pull-down resistor (CTL_MTR)
100
kΩ
RPD(EN_VLDO)
Pull-down resistor (EN_VLDO)
100
kΩ
RPD(EN_VLDO3)
Pull-down resistor (EN_VLDO3)
100
kΩ
RPD(USB_SUSPEND)
Pull-down resistor (USB_SUSPEND)
100
kΩ
RPU(nCHEN)
Pull-up resistor (nCHEN) to VLDO1
100
kΩ
0.7 x VLDO1
V
VBUS_PG, VAC_PG OUTPUTS
VOH(PG)
High-level output saturation voltage
3.4 V < PWR < 5.75 V, IO = -500 µA,
VDD = VLDO1
VOL(PG)
Low-level output saturation voltage
3.4 V < PWR < 5.75 V, IO = 500 µA,
VDD = VLDO1
0.25
V
IO = 2.5 mA
0.25
V
VDD - 0.25
V
STAT1, STAT2 OUTPUTS
VOL(STAT)
Low-level output saturation voltage
nRST_OUT OUTPUT
VOL(nRST)
Low-level output saturation voltage
RPU(nRST)
Pull-up resistor (nRST_OUT) to VLDO1
tdly(nRST)
Deglitch time on nRST_OUT
IO = 2.5 mA
0.25
100
95
125
V
kΩ
160
ms
THERMAL SHUTDOWN THRESHOLD
T(SHTDWN)
Thermal trip threshold
TJ increasing
150
°C
hys(SHTDWN)
Thermal hysteresis
TJ increasing
15
°C
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s): TPS65471
9
TPS65471
SLVSBE8 – JUNE 2012
www.ti.com
FUNCTION DESCRIPTION
Power Path Function
TPS65471 has a power-path circuitry to choose automatically any one of USB-port (VBUS), AC-DC adapter
(VAC) and Li-ion battery (VBAT) as power source for LDOs.
The priority of power selection is VBUS, VAC, then VBAT. When both VBUS and VAC are available, VBUS is
used as the power source of the charger and LDOs.
The exception is USB suspend mode, in this cases, power source of charger and LDOs are provided to PWR
from VAC.
The VBAT (Li-ion battery) is chosen as a power source when both VBUS (USB-port) and VAC (AC-DC adapter)
are not available. In this case, the linear charger function does not operate.
Figure 1 shows an equivalent circuit of the power path. Power FETs SW1, SW2 and SW3 are turned on/off per
Table 1 and provide appropriate power sources to each power output.
VBUS
PWR
SW1
To LDO 1, LDO2, LDO3, LDO4
and 4.25V LDO
SW3
VAC
SW2
VBAT
Charge
Core
Figure 1. Power Path Circuitry
As Table 1 shows, the state of the linear charger circuitry depends on the state of the power path circuitry. If the
power path circuitry is not ready for charging, regardless of nCHEN = L, the charger function is not turned on.
Table 1. Power Path Circuitry Truth Table
AC-DC
ADAPTER
(VAC)
(1)
(2)
10
USB-PORT
(VBUS)
LI-ION
BATTERY
(VBAT)
Absent
Absent
Absent
Present
USB_SUSPEND
POWER SOURCE
STATE
Absent
X
Non
#01#
Absent
H
Non
#02# (2)
CHARGE STATUS (1)
Absent
Present
Absent
L
VBUS
#03#
nCHEN = L: Recovery - Charge
Present
Absent
Absent
X
VAC
#04#
nCHEN = L: Recovery - Charge
Absent
Absent
Present
X
VBAT
#05#
Absent
Present
Present
H
VBAT
#06#
Absent
Present
Present
L
VBUS
#07#
nCHEN = L: Charge
Present
Absent
Present
X
VAC
#08#
nCHEN = L: Charge
Present
Present
Absent
H
VAC
#09#
nCHEN = L: Recovery - Charge
Present
Present
Absent
L
VBUS
#10#
nCHEN = L: Recovery - Charge
Present
Present
Present
H
VAC
#11#
nCHEN = L: Charge
Present
Present
Present
L
VBUS
#12#
nCHEN = L: Charge
For recovery charge, the voltage of VBAT shows the charge state below V(BATUVLO).
