NEC UPC3215TB

DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
µPC3215TB
5 V, SUPER MINIMOLD SILICON MMIC WIDEBAND AMPLIFIER
DESCRIPTION
The µPC3215TB is a silicon monolithic IC designed as wideband amplifier.
The µPC3215TB is suitable to
systems required wideband operation from HF to L band.
This IC is manufactured using NEC’s 30 GHz fmax UHS0 (Ultra High Speed Process) silicon bipolar process.
The package is 6-pin super minimold suitable for surface mount.
FEATURES
• Wideband response
: fu = 2.9 GHz TYP. @3 dB bandwidth
• Noise figure
: NF = 2.3 dB TYP. @f = 1.5 GHz
• Power gain
: GP = 20.5 dB TYP. @f = 1.5 GHz
• Supply voltage
: VCC = 4.5 to 5.5 V
• High-density surface mounting: 6-pin super minimold package
APPLICATION
• Systems required wideband operation from HF to L band
ORDERING INFORMATION
Part Number
µPC3215TB-E3
Remark
Package
6-pin super minimold
Marking
C3H
Supplying Form
Embossed tape 8 mm wide.
1, 2, 3 pins face the perforation side of the tape.
Qty 3 kpcs/reel.
To order evaluation samples, please contact your local NEC sales office. (Part number for sample
order: µPC3215TB)
Caution Electro-static sensitive devices
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. P14765EJ2V0DS00 (2nd edition)
Date Published August 2000 N CP(K)
Printed in Japan
The mark
shows major revised points.
©
2000
µPC3215TB
PIN CONNECTIONS
(Bottom View)
C3H
(Top View)
3
2
1
4
4
Pin No.
Pin Name
1
INPUT
2
GND
3
GND
4
OUTPUT
5
GND
6
VCC
3
5
5
2
6
6
1
PRODUCT LINE-UP OF 5V-BIAS SILICON MMIC WIDEBAND AMPLIFIERS
(TA = +25°C, VCC = 5.0 V, ZS = ZL = 50 Ω)
Part No.
µPC2711T
fu
(GHz)
PO (sat)
(dBm)
GP
(dB)
NF
(dB)
ICC
(mA)
2.9
+1.0
13
5.0
@f = 1 GHz
12
4.5
@f = 1 GHz
12
µPC2711TB
µPC2712T
2.6
+3.0
20
µPC2712TB
2
Package
6-pin minimold
Marking
C1G
6-pin super minimold
6-pin minimold
C1H
6-pin super minimold
µPC3210TB
2.3
+3.5
20
3.4
@f = 1.5 GHz
15
6-pin super minimold
C2X
µPC3215TB
2.9
+3.5
20.5
2.3
@f = 1.5 GHz
14
6-pin super minimold
C3H
Remark
Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail.
Caution
The package size distinguishes between minimold and super minimold.
Data Sheet P14765EJ2V0DS00
µPC3215TB
PIN EXPLANATION
Pin
No.
1
2
3
5
4
6
Pin Name
INPUT
GND
OUTPUT
VCC
Applied
Voltage
(V)
Pin
Voltage
Note
(V)

0.82
0

4.5 to 5.5

3.8

Function and Applications
Internal Equivalent Circuit
Signal input pin. A internal matching circuit,
configured with resistors, enables 50 Ω
connection over a wideband. A multifeedback circuit is designed to cancel the
deviations of hFE and resistance. This pin
must be coupled to signal source with
capacitor for DC cut.
Ground pin. This pin should be connected
to system ground with minimum inductance.
Ground pattern on the board should be
formed as wide as possible. All the ground
pins must be connected together with wide
ground pattern to decrease impedance
difference.
Signal output pin. A internal matching
circuit, configured with resistors, enables 50
Ω connection over a wideband. This pin
must be coupled to next stage with
capacitor for DC cut.
VCC
6
4
OUT
IN
1
2
5
GND
3
GND
Power supply pin. This pin should be
externally equipped with bypass capacitor to
minimize ground impedance.
Note Pin voltage is measured at VCC = 5.0 V
Data Sheet P14765EJ2V0DS00
3
µPC3215TB
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Conditions
Ratings
Unit
Supply Voltage
VCC
TA = +25°C
6.0
V
Circuit Current
ICC
TA = +25°C
30
mA
Input Power
Pin
TA = +25°C
+10
dBm
270
mW
Note
TA = +85°C
Power Dissipation
PD
Operating Ambient Temperature
TA
–40 to +85
°C
Storage Temperature
Tstg
–55 to +150
°C
Note Mounted on 50 × 50 × 1.6-mm epoxy glass PWB, with copper patterning on both sides.
RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol
MIN.
TYP.
MAX.
Unit
Supply Voltage
VCC
4.5
5.0
5.5
V
Operating Ambient Temperature
TA
–40
+25
+85
°C
Input Power
Pin
–
–
0
dBm
Input Frequency
fin
0.1
–
2.9
GHz
ELECTRICAL CHARACTERISTICS (TA = +25°C, VCC = 5.0 V, ZS = ZL = 50 Ω)
Parameter
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
Circuit Current
ICC
No input signals
10.5
14.0
17.5
mA
Power Gain
GP
f = 1.5 GHz, Pin = –30 dBm
18.5
20.5
–
dB
Noise Figure
NF
f = 1.5 GHz
–
2.3
3.0
dB
3 dB down below from gain at
f = 0.1 GHz
2.5
2.9
–
GHz
Upper Limit Operating
Frequency
fu
Isolation
ISL
f = 1.5 GHz, Pin = –30 dBm
39
44
–
dB
Input Return Loss
RLin
f = 1.5 GHz, Pin = –30 dBm
10
15
–
dB
Output Return Loss
RLout
f = 1.5 GHz, Pin = –30 dBm
6.5
9.5
–
dB
1 dB Compression Point
P-1
–4
–1.5
–
dBm
STANDARD CHARACTERISTICS (TA = +25°C, VCC = 5.0 V, ZS = ZL = 50 Ω)
Parameter
4
Symbol
Test Conditions
Reference Values
Unit
Saturated Output Power
PO(sat)
Pin = 0 dBm
+3.5
dBm
Output Intercept Point
OIP3
f1 = 1.5 GHz, f2 = 1.501 GHz
+10
dBm
Gain Flatness
∆GP
f = 0.1 to 2.15 GHz
1.0
dB
Data Sheet P14765EJ2V0DS00
µPC3215TB
TYPICAL CHARACTERISTICS (Unless otherwise specified, TA = +25°°C)
CIRCUIT CURRENT vs.
OPERATING AMBIENT TEMPERATURE
CIRCUIT CURRENT vs. SUPPLY VOLTAGE
20
20
No input signal
VCC = 5 V
Circuit Current ICC (mA)
Circuit Current ICC (mA)
No input signal
15
10
5
TA = –40°C
TA = +25°C
TA = +85°C
0
0
1
2
3
4
Supply Voltage VCC (V)
5
15
10
5
0
–50
6
INSERTION POWER GAIN vs. FREQUENCY
INSERTION POWER GAIN vs. FREQUENCY
25
20
15
10
Pin = –30 dBm
VCC = 4.5 V
VCC = 5.0 V
VCC = 5.5 V
5
0.3
1.0
Frequency fin (GHz)
Insertion Power Gain GP (dB)
Insertion Power Gain GP (dB)
25
0
0.1
0
+75
+100
+25
+50
–25
Operating Ambient Temperature TA (°C)
20
15
10
5
0
0.1
3.0
NOISE FIGURE vs. FREQUENCY
4
VCC = 4.5 V
VCC = 5.0 V
VCC = 5.5 V
2
1
0.3
1.0
Frequency fin (GHz)
3.0
NOISE FIGURE vs. FREQUENCY
3
0
0.1
0.3
1.0
Frequency fin (GHz)
5
Noise Figure NF (dB)
Noise Figure NF (dB)
5
VCC = 5 V
Pin = –30 dBm
TA = –40°C
TA = +25°C
TA = +85°C
3.0
VCC = 5 V
TA = –40°C
TA = +25°C
4
TA = +85°C
3
2
1
0
0.1
Data Sheet P14765EJ2V0DS00
0.3
1.0
Frequency fin (GHz)
3.0
5
µPC3215TB
ISOLATION vs. FREQUENCY
ISOLATION vs. FREQUENCY
0
0
Isolation ISL (dB)
Isolation ISL (dB)
Pin = –30 dBm
VCC = 4.5 V
VCC = 5.0 V
–10
VCC = 5.5 V
–20
–30
VCC = 5 V
Pin = –30 dBm
TA = –40°C
–10
TA = +25°C
TA = +85°C
–20
–30
–40
–40
–50
0.1
–50
0.1
3.0
0.3
1.0
Frequency fin (GHz)
