TI TXS02612ZQSR

TXS02612
www.ti.com ............................................................................................................................................................... SCES682A – MAY 2008 – REVISED JULY 2008
SDIO PORT EXPANDER WITH VOLTAGE-LEVEL TRANSLATION
FEATURES
1
• 6-to-12 Demultiplexer/Multiplexer Allows SDIO
Port Expansion
• Built-in Level Translator Eliminates Voltage
Mismatch Between Baseband and SD Card or
SDIO Peripheral
• VCCA, VCCB0, and VCCB1 Each Operate Over Full
1.1-V to 3.6-V Range
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
2
•
•
ESD Performance A Port
– 2000-V Human-Body Model (A114-B)
– 100-V Machine Model (A115-A)
– 1500-V Charged-Device Model (C101)
ESD Performance B Port
– ±6-kV IEC 61000-4-2 ESD,
Air-Gap Discharge
– ±8-kV IEC 61000-4-2 ESD,
Contact Discharge
DESCRIPTION/ORDERING INFORMATION
The TXS02612 is designed to interface the cellphone baseband with external SDIO peripherals. The device
includes a 6-channel SPDT switch with voltage-level translation capability. This allows a single SDIO port to be
interfaced with two SDIO peripherals. The TXS02612 has three separate supply rails that operate over the full
range of 1.1 V to 3.6 V. This allows the baseband and SDIO peripherals to operate at different supply voltages if
required.
The select (SEL) input is used to choose between the B0 port and B1 port. When SEL = Low, B0 port is
selected; when SEL = High, B1 port is selected. SEL is referenced to VCCA. For the unselected B port, the clock
output is held low, whereas the data and command I/Os are pulled high to their respective VCCB through a 70-kΩ
resistor (±30% tolerance).
ORDERING INFORMATION
TA
PACKAGE
–40°C to 85°C
(1)
(2)
(1) (2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
MicroStar Junior™ BGA
(VFBGA) – ZQS
Reel of 3000
TXS02612ZQSR
YJ612
QFN – RTW
Reel of 3000
TXS02612RTWR
YJ612
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
CMDB0
ZQS PACKAGE TERMINAL ASSIGNMENTS
ZQS PACKAGE
(TOP VIEW)
1 2 3 4 5
CLKB0
DAT3B0
VCCB0
SEL
DAT2B0
RTW PACKAGE
(TOP VIEW)
1
2
3
4
5
A
DAT2A
SEL
DAT3B0
CMDB0
CLKB0
A
B
DAT3A
DAT2B0
VCCB0
DAT0B0
DAT2A
1
18
DAT0B0
B
C
CMDA
VCCA
GND
VCCB1
DAT1B0
GND
2
17
VCCB1
C
D
DAT0A
CLKA
GND
DAT1B1
DAT0B1
DAT3A
3
16
DAT1B0
D
DAT1A
4
DAT2B1
DAT3B1
CMDB1
CLKB1
15
DAT1B1
E
E
CMDA
VCCA
5
14
DAT0B1
DAT0A
6
13
CLKB1
24 23 22 21 20 19
DAT1A
CLKA
GND
9 10 11 12
CMDB1
8
DAT3B1
7
DAT2B1
Exposed
Center Pad
For RTW, if the exposed
center pad is used, it must
be connected to ground
or electrically open.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
MicroStar Junior is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008, Texas Instruments Incorporated
TXS02612
SCES682A – MAY 2008 – REVISED JULY 2008 ............................................................................................................................................................... www.ti.com
APPLICATION BLOCK DIAGRAM
VCCB0
VCCA
VCCB0
VCCB1
VCCA
DAT0B0
DAT0A
DAT0B1
DAT1B0
DAT1A
DAT1B1
DAT2B0
DAT2A
DAT2B1
SD/MMC
Memory Card
DAT3B0
SDIO Port
DAT3A
DAT3B1
CMDB0
CMDA
CMDB1
CLKB0
CLKA
Digital Baseband
or Apps
Processor
Clock
Logic
SEL
CLKB1
VCCB1
TXS02612
NOTE:
Switch positions shown in this
diagram are for the case when
SEL = Low
SDIO Peripheral
(Bluetooth,
WLAN, DTV, etc)
2
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Copyright © 2008, Texas Instruments Incorporated
TXS02612
www.ti.com ............................................................................................................................................................... SCES682A – MAY 2008 – REVISED JULY 2008
PIN ASSIGNMENTS
RTW PACKAGE
PIN NO.
ZQS PACKAGE
BALL NO.