At state #2#, while USB_SUSPEND = H, the 3.2-V LDO (VLDO1) is toggled. The USB_SUSPEND signal is detected after the activation
of 3.2-V LDO and turns SW1 off. If the 3.2-V LDO is turned off and TPS65471 cannot detect USB_SUSPEND = H, SW1 will turn on and
3.2-V LDO is then deactivated.
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s): TPS65471
TPS65471
www.ti.com
SLVSBE8 – JUNE 2012
USB Suspend Function
TPS65471 has USB suspend function. USB_SUSPEND = H sends TPS65471 into USB suspend mode. While in
USB suspend mode, current from the USB host to the VBUS pin is reduced under the USB suspended current.
USB suspend mode does not depend on Li-ion battery status. Even if the Li-ion battery on the VBAT pin is
removed or NG. VBUS, which is in USB suspend mode, does not provide electrical power for 3.2-V, 3-V and
4.25-V outputs and these outputs should be disabled.
Even in USB suspend mode, when VAC exists, source power is provided to the 3.2-V, 3-V and 4.25-V outputs
from VAC.
This function complies with Table 1.
Standby Function
TPS65471 enters standby mode when the power source Li-ion battery (states #05# and #06#) and both logic
inputs of EN_VLDO and EN_VLDO3 are at L level. While in standby mode, current from the Li-ion battery to the
VBAT pin is reduced under VVBAT(STBY). The low resistance PMOS FET and NMOS FET are connected to SW2
between the PWR pin and VBAT pin in parallel. In order for the TPS65471 to decrease the power supply current,
the PMOS FET operates in standby mode. In standby mode, the PMOS FET turns on corresponding to the
output current of the VLDO1 voltage drop of PWR.
To recover from standby mode, the logic input of EN_VLDO or EN_VLDO3 is set to H level, then the low
resistance NMOS FET connected between PWR and VBAT turns on. The startup time of the LDOs controlled by
these logic input signals is approximately 1 ms.
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s): TPS65471
11
TPS65471
SLVSBE8 – JUNE 2012
www.ti.com
Timing Diagrams of Power Path Operation
USB-Port Hot-Plug During Battery Operation (Absent VAC and Charge Off, #5# → #7# → #5#)
Connecting USB
Disconnecting USB
VBUS Level
4.25V
4 .15 V
USB-port (VBUS)
VBUS_PG
VBAT is grater than V(VBATUVLO)
and VLOD1 is grater than V(RST)
Li-Ion Battery (VBAT)
Battery Level
VBUS Level
PWR
Battery Level
Battery Level
Discharge Period
Discharge Period
PWR < VBATT , then
Start to switch SW 2
Power FET SW1
OFF
ON
OFF
Power FET SW2
ON
OFF
ON
VLDO1
VLED4P25
Boost Start
nRST_OUT
Figure 2. USB-Port Hot-Plug During Battery Operation (#5# → #7# → #5#, Charge Off, EN_VLDO = H)
12
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s): TPS65471
TPS65471
www.ti.com
SLVSBE8 – JUNE 2012
USB-Port Hot-Plug During Battery Operation (Absent VAC and Charge On, #5# → #7# → #5#)
Connecting USB
Disconnecting USB
VBUS Level
4.25V
4 .15 V
USB-port (VBUS)
VBUS_PG
Battery Level
Li-Ion Battery (VBAT)
VBAT is grater than V(VBATUVLO)
and VLOD1 is grater than V(RST)
VBUS Level
PWR
Battery Level
Battery Level
Discharge Period
Discharge Period
PWR < VBATT , then
Start to switch SW 2
Power FET SW1
OFF
ON
OFF
Power FET SW2
ON
OFF
ON
VBUS_PG=L or VBUS < VBAT + 80mV