INPUT RETURN LOSS vs. FREQUENCY
Input Return Loss RLin (dB)
Input Return Loss RLin (dB)
0
–10
–20
–30
Pin = –30 dBm
VCC = 4.5 V
VCC = 5.0 V
VCC = 5.5 V
–50
0.1
–10
–20
–30
–40
VCC = 5 V
Pin = –30 dBm
TA = –40°C
TA = +25°C
TA = +85°C
–50
0.1
3.0
0.3
1.0
Frequency fin (GHz)
OUTPUT RETURN LOSS vs. FREQUENCY
3.0
0
Output Return Loss RLout (dB)
Output Return Loss RLout (dB)
0.3
1.0
Frequency fin (GHz)
OUTPUT RETURN LOSS vs. FREQUENCY
0
–10
–20
–30
–40 Pin = –30 dBm
VCC = 4.5 V
VCC = 5.0 V
VCC = 5.5 V
–50
0.1
0.3
Frequency fin
6
3.0
INPUT RETURN LOSS vs. FREQUENCY
0
–40
0.3
1.0
Frequency fin (GHz)
1.0
(GHz)
3.0
–10
–20
–30
–40
VCC = 5 V
Pin = –30 dBm
TA = –40°C
TA = +25°C
TA = +85°C
–50
0.1
Data Sheet P14765EJ2V0DS00
0.3
1.0
Frequency fin (GHz)
3.0
µPC3215TB
OUTPUT POWER vs. INPUT POWER
OUTPUT POWER vs. INPUT POWER
+10
0
–10
–20
–30
–40
fin = 1 GHz
VCC = 4.5 V
VCC = 5.0 V
VCC = 5.5 V
+10
–30
–20
–10
0
Input Power Pin (dBm)
Output Power Pout (dBm)
Output Power Pout (dBm)
+10
0
–10
–30
–40
OUTPUT POWER vs. INPUT POWER
OUTPUT POWER vs. INPUT POWER
+10
0
–10
–30
–40
fin = 1.5 GHz
VCC = 4.5 V
VCC = 5.0 V
VCC = 5.5 V
+10
–30
–20
–10
0
Input Power Pin (dBm)
Output Power Pout (dBm)
Output Power Pout (dBm)
+10
–20
VCC = 5 V
fin = 1 GHz
TA = –40°C
TA = +25°C
TA = +85°C
+10
–10
0
–30
–20
Input Power Pin (dBm)
–20
0
–10
–20
–30
–40
Data Sheet P14765EJ2V0DS00
VCC = 5 V
fin = 1.5 GHz
TA = –40°C
TA = +25°C
TA = +85°C
+10
–30
–20
–10
0
Input Power Pin (dBm)
7
µPC3215TB
OUTPUT POWER vs. INPUT POWER
OUTPUT POWER vs. INPUT POWER
+10
0
–10
–20
–30
–40
fin = 2.15 GHz
VCC = 4.5 V
VCC = 5.0 V
VCC = 5.5 V
+10
–30
–20
–10
0
Input Power Pin (dBm)
Output Power Pout (dBm)
Output Power Pout (dBm)
+10
0
–10
–30
–40
OUTPUT POWER vs. INPUT POWER
OUTPUT POWER vs. INPUT POWER
0
–10
–30
–40
8
+10
fin = 2.4 GHz
VCC = 4.5 V
VCC = 5.0 V
VCC = 5.5 V
+10
–30
–20
–10
0
Input Power Pin (dBm)
Output Power Pout (dBm)
Output Power Pout (dBm)
+10
–20
VCC = 5 V
fin = 2.15 GHz
TA = –40°C
TA = +25°C
TA = +85°C
+10
–30
–20
–10
0
Input Power Pin (dBm)
–20
0
–10
–20
–30
–40
Data Sheet P14765EJ2V0DS00
VCC = 5 V
fin = 2.4 GHz
TA = –40°C
TA = +25°C
TA = +85°C
+10
–30
–20
–10
0
Input Power Pin (dBm)
µPC3215TB
OUTPUT POWER OF EACH TONE vs.
INPUT POWER OF EACH TONE
+20
0
–20
–40
–60
VCC = 5 V
f1 = 1 000 MHz
f2 = 1 001 MHz
–80
–40 –35 –30 –25 –20 –15 –10 –5
0
Input Power of Each Tone Pin(each) (dBm)
Output Power of Each Tone PO(each) (dBm)
Output Power of Each Tone PO(each) (dBm)
OUTPUT POWER OF EACH TONE vs.