NAME
1
A1
DAT2A
Data bit 2. Referenced to VCCA.
I/O
3
B1
DAT3A
Data bit 3. Referenced to VCCA.
I/O
4
C1
CMDA
Command bit. Referenced to VCCA.
I/O
6
D1
DAT0A
Data bit 0. Referenced to VCCA.
I/O
7
E1
DAT1A
Data bit 1. Referenced to VCCA.
24
A2
SEL
5
C2
VCCA
A-port supply voltage. 1.1 V ≤ VCCA ≤ 3.6 V.
Power
9
D2
CLKA
Clock input A. Referenced to VCCA.
Input
8
E2
DAT2B1
Data bit 2. Referenced to VCCB1.
I/O
22
A3
DAT3B0
Data bit 3. Referenced to VCCB0.
I/O
23
B3
DAT2B0
Data bit 2. Referenced to VCCB0.
I/O
2
C3
GND
Ground
11
D3
GND
Ground
10
E3
DAT3B1
Data bit 3. Referenced to VCCB1.
I/O
20
A4
CMDB0
Command bit. Referenced to VCCB0.
I/O
21
B4
VCCB0
B0-port supply voltage. 1.1 V ≤ VCCB0 ≤ 3.6 V.
Power
17
C4
VCCB1
B1-port supply voltage. 1.1 V ≤ VCCB1 ≤ 3.6 V.
Power
15
D4
DAT1B1
Data bit 1. Referenced to VCCB1.
I/O
12
E4
CMDB1
Command bit. Referenced to VCCB1.
I/O
19
A5
CLKB0
Clock output. Referenced to VCCB0.
Output
18
B5
DAT0B0
Data bit 0. Referenced to VCCB0.
I/O
16
C5
DAT1B0
Data bit 1. Referenced to VCCB0.
I/O
14
D5
DAT0B1
Data bit 0. Referenced to VCCB1.
13
E5
CLKB1
B2
Copyright © 2008, Texas Instruments Incorporated
FUNCTION
TYPE
I/O
Select pin to choose between B0 and B1. Referenced to VCCA.
Input
Depopulated
I/O
Clock output. Referenced to VCCB1.
Output
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3
TXS02612
SCES682A – MAY 2008 – REVISED JULY 2008 ............................................................................................................................................................... www.ti.com
SIMPLIFIED INTERNAL STRUCTURE
VCCA
VCCBx
SPEED-UP
CIRCUITRY A-to-B
R1
(see Note A)
GATE
R2
(see Note A)
A-Port
(Data or
Command)
Bx-Port
(Data or
Command)
SPEED-UP
CIRCUITRY B-to-A
Simplified Architecture of Command and Each Data Path
VCCB0
VCCB0
P-ch
CLKA
CLKB0
TRANSLATOR
N-ch
GND
VCCB1
VCCB1
P-ch
CLKB1
TRANSLATOR
SEL
N-ch
GND
Simplified Architecture of the Clock Path
A.
4
R1 and R2 resistor values are determined based upon the logic level applied to the A port or B port, as follows:
R1 and R2 = 40 kΩ when a logic level low is applied to the A port or B port.
R1 and R2 = 4 kΩ when a logic level high is applied to the A port or B port.
R1 and R2 = 70 kΩ when the port is deselected.