then Charging function is stopped
Charging function is activated
Battery Charging
OFF
ON
OFF
VLDO1
VLED4P25
Boost Start
nRST_OUT
Figure 3. USB-Port Hot-Plug During Battery Operation (#5# → #7# → #5#, Charge On, EN_VLDO = H)
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s): TPS65471
13
TPS65471
SLVSBE8 – JUNE 2012
www.ti.com
USB-Port Hot-Plug (Absent Battery and VAC, #1# → #3# → #1#)
Connecting USB
Disconnecting USB
VBUS Level
4.25V
4 .15 V
USB-port (VBUS)
VBUS_PG
VBAT is less than V(VBATUVLO)
Li-Ion Battery (VBAT)
Battery Level
VBUS Level
Discharge Period
PWR
Power FET SW1
OFF
Power FET SW2
ON
OFF
OFF
2.94V
VLDO1
2.8V
125 msec
nRST_OUT
Figure 4. USB-Port Hot-Plug (Absent Battery and VAC, #1# → #3# → #1#)
14
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s): TPS65471
TPS65471
www.ti.com
SLVSBE8 – JUNE 2012
Battery Hot-Plug (Absent VBUS and VAC, #1# → #5# → #1#)
Connecting Battery
Disconnecting Battery
Battery level
2.7 V
Li-Ion Battery (VBAT )
USB-port (VBUS)
420
usec
battery uvlo
Battery level
PWR
Power FET SW1
Power FET SW2
OFF
OFF
ON
OFF
2.94V
VLDO1
2.8V
125 msec
nRST_OUT
Figure 5. Battery Hot-Plug (Absent VBUS and VAC, #1# → #5# → #1#)
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s): TPS65471
15
TPS65471
SLVSBE8 – JUNE 2012
www.ti.com
USB Suspend Enabling/Disabling (Present VBUS and Battery, Absent VAC, #7# → #6# → #7#)
USB_SUSPEND
VBUS Level
USB-port (VBUS)
VBUS is grater than V(VBUSPG)
Battery Level
Li-Ion Battery (VBAT)
Discharge Period
VBAT is grater than V(VBATUVLO)
and VLOD1 is grater than V(RST)
VBUS Level
VBUS Level
Battery Level
PWR
Discharge Period
PWR < VBAT , then
Start to switch
Power FET SW1
ON
OFF
ON
Power FET SW2
OFF
ON
OFF
VLDO1
VLED4P25
Boost Start
nRST_OUT
Figure 6. USB Suspend Mode (#7# → #6# → #7#, EN_VLDO = H)
16
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s): TPS65471
TPS65471
www.ti.com
SLVSBE8 – JUNE 2012
LDO1
The TPS65471 has a 3.2-V regulator as the LDO1 power and it provides a stable and accurate voltage of 3.2 V
(±64 mV). Complying with Table 1, LDO1 keeps its operation during PWR on. This LDO provides the power
supply to the circuit of logic I/O. If PWR power decreases, discharge resistors at VLOD1 will be turned on and
discharge power to the remaining electrode.
LDO2
The TPS65471 has a 3.2-V regulator as the LDO2 power and it provides a stable and accurate voltage of 3.2 V
(±32 mV). LDO2 is controlled by logic input EN_VLDO and source of supply is PWR. This output is turned off
when the EN_VLDO is L.
Table 2. Output Control Truth Tables
EN_VLDO
LDO2
LDO4
4.25-V
BOOST/LD
H
3.2 V (On)
3 V (On)
4.25 V (On)
L
0 V (Off)
0 V (Off)
0 V (Off)
EN_VLDO3
LDO3
H
3.2 V (On)
L
0 V (Off)
LDO3
The TPS65471 has a 3.2-V regulator as the LDO3 power and it provides a stable and accurate voltage of 3.2 V
(±64 mV). LDO3 is controlled by logic input EN_VLDO3 and source of supply is PWR. This output is turned off
when the EN_VLDO3 is L.
LDO4
The TPS65471 has a 3-V regulator as the LDO4 power and it provides a stable and accurate voltage of 3 V
(±0.1 V). LDO4 is controlled by logic input EN_VLDO. This ouput is turned off when the EN_VLDO is L.
