TSC TSM6963SD_1011

TSM6963SD
20V Dual P-Channel MOSFET
TSSOP-8
Pin Definition:
1. Drain 1
8. Drain 2
2. Source 1
7. Source 2
3. Source 1
6. Source 2
4. Gate 1
5. Gate 2
PRODUCT SUMMARY
VDS (V)
RDS(on)(mΩ)
-20
ID (A)
30 @ VGS = -4.5V
-4.5
42 @ VGS = -2.5V
-3
68 @ VGS = -1.8V
-2
Block Diagram
Features
●
Advance Trench Process Technology
●
High Density Cell Design for Ultra Low On-resistance
Application
●
Load Switch
●
PA Switch
Ordering Information
Part No.
TSM6963SDCA RV
TSM6963SDCA RVG
Package
Packing
TSSOP-8
TSSOP-8
3Kpcs / 13” Reel
3Kpcs / 13” Reel
Dual P-Channel MOSFET
Note: “G” denote for Halogen Free Product
Absolute Maximum Rating (Ta = 25oC unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
VDS
-20
V
Gate-Source Voltage
VGS
±12
V
Continuous Drain Current, VGS @4.5V.
ID
-4.5
A
Pulsed Drain Current, VGS @4.5V
IDM
-16
A
IS
-1.0
A
Continuous Source Current (Diode Conduction)
a,b
o
Ta = 25 C
Maximum Power Dissipation
1.14
PD
o
Ta = 70 C
Operating Junction Temperature
Operating Junction and Storage Temperature Range
W
0.73
TJ
+150
o
TJ, TSTG
- 55 to +150
o
Symbol
Limit
C
C
Thermal Performance
Parameter
Junction to Foot (Drain) Thermal Resistance
RӨJF
Junction to Ambient Thermal Resistance (PCB mounted)
RӨJA
Unit
75
o
90
o
C/W
C/W
Notes:
a. Surface Mounted on 1” x 1” FR4 Board.
b. Pulse width limited by maximum junction temperature
1/6
Version: C09
TSM6963SD
20V Dual P-Channel MOSFET
Electrical Specifications (Ta =25oC unless otherwise noted)
Parameter
Conditions
Symbol
Min
Typ
Max
Unit
Static
Drain-Source Breakdown Voltage
VGS =0V, ID =-250uA
BVDSS
-20
--
--
V
Gate Threshold Voltage
VDS =VGS, ID =-250uA
VGS(TH)
-0.5
-0.7
-1.0
V
Zero Gate Voltage Drain Current
VDS =-16V, VGS =0V
IDSS
--
--
-1
uA
Gate Body Leakage
VGS =±12V, VDS =0V
IGSS
--
--
±100
nA
On-State Drain Current
VDS =-5V, VGS =-4.5V
ID(ON)
-25
--
--
A
--
23
30
--
30
42
--
45
68
VGS =-4.5V, ID =-4.5A
Drain-Source On-State Resistance
VGS =-2.5V, ID =-3A
RDS(ON)
VGS =-1.8V, ID =-2A
mΩ
Forward Transconductance
VDS =-5V, ID =-4.5A
gfs
--
16
--
S
Diode Forward Voltage
b
Dynamic
IS =-0.5A, VGS =0V
VSD
--
- 0.8
-1.3
V
Qg
--
14
20
Qgs
--
2.1
10
Qgd
--
4.7
--
Ciss
--
1500
--
Coss
--
220
--
Crss
--
160
--
td(on)
--
6
11
tr
--
13
23
td(off)
--
86
145
--
42
70
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Switching
VDS =-10V, ID =-4.5A,
VGS =-4.5V
VDS =-10V, VGS =0V,
f =1.0MHz
nC
pF
b,C
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
VDD =-10V, RL =10Ω,
ID =-1A, VGEN =-4.5V,
RG =6Ω
Turn-Off Fall Time
tf
Notes:
a. pulse test: PW≤300µS, duty cycle ≤2%
b. For DESIGN AID ONLY, not subject to production testing.
c. Switching time is essentially independent of operating temperature.
2/6
nS
Version: C09
TSM6963SD
20V Dual P-Channel MOSFET
Electrical Characteristics Curve (Ta = 25oC, unless otherwise noted)
Output Characteristics
Transfer Characteristics
On-Resistance vs. Drain Current
Gate Charge
On-Resistance vs. Junction Temperature
Source-Drain Diode Forward Voltage
3/6
Version: C09
TSM6963SD
20V Dual P-Channel MOSFET
Electrical Characteristics Curve (Ta = 25oC, unless otherwise noted)
On-Resistance vs. Gate-Source Voltage
Threshold Voltage
Single Pulse Power
Normalized Thermal Transient Impedance, Junction-to-Ambient
4/6
Version: C09
TSM6963SD
20V Dual P-Channel MOSFET
TSSOP-8 Mechanical Drawing
DIM
A
a
B
C
D
E
e
F
L
TSSOP-8 DIMENSION
MILLIMETERS
INCHES
MIN
MAX
MIN
MAX
6.20
6.60
0.244
0.260
4.30
4.50
0.170
0.177
2.90
3.10
0.114
0.122
0.65 (typ)
0.025 (typ)
0.25
0.30
0.010
0.019
1.05
1.20
0.041
0.049
0.05
0.15
0.002
0.009
0.127
0.005
0.50
0.70
0.020
0.028
Marking Diagram
Y = Year Code
M = Month Code
(A=Jan, B=Feb, C=Mar, D=Apl, E=May, F=Jun, G=Jul, H=Aug,
I=Sep, J=Oct, K=Nov, L=Dec)
= Month Code for Halogen Free Product
(O=Jan, P=Feb, Q=Mar, R=Apl, S=May, T=Jun, U=Jul, V=Aug,
W=Sep, X=Oct, Y=Nov, Z=Dec)
L = Lot Code
5/6
Version: C09
TSM6963SD
20V Dual P-Channel MOSFET
Notice
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assumes no responsibility or liability for any errors or inaccuracies.
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Customers using or selling these products for use in such applications do so at their own risk and agree to fully
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Version: C09