TXS0101 www.ti.com ...................................................................................................................................................... SCES638A – OCTOBER 2007 – REVISED MAY 2008 1-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR FOR OPEN-DRAIN AND PUSH-PULL APPLICATIONS FEATURES 1 • No Direction-Control Signal Needed • Max Data Rates – 24 Mbps (Push Pull) – 2 Mbps (Open Drain) • Available in the Texas Instruments NanoFree™ Package • 1.65 V to 3.6 V on A port and 2.3 V to 5.5 V on B port (VCCA ≤ VCCB) • VCC Isolation Feature – If Either VCC Input Is at GND, Both Ports Are in the High-Impedance State • No Power-Supply Sequencing Required Either VCCA or VCCB can be ramped first • Ioff Supports Partial-Power-Down Mode Operation • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II 2 • ESD Protection Exceeds JESD 22 – A Port – 2500-V Human-Body Model (A114-B) – 200-V Machine Model (A115-A) – 1500-V Charged-Device Model (C101) – B Port – 8-kV Human-Body Model (A114-B) – 200-V Machine Model (A115-A) – 1500-V Charged-Device Model (C101) DBV, DCK, OR DRL PACKAGE (TOP VIEW) VCCA GND A 1 6 2 5 3 4 VCCB OE B YZP PACKAGE (BOTTOM VIEW) A GND VCCA 3 4 2 5 1 6 B OE VCCB DESCRIPTION/ORDERING INFORMATION This one-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to track VCCA. VCCA accepts any supply voltage from 1.65 V to 3.6 V. The B port is designed to track VCCB. VCCA must be less than or equal to VCCB. VCCB accepts any supply voltage from 2.3 V to 5.5 V. This allows for low-voltage bidirectional translation between any of the 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. When the output-enable (OE) input is low, all outputs are placed in the high-impedance state. To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoFree is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2007–2008, Texas Instruments Incorporated TXS0101 SCES638A – OCTOBER 2007 – REVISED MAY 2008 ...................................................................................................................................................... www.ti.com ORDERING INFORMATION TA PACKAGE (1) (2) ORDERABLE PART NUMBER NanoFree™ – WCSP (DSBGA) 0.23-mm Large Bump – YZP (Pb-free) SOT (SOT-23) – DBV –40°C to 85°C SOT (SC-70) – DCK SOT (SOT-563) – DRL (1) (2) (3) Reel of 3000 TXS0101YZPR Reel of 3000 TXS0101DBVR Reel of 250 TXS0101DBVT Reel of 3000 TXS0101DCKR Reel of 250 TXS0101DCKT Reel of 3000 TXS0101DRLR Reel of 250 TXS0101DRLT TOP-SIDE MARKING (3) _ _ _2G_ 2G_ NFF_ 2G_ Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). PIN DESCRIPTION NO. NAME 1 VCCA A-port supply voltage. 1.65 V ≤ VCCA ≤ 3.6 V and VCCA ≤ VCCB FUNCTION 2 GND Ground 3 A Input/output A. Referenced to VCCA. 4 B Input/output B. Referenced to VCCB. 5 OE 6 VCCB Output enable. Pull OE low to place all outputs in 3-state mode. Referenced to VCCA. B-port supply voltage. 2.3 V ≤ VCCB ≤ 5.5 V TYPICAL OPERATING CIRCUIT 1.8 V 3.3 V 1.8 V System Controller Data GND 2 VCCA VCCB OE A B 3.3 V System Data GND Submit Documentation Feedback GND Copyright © 2007–2008, Texas Instruments Incorporated Product Folder Link(s): TXS0101 TXS0101 www.ti.com ...................................................................................................................................................... SCES638A – OCTOBER 2007 – REVISED MAY 2008 ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCCA Supply voltage range –0.5 4.6 V VCCB Supply voltage range –0.5 6.5 V VI Input voltage range (2) A port –0.5 4.6 B port, OE –0.5 6.5 VO Voltage range applied to any output in the high-impedance or power-off state (2) A port –0.5 4.6 B port –0.5 6.5 VO Voltage range applied to any output in the high or low state (2) (3) A port –0.5 VCCA + 0.5 B port –0.5 VCCB + 0.5 IIK Input clamp current VI < 0 –50 mA IOK Output clamp current VO < 0 –50 mA IO Continuous output current ±50 mA ±100 mA Continuous current through VCCA, VCCB, or GND θJA Package thermal impedance (4) Tstg Storage temperature range DBV package 165 DCK package 259 DRL package 142 YZP package (1) (2) (3) (4) UNIT V V V °C/W 123 –65 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed. The value of VCCA and VCCB are provided in the recommended operating conditions table. The package thermal impedance is calculated in accordance with JESD 51-7. THERMAL IMPEDANCE RATINGS UNIT θJA (1) Package thermal impedance (1) DBV package 165 DCK package 259 DRL package 142 YEP/YZP package 123 °C/W The package thermal impedance is calculated in accordance with JESD 51-7. Submit Documentation Feedback Copyright © 2007–2008, Texas Instruments Incorporated Product Folder Link(s): TXS0101 3 TXS0101 SCES638A – OCTOBER 2007 – REVISED MAY 2008 ...................................................................................................................................................... www.ti.com RECOMMENDED OPERATING CONDITIONS (1) (2) VCCA VCCA VCCB MIN MAX 1.65 3.6 2.3 5.5 VCCI – 0.2 VCCI VCCI – 0.4 VCCI VCCI – 0.4 VCCI VCCA × 0.65 5.5 0 0.15 Supply voltage (3) 1.65 V to 1.95 V A-port I/Os VIH VCCB High-level input voltage 2.3 V to 3.6 V B-port I/Os OE input 2.3 V to 5.5 V 1.65 V to 3.6 V 2.3 V to 5.5 V 1.65 V to 3.6 V 2.3 V to 5.5 V A-port I/Os VIL Low-level input voltage B-port I/Os OE input 0 0.15 0 VCCA × 0.35 A-port I/Os, push-pull driving Δt/Δv Input transition rise or fall rate TA Operating free-air temperature B-port I/Os, push-pull driving V V V 10 1.65 V to 3.6 V 2.3 V to 5.5 V 10 Control Input (1) (2) (3) UNIT ns/V 10 –40 85 °C VCCI is the supply associated with the input port. VCCO is the supply associated with the output port. VCCA must be less than or equal to VCCB, and VCCA must not exceed 3.6 V. ELECTRICAL CHARACTERISTICS (1) (2) (3) over recommended operating free-air temperature range (unless otherwise noted) TEST CONDITIONS VCCA VCCB VOHA IOH = –20 µA, VIB ≥ VCCB – 0.4 V 1.65 V to 3.6 V 2.3 V to 5.5 V VOLA IOL = 1 mA, VIB ≤ 0.15 V 1.65 V to 3.6 V 2.3 V to 5.5 V VOHB IOH = –20 µA, VIA ≥ VCCA – 0.2 V 1.65 V to 3.6 V 2.3 V to 5.5 V VOLB IOL = 1 mA, VIA ≤ 0.15 V 1.65 V to 3.6 V 2.3 V to 5.5 V 1.65 V to 3.6 V 1.65 V to 5.5 V A port 0V B port 0 to 3.6 V PARAMETER II Ioff IOZ OE A or B port VI = VO = open, IO = 0 ICCA VI = VO = open, IO = 0 ICCB ICCA + ICCB CI Cio (1) (2) (3) 4 VI = VCCI, IO = 0 OE A port B port TA = 25°C MIN –40°C to 85°C TYP MAX MIN MAX VCCA × 0.67 UNIT V 0.4 VCCB × 0.67 V V 0.4 V ±1 ±2 µA 0 to 5.5 V ±1 ±2 µA 0V ±1 ±2 µA 1.65 V to 3.6 V 2.3 V to 5.5 V ±1 ±2 µA 1.65 V to VCCB 2.3 V to 5.5 V 2.4 3.6 V 0V 2.2 0V 5.5 V -1 1.65 V to VCCB 2.3 V to 5.5 V 12 3.6 V 0V -1 0V 5.5 V 1 1.65 V to VCCB 2.3 V to 5.5 V 3.3 V 3.3 V 3.3 V 3.3 V 2.5 5 6 6 7.5 µA µA 14.4 µA 3.5 pF pF VCCI is the VCC associated with the input port. VCCO is the VCC associated with the output port. VCCA must be less than or equal to VCCB, and VCCA must not exceed 3.6 V. Submit Documentation Feedback Copyright © 2007–2008, Texas Instruments Incorporated Product Folder Link(s): TXS0101 TXS0101 www.ti.com ...................................................................................................................................................... SCES638A – OCTOBER 2007 – REVISED MAY 2008 TIMING REQUIREMENTS over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted) VCCB = 2.5 V ± 0.2 V MIN MAX Data rate tw Pulse duration Push-pull driving Open-drain driving Push-pull driving Open-drain driving Data inputs VCCB = 