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TXS02612
www.ti.com ............................................................................................................................................................... SCES682A – MAY 2008 – REVISED JULY 2008
FUNCTION TABLE
Clock Channel
SEL
CLKB0
CLKB1
OPERATION
L
Active
Low
CLKA to CLKB0
H
Low
Active
CLKA to CLKB1
Data and Command Channel
SEL
DATxB0 or CMDxB0
DATxB1 or CMDxB1
OPERATION
L
Active
Disabled, pulled to VCCB1 through 70 kΩ
DATxA to DATxB0, CMDA to CMDB0
H
Disabled, pulled to VCCB0 through 70 kΩ
Active
DATxA to DATxB1, CMDA to CMDB1
ABSOLUTE MAXIMUM RATINGS (1) (2)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
–0.5
4.6
V
VCCA
VCCB0
VCCB1
Supply voltage range (2)
VI
Input voltage range
A port, B0 port,
B1 port, control inputs
–0.5
VCCx + 0.5
V
VO
Voltage range applied to any output in the high-impedance or
power-off state
A port, B0 port,
B1 port
–0.5
VCCx + 0.5
V
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
ICC/
IGND
Continuous current through VCCA, VCCB0, VCCB1, or GND
±100
mA
Tstg
Storage temperature range
150
°C
(1)
(2)
–65
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
PACKAGE THERMAL IMPEDANCE
PARAMETER
θJA
Package thermal impedance
Copyright © 2008, Texas Instruments Incorporated
UNIT
RTW package
66
ZQS package
171.6
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°C/W
5
TXS02612
SCES682A – MAY 2008 – REVISED JULY 2008 ............................................................................................................................................................... www.ti.com
RECOMMENDED OPERATING CONDITIONS
VCCA
VCCA
VCCB0
VCCB1
Supply voltage
VIH
High-level input voltage
VCCBx (1)
A-port I/Os
VIL
Low-level input voltage
Input transition rise or fall rate
TA
Operating free-air temperature
(1)
MAX
1.1
3.6
VCCI – 0.2
VCCI
VCCI – 0.2
VCCI
SEL, CLKA
VCCA × 0.65 V
3.6
A-port I/Os
0
0.15
B-port I/Os
B-port I/Os
1.1 V to 3.6 V
1.1 V to 3.6 V
1.1 V to 3.6 V
1.1 V to 3.6 V
SEL, CLKA
Δt/Δv
MIN
0
0.15
0
VCCA × 0.35
CLK, SEL
–40
UNIT
V
V
V
10
ns/V
85
°C
VCCBx refers to VCCB0 and VCCB1.
ELECTRICAL CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
VOHA
(DATA &
CMD)
VOLA
(DATA &
CMD)
TEST CONDITIONS
IOH = –20 µA,
VIBx ≥ VCCBx – 0.2 V
VOHCLKB
0.74
1.4 V
1.4 V
VCCA × 0.67
1.65 V
1.65 V
VCCA × 0.67
2.3 V
2.3 V
VCCA × 0.67
VCCA × 0.67
MAX
3V
0.35
IOL = 180 µA, VIBx ≤ 0.15 V
1.4 V
1.4 V
0.35
IOL = 220 µA, VIBx ≤ 0.15 V
1.65 V
1.65 V
0.45
IOL = 300 µA, VIBx ≤ 0.15 V
2.3 V
2.3 V
0.55
IOH = –20 µA,
VIAx ≥ VCCAx – 0.2 V
3V
3V
1.1 V
1.1 V
0.74
V
0.70
1.4 V
1.4 V
VCCBx × 0.67
1.65 V
1.65 V
VCCBx × 0.67
2.3 V
2.3 V
VCCBx × 0.67
VCCBx × 0.67
V
3V
3V
IOH = – 0.5 mA
1.1 V
1.1 V
0.74
IOH = – 1 mA
1.4 V
1.4 V
1.05
IOH = – 2 mA
1.65 V
1.65 V
1.2
IOH = – 4 mA
2.3 V
2.3 V
1.75
3V
3V
2.3
1.1 V
1.1 V
0.35
V
IOL = 180 µA, VIAx ≤ 0.15 V
1.4 V
1.4 V
0.35
IOL = 220 µA, VIAx ≤ 0.15 V
1.65 V
1.65 V
0.45
IOL = 300 µA, VIAx ≤ 0.15 V
2.3 V
2.3 V
0.55
3V
3V
0.70
IOL = 0.5 mA
1.1 V
1.1 V
0.35
IOL = 1 mA
1.4 V
1.4 V
0.35
IOL = 2 mA
1.65 V
1.65 V
0.45
IOL = 4 mA
2.3 V
2.3 V
0.55
IOL = 8 mA
3V
3V
0.7
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UNIT
V
1.1 V