4.25-V Boost/LDO
The TPS65471 has a 4.25-V regulator and synchronous boost converter as the LED power. It provides a stable
and accurate voltage of 4.25 V (±85 mV) connected to the VLED4P25. The boost converter is based on a fixed
frequency pulse-width-modulation (PWM) controller. This output is controlled by logic input EN_VLDO. If USBport (VBUS pin) or AC-DC adapter (VAC pin) powers are detected, the 4.25-V LDO operates (PWR supply
source), and the 4.25V synchronous boost converter stops operation. If the voltage on both VBUS pin and VAC
pin are less than the Power Good voltage, the power is provided to VBAT pin from the Li-ion battery, then the
4.25-V synchronous boost converter operates and the 4.25-V LDO stops operation. Complying with Table 1, in
USB suspend mode (even if the voltage of VBUS pin is greater than V(VBUSPG)) the source of supply is the
battery.
R, G and B
The TPS65471 has three open-drain outputs for LED drivers. The R output is controlled by logic input CTL_R,
the G output is controlled by CTL_G and the B output is controlled by CTL_B. For example, the open-drain
output of R pulls low (On) when the CTL_R pin goes to H level. The open-drain output turns off when the CTL_R
is L. These functions can operate when the EN_VLDO is H.
MTRIN
The TPS65471 has one open-drain output for the motor driver. The MTRIN output is controlled by logic input
CTL_MTR. The open-drain output of MTRIN pulls low (On) when the CTL_MTR pin goes to H level. The opendrain output is turned off when the CTL_MTR is L.
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s): TPS65471
17
TPS65471
SLVSBE8 – JUNE 2012
www.ti.com
Reset Generator
The TPS65471 monitors the status of VLDO1 (LDO1) and has reset generator circuitry to indicate a reset signal
to the system.
The reset signal output is L level when the voltage of VLDO1 is less than V(RST), and H level when the voltage of
VLDO1 is greater than V(RST) + 0.14 V. The Reset pin goes to H level tdly(RESET) after internal signal goes to H.
The Reset terminal has a 100-kΩ pull-up resistor to VLDO1. Also the outputs of VLDO2, VLDO3, VDDO4 and
VLED4P25 turn Off when the voltage of VLDO1 is less than V(RST). If VLDO1 becomes greater than V(RST) +
0.14 V, these outputs are turned On at the input level of each control signal.
2.8V
VLDO1
nRST_OUT
2.8V + V(RSTHYS)
125 msec
Figure 7. Timing of nRST_OUT Signal When a Voltage Drop Occurs on VLDO1
Charge Control
Preconditioning Phase
Current Regulation Phase
Voltage Regulation and Charge Termination Phase
Regulation Voltage
Regulation Current
Charge Voltage
Minimum Charge Voltage
Charge Complete
Charge Current
Pre-conditioning
And Terminal detect
Safety Timer
Figure 8. Charging Profile
18
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s): TPS65471
TPS65471
www.ti.com
SLVSBE8 – JUNE 2012
VBUS > VBAT ?
Charge Off
OFF
No
Always Monitored
Yes
VBAT < V(LOWV)
Reset and Start
T(PRECHG)
Timer
Yes
Indicate
CHARGE in Progress
No
No
VBAT < V(LOWV) ?
Reset All timers
Start T(CHG)
timer
No
Yes
Regulate current or voltage
Indicate CHARGE in
Progress
T(PRECHG) Expired?
Yes
Yes
T(CHG) Expired?
No
Indicate FAULT
Yes
Yes
VBAT < V(LOWV)?
VBAT > V(RCH)
I(TERM)
Detection?
No
Enable I(FAULT)
Current
Yes
No
Yes
Indicate DONE
VBAT > V(RCH)?
Yes
No
Stop I(FAULT)
VI(OUT) < V(RCH)?
No
Indicate FAULT
VBAT < V(RCH)
Yes
Figure 9. Charging Flow Chart
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s): TPS65471
19
TPS65471
SLVSBE8 – JUNE 2012
www.ti.com
Battery Pre-Conditioning
During a charge cycle, if the battery voltage is below the V(LOWV) threshold, the device applies a pre-charge
current, IO(PRECHG), to the battery. This feature revives deeply discharged cells. Resistor RSETn, connected
between ISET1 and AGND an also between ISET1 and ISET2, determines the pre-charge rate. The V(PRECHG)
and K(SET) parameters are specified in the Electrical Characteristics table.
