D SCSI SPI-2, SPI-3, SPI-4, D D D D 1 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 2 47 3 46 4 45 5 44 6 43 7 42 8 41 9 40 10 39 11 38 12 37 13 36 14 35 15 34 33 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 {DISCNCT1 {DISCNCT2 L21– L21+ L20– L20+ L19– L19+ DIFSENS DIFFB L18– L18+ L17– L17+ L16– L16+ L12+ L12– L13+ L13– L1+ L1– L2+ L2– L3+ L3– L4+ L4– L14+ L14– L15+ L15– PTRMPWR REG SGND PGND LVD L10– L10+ L11– L11+ PM PACKAGE (TOP VIEW) L24+ L24– L23+ L23– L9+ L9– L8+ L8– L7+ L7– L6+ L6– L5+ L5– D D Ultra160, Ultra320 Compliance Smallest Footprint Lowest Channel L25– Capacitance, 2 pF L25+ Less than 0.5-pF Capacitance L26– Differential Between Pairs L26+ 2.7 V to 5.25 V Operation L27– Differential Failsafe Bias L27+ 64-Pin Low Profile QFP STRMPWR L22+ L22– SLUS386B – FEBRUARY 2000 – REVISED APRIL 2001 {For the UCC5647, Pin 47 is DISCNCT1 and Pin 48 is DISCNCT2. description The UCC5646 is a twenty-seven line active terminator for low-voltage-differential (LVD) SCSI networks. This LVD SCSI-only design allows the user to reach peak bus performance, while reducing system cost. The device is designed as an active Y-terminator to improve the frequency response of the LVD SCSI Bus. Designed with a 2-pF (typical) channel capacitance, the UCC5646 allows for minimal bus loading for a maximum number of peripherals. With the UCC5646, the designer is able to comply with the Ultra2, Ultra3, Ultra160 and Ultra320 specifications. The UCC5646 also provides a much-needed system migration path for the ever improving SCSI system standards. This device is available in the 64-pin low-profile QFP package for ease of layout use. Single-ended (SE) and high-voltage differential (HVD) SCSI drivers are not supported. AVAILABLE OPTIONS DISCONNECT STATUS TA 0°C to 70°C REGULAR PACKAGED DEVICES† LOW PROFILE QFP (PM) UCC5646PM REVERSE UCC5647PM † The PM package is available taped and reeled. Add TR suffix to device type (e.g. UCC5646PMTR) to order quantities of 1000 devices per reel. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2001, Texas Instruments Incorporated !"#$%! & '("")% $& ! *(+,'$%! -$%). "!-('%& '! !"# %! &*)' '$%!& *)" %/) %)"#& ! )0$& &%"(#)%& &%$-$"- 1$""$%2. "!-('%! *"!')&&3 -!)& !% )')&&$",2 ',(-) %)&%3 ! $,, *$"$#)%)"&. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SLUS386B – FEBRUARY 2000 – REVISED APRIL 2001 block diagram DIFSENS 40 –15mA≤ ISOURCE ≤ –5mA 50µA ≤ ISINK ≤ 200µA *FOR THE UCC5647 PIN 47 IS DISCNCT1 AND PIN 48 IS DISCNCT2. REF 1.3V 1.3V +/– 0.1V 2.15 V DIFFB + HPD 39 12 LVD + STRMPWR 7 PTRMPWR 8 *DISCNCT1 *DISCNCT2 48 47 0.6V SE 125 REF 1.25V L10 L1 SOURCE/SINK REGULATOR L27 L9 52 – + +56mV MODE ALL SWITCHES SE LVD HVD DISCNCT OPEN DOWN OPEN OPEN 22 L1– 21 L1+ 5 L27– 6 L27+ 52 + – +56mV 125 52 – + +56mV 52 + – +56mV 10 11 9 SGND PGND REG absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†‡ Input voltage VIN (STRMPWR, PTRMPWR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 V Signal line input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V to 5 V Regulator output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.75 A Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –55°C to 150°C Operating virtual junction temperature range, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –55°C to 150°C Lead temperature (soldering, 10 seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. ‡ Unless otherwise indicated, voltages are reference to ground and currents are positive into and negative out of the specified terminals. Consult Packaging Section of the Databook for thermal limitations and considerations of packages. All voltages are referenced to GND. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SLUS386B – FEBRUARY 2000 – REVISED APRIL 2001 electrical characteristics over recommended operating free-air temperature range, xTRMPWR = 2.7 V to 5.25 V, TA = 0_C to 70_C, DISCNCT1 = DISCNCT2 = 0 V for UCC5646, DISCNCT1 = DISCNCT2 = open for UCC5647, TA = TJ, (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT xTRMPWR Supply Current Section LVD mode xTRMPWR supply current Disabled terminator 65 mA 500 µA 1.25 V Regulator Section 1.25 V regulator 0.5 V ≤ VCM ≤ 2.0 V, Regulator source current VREG = 0 V Regulator sink current VREG = 3.0 V 240 300 1.3 V regulator –5mA ≤ IDIFSENS ≤ 50 µA 1.2 1.3 1.4 V Short-circuit source