INPUT POWER OF EACH TONE
+20
0
–20
–40
–60
–80
–40 –35 –30 –25 –20 –15 –10 –5
0
Input Power of Each Tone Pin(each) (dBm)
OUTPUT POWER OF EACH TONE vs.
INPUT POWER OF EACH TONE
+20
0
–20
–40
VCC = 5 V
f1 = 2 150 MHz
f2 = 2 151 MHz
–80
–40 –35 –30 –25 –20 –15 –10 –5
0
Input Power of Each Tone Pin(each) (dBm)
Remark
Output Power of Each Tone PO(each) (dBm)
Output Power of Each Tone PO(each) (dBm)
OUTPUT POWER OF EACH TONE vs.
INPUT POWER OF EACH TONE
–60
VCC = 5 V
f1 = 1 500 MHz
f2 = 1 501 MHz
+20
0
–20
–40
–60
VCC = 5 V
f1 = 2 400 MHz
f2 = 2 401 MHz
–80
–40 –35 –30 –25 –20 –15 –10 –5
0
Input Power of Each Tone Pin(each) (dBm)
The graphs indicate nominal characteristics.
Data Sheet P14765EJ2V0DS00
9
µPC3215TB
S-PARAMETERS (TA = +25°°C, VCC = 5 V)
S11-FREQUENCY
START
STOP
0.100000000 GHz
3.100000000 GHz
START
STOP
0.100000000 GHz
3.100000000 GHz
S22-FREQUENCY
10
Data Sheet P14765EJ2V0DS00
µPC3215TB
TYPICAL S-PARAMETER VALUES (TA = +25°°C)
VCC = 5.0 V, ICC = 16 mA
FREQUENCY
MHz
S21
S11
S12
S22
K
MAG.
ANG.
MAG.
ANG.
MAG.
ANG.
MAG.
ANG.
100.0000
0.207
174.1
10.788
−4.6
0.013
6.3
0.285
−3.3
3.38
200.0000
0.190
173.1
10.714
−9.8
0.013
−0.5
0.282
−3.7
3.39
300.0000
0.186
174.3
10.565
−14.3
0.013
2.7
0.283
−4.6
3.37
400.0000
0.192
173.8
10.359
−18.3
0.014
4.7
0.285
−6.2
3.92
500.0000
0.200
174.5
10.225
−21.7
0.013
5.3
0.286
−7.6
3.96
600.0000
0.201
173.0
10.116
−24.9
0.013
2.1
0.286
−8.8
3.69
700.0000
0.204
173.0
10.116
−28.0
0.011
1.6
0.288
−10.4
3.91
800.0000
0.206
172.4
10.122
−31.1
0.011
12.9
0.289
−11.7
4.17
900.0000
0.210
172.7
10.186
−34.5
0.011
5.1
0.290
−13.5
3.99
1000.0000
0.212
171.4
10.182
−37.7
0.009
4.1
0.295
−14.9
4.28
1100.0000
0.218
169.4
10.208
−41.6
0.011
4.9
0.299
−16.8
4.19
1200.0000
0.217
168.4
10.296
−45.6
0.009
11.0
0.300
−18.0
4.65
1300.0000
0.221
165.9
10.248
−49.7
0.006
20.5
0.299
−20.2
5.78
1400.0000
0.228
164.7
10.438
−53.9
0.008
1.6
0.307
−23.1
6.97
1500.0000
0.233
162.3
10.369
−58.0
0.006
25.7
0.310
−24.8
6.80
1600.0000
0.238
159.5
10.554
−62.7
0.005
31.6
0.316
−27.5
11.54
1700.0000
0.244
157.2
10.492
−67.2
0.004
48.5
0.317
−30.5
11.75
1800.0000
0.246
153.9
10.483
−72.2
0.003
87.2
0.318
−33.3
13.52
1900.0000
0.248
150.6
10.408
−76.9
0.004
93.4
0.323
−36.9
8.46
2000.0000
0.246
147.4
10.405
−82.2
0.007
114.5
0.323
−40.6
7.46
2100.0000
0.241
144.9
10.267
−87.2
0.008
115.4
0.319
−44.9
6.20
2200.0000
0.236
142.2
10.039
−92.7
0.011
124.0
0.312
−48.9
4.50
2300.0000
0.229
142.2
9.896
−97.7
0.012
121.6
0.306
−52.6
4.12
2400.0000
0.219
143.5
9.684
−102.4
0.014
124.9
0.292
−56.3
3.40
2500.0000
0.215
145.7
9.348
−107.5
0.015
117.8
0.279
−59.3
3.42
2600.0000
0.213
149.3
9.068
−112.0
0.018
117.3
0.270
−61.7
3.02
2700.0000
0.221
150.1
8.673
−116.6
0.017
114.4
0.256
−63.7
3.17
2800.0000
0.234
151.3
8.437
−121.1
0.020
114.0
0.248
−65.1
2.85
2900.0000
0.253
152.1
8.080
−124.9
0.021
111.6
0.237
−67.3
2.98
3000.0000
0.264
150.7
7.791
−129.4
0.020
112.5
0.232
−68.0
2.90
3100.0000
0.283
148.7
7.458
−132.7
0.022
113.7
0.229
−70.2
3.02
Data Sheet P14765EJ2V0DS00
11
µPC3215TB
TEST CIRCUIT
VCC
1 000 pF
C3
6
50 Ω
C1
1
IN
1 000 pF
50 Ω
C2
4
OUT
1 000 pF
2, 3, 5
EXAMPLE OF APPLICATION CIRCUIT
VCC
1 000 pF
1 000 pF
6