V(PRECHG) ´ K (SET)
IO(PRECHG) =
RSET
(1)
TPS65471 activates a safety timer, t(PRECHG), during the conditioning phase. If the V(LOWV) threshold is not
reached within the timer period, the device turns off the charger and enunciates FAULT on the STATx pins. See
the Timer Fault Recovery section for additional details.
Battery Fast-Charge Constant Current
The TPS65471 offers on-chip current regulation with programmable set point. Resistor, RSETn, connected
between the ISET1 and AGND and also connected between ISET1 and ISET2, determines the charge rate. The
V(SET) and K(SET) parameters are specified in the Electrical Characteristics table.
V(SET) ´ K (SET)
IO(OUT) =
RSET
(2)
If USB-port (VBUS pin) is detected, MOS-FET of N channels connected to ISET2 turns off. The charge current is
determined by the resistance of RSET1 connected between ISET1 and GND. If AC-DC adapter (VAC pin) is
detected, MOS-FET of N channel connected to ISET2 turns on. The charge current is determined by the
resistance of RSET1 and RSET2. When both VBUS and VAC are present, the charge current is determined by
the resistance of RSET1 connected between ISET1 and AGND.
ISET1
Linear Charger
RSET1
RSET2
ISET2
Figure 10. Equivalent Circuit ISET1 and ISET2 Terminals
Battery Fast-Charge Voltage Regulation
The voltage regulation feedback is through the VBAT pin. This input is tied directly to the positive side of the
battery pack. The device monitors the battery-pack voltage between the VBAT and AGND pins. When the battery
voltage rises to the VO(REG) threshold, the voltage regulation phase begins and the charging current begins to
decrease.
As a safety backup, the device also monitors the charge time in charge mode. If charge is not terminated within
this time period, t(CHG), the charger is turned off and FAULT is set on the STATx pins. See the Timer Fault and
Recovery section for additional details.
20
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s): TPS65471
TPS65471
www.ti.com
SLVSBE8 – JUNE 2012
Charge Termination Detection and Recharge
The TPS65471 monitors the charging current during the voltage regulation phase. Once the termination
threshold, I(TERM), is detected, charge is terminated. The V(TERM) and K(SET) parameters are specified in the
specifications.
V(TERM) ´ K (SET)
IO(TERM) =
RSET
(3)
After charge termination, the device restarts the charge once the voltage on the VBAT pin falls below the V(RCH)
threshold. This feature keeps the battery at full capacity at all times.
The device monitors the charging current during the voltage regulation phase. Once the termination threshold,
I(TERM), is detected, the charger is terminated immediately.
Resistors RSETn, connected between the ISET1 and AGND and also connected between ISET1 and ISET2,
determine the current level at the termination threshold.
Charge Status Outputs
The open-drain STAT1 and STAT2 outputs indicate various charger operations as shown in Table 3.
These status pins can be used to communicate to the host processor. Note that this open-drain output is
powered by VLDO1 and an external pull-up resistor should be applied. lso, note that OFF indicates the opendrain transistor is turns off.
Table 3. State of STAT1/STAT2 Pins
CHARGE STATE
STAT1
STAT2
Pre-charge in progress
ON
ON
Fast charge in progress
ON
OFF
Charge done
OFF
ON
Charge suspend, Timer Fault
Any device state except #07#, #08#, #11#, #12# of
charging
OFF
OFF
Charge Enable Signal
The nCHEN digital input can control a state of the charger function. If nCHEN is H level, TPS65471 stops all
charge functions and turns the charger off.
Timer Fault Recovery
As shown in Figure 9, the device provides a recovery method to deal with timer fault conditions. The following
summarizes this method:
Condition Number 1: Charge voltage above recharge threshold (V(RCH)) and timeout fault occurs.
Recovery Method: The device waits for the battery voltage to fall below the recharge
threshold. This could happen as a result of a load on the battery, self-discharge, or battery
removal. Once the battery voltage falls below the recharge threshold, the device clears the
fault and starts a new charge cycle. A POR or nCHEN toggle also clears the fault.
Condition Number 2: Charge voltage below recharge threshold (V(RCH)) and timeout fault occurs.