current VDIFSENS = 0 V –5 –8 –15 mA Short-circuit sinkcurrent VDIFSENS = 2.75 V 50 200 µA See Note 1 1.15 1.25 1.35 V –300 –240 mA mA 1.3 V (DIFSENS) Regulator Section Differential Termination Section (Applies to each line pair 1–27) Differential bias voltage 100 125 mV Differential impedance 100 105 110 Ω 1.15 1.25 1.35 V 110 140 165 Ω 10 400 nA 3 pF Common-mode bias voltage L+ and L– shorted together Common-mode impedance L+ and L– shorted together, See Note 2 SE measurement to GND, See Note 3 Disconnected Termination Section Output leakage current Output capacitance Disconnect Control (DISCNCT1) or (DISNCNT2) and DIFFB Input Section DISCNCT threshold voltage 0.8 DISCNCT input current VDISCNCT = 0 V and 2.0 V DIFFB SE to LVD threshold voltage DIFFB LVD to HPD threshold voltage 0 V ≤ VDIFFB ≤ 2.75 V, DIFFB Input current 1.5 –30 2.0 V –10 µA V 0.5 0.6 0.7 1.9 2.05 2.2 V 10 µA –4 mA –10 Low-Voltage Differential (LVD) Status Bit Section Source current VLOAD = 2.4 V Sink current VLOAD = 0.4 V –6 2 5 140 155 mA Thermal Shutdown Section Thermal shutdown threshold For increasing temperature Thermal shutdown hysteresis 10 170 _C _C NOTE 1: VCM is applied to all L+ and L– lines simultaneously. 2.0 V * 0.5 V , VCM(max) = 2.0 V, VCM(min) = 0.5 V + CM I *I VCM (max) VCM (max) NOTE 3: Ensured by design, not production tested. NOTE 2: Z ƪ ƫ POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SLUS386B – FEBRUARY 2000 – REVISED APRIL 2001 pin descriptions STRMPWR: 2.7 V to 5.25 V power supply for all circuitry except the 1.25-V regulator. SGND: Ground reference for all circuitry except the 1.25-V regulator. PTRMPWR: 2.7 V to 5.25 V power supply for the 1.25-V regulator. PGND: Ground reference for the 1.25-V regulator. REG: Output of the internal 1.25-V regulator; must be connected to a 4.7-µF bypass capacitor and a high-frequency, low-ESR 0.01-µF capacitor to GND. DIFSENS: Drives the SCSI bus DIFF SENSE line to 1.3 V to detect what types of devices are tied to the bus. DIFFB: DIFF SENSE input pin. Connect through a 20-kΩ resistor to DIFSENS and through a 0.1-µF capacitor to GND. Input to comparators that detect what type of drives are connected to the SCSI bus. DISCNCT1: Disconnect one controls termination lines 10–27 (control and low byte). DISCNCT2: Disconnect two controls termination lines 1–9 (high byte). LVD: TTL compatible status bit indicating when low-voltage-differential voltage is present on DIFFB. L1– thru L27–: Negative lines for the SCSI bus. L1+ thru L27+: Positive lines for the SCSI bus. 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SLUS386B – FEBRUARY 2000 – REVISED APRIL 2001 UCC5646 L1+ 21 21 L1+ L1– 22 22 L1– Termpower 7 STRMPWR L9+ 60 60 L9+ L9– 59 59 L9– 4.7 µ F 12 LVD L10+ 14 14 L10+ L10– 13 13 L10– CONTROL AND LOW BYTE 37 L18+ L18– 38 38 L18– L19+ 41 41 L19+ L19– 42 42 L19– 0.01 µF L27+ 6 6 L27+ L27– 5 5 L27– DIFSENS 40 8 48 40 HIGH SIDE PGND 11 DIFSENS SGND 10 REG DIFFB DIFFB REG 9 39 39 9 4.7 µ F 50 kΩ 0.01 µ F DISCNCT2 47 HIGH SIDE 10 SGND PTRMPWR CONTROL AND LOW BYTE DATA (8) + PARITY LINES 11 PGND 7 DISCNCT1 L18+ 37 DISCNCT2 STRMPWR 4.7 µ F DATA (8) + PARITY LINES 48 DISCNCT1 47 Termpower CONTROL LINES (9) 8 PTRMPWR 0.01 µF UCC5646 50 kΩ 4.7 µF 4.7 µF 4.7 µ F 0.01µ F UDG–98202 Figure 1. Typical Application Diagram POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 SLUS386B – FEBRUARY 2000 – REVISED APRIL 2001 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. Customers are responsible for their applications using TI components. In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, license, warranty or endorsement thereof. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations and notices. Representation or reproduction of this information with alteration voids all warranties provided for an associated TI product or service, is an unfair and deceptive business practice, and TI is not responsible nor liable for any such use. Resale of TI’s products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service, is an unfair and deceptive business practice, and TI is not responsible nor liable for any such use. Also see: Standard Terms and Conditions of Sale for Semiconductor Products. www.ti.com/sc/docs/stdterms.htm Mailing Address: Texas Instruments Post Office Box 655303 Dallas, Texas 75265 Copyright 2001, Texas Instruments Incorporated