IOL = 620 µA, VIAx ≤ 0.15 V
6
1.1 V
MIN
3V
IOL = 135 µA, VIAx ≤ 0.15 V
VOLCLKB
1.1 V
TYP
1.1 V
IOH = – 8 mA
VOLB
(DATA &
CMD)
TA = –40°C to 85°C
VCCBx
IOL = 135 µA, VIBx ≤ 0.15 V
IOL = 620 µA, VIBx ≤ 0.15 V
VOHB
(DATA &
CMD)
TA = 25°C
VCCA
V
V
Copyright © 2008, Texas Instruments Incorporated
TXS02612
www.ti.com ............................................................................................................................................................... SCES682A – MAY 2008 – REVISED JULY 2008
ELECTRICAL CHARACTERISTICS (continued)
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
SEL, CLKA
II
DAT, CMD
VI = VO = Open, IO = 0,
SEL, CLK = High or Low
ICCA
1.1 V to 3.6 V
1.1 V to 3.6 V
1.1 V to 3.6 V
1.1 V to 3.6 V
12
3.6 V
0V
12
–1
MIN
±1
±2
±1
±2
3.6 V
1.1 V to 3.6 V
24
–12
0V
0V
3.6 V
Ci
SEL, CLKA
3.3 V
3.3 V
3.3 V
UNIT
MAX
0V
3.6 V
B port
TYP
1.1 V to 3.6 V
VI = VO = Open, IO = 0,
SEL, CLK = High or Low
Cio
TA = –40°C to 85°C
VCCBx
ICCB0 or
ICCB1
A port
TA = 25°C
VCCA
µA
µA
µA
24
3.3 V
2.5
3.5
7
7.5
9.5
10
pF
pF
TIMING REQUIREMENTS
TA = 25°C, VCCA = 1.2 V
VCCB = 1.2 V
Command
Data
rate
tw
Push-pull driving
Open-drain driving
VCCB = 1.5 V
VCCB = 1.8 V
VCCB = 2.5 V
VCCB = 3.3 V
TYP
TYP
TYP
TYP
TYP
60
80
120
120
120
2
2
2
2
2
UNIT
Mbps
Clock
Push-pull driving
30
40
60
60
60
MHz
Data
Push-pull driving
60
80
120
120
120
Mbps
Push-pull
driving
CLK
17
13
8
8
8
Open-drain
driving
CMD
500
500
500
500
500
Data
17
13
8
8
8
CMD
17
13
8
8
8
Pulse
duration
Push-pull
driving
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7
TXS02612
SCES682A – MAY 2008 – REVISED JULY 2008 ............................................................................................................................................................... www.ti.com
TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 1.5 V ± 0.1 V (unless otherwise noted)
VCCB = 1.5 V
± 0.1 V
VCCB = 1.2 V
TYP
Command
Data
rate
tw
Push-pull driving
MIN
MAX
VCCB = 1.8 V
± 0.15 V
MIN
MAX
VCCB = 2.5 V
± 0.2 V
MIN
VCCB = 3.3 V
± 0.3 V
MAX
MIN
60
80
120
120
120
2
2
2
2
2
40
60
60
60
MHz
120
Mbps
Open-drain driving
Clock
Push-pull driving
30
Data
Push-pull driving
60
Push-pull
driving
CLK
17
13
8
8
8
Open-drain
driving
CMD
500
500
500
500
500
Data
17
13
8
8
8
CMD
17
13
8
8
8
Pulse
duration
Push-pull
driving
UNIT
MAX
80
120
120
Mbps
ns
TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted)
VCCB = 1.5 V
± 0.1 V
VCCB = 1.2 V
TYP
Command
Data
rate
tw
Push-pull driving
Open-drain driving
MAX
MIN
MAX
VCCB = 2.5 V
± 0.2 V
MIN
MAX
VCCB = 3.3 V
± 0.3 V
MIN
UNIT
MAX
60
80
120
120
120
2
2
2
2
2
Mbps
Clock
Push-pull driving
30
40
60
60
60
MHz
Data
Push-pull driving
60
80
120
120
120
Mbps
Push-pull
driving
CLK
17
13
8
Open-drain
driving
CMD
500
500
500
Data
17
13
8
8
8
CMD
17
13
8
8
8
Pulse
duration
Push-pull
driving
8
MIN
VCCB = 1.8 V
± 0.15 V
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8
500
8
500
ns
Copyright © 2008, Texas Instruments Incorporated
TXS02612
www.ti.com ............................................................................................................................................................... SCES682A – MAY 2008 – REVISED JULY 2008
TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted)
VCCB = 1.5 V
± 0.1 V
VCCB = 1.2 V
TYP
Command
Data
rate
tw
Push-pull driving
MIN
MAX
VCCB = 1.8 V
± 0.15 V
MIN
MAX
VCCB = 2.5 V
± 0.2 V
MIN
MAX
VCCB = 3.3 V
± 0.3 V
MIN
60
80
120
120
120
2
2
2
2
2
40
60
60
60
MHz
120
Mbps
Open-drain driving
Clock
Push-pull driving
30
Data
Push-pull driving
60
Push-pull
driving
CLK
17
13
8
8
8
Open-drain
driving
CMD
500
500
500
500
500
Data
17
13
8
8
8
CMD
17
13
8
8
8
Pulse
duration
Push-pull
driving
UNIT
MAX
80
120
120
Mbps
ns
TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted)
VCCB = 1.5 V
± 0.1 V
VCCB = 1.2 V
TYP
Command
Data
rate
tw
Push-pull driving
Open-drain driving
MIN
MAX
VCCB = 1.8 V
± 0.15 V
MIN
MAX
VCCB = 2.5 V
± 0.2 V
MIN
MAX
VCCB = 3.3 V
± 0.3 V
MIN
UNIT
MAX
60
80
120
120
120
2
2
2
2
2
Mbps
Clock
Push-pull driving
30
40
60
60
60
MHz
Data
Push-pull driving
60
80
120
120
120
Mbps
Push-pull
driving
CLK
17
13
8
8
8
Open-drain
driving
CMD
500
500
500
500
500
Data
17
13
8
8
8
CMD
17
13
8
8
8
Pulse
duration
Push-pull
driving
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9
TXS02612
SCES682A – MAY 2008 – REVISED JULY 2008 ............................................................................................................................................................... www.ti.com
SWITCHING CHARACTERISTICS
TA = 25°C, VCCA = 1.2 V
PARAMETER
tPD
FROM
(INPUT)
TO
(OUTPUT)
CMDA
CMDB
CMDB
CMDA
CLKA
CLKB
DATA
DATB
DATB
DATA
SEL
B-Port
TEST
CONDITIONS
VCCB = 1.2 V
VCCB = 1.5 V
VCCB = 1.8 V
VCCB = 2.5 V
VCCB = 3.3 V
TYP
TYP
TYP
TYP
TYP
Push-pull driving
5.9
4.8
4.4
4
4.46
Open-drain driving
238
214
192
159
140
Push-pull driving
5.6
4.8
4.4
4.1
4
Open-drain driving
227
201
176
137
114
Push-pull driving
5.5
4.1
3.6
3.2
3
5.8
4.8
4.4
4.2
6.8
5.6
4.8
4.4
4.1
4
Push-pull driving
13
11
10
9.4
9.1
Push-pull driving
trA
A-port rise time
Push-pull driving
4.8
5.1
5.1
5.3
5.7
trB
B-port rise time
Push-pull driving
6.1
3.8
2.9
1.9
1.5
Push-pull driving
5.2
3.4
2.6
1.7
1.3
A-port fall time
Push-pull driving
3.4
2.8
2.6
2.6
2.6
B-port fall time
1.5
trB
CLKA
tfA
tfB
tfB
CLKB
Push-pull driving
4.2
3
2.3
1.7
CLKB
Push-pull driving
3.1
2.1
1.6
1.2
1
ChA-to-ChB skew
Push-pull driving
0.4
0.4
0.3
0.4
0.4
ChB-to-ChA skew
Push-pull driving
CLKA
tsk(O)
ns
0.3
0.3
0.3
0.3
0.4
1.5
1.5
1.5
1.7
Push-pull driving
60
80
120
120
120
Open-drain driving
2
2
2
2
2
Clock
Push-pull driving
30
40
60
60
60
MHz
Data
Push-pull driving
60
80
120
120
120
Mbps
Command
10
ns
1.68
Channel-to-Clock
skew
Max data rate
UNIT
Push-pull driving
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ns
Mbps
Copyright © 2008, Texas Instruments Incorporated
TXS02612
www.ti.com ............................................................................................................................................................... SCES682A – MAY 2008 – REVISED JULY 2008
SWITCHING CHARACTERISTICS
over operating free-air temperature range, VCCA = 1.5 V ± 0.1 V (unless otherwise noted)
PARAMETER
tPD
trA
trB
trB
FROM
(INPUT)
TO
(OUTPUT)
CMDA
CMDB
CMDB
CMDA
CLKA
CLKB
DATA
DATB
DATB
DATA
SEL
B-Port
TEST
CONDITIONS
VCCB = 1.2 V
TYP
VCCB = 1.5 V
± 0.1 V
MIN
VCCB = 1.8 V
± 0.15 V
MAX
MIN
VCCB = 2.5 V
± 0.2 V
MAX
MIN
VCCB = 3.3 V
± 0.3 V
MAX
MIN
Push-pull driving
5.1
13
9
8
7.5
Open-drain driving
210
777
756
684
758
Push-pull driving
4.5
10.6
9.2
8.5
8.2
Open-drain driving
200
616
560
433
375
Push-pull driving
4.7
13.1
9.8
6
5.2
5.1
13
9
8
7.8
4.5
11
9.3
8.8
8.4
Push-pull driving
9.5
26
21
19
A-port rise time
Push-pull driving
2.7
1.5
5.8
1.7
5.9
B-port rise time
Push-pull driving
3.3
1.7
8.2
1.3
Push-pull driving
5.2
1.7
6.4
1.3
CLKA
CLKB
Push-pull driving
6
1.8
6.1
6.6
1
4.3
0.8
2.9
4.9
0.9
3.2
0.8
2.5
A-port fall time
Push-pull driving
2.4
1
3.9
0.9
3.4
0.9
3.2
1.3
3.3
tfB
B-port fall time
Push-pull driving
3.7
1.1
6.3
0.9
5.2
0.6
3.9
0.6
3.2
CLKB
Push-pull driving
3.1
0.9
4.1
0.8
3.2
0.5
2.2
0.5
1.9
ChA-to-ChB skew
Push-pull driving
0.32
0.47
0.58
0.63
0.63
ChB-to-ChA skew
Push-pull driving
0.27
0.24
0.23
0.22
0.22
1.47
1.66
1.68
1.82
1.77
tsk(O)
CLKA
Channel-to-Clock
skew
Push-pull driving
60
80
120
120
120
Open-drain driving
2
2
2
2
2
Clock
Push-pull driving
30
40
60
60
Data
Push-pull driving
60
80
120
120
Command
Max data rate
Push-pull driving
Copyright © 2008, Texas Instruments Incorporated
ns
18
1.7
tfA
tfB
UNIT
MAX
60
ns
ns
ns
Mbps
MHz
120 Mbps
Submit Documentation Feedback
11
TXS02612
SCES682A – MAY 2008 – REVISED JULY 2008 ............................................................................................................................................................... www.ti.com
SWITCHING CHARACTERISTICS
over operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted)
PARAMETER
tPD
trA
trB
trB
FROM
(INPUT)
TO
(OUTPUT)
CMDA
CMDB
CMDB
CMDA
CLKA
CLKB
DATA
DATB
DATB
DATA
SEL
B-Port
TEST
CONDITIONS
VCCB = 1.2 V
TYP
VCCB = 1.5 V
± 0.1 V
MIN
VCCB = 1.8 V
± 0.15 V
MAX
MIN
VCCB = 2.5 V
± 0.2 V
MAX
MIN
VCCB = 3.3 V
± 0.3 V
MAX
MIN
Push-pull driving
4.8
12
8
6
5.7
Open-drain driving
183
726
715
686
780
9
7
6.4
6
Open-drain driving
175
565
563
441
392
Push-pull driving
4.5
13
9
5.4
4.5
4.7
12
8.4
6
5.8
4.1
9
7.5
6.4
6.3
Push-pull driving
8.2
22
17
14.8
A-port rise time
Push-pull driving
2
1.1
4
1.1
4.3
B-port rise time
Push-pull driving
6.2
1.7
7.9
1.2
Push-pull driving
5.2
1.7
6.4
1.3
CLKA
CLKB
Push-pull driving
Push-pull driving
4
4.5
1.3
4.6
6.2
1
4.3
0.8
3.1
4.9
0.9
3.2
0.8
2.5
2.6
A-port fall time
Push-pull driving
1.8
0.8
3.2
0.7
2.8
0.7
1.7
0.7
tfB
B-port fall time
Push-pull driving
3.5
1
5.6
0.9
3.5
0.6
1.9
0.6
3
CLKB
Push-pull driving
3.1
0.9
4.1
0.8
3.2
0.5
2.2
0.5
1.9
ChA-to-ChB skew
Push-pull driving
0.33
0.45
0.48
0.53
0.67
ChB-to-ChA skew
Push-pull driving
0.28
0.24
0.23
0.23
0.22
1.51
1.58
1.46
1.56
1.48
CLKA
tsk(O)
Channel-to-Clock
skew
Push-pull driving
60
80
120
120
120
Open-drain driving
2
2
2
2
2
Clock
Push-pull driving
30
40
60
60
Data
Push-pull driving
60
80
120
120
Command
Max data rate
12
Push-pull driving
Submit Documentation Feedback
ns
14
1.2
tfA
tfB
UNIT
MAX
60
ns
ns
ns
Mbps
MHz
120 Mbps
Copyright © 2008, Texas Instruments Incorporated
TXS02612
www.ti.com ............................................................................................................................................................... SCES682A – MAY 2008 – REVISED JULY 2008
SWITCHING CHARACTERISTICS
over operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted)