Recovery Method: Under this scenario, the device applies the I(FAULT) current. This small
current is used to detect a battery removal condition and remains on as long as the battery
voltage stays below the recharge threshold. If the battery voltage goes above the recharge
threshold, then the device disables the I(FAULT) current and executes the recovery method
described for Condition Number 1. Once the battery falls below the recharge threshold, the
device clears the fault and starts a new charge cycle. A POR or nCHEN toggle also clears
the fault.
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s): TPS65471
21
TPS65471
SLVSBE8 – JUNE 2012
www.ti.com
Over Discharge Protection
TPS65471 monitors the voltage of Li-ion battery and protects it from over discharge.
If the voltage on VBAT pin is under V(BATUVLO), the current path from VBAT to the device is cut off and the current
from the Li-ion battery will be minimized (< IBAT(ODP)) as much as possible. This can prevent early battery
degradation.
In this case, if the USB-port power source condition or AC-DC adaptor power source is good (state #03#, #04#,
#09#, #10#), charge function can be enabled by nCHEN = L. Charge operation must be started from the preconditioning phase. When the pre-conditioning phase exceeds V(BATUVLO), the state of TPS65471 changes to
(#07#, #08#, #11#, #12#).
Thermal Shut Down Function
When the junction temperature of TPS65471 increases higher than T(SHTDWN), the thermal shut down function is
activated.
During a state of thermal shut down, all functions (for the charge, power paths LDO1, LDO2, LDO3, LDO4 and
4.25-V Boost/LDO) are turned off and any current is shut off. If the junction temperature decreases less than
T(SHTDWN), (Note: -15°C (typical) hysteresis) TPS65471 goes back to normal operation. In this case, timers in the
charger are not cleared. The charger timer maintains operation.
22
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s): TPS65471
TPS65471
www.ti.com
SLVSBE8 – JUNE 2012
APPLICATION INFORMATION
Behavior of the Charger Without Li-Ion Battery on VBAT Pin
If charger function is activated without the Li-ion battery on the VBAT pin, the charger shows the below
phenomenon.
1. Voltage level of VBAT pin goes to 4.2 V.
2. After t(TRMDET) has passed, the charger function is turned off. Then the voltage level on the VBAT pin goes to
GND.
3. Since the voltage level on the VBAT pin become less than VO(RCH), after t(DEGL) turns off, the charger function
is activated again.
4. Return to 1.
Condition :
VBUS > V(VBUSPG)
or VAC > V(VACPG)
nCHEN = L
ｔ
（TRMDET)
ｔ
（DEGL)
ｔ
（TRMDET)
ｔ
（DEGL)
VO(REG)
V O(RCH)
VBAT
0V
Removing battery
STAT1
STAT2
Figure 11. VBAT Waveform When Charging Without Battery Connection
Behaviors If a Short Occurs
VLDO1 Output Shorted to GND
If a short-circuit occurs between the 3.2-V LDO output (VLDO1) and GND, the current is limited by the LDO’s
current limit. If LDO is heated by the current and voltage, thermal shut down is activated (depending on ambient
temperature and PCB structure).
VLDO2, VLDO4 or VLED4P25 Output Shorted to GND
If a short-circuit occurs between the output and GND, the current is limited by the LDO's current limit. If these
output terminals decrease below LVP (low voltage protection), these power outputs will be turned off and this
state will be held. In addition, if any output of VLDO2 or VLDO4 or VLED4P25 is connected to GND, all the
outputs controlled by the signal of EN_VLDO are turned off. Recovery method, EN_VLDO pin goes to L level at
once, then goes to H level.
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s): TPS65471
23
TPS65471
SLVSBE8 – JUNE 2012
www.ti.com
VLDO3 Output Shorted to GND
If a short-circuit occurs between the 3.2-V LDO output (VLDO3) and GND, the current is limited by the LDO
current limit. If this output terminal decreases below LVP, the power output will be turned off and this state will be
held. Recovery method, EN_VLDO3 pin goes to L level at once, then goes to H level.