3.3 V ± 0.3 V MIN VCCB = 5 V ± 0.5 V MAX MIN UNIT MAX 21 22 24 2 2 2 47 45 41 500 500 500 Mbps ns TIMING REQUIREMENTS over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted) VCCB = 2.5 V ± 0.2 V MIN MAX Data rate tw Pulse duration Push-pull driving Open-drain driving Push-pull driving Open-drain driving Data inputs VCCB = 3.3 V ± 0.3 V MIN VCCB = 5 V ± 0.5 V MAX MIN UNIT MAX 20 22 24 2 2 1 50 45 41 500 500 500 Mbps ns TIMING REQUIREMENTS over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted) VCCB = 3.3 V ± 0.3 V MIN Data rate tw Pulse duration Push-pull driving Open-drain driving Push-pull driving Open-drain driving Data inputs VCCB = 5 V ± 0.5 V MAX MIN UNIT MAX 23 24 2 2 43 41 500 500 Submit Documentation Feedback Copyright © 2007–2008, Texas Instruments Incorporated Product Folder Link(s): TXS0101 Mbps ns 5 TXS0101 SCES638A – OCTOBER 2007 – REVISED MAY 2008 ...................................................................................................................................................... www.ti.com SWITCHING CHARACTERISTICS over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted) PARAMETER FROM (INPUT) TO (OUTPUT) VCCB = 2.5 V ± 0.2 V MIN Push-pull driving tPHL A B tPLH Open-drain driving MIN 8.8 45 260 5.3 9.6 36 208 6.8 2.6 4.4 10 7.5 27 4.5 1.1 UNIT MIN MAX 7.1 4.4 1.9 MAX VCCB = 5 V ± 0.5 V 5.4 2.4 6.8 Push-pull driving Open-drain driving MAX VCCB = 3.3 V ± 0.3 V 5.3 2.3 Push-pull driving Open-drain driving tPHL ns 198 4.7 1.2 4 B A ten OE A or B 200 200 200 ns tdis OE A or B 50 40 35 ns tPLH Push-pull driving Open-drain driving trA A-port rise time trB B-port rise time tfA A-port fall time tfB B-port fall time Max data rate 6 TEST CONDITIONS 5.3 45 175 4.5 36 140 0.5 27 102 Push-pull driving 3.2 9.5 2.3 9.3 2 7.6 Open-drain driving 38 165 30 132 22 95 Push-pull driving 1.1 10.8 1 9.1 1 7.6 Open-drain driving 34 145 23 106 10 76 Push-pull driving 1.9 5.9 1.9 6 1.4 13.3 Open-drain driving 4.4 6.9 4.3 6.4 4.2 6.1 Push-pull driving 2.2 13.8 2.2 16.2 2.6 16.2 Open-drain driving 6.9 13.8 7.5 16.2 7 16.2 Push-pull driving 21 22 24 2 2 2 Open-drain driving Submit Documentation Feedback ns ns ns ns Mbps Copyright © 2007–2008, Texas Instruments Incorporated Product Folder Link(s): TXS0101 TXS0101 www.ti.com ...................................................................................................................................................... SCES638A – OCTOBER 2007 – REVISED MAY 2008 SWITCHING CHARACTERISTICS over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted) PARAMETER FROM (INPUT) TO (OUTPUT) TEST CONDITIONS VCCB = 2.5 V ± 0.2 V MIN Push-pull driving tPHL A B tPLH Open-drain driving Open-drain driving 6.3 43 250 4.7 6 36 206 3.8 2.1 4.2 5.8 4.4 27 3.6 1.6 UNIT MIN MAX 4.1 3 1.8 MAX VCCB = 5 V ± 0.5 V 3.7 2 3.5 Push-pull driving tPHL MIN 3.2 1.7 Push-pull driving Open-drain driving MAX VCCB = 3.3 V ± 0.3 V ns 190 4.3 1.2 4 B A ten OE A or B 200 200 200 ns tdis OE A or B 50 40 35 ns tPLH Push-pull driving Open-drain driving trA A-port rise time trB B-port rise time tfA A-port fall time tfB B-port fall time Max data rate 2.5 44 170 1.6 37 140 1 27 103 Push-pull driving 2.8 7.4 2.1 6.6 0.9 5.6 Open-drain driving 34 149 28 121 24 89 Push-pull driving 1.3 8.3 0.9 7.2 0.4 6.1 Open-drain driving 35 151 24 112 12 81 Push-pull driving 1.9 5.7 1.4 5.5 0.8 5.3 Open-drain driving 4.4 6.9 4.3 6.2 4.2 5.8 Push-pull driving 2.2 7.8 2.4 6.7 2.6 6.6 Open-drain driving 5.1 8.8 5.4 9.4 5.4 10.4 Push-pull driving 20 22 24 2 2 2 Open-drain driving Submit Documentation Feedback Copyright © 2007–2008, Texas Instruments Incorporated Product Folder Link(s): TXS0101 ns ns ns ns ns Mbps 7 TXS0101 SCES638A – OCTOBER 2007 – REVISED MAY 2008 ...................................................................................................................................................... www.ti.com SWITCHING CHARACTERISTICS over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted) PARAMETER FROM (INPUT) TO (OUTPUT) TEST CONDITIONS VCCB = 3.3 V ± 0.3 V MIN Push-pull driving tPHL A B tPLH Open-drain driving Open-drain driving 3.1 1.4 4.2 36 Push-pull driving tPHL 4.2 204 124 4.6 4.4 28 2.5 1 UNIT MIN MAX 2.4 1.3 Push-pull driving Open-drain driving MAX VCCB = 5 V ± 0.5 V ns 165 3.3 1 97 B A ten OE A or B 200 200 ns tdis OE A or B 40 35 ns tPLH Push-pull driving Open-drain driving trA A-port rise time trB B-port rise time tfA A-port fall time tfB B-port fall time Max data rate 2.5 3 139 2.6 3 105 Push-pull driving 2.3 5.6 1.9 4.8 Open-drain driving 25 116 19 85 Push-pull driving 1.6 6.4 0.6 7.4 Open-drain driving 26 116 14 72 Push-pull driving 1.4 5.4 1 5 Open-drain driving 4.3 6.1 4.2 5.7 Push-pull driving 2.3 7.4 2.4 7.6 5 7.6 4.8 8.3 Open-drain driving Push-pull driving Open-drain driving 23 24 2 2 ns ns ns ns ns Mbps PRINCIPLES OF OPERATION Applications The TXS0101 can be used in level-translation applications for interfacing devices or systems operating at different interface voltages with one another. The TXS0101 is ideal for use in applications where an open-drain driver is connected to the data I/Os. The TXB0101 can also be used in applications where a push-pull driver is connected to the data I/Os, but the TXB0102 might be a better option for such push-pull applications. Architecture The TXS0101 architecture (see Figure 1) does not require a direction-control signal to control the direction of data flow from A to B or from B to A. 8 Submit Documentation Feedback Copyright © 2007–2008, Texas Instruments Incorporated Product Folder Link(s): TXS0101 TXS0101 www.ti.com ...................................................................................................................................................... SCES638A – OCTOBER 2007 – REVISED MAY 2008 VCCB VCCA T1 Oneshot Oneshot 10k T2 10k Gate Bias A B Figure 1. Architecture of a TXS01xx Cell Each A-port I/O has an internal 10-kΩ pullup resistor to VCCA, and each B-port I/O has an internal 10-kΩ pullup resistor to VCCB. The output one-shots detect rising edges on the A or B ports. During a rising edge, the one-shot turns on the PMOS transistors (T1,T2) for a short duration, which speeds up the low-to-high transition. Input Driver Requirements The fall time (tfA, tfB) of a signal depends on the output impedance of the external device driving the data I/Os of the TXS0101. Similarly, the tPHL and max data rates also depend on the output impedance of the external driver. The values for tfA, tfB, tPHL, and maximum data rates in the data sheet assume that the output impedance of the external driver is less than 50 Ω. Power Up During operation, ensure that VCCA ≤ VCCB at all times. During power-up sequencing, VCCA ≥ VCCB does not damage the device, so any power supply can be ramped up first. Enable and Disable The TXS0101 has an OE input that is used to disable the device by setting OE low, which places all I/Os in the Hi-Z state. The disable time (tdis) indicates the delay between the time when OE goes low and when the outputs actually get disabled (Hi-Z). The enable time (ten) indicates the amount of time the user must allow for the one-shot circuitry to become operational after OE is taken high. Pullup or Pulldown Resistors on I/O Lines Each A-port I/O has an internal 10-kΩ pullup resistor to VCCA, and each B-port I/O has an internal 10-kΩ pullup resistor to VCCB. If a smaller value of pullup resistor is required, an external resistor must be added from the I/O to VCCA or VCCB (in parallel with the internal 10-kΩ resistors). Submit Documentation Feedback Copyright © 2007–2008, Texas Instruments Incorporated Product Folder Link(s): TXS0101 9 TXS0101 SCES638A – OCTOBER 2007 – REVISED MAY 2008 ...................................................................................................................................................... www.ti.com PARAMETER MEASUREMENT INFORMATION VCCI VCCO VCCI VCCO DUT IN DUT IN OUT OUT 1 MW 15 pF 1 MW 15 pF DATA RATE, PULSE DURATION, PROPAGATION DELAY, OUTPUT RISE AND FALL TIME MEASUREMENT USING AN OPEN-DRAIN DRIVER DATA RATE, PULSE DURATION, PROPAGATION DELAY, OUTPUT RISE AND FALL TIME MEASUREMENT USING A PUSH-PULL DRIVER 2 × VCCO 50 kW From Output Under Test 15 pF S1 Open 50 kW LOAD CIRCUIT FOR ENABLE/DISABLE TIME MEASUREMENT TEST S1 tPZL/tPLZ tPHZ/tPZH 2 × VCCO Open tw VCCI VCCI/2 Input VCCI/2 0V VOLTAGE WAVEFORMS PULSE DURATION VCCA Output Control (low-level enabling) VCCA/2 0V tPLZ tPZL VCCI Input VCCI/2 VCCI/2 0V tPLH Output tPHL VCCO/2 0.9 y VCCO 0.1 y VCCO VOH VCCO/2 VOL Output Waveform 1 S1 at 2 × VCCO (see Note B) Output Waveform 2 S1 at GND (see Note B) VCCA/2 VCCO VCCO/2 0.1 y VCCO VOL tPHZ tPZH VOH 0.9 y VCCO VCCO/2 0V tf tr VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRRv10 MHz, ZO = 50 Ω, dv/dt ≥ 1 V/ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. VCCI is the VCC associated with the input port. I. VCCO is the VCC associated with the output port. J. All parameters and waveforms are not applicable to all devices. Figure 2. Load Circuit and Voltage Waveforms 10 Submit Documentation Feedback Copyright © 2007–2008, Texas Instruments Incorporated Product Folder Link(s): TXS0101 PACKAGE OPTION ADDENDUM www.ti.com 22-Jul-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TXS0101DBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXS0101DBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXS0101DBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXS0101DBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXS0101DCKR ACTIVE SC70 DCK 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXS0101DCKRG4 ACTIVE SC70 DCK 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXS0101DCKT ACTIVE SC70 DCK 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXS0101DCKTG4 ACTIVE SC70 DCK 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXS0101DRLR ACTIVE SOT DRL 6 4000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXS0101DRLRG4 ACTIVE SOT DRL 6 4000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXS0101YZPR ACTIVE DSBGA YZP 6 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 22-Jul-2008 to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 22-Jul-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ TXS0101DBVR SOT-23 3000 180.0 DBV 6 Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 9.2 3.23 3.17 1.37 4.0 8.0 Q3 TXS0101DBVT SOT-23 DBV 6 250 180.0 9.2 3.23 3.17 1.37 4.0 8.0 Q3 TXS0101DCKR SC70 DCK 6 3000 179.0 8.4 2.2 2.5 1.2 4.0 8.0 Q3 TXS0101DCKT SC70 DCK 6 250 179.0 8.4 2.2 2.5 1.2 4.0 8.0 Q3 TXS0101DRLR SOT DRL 6 4000 180.0 9.2 1.78 1.78 0.69 4.0 8.0 Q3 TXS0101YZPR DSBGA YZP 6 3000 180.0 8.4 1.02 1.52 0.66 4.0 8.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 22-Jul-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TXS0101DBVR SOT-23 DBV 6 3000 202.0 201.0 28.0 TXS0101DBVT SOT-23 DBV 6 250 202.0 201.0 28.0 TXS0101DCKR SC70 DCK 6 3000 195.0 200.0 45.0 TXS0101DCKT SC70 DCK 6 250 195.0 200.0 45.0 TXS0101DRLR SOT DRL 6 4000 202.0 201.0 28.0 TXS0101YZPR DSBGA YZP 6 3000 220.0 220.0 34.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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