PARAMETER
tPD
trA
trB
trB
FROM
(INPUT)
TO
(OUTPUT)
CMDA
CMDB
CMDB
CMDA
CLKA
CLKB
DATA
DATB
DATB
DATA
SEL
B-Port
TEST
CONDITIONS
VCCB = 1.2 V
TYP
VCCB = 1.5 V
± 0.1 V
MIN
VCCB = 1.8 V
± 0.15 V
MAX
MIN
VCCB = 2.5 V
± 0.2 V
MAX
MIN
VCCB = 3.3 V
± 0.3 V
MAX
MIN
Push-pull driving
4.4
11
7.4
4.4
3.8
Open-drain driving
143
544
596
605
669
Push-pull driving
3.8
7.6
5.5
4.2
3.7
Open-drain driving
137
434
444
414
372
Push-pull driving
4.1
12
8
4.8
3.8
4.4
11
7
4.5
3.8
4.4
8
5.5
4.1
3.7
Push-pull driving
7
18
13
10.5
A-port rise time
Push-pull driving
1.4
0.75
2.2
0.74
2.2
1.06
2.6
0.7
2.8
B-port rise time
Push-pull driving
6.3
1.91
7.7
1.34
6.1
0.95
4.2
0.83
3.2
Push-pull driving
5.2
1.67
6.4
1.27
4.9
0.9
3.2
0.76
2.6
1.9
CLKA
CLKB
Push-pull driving
A-port fall time
Push-pull driving
1.1
0.58
1.9
0.58
2
0.61
1.9
0.57
tfB
B-port fall time
Push-pull driving
3.6
1.04
5.4
0.87
4.3
0.66
3.4
0.57
3
CLKB
Push-pull driving
3.1
0.92
4.2
0.79
3.2
0.56
2.2
0.49
1.9
ChA-to-ChB skew
Push-pull driving
0.41
0.43
0.39
0.59
0.68
ChB-to-ChA skew
Push-pull driving
0.41
0.24
0.2
0.19
0.18
2.11
1.47
1.3
1.25
1.21
tsk(O)
CLKA
Channel-to-Clock
skew
Push-pull driving
60
80
120
120
120
Open-drain driving
2
2
2
2
2
Clock
Push-pull driving
30
40
60
60
Data
Push-pull driving
60
80
120
120
Command
Max data rate
Push-pull driving
Copyright © 2008, Texas Instruments Incorporated
ns
9
tfA
tfB
UNIT
MAX
60
ns
ns
ns
Mbps
MHz
120 Mbps
Submit Documentation Feedback
13
TXS02612
SCES682A – MAY 2008 – REVISED JULY 2008 ............................................................................................................................................................... www.ti.com
SWITCHING CHARACTERISTICS
over operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted)
PARAMETER
tPD
FROM
(INPUT)
TO
(OUTPUT)
CMDA
CMDB
CMDB
CMDA
CLKA
CLKB
DATA
DATB
DATB
DATA
SEL
B-Port
TEST
CONDITIONS
VCCB = 1.2 V
TYP
VCCB = 1.5 V
± 0.1 V
MIN
VCCB = 1.8 V
± 0.15 V
MAX
MIN
VCCB = 2.5 V
± 0.2 V
MAX
MIN
VCCB = 3.3 V
± 0.3 V
MAX
MIN
Push-pull driving
4.4
11
7
4.1
3.3
Open-drain driving
116
432
477
506
533
Push-pull driving
4.2
7.5
5.4
3.8
3
Open-drain driving
112
349
363
347
324
Push-pull driving
4.1
12
7.8
4.4
3.5
4.3
11
6.8
4
3.8
7.9
7.8
5.4
3.4
3
Push-pull driving
6.4
16
11.5
8.8
7.6
Push-pull driving
trA
A-port rise time
Push-pull driving
1.1
0.57
1.7
0.57
1.8
0.56
1.7
0.53
1.8
trB
B-port rise time
Push-pull driving
6.2
1.96
7.7
1.43
6.1
0.95
4.2
0.71
3.1
Push-pull driving
5.2
1.67
6.4
1.26
4.9
0.91
3.3
0.76
2.5
trB
CLKA
CLKB
tfA
A-port fall time
Push-pull driving
1
0.53
1.6
0.52
1.6
0.53
1.6
0.56
1.6
tfB
B-port fall time
Push-pull driving
3.4
0.95
5.2
0.8
4.1
0.63
3.2
0.58
2.9
CLKB
Push-pull driving
3.1
0.92
4.1
0.79
3.2
0.56
2.2
0.49
1.9
ChA-to-ChB skew
Push-pull driving
0.39
0.36
0.39
0.57
0.65
ChB-to-ChA skew
Push-pull driving
0.45
0.3
0.19
0.19
0.18
1.7
1.61
1.34
1.22
1.14
Push-pull driving
60
80
120
120
120
Open-drain driving
2
2
2
2
2
Clock
Push-pull driving
30
40
60
60
Data
Push-pull driving
60
80
120
120
tfB
CLKA
tsk(O)
Channel-to-Clock
skew
Command
Max data rate
Push-pull driving
UNIT
MAX
60
ns
ns
ns
ns
Mbps
MHz
120 Mbps
OPERATING CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