PWR Shorted to GND
(VBAT pin) Li-ion battery provides power to PWR. If a short-circuit is detected on the PWR pin, power-path SW2
goes to high-resistance mode immediately and limits this current. If the SW2 is heated by the current and
voltage, thermal shut down is activated (depending on ambient temperature and PCB structure).
(VBUS pin or VAC pin) USB-port or AC-DC adaptor power provide power to PWR. If a short-circuit is detected on
the PWR pin, current flows through power-path SW1 from VBUS to PWR. This current is limited by internal
current limit on SW1. Short current flow through power-path SW3 from VAC to PWR is limited by internal current
limit on SW3. If SW2 or SW3 is heated by the current and voltage, thermal shut down is activated (depending on
ambient temperature and PCB structure).
VBAT Shorted to GND
If VBAT is shorted to GND, a protection IC in the battery pack will protect the battery.
24
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s): TPS65471
TPS65471
www.ti.com
SLVSBE8 – JUNE 2012
BILL OF MATERIALS
Table 4. Recommended Inductors and Capacitors
PIN
PARTS
VALUE
CHARACTERISTIC
VBUS
Ceramic capacitor
1.0 µF
X5R/X7R
VAC
Ceramic capacitor
1.0 µF
X5R/X7R
VBAT
Ceramic capacitor
1.0 µF
X5R/X7R
PWR
Ceramic capacitor
10 µF
X5R/X7R
VLDO1
Ceramic capacitor
1.0 µF
X5R/X7R
VLDO2
Ceramic capacitor
1.0 µF
X5R/X7R
VLDO3
Ceramic capacitor
1.0 µF
X5R/X7R
VLDO4
Ceramic capacitor
1.0 µF
X5R/X7R
VLED4P25
Ceramic capacitor
22 µF
X5R/X7R
VIN
Ceramic capacitor
22 µF
X5R/X7R
Between SW
and L
Inductor
6.8 µH
±20%
NOTE
Regarding an effect of DC bias on the
capacitor, select a capacitor that can
secure at least 4.7 µF in worst case.
NR4018T6R8M : TAIYO YUDEN or
equivalent
LAYOUT CONSIDERATION
As for all switching power supplies, the layout is an important step in the design, especially at high peak currents
and high switching frequencies. If the layout is not carefully done, the regulator could show stability problems as
well as EMI problems.
1. Use wide and short traces for the main current path and for the power ground tracks without using vias if
possible. If vias are unavoidable, use many vias in parallel to reduce resistance and inductance.
2. The input capacitor, output capacitor and the inductor should be placed as close as possible to the IC. These
components should be placed on the same side of the printed circuit board. The order of placement for these
components is output capacitor (VLED4P25 pin and PGND pin), inductor (L pin and SW pin), then input
capacitor (VIN pin and ground plane).
3. Use of a ground plane is recommended.
Since TPS65471 provides charging current and system power with internal linear regulators, users need to
consider thermal condition.
1. PowerPAD should be soldered to a thermal land on the PCB.
2. Vias on the thermal land of the PCB are necessary. This is a thermal path through the other side of the PCB.
3. A thermal pad of the same size is required on the other side of the PCB. All thermal pads should be
connected by vias.
4. A metal layer should cover all of the PCB if possible.
5. Place vias to connect other sides to create thermal paths.
With these steps, the thermal resistance of TPS65471 can be lowered.
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s): TPS65471
25
PACKAGE OPTION ADDENDUM
www.ti.com
29-Aug-2012
PACKAGING INFORMATION
Orderable Device
TPS65471RHAR
Status
(1)
ACTIVE
Package Type Package
Drawing
VQFN
RHA
Pins
Package Qty
40
2500
Eco Plan
(2)
Green (RoHS
& no Sb/Br)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
CU NIPDAUAGLevel-3-260C-168 HR
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
29-Aug-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
TPS65471RHAR
Package Package Pins
Type Drawing
VQFN
RHA
40
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2500
330.0
16.4
Pack Materials-Page 1
6.3
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
6.3
1.5
12.0
16.0
Q2
PACKAGE MATERIALS INFORMATION
www.ti.com
29-Aug-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPS65471RHAR
VQFN
RHA
40
2500
367.0
367.0
38.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Mobile Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated