TXS02612 www.ti.com ............................................................................................................................................................... SCES682A – MAY 2008 – REVISED JULY 2008 SDIO PORT EXPANDER WITH VOLTAGE-LEVEL TRANSLATION FEATURES 1 • 6-to-12 Demultiplexer/Multiplexer Allows SDIO Port Expansion • Built-in Level Translator Eliminates Voltage Mismatch Between Baseband and SD Card or SDIO Peripheral • VCCA, VCCB0, and VCCB1 Each Operate Over Full 1.1-V to 3.6-V Range • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II 2 • • ESD Performance A Port – 2000-V Human-Body Model (A114-B) – 100-V Machine Model (A115-A) – 1500-V Charged-Device Model (C101) ESD Performance B Port – ±6-kV IEC 61000-4-2 ESD, Air-Gap Discharge – ±8-kV IEC 61000-4-2 ESD, Contact Discharge DESCRIPTION/ORDERING INFORMATION The TXS02612 is designed to interface the cellphone baseband with external SDIO peripherals. The device includes a 6-channel SPDT switch with voltage-level translation capability. This allows a single SDIO port to be interfaced with two SDIO peripherals. The TXS02612 has three separate supply rails that operate over the full range of 1.1 V to 3.6 V. This allows the baseband and SDIO peripherals to operate at different supply voltages if required. The select (SEL) input is used to choose between the B0 port and B1 port. When SEL = Low, B0 port is selected; when SEL = High, B1 port is selected. SEL is referenced to VCCA. For the unselected B port, the clock output is held low, whereas the data and command I/Os are pulled high to their respective VCCB through a 70-kΩ resistor (±30% tolerance). ORDERING INFORMATION TA PACKAGE –40°C to 85°C (1) (2) (1) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING MicroStar Junior™ BGA (VFBGA) – ZQS Reel of 3000 TXS02612ZQSR YJ612 QFN – RTW Reel of 3000 TXS02612RTWR YJ612 Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. CMDB0 ZQS PACKAGE TERMINAL ASSIGNMENTS ZQS PACKAGE (TOP VIEW) 1 2 3 4 5 CLKB0 DAT3B0 VCCB0 SEL DAT2B0 RTW PACKAGE (TOP VIEW) 1 2 3 4 5 A DAT2A SEL DAT3B0 CMDB0 CLKB0 A B DAT3A DAT2B0 VCCB0 DAT0B0 DAT2A 1 18 DAT0B0 B C CMDA VCCA GND VCCB1 DAT1B0 GND 2 17 VCCB1 C D DAT0A CLKA GND DAT1B1 DAT0B1 DAT3A 3 16 DAT1B0 D DAT1A 4 DAT2B1 DAT3B1 CMDB1 CLKB1 15 DAT1B1 E E CMDA VCCA 5 14 DAT0B1 DAT0A 6 13 CLKB1 24 23 22 21 20 19 DAT1A CLKA GND 9 10 11 12 CMDB1 8 DAT3B1 7 DAT2B1 Exposed Center Pad For RTW, if the exposed center pad is used, it must be connected to ground or electrically open. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. MicroStar Junior is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2008, Texas Instruments Incorporated TXS02612 SCES682A – MAY 2008 – REVISED JULY 2008 ............................................................................................................................................................... www.ti.com APPLICATION BLOCK DIAGRAM VCCB0 VCCA VCCB0 VCCB1 VCCA DAT0B0 DAT0A DAT0B1 DAT1B0 DAT1A DAT1B1 DAT2B0 DAT2A DAT2B1 SD/MMC Memory Card DAT3B0 SDIO Port DAT3A DAT3B1 CMDB0 CMDA CMDB1 CLKB0 CLKA Digital Baseband or Apps Processor Clock Logic SEL CLKB1 VCCB1 TXS02612 NOTE: Switch positions shown in this diagram are for the case when SEL = Low SDIO Peripheral (Bluetooth, WLAN, DTV, etc) 2 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated TXS02612 www.ti.com ............................................................................................................................................................... SCES682A – MAY 2008 – REVISED JULY 2008 PIN ASSIGNMENTS RTW PACKAGE PIN NO. ZQS PACKAGE BALL NO. NAME 1 A1 DAT2A Data bit 2. Referenced to VCCA. I/O 3 B1 DAT3A Data bit 3. Referenced to VCCA. I/O 4 C1 CMDA Command bit. Referenced to VCCA. I/O 6 D1 DAT0A Data bit 0. Referenced to VCCA. I/O 7 E1 DAT1A Data bit 1. Referenced to VCCA. 24 A2 SEL 5 C2 VCCA A-port supply voltage. 1.1 V ≤ VCCA ≤ 3.6 V. Power 9 D2 CLKA Clock input A. Referenced to VCCA. Input 8 E2 DAT2B1 Data bit 2. Referenced to VCCB1. I/O 22 A3 DAT3B0 Data bit 3. Referenced to VCCB0. I/O 23 B3 DAT2B0 Data bit 2. Referenced to VCCB0. I/O 2 C3 GND Ground 11 D3 GND Ground 10 E3 DAT3B1 Data bit 3. Referenced to VCCB1. I/O 20 A4 CMDB0 Command bit. Referenced to VCCB0. I/O 21 B4 VCCB0 B0-port supply voltage. 1.1 V ≤ VCCB0 ≤ 3.6 V. Power 17 C4 VCCB1 B1-port supply voltage. 1.1 V ≤ VCCB1 ≤ 3.6 V. Power 15 D4 DAT1B1 Data bit 1. Referenced to VCCB1. I/O 12 E4 CMDB1 Command bit. Referenced to VCCB1. I/O 19 A5 CLKB0 Clock output. Referenced to VCCB0. Output 18 B5 DAT0B0 Data bit 0. Referenced to VCCB0. I/O 16 C5 DAT1B0 Data bit 1. Referenced to VCCB0. I/O 14 D5 DAT0B1 Data bit 0. Referenced to VCCB1. 13 E5 CLKB1 B2 Copyright © 2008, Texas Instruments Incorporated FUNCTION TYPE I/O Select pin to choose between B0 and B1. Referenced to VCCA. Input Depopulated I/O Clock output. Referenced to VCCB1. Output Submit Documentation Feedback 3 TXS02612 SCES682A – MAY 2008 – REVISED JULY 2008 ............................................................................................................................................................... www.ti.com SIMPLIFIED INTERNAL STRUCTURE VCCA VCCBx SPEED-UP CIRCUITRY A-to-B R1 (see Note A) GATE R2 (see Note A) A-Port (Data or Command) Bx-Port (Data or Command) SPEED-UP CIRCUITRY B-to-A Simplified Architecture of Command and Each Data Path VCCB0 VCCB0 P-ch CLKA CLKB0 TRANSLATOR N-ch GND VCCB1 VCCB1 P-ch CLKB1 TRANSLATOR SEL N-ch GND Simplified Architecture of the Clock Path A. 4 R1 and R2 resistor values are determined based upon the logic level applied to the A port or B port, as follows: R1 and R2 = 40 kΩ when a logic level low is applied to the A port or B port. R1 and R2 = 4 kΩ when a logic level high is applied to the A port or B port. R1 and R2 = 70 kΩ when the port is deselected. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated TXS02612 www.ti.com ............................................................................................................................................................... SCES682A – MAY 2008 – REVISED JULY 2008 FUNCTION TABLE Clock Channel SEL CLKB0 CLKB1 OPERATION L Active Low CLKA to CLKB0 H Low Active CLKA to CLKB1 Data and Command Channel SEL DATxB0 or CMDxB0 DATxB1 or CMDxB1 OPERATION L Active Disabled, pulled to VCCB1 through 70 kΩ DATxA to DATxB0, CMDA to CMDB0 H Disabled, pulled to VCCB0 through 70 kΩ Active DATxA to DATxB1, CMDA to CMDB1 ABSOLUTE MAXIMUM RATINGS (1) (2) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT –0.5 4.6 V VCCA VCCB0 VCCB1 Supply voltage range (2) VI Input voltage range A port, B0 port, B1 port, control inputs –0.5 VCCx + 0.5 V VO Voltage range applied to any output in the high-impedance or power-off state A port, B0 port, B1 port –0.5 VCCx + 0.5 V IIK Input clamp current VI < 0 –50 mA IOK Output clamp current VO < 0 –50 mA ICC/ IGND Continuous current through VCCA, VCCB0, VCCB1, or GND ±100 mA Tstg Storage temperature range 150 °C (1) (2) –65 Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. PACKAGE THERMAL IMPEDANCE PARAMETER θJA Package thermal impedance Copyright © 2008, Texas Instruments Incorporated UNIT RTW package 66 ZQS package 171.6 Submit Documentation Feedback °C/W 5 TXS02612 SCES682A – MAY 2008 – REVISED JULY 2008 ............................................................................................................................................................... www.ti.com RECOMMENDED OPERATING CONDITIONS VCCA VCCA VCCB0 VCCB1 Supply voltage VIH High-level input voltage VCCBx (1) A-port I/Os VIL Low-level input voltage Input transition rise or fall rate TA Operating free-air temperature (1) MAX 1.1 3.6 VCCI – 0.2 VCCI VCCI – 0.2 VCCI SEL, CLKA VCCA × 0.65 V 3.6 A-port I/Os 0 0.15 B-port I/Os B-port I/Os 1.1 V to 3.6 V 1.1 V to 3.6 V 1.1 V to 3.6 V 1.1 V to 3.6 V SEL, CLKA Δt/Δv MIN 0 0.15 0 VCCA × 0.35 CLK, SEL –40 UNIT V V V 10 ns/V 85 °C VCCBx refers to VCCB0 and VCCB1. ELECTRICAL CHARACTERISTICS over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VOHA (DATA & CMD) VOLA (DATA & CMD) TEST CONDITIONS IOH = –20 µA, VIBx ≥ VCCBx – 0.2 V VOHCLKB 0.74 1.4 V 1.4 V VCCA × 0.67 1.65 V 1.65 V VCCA × 0.67 2.3 V 2.3 V VCCA × 0.67 VCCA × 0.67 MAX 3V 0.35 IOL = 180 µA, VIBx ≤ 0.15 V 1.4 V 1.4 V 0.35 IOL = 220 µA, VIBx ≤ 0.15 V 1.65 V 1.65 V 0.45 IOL = 300 µA, VIBx ≤ 0.15 V 2.3 V 2.3 V 0.55 IOH = –20 µA, VIAx ≥ VCCAx – 0.2 V 3V 3V 1.1 V 1.1 V 0.74 V 0.70 1.4 V 1.4 V VCCBx × 0.67 1.65 V 1.65 V VCCBx × 0.67 2.3 V 2.3 V VCCBx × 0.67 VCCBx × 0.67 V 3V 3V IOH = – 0.5 mA 1.1 V 1.1 V 0.74 IOH = – 1 mA 1.4 V 1.4 V 1.05 IOH = – 2 mA 1.65 V 1.65 V 1.2 IOH = – 4 mA 2.3 V 2.3 V 1.75 3V 3V 2.3 1.1 V 1.1 V 0.35 V IOL = 180 µA, VIAx ≤ 0.15 V 1.4 V 1.4 V 0.35 IOL = 220 µA, VIAx ≤ 0.15 V 1.65 V 1.65 V 0.45 IOL = 300 µA, VIAx ≤ 0.15 V 2.3 V 2.3 V 0.55 3V 3V 0.70 IOL = 0.5 mA 1.1 V 1.1 V 0.35 IOL = 1 mA 1.4 V 1.4 V 0.35 IOL = 2 mA 1.65 V 1.65 V 0.45 IOL = 4 mA 2.3 V 2.3 V 0.55 IOL = 8 mA 3V 3V 0.7 Submit Documentation Feedback UNIT V 1.1 V IOL = 620 µA, VIAx ≤ 0.15 V 6 1.1 V MIN 3V IOL = 135 µA, VIAx ≤ 0.15 V VOLCLKB 1.1 V TYP 1.1 V IOH = – 8 mA VOLB (DATA & CMD) TA = –40°C to 85°C VCCBx IOL = 135 µA, VIBx ≤ 0.15 V IOL = 620 µA, VIBx ≤ 0.15 V VOHB (DATA & CMD) TA = 25°C VCCA V V Copyright © 2008, Texas Instruments Incorporated TXS02612 www.ti.com ............................................................................................................................................................... SCES682A – MAY 2008 – REVISED JULY 2008 ELECTRICAL CHARACTERISTICS (continued) over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS SEL, CLKA II DAT, CMD VI = VO = Open, IO = 0, SEL, CLK = High or Low ICCA 1.1 V to 3.6 V 1.1 V to 3.6 V 1.1 V to 3.6 V 1.1 V to 3.6 V 12 3.6 V 0V 12 –1 MIN ±1 ±2 ±1 ±2 3.6 V 1.1 V to 3.6 V 24 –12 0V 0V 3.6 V Ci SEL, CLKA 3.3 V 3.3 V 3.3 V UNIT MAX 0V 3.6 V B port TYP 1.1 V to 3.6 V VI = VO = Open, IO = 0, SEL, CLK = High or Low Cio TA = –40°C to 85°C VCCBx ICCB0 or ICCB1 A port TA = 25°C VCCA µA µA µA 24 3.3 V 2.5 3.5 7 7.5 9.5 10 pF pF TIMING REQUIREMENTS TA = 25°C, VCCA = 1.2 V VCCB = 1.2 V Command Data rate tw Push-pull driving Open-drain driving VCCB = 1.5 V VCCB = 1.8 V VCCB = 2.5 V VCCB = 3.3 V TYP TYP TYP TYP TYP 60 80 120 120 120 2 2 2 2 2 UNIT Mbps Clock Push-pull driving 30 40 60 60 60 MHz Data Push-pull driving 60 80 120 120 120 Mbps Push-pull driving CLK 17 13 8 8 8 Open-drain driving CMD 500 500 500 500 500 Data 17 13 8 8 8 CMD 17 13 8 8 8 Pulse duration Push-pull driving Copyright © 2008, Texas Instruments Incorporated Submit Documentation Feedback ns 7 TXS02612 SCES682A – MAY 2008 – REVISED JULY 2008 ............................................................................................................................................................... www.ti.com TIMING REQUIREMENTS over recommended operating free-air temperature range, VCCA = 1.5 V ± 0.1 V (unless otherwise noted) VCCB = 1.5 V ± 0.1 V VCCB = 1.2 V TYP Command Data rate tw Push-pull driving MIN MAX VCCB = 1.8 V ± 0.15 V MIN MAX VCCB = 2.5 V ± 0.2 V MIN VCCB = 3.3 V ± 0.3 V MAX MIN 60 80 120 120 120 2 2 2 2 2 40 60 60 60 MHz 120 Mbps Open-drain driving Clock Push-pull driving 30 Data Push-pull driving 60 Push-pull driving CLK 17 13 8 8 8 Open-drain driving CMD 500 500 500 500 500 Data 17 13 8 8 8 CMD 17 13 8 8 8 Pulse duration Push-pull driving UNIT MAX 80 120 120 Mbps ns TIMING REQUIREMENTS over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted) VCCB = 1.5 V ± 0.1 V VCCB = 1.2 V TYP Command Data rate tw Push-pull driving Open-drain driving MAX MIN MAX VCCB = 2.5 V ± 0.2 V MIN MAX VCCB = 3.3 V ± 0.3 V MIN UNIT MAX 60 80 120 120 120 2 2 2 2 2 Mbps Clock Push-pull driving 30 40 60 60 60 MHz Data Push-pull driving 60 80 120 120 120 Mbps Push-pull driving CLK 17 13 8 Open-drain driving CMD 500 500 500 Data 17 13 8 8 8 CMD 17 13 8 8 8 Pulse duration Push-pull driving 8 MIN VCCB = 1.8 V ± 0.15 V Submit Documentation Feedback 8 500 8 500 ns Copyright © 2008, Texas Instruments Incorporated TXS02612 www.ti.com ............................................................................................................................................................... SCES682A – MAY 2008 – REVISED JULY 2008 TIMING REQUIREMENTS over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted) VCCB = 1.5 V ± 0.1 V VCCB = 1.2 V TYP Command Data rate tw Push-pull driving MIN MAX VCCB = 1.8 V ± 0.15 V MIN MAX VCCB = 2.5 V ± 0.2 V MIN MAX VCCB = 3.3 V ± 0.3 V MIN 60 80 120 120 120 2 2 2 2 2 40 60 60 60 MHz 120 Mbps Open-drain driving Clock Push-pull driving 30 Data Push-pull driving 60 Push-pull driving CLK 17 13 8 8 8 Open-drain driving CMD 500 500 500 500 500 Data 17 13 8 8 8 CMD 17 13 8 8 8 Pulse duration Push-pull driving UNIT MAX 80 120 120 Mbps ns TIMING REQUIREMENTS over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted) VCCB = 1.5 V ± 0.1 V VCCB = 1.2 V TYP Command Data rate tw Push-pull driving Open-drain driving MIN MAX VCCB = 1.8 V ± 0.15 V MIN MAX VCCB = 2.5 V ± 0.2 V MIN MAX VCCB = 3.3 V ± 0.3 V MIN UNIT MAX 60 80 120 120 120 2 2 2 2 2 Mbps Clock Push-pull driving 30 40 60 60 60 MHz Data Push-pull driving 60 80 120 120 120 Mbps Push-pull driving CLK 17 13 8 8 8 Open-drain driving CMD 500 500 500 500 500 Data 17 13 8 8 8 CMD 17 13 8 8 8 Pulse duration Push-pull driving Copyright © 2008, Texas Instruments Incorporated Submit Documentation Feedback ns 9 TXS02612 SCES682A – MAY 2008 – REVISED JULY 2008 ............................................................................................................................................................... www.ti.com SWITCHING CHARACTERISTICS TA = 25°C, VCCA = 1.2 V PARAMETER tPD FROM (INPUT) TO (OUTPUT) CMDA CMDB CMDB CMDA CLKA CLKB DATA DATB DATB DATA SEL B-Port TEST CONDITIONS VCCB = 1.2 V VCCB = 1.5 V VCCB = 1.8 V VCCB = 2.5 V VCCB = 3.3 V TYP TYP TYP TYP TYP Push-pull driving 5.9 4.8 4.4 4 4.46 Open-drain driving 238 214 192 159 140 Push-pull driving 5.6 4.8 4.4 4.1 4 Open-drain driving 227 201 176 137 114 Push-pull driving 5.5 4.1 3.6 3.2 3 5.8 4.8 4.4 4.2 6.8 5.6 4.8 4.4 4.1 4 Push-pull driving 13 11 10 9.4 9.1 Push-pull driving trA A-port rise time Push-pull driving 4.8 5.1 5.1 5.3 5.7 trB B-port rise time Push-pull driving 6.1 3.8 2.9 1.9 1.5 Push-pull driving 5.2 3.4 2.6 1.7 1.3 A-port fall time Push-pull driving 3.4 2.8 2.6 2.6 2.6 B-port fall time 1.5 trB CLKA tfA tfB tfB CLKB Push-pull driving 4.2 3 2.3 1.7 CLKB Push-pull driving 3.1 2.1 1.6 1.2 1 ChA-to-ChB skew Push-pull driving 0.4 0.4 0.3 0.4 0.4 ChB-to-ChA skew Push-pull driving CLKA tsk(O) ns 0.3 0.3 0.3 0.3 0.4 1.5 1.5 1.5 1.7 Push-pull driving 60 80 120 120 120 Open-drain driving 2 2 2 2 2 Clock Push-pull driving 30 40 60 60 60 MHz Data Push-pull driving 60 80 120 120 120 Mbps Command 10 ns 1.68 Channel-to-Clock skew Max data rate UNIT Push-pull driving Submit Documentation Feedback ns Mbps Copyright © 2008, Texas Instruments Incorporated TXS02612 www.ti.com ............................................................................................................................................................... SCES682A – MAY 2008 – REVISED JULY 2008 SWITCHING CHARACTERISTICS over operating free-air temperature range, VCCA = 1.5 V ± 0.1 V (unless otherwise noted) PARAMETER tPD trA trB trB FROM (INPUT) TO (OUTPUT) CMDA CMDB CMDB CMDA CLKA CLKB DATA DATB DATB DATA SEL B-Port TEST CONDITIONS VCCB = 1.2 V TYP VCCB = 1.5 V ± 0.1 V MIN VCCB = 1.8 V ± 0.15 V MAX MIN VCCB = 2.5 V ± 0.2 V MAX MIN VCCB = 3.3 V ± 0.3 V MAX MIN Push-pull driving 5.1 13 9 8 7.5 Open-drain driving 210 777 756 684 758 Push-pull driving 4.5 10.6 9.2 8.5 8.2 Open-drain driving 200 616 560 433 375 Push-pull driving 4.7 13.1 9.8 6 5.2 5.1 13 9 8 7.8 4.5 11 9.3 8.8 8.4 Push-pull driving 9.5 26 21 19 A-port rise time Push-pull driving 2.7 1.5 5.8 1.7 5.9 B-port rise time Push-pull driving 3.3 1.7 8.2 1.3 Push-pull driving 5.2 1.7 6.4 1.3 CLKA CLKB Push-pull driving 6 1.8 6.1 6.6 1 4.3 0.8 2.9 4.9 0.9 3.2 0.8 2.5 A-port fall time Push-pull driving 2.4 1 3.9 0.9 3.4 0.9 3.2 1.3 3.3 tfB B-port fall time Push-pull driving 3.7 1.1 6.3 0.9 5.2 0.6 3.9 0.6 3.2 CLKB Push-pull driving 3.1 0.9 4.1 0.8 3.2 0.5 2.2 0.5 1.9 ChA-to-ChB skew Push-pull driving 0.32 0.47 0.58 0.63 0.63 ChB-to-ChA skew Push-pull driving 0.27 0.24 0.23 0.22 0.22 1.47 1.66 1.68 1.82 1.77 tsk(O) CLKA Channel-to-Clock skew Push-pull driving 60 80 120 120 120 Open-drain driving 2 2 2 2 2 Clock Push-pull driving 30 40 60 60 Data Push-pull driving 60 80 120 120 Command Max data rate Push-pull driving Copyright © 2008, Texas Instruments Incorporated ns 18 1.7 tfA tfB UNIT MAX 60 ns ns ns Mbps MHz 120 Mbps Submit Documentation Feedback 11 TXS02612 SCES682A – MAY 2008 – REVISED JULY 2008 ............................................................................................................................................................... www.ti.com SWITCHING CHARACTERISTICS over operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted) PARAMETER tPD trA trB trB FROM (INPUT) TO (OUTPUT) CMDA CMDB CMDB CMDA CLKA CLKB DATA DATB DATB DATA SEL B-Port TEST CONDITIONS VCCB = 1.2 V TYP VCCB = 1.5 V ± 0.1 V MIN VCCB = 1.8 V ± 0.15 V MAX MIN VCCB = 2.5 V ± 0.2 V MAX MIN VCCB = 3.3 V ± 0.3 V MAX MIN Push-pull driving 4.8 12 8 6 5.7 Open-drain driving 183 726 715 686 780 9 7 6.4 6 Open-drain driving 175 565 563 441 392 Push-pull driving 4.5 13 9 5.4 4.5 4.7 12 8.4 6 5.8 4.1 9 7.5 6.4 6.3 Push-pull driving 8.2 22 17 14.8 A-port rise time Push-pull driving 2 1.1 4 1.1 4.3 B-port rise time Push-pull driving 6.2 1.7 7.9 1.2 Push-pull driving 5.2 1.7 6.4 1.3 CLKA CLKB Push-pull driving Push-pull driving 4 4.5 1.3 4.6 6.2 1 4.3 0.8 3.1 4.9 0.9 3.2 0.8 2.5 2.6 A-port fall time Push-pull driving 1.8 0.8 3.2 0.7 2.8 0.7 1.7 0.7 tfB B-port fall time Push-pull driving 3.5 1 5.6 0.9 3.5 0.6 1.9 0.6 3 CLKB Push-pull driving 3.1 0.9 4.1 0.8 3.2 0.5 2.2 0.5 1.9 ChA-to-ChB skew Push-pull driving 0.33 0.45 0.48 0.53 0.67 ChB-to-ChA skew Push-pull driving 0.28 0.24 0.23 0.23 0.22 1.51 1.58 1.46 1.56 1.48 CLKA tsk(O) Channel-to-Clock skew Push-pull driving 60 80 120 120 120 Open-drain driving 2 2 2 2 2 Clock Push-pull driving 30 40 60 60 Data Push-pull driving 60 80 120 120 Command Max data rate 12 Push-pull driving Submit Documentation Feedback ns 14 1.2 tfA tfB UNIT MAX 60 ns ns ns Mbps MHz 120 Mbps Copyright © 2008, Texas Instruments Incorporated TXS02612 www.ti.com ............................................................................................................................................................... SCES682A – MAY 2008 – REVISED JULY 2008 SWITCHING CHARACTERISTICS over operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted) PARAMETER tPD trA trB trB FROM (INPUT) TO (OUTPUT) CMDA CMDB CMDB CMDA CLKA CLKB DATA DATB DATB DATA SEL B-Port TEST CONDITIONS VCCB = 1.2 V TYP VCCB = 1.5 V ± 0.1 V MIN VCCB = 1.8 V ± 0.15 V MAX MIN VCCB = 2.5 V ± 0.2 V MAX MIN VCCB = 3.3 V ± 0.3 V MAX MIN Push-pull driving 4.4 11 7.4 4.4 3.8 Open-drain driving 143 544 596 605 669 Push-pull driving 3.8 7.6 5.5 4.2 3.7 Open-drain driving 137 434 444 414 372 Push-pull driving 4.1 12 8 4.8 3.8 4.4 11 7 4.5 3.8 4.4 8 5.5 4.1 3.7 Push-pull driving 7 18 13 10.5 A-port rise time Push-pull driving 1.4 0.75 2.2 0.74 2.2 1.06 2.6 0.7 2.8 B-port rise time Push-pull driving 6.3 1.91 7.7 1.34 6.1 0.95 4.2 0.83 3.2 Push-pull driving 5.2 1.67 6.4 1.27 4.9 0.9 3.2 0.76 2.6 1.9 CLKA CLKB Push-pull driving A-port fall time Push-pull driving 1.1 0.58 1.9 0.58 2 0.61 1.9 0.57 tfB B-port fall time Push-pull driving 3.6 1.04 5.4 0.87 4.3 0.66 3.4 0.57 3 CLKB Push-pull driving 3.1 0.92 4.2 0.79 3.2 0.56 2.2 0.49 1.9 ChA-to-ChB skew Push-pull driving 0.41 0.43 0.39 0.59 0.68 ChB-to-ChA skew Push-pull driving 0.41 0.24 0.2 0.19 0.18 2.11 1.47 1.3 1.25 1.21 tsk(O) CLKA Channel-to-Clock skew Push-pull driving 60 80 120 120 120 Open-drain driving 2 2 2 2 2 Clock Push-pull driving 30 40 60 60 Data Push-pull driving 60 80 120 120 Command Max data rate Push-pull driving Copyright © 2008, Texas Instruments Incorporated ns 9 tfA tfB UNIT MAX 60 ns ns ns Mbps MHz 120 Mbps Submit Documentation Feedback 13 TXS02612 SCES682A – MAY 2008 – REVISED JULY 2008 ............................................................................................................................................................... www.ti.com SWITCHING CHARACTERISTICS over operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted) PARAMETER tPD FROM (INPUT) TO (OUTPUT) CMDA CMDB CMDB CMDA CLKA CLKB DATA DATB DATB DATA SEL B-Port TEST CONDITIONS VCCB = 1.2 V TYP VCCB = 1.5 V ± 0.1 V MIN VCCB = 1.8 V ± 0.15 V MAX MIN VCCB = 2.5 V ± 0.2 V MAX MIN VCCB = 3.3 V ± 0.3 V MAX MIN Push-pull driving 4.4 11 7 4.1 3.3 Open-drain driving 116 432 477 506 533 Push-pull driving 4.2 7.5 5.4 3.8 3 Open-drain driving 112 349 363 347 324 Push-pull driving 4.1 12 7.8 4.4 3.5 4.3 11 6.8 4 3.8 7.9 7.8 5.4 3.4 3 Push-pull driving 6.4 16 11.5 8.8 7.6 Push-pull driving trA A-port rise time Push-pull driving 1.1 0.57 1.7 0.57 1.8 0.56 1.7 0.53 1.8 trB B-port rise time Push-pull driving 6.2 1.96 7.7 1.43 6.1 0.95 4.2 0.71 3.1 Push-pull driving 5.2 1.67 6.4 1.26 4.9 0.91 3.3 0.76 2.5 trB CLKA CLKB tfA A-port fall time Push-pull driving 1 0.53 1.6 0.52 1.6 0.53 1.6 0.56 1.6 tfB B-port fall time Push-pull driving 3.4 0.95 5.2 0.8 4.1 0.63 3.2 0.58 2.9 CLKB Push-pull driving 3.1 0.92 4.1 0.79 3.2 0.56 2.2 0.49 1.9 ChA-to-ChB skew Push-pull driving 0.39 0.36 0.39 0.57 0.65 ChB-to-ChA skew Push-pull driving 0.45 0.3 0.19 0.19 0.18 1.7 1.61 1.34 1.22 1.14 Push-pull driving 60 80 120 120 120 Open-drain driving 2 2 2 2 2 Clock Push-pull driving 30 40 60 60 Data Push-pull driving 60 80 120 120 tfB CLKA tsk(O) Channel-to-Clock skew Command Max data rate Push-pull driving UNIT MAX 60 ns ns ns ns Mbps MHz 120 Mbps OPERATING CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) VCCA PARAMETER Data & CMD CpdA A-port input, B-port output Data & CMD CpdB CpdA A-port input, B-port output CpdB B-port input, A-port output Clock 14 CL = 0, f = 10 MHz, tr = tr = 1 ns, OE = Outputs Enabled B-port input, A-port output A-port input, B-port output 1.5 V 1.8 V 2.5 V 3.3 V 1.2 V 1.5 V 1.8 V 2.5 V 3.3 V TYP TYP TYP TYP TYP 14.5 12.9 12.1 13.4 15 20.7 20.7 21 22 23.2 23.2 23.4 23.6 24.5 25.5 14.1 12.2 11.5 12.9 14.4 0.1 0.1 0.1 0.1 0.1 0.4 0.4 0.4 0.5 0.7 14 13.9 13.8 13.8 13.7 TEST CONDITIONS A-port input, B-port output B-port input, A-port output 1.2 V OE = Outputs Disabled CL = 0, f = 10 MHz, tr = tr = 1 ns, OE = Outputs Enabled Submit Documentation Feedback VCCB UNIT pF pF pF Copyright © 2008, Texas Instruments Incorporated TXS02612 www.ti.com ............................................................................................................................................................... SCES682A – MAY 2008 – REVISED JULY 2008 PARAMETER MEASUREMENT INFORMATION VCCI VCCO VCCI VCCO DUT IN DUT IN OUT OUT 1 MΩ 15 pF 1 MΩ 15 pF DATA RATE, PULSE DURATION, PROPAGATION DELAY, ENABLE/DISABLE OUTPUT RISE AND FALL TIME MEASUREMENT USING A PUSH-PULL DRIVER DATA RATE, PULSE DURATION, PROPAGATION DELAY, OUTPUT RISE AND FALL TIME MEASUREMENT USING AN OPEN-DRAIN DRIVER tw VCCI VCCI/2 Input VCCI/2 0V VOLTAGE WAVEFORMS PULSE DURATION Input VCCI VCCO/2 VCCO/2 0V tPLH Output tPHL VCCI /2 0.8 x VCCO 0.2 x VCCO tr VCCI /2 VOL tf VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES NOTES: VOH VCCA Output Control (low-level enabling) Output Waveform 1 CMD and DATA (see Note B) VCCA/2 VCCA/2 0V tPLZ tPZL VCCO VCCO/2 0.2 x VCCO VOL VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low , except when disabled by the output control. Waveform C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, Z O = 50Ω, dv/dt≥ 1 V/ns. D. The outputs are measured one at a time, with one transition per measurement. t . E. tP L Z and tP HZ are the same as dis F. tP Z L and tP Z H are the same as en t . G. tP L H and tP HL are the same as pd t . H. V CCI is the V CC associated with the input port. I. V CCO is the V CC associated with the output port. J. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms Copyright © 2008, Texas Instruments Incorporated Submit Documentation Feedback 15 PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing TXS02612RTWR ACTIVE QFN RTW 24 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TXS02612ZQSR ACTIVE ZQS 24 2500 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM BGA MI CROSTA R JUNI OR Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 16-Aug-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device TXS02612RTWR TXS02612ZQSR Package Package Pins Type Drawing QFN BGA MI CROSTA R JUNI OR SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant RTW 24 3000 330.0 12.4 4.3 4.3 1.5 8.0 12.0 Q2 ZQS 24 2500 330.0 12.4 3.3 3.3 1.6 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 16-Aug-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TXS02612RTWR QFN RTW 24 3000 346.0 346.0 29.0 TXS02612ZQSR BGA MICROSTAR JUNIOR ZQS 24 2500 340.5 338.1 20.6 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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