YEASHIN U2B

DATA SHEET
U2A Thru U2M
SEMICONDUCTOR
SURFACE MOUNT REVERSE VOLTAGE - 50 to 1000 Volts
ULTRA FAST RECTIFIERS FORWARD CURRENT - 2 Ampere
SMF Unit: inch ( mm )
0.195 (0.9)typical
FEATURES
•Glass passivated chip
•Ultra fast switching for high efficiency
•For surface mounted applications
(0.189)4.8
•Low forward voltage drop and high current capability
(0.173)4.4
•Low reverse leakage current
5
0.22
•Plastic material has UL flammability classification 94V-0
0.15
(0.052)1.3
O
•High temperature soldering : 260 C / 10 seconds at terminals
(0.043)1.1
• Pb free product at available : 99% Sn above meet RoHS environment
Z
5
substance directive request
Cathode Band
Top View
Detail Z
enlarged
MECHANCALDATA
•Case: ITO-220AB full molded plastic package
0.110(2.8)
•Case : Molded plastic
1.43
1.38
0.095(2.4)
0.10 max
•Polarity : Indicated by cathode band
•Weight : 0.002 ounces, 0.064 grams
3.6
3.2
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25℃ ambient temperature unless otherwise specified.
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%
CHARACTERISTICS
SYMBOL
U2A
U2B
U2D
U2G
U2J
U2K
U2M
UNITS
Maximum Recurrent Peak Reverse Voltage
VRRM
50
100
200
400
600
800
1000
V
Maximum RMS Voltage
VRMS
35
70
140
280
420
560
700
V
VDC
50
100
200
400
600
800
1000
V
Maximum DC Blocking Voltage
Maximum Average Forward
Rectified Current
@TL =75°C
IAV
2.0
A
IFSM
60
A
Peak Forward Surge Current
8.3ms single half sine-wave
super imposed on rated load (JEDEC METHOD)
Maximum DC Reverse Current
@TJ =25°C
at Rated DC Blocking Voltage
@TJ =100°C
Typical Junction
Capacitance (Note 2)
1.7
1.5
5
IR
Maximum Reverse Recovery Time (Note 1)
Typical Thermal Resistance (Note 3)
1.3
1.0
VF
Maximum forward Voltage at 1.0A DC
V
µA
100
CJ
20
10
pF
TRR
50
75
ns
RӨJC
30
°C/W
TJ
-55 to +150
°C
TSTG
-55 to +150
°C
Operating Temperature Range
Storage Temperature Range
NOTES:
1. Measured at 1 MHz and applied reverse voltage of 4.0 VDC.
2. Reverse Recovery Test Conditions: IF=.5A, IR=1A, Irr=.25A.
3. Thermal resistance from Junction to ambient and from junction to lead 0.375” (9.5mm) P.C.B mounted.
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1
REV.02 20110725
RATING AND CHARACTERISTIC CURVES
U2A Thru U2M
trr
+0.5A
0
-0.25
-1.0
NOTE:1.Rise Time = 7ns max.
Input Impedance = 1 megohm. 22pF
2.Rise Time = 10ns max.
1cm
SET TIME
BASE FOR
50 ns/cm
Source Impedance = 50 Ohms
Fig. 1-REVERSE RECOVERY TIME CHARACTERISTIC AND TEST CIRCUIT DIAGRAM
10
AVERAGE FORWARD CURRENT,
AMPERES
TJ = 25 ¢J
TYPICAL
U2A
IFM, Apk
1.0
U2G
0.1
U2M
2.0
1.0
.01
0
.2
.4
.6
SINGLE PHASE HALF WAVE
RESISTIVE OR INDUCTIVE
P.C.B MOUNTED ON
0.315×0.315"(8.0×8.0mm)
PAD AREAS
25
.8
1.0 1.2
50
75 100 125 150 175
1.4
LEAD TEMPERATURE, ¢J
Fig. 2-FORWARD CHARACTERISTICS
Fig. 3-FORWARD CURRENT DERATING CURVE
PEAK FORWARD SURGE CURRENT,
AMPERES
JUNCTION CAPACITANCE, pF
100
TJ = 25 ¢J
f = 1.0MHz
Vsig = 50m Vp-p
10
1
0.1
1
10
100
REVERSE VOLTAGE, VOLTS
25
8.3ms SINGLE HALF SINE WAVE
JEDEC METHOD
20
15
10
5
1
2
5
10
20
50
NUMBER OF CYCLES AT 60Hz
Fig. 4-TYPICAL JUNCTION CAPACITANCE
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30
Fig. 5-PEAK FORWARD SURGE CURRENT
2
REV.02 20110725
100