VCCA
PARAMETER
Data
&
CMD
CpdA
A-port input, B-port
output
Data
&
CMD
CpdB
CpdA
A-port input, B-port
output
CpdB
B-port input, A-port
output
Clock
14
CL = 0, f = 10 MHz,
tr = tr = 1 ns,
OE = Outputs Enabled
B-port input, A-port
output
A-port input, B-port
output
1.5 V
1.8 V
2.5 V
3.3 V
1.2 V
1.5 V
1.8 V
2.5 V
3.3 V
TYP
TYP
TYP
TYP
TYP
14.5
12.9
12.1
13.4
15
20.7
20.7
21
22
23.2
23.2
23.4
23.6
24.5
25.5
14.1
12.2
11.5
12.9
14.4
0.1
0.1
0.1
0.1
0.1
0.4
0.4
0.4
0.5
0.7
14
13.9
13.8
13.8
13.7
TEST CONDITIONS
A-port input, B-port
output
B-port input, A-port
output
1.2 V
OE = Outputs Disabled
CL = 0, f = 10 MHz,
tr = tr = 1 ns,
OE = Outputs Enabled
Submit Documentation Feedback
VCCB
UNIT
pF
pF
pF
Copyright © 2008, Texas Instruments Incorporated
TXS02612
www.ti.com ............................................................................................................................................................... SCES682A – MAY 2008 – REVISED JULY 2008
PARAMETER MEASUREMENT INFORMATION
VCCI
VCCO
VCCI
VCCO
DUT
IN
DUT
IN
OUT
OUT
1 MΩ
15 pF
1 MΩ
15 pF
DATA RATE, PULSE DURATION, PROPAGATION DELAY, ENABLE/DISABLE
OUTPUT RISE AND FALL TIME MEASUREMENT USING
A PUSH-PULL DRIVER
DATA RATE, PULSE DURATION, PROPAGATION DELAY,
OUTPUT RISE AND FALL TIME MEASUREMENT USING
AN OPEN-DRAIN DRIVER
tw
VCCI
VCCI/2
Input
VCCI/2
0V
VOLTAGE WAVEFORMS
PULSE DURATION
Input
VCCI
VCCO/2
VCCO/2
0V
tPLH
Output
tPHL
VCCI /2
0.8 x VCCO
0.2 x VCCO
tr
VCCI /2
VOL
tf
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
NOTES:
VOH
VCCA
Output
Control
(low-level
enabling)
Output
Waveform 1
CMD and DATA
(see Note B)
VCCA/2
VCCA/2
0V
tPLZ
tPZL
VCCO
VCCO/2
0.2 x VCCO
VOL
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low
, except when disabled by the output control.
Waveform
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, Z O = 50Ω, dv/dt≥ 1 V/ns.
D. The outputs are measured one at a time, with one transition per measurement.
t .
E. tP L Z and tP HZ are the same as dis
F. tP Z L and tP Z H are the same as en
t .
G. tP L H and tP HL are the same as pd
t .
H. V CCI is the V CC associated with the input port.
I. V CCO is the V CC associated with the output port.
J. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
Copyright © 2008, Texas Instruments Incorporated
Submit Documentation Feedback
15
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
TXS02612RTWR
ACTIVE
QFN
RTW
24
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TXS02612ZQSR
ACTIVE
ZQS
24
2500 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
BGA MI
CROSTA
R JUNI
OR
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Aug-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
TXS02612RTWR
TXS02612ZQSR
Package Package Pins
Type Drawing
QFN
BGA MI
CROSTA
R JUNI
OR
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
RTW
24
3000
330.0
12.4
4.3
4.3
1.5
8.0
12.0
Q2
ZQS
24
2500
330.0
12.4
3.3
3.3
1.6
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Aug-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TXS02612RTWR
QFN
RTW
24
3000
346.0
346.0
29.0
TXS02612ZQSR
BGA MICROSTAR
JUNIOR
ZQS
24
2500
340.5
338.1
20.6
Pack Materials-Page 2
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