6
50 Ω
1
IN
4
1 000 pF
1
1 000 pF
50 Ω
4
1 000 pF
OUT
1 000 pF
50 to 200 Ω
2, 3, 5
2, 3, 5
Please connect these
component to stabilize
operation.
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
Capacitors for VCC, input and output pins
1 000 pF capacitors are recommendable as bypass capacitor for VCC pin and coupling capacitors for input/output
pins.
Bypass capacitor for VCC pin is intended to minimize VCC pin’s ground impedance. Therefore, stable bias can be
supplied against VCC fluctuation.
Coupling capacitors for input/output pins are intended to minimize RF serial impedance and cut DC.
To get flat gain from 100 MHz up, 1 000 pF capacitors are assembled on the test circuit. [Actually, 1 000 pF
capacitors give flat gain at least 10 MHz. In the case of under 10 MHz operation, increase the value of coupling
capacitor such as 2 200 pF. Because the coupling capacitors are determined by the equation of C = 1/(2 π fZs).]
12
Data Sheet P14765EJ2V0DS00
µPC3215TB
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
AMP-2
Top View
3
2
1
IN
OUT
C
3H
C
C
6
5
4
Mounting direction
VCC
C
COMPONENT LIST
Notes
1. 30 × 30 × 0.4 mm double sided copper clad polyimide board.
Value
C
1 000 pF
2. Back side: GND pattern
3. Solder plated on pattern
4.
: Through holes
Data Sheet P14765EJ2V0DS00
13
µPC3215TB
PACKAGE DIMENSIONS
6-PIN SUPER MINIMOLD (UNIT: mm)
2.1±0.1
0.2+0.1
–0.05
0.65
0.65
1.3
2.0±0.2
1.25±0.1
14
Data Sheet P14765EJ2V0DS00
0.15 +0.1
–0 .05
0 to 0.1
0.7
0.9±0.1
0.1 MIN.
µPC3215TB
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
(3) Keep the track length of the ground pins as short as possible.
(4) A low pass filter must be attached to VCC line.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions.
For soldering methods and
conditions other than those recommended below, contact your NEC sales representative.
Soldering Method
Soldering Conditions
Recommended Condition Symbol
Infrared Reflow
Package peak temperature: 235°C or below
Time: 30 seconds or less (at 210°C)
Note
Count: 3, Exposure limit: None
IR35-00-3
VPS
Package peak temperature: 215°C or below
Time: 40 seconds or less (at 200°C)
Note
Count: 3, Exposure limit: None
VP15-00-3
Wave Soldering
Soldering bath temperature: 260°C or below
Time: 10 seconds or less
Note
Count: 1, Exposure limit: None
WS60-00-1
Partial Heating
Pin temperature: 300°C
Time: 3 seconds or less (per side of device)
Note
Exposure limit: None
–
Note After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period.
Caution
Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
Data Sheet P14765EJ2V0DS00
15
µPC3215TB
• The information in this document is current as of August, 2000. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or
data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all
products and/or types are available in every country. Please check with an NEC sales representative
for availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
• NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
• While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
• NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
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