ETC UPD16780N-XXX

DATA SHEET
MOS INTEGRATED CIRCUIT
µ PD16780
288/300 OUTPUT TFT-LCD SOURCE DRIVER
DESCRIPTION
The µ PD16780 is a source driver for TFT-LCDs. The µ PD16780 corresponds only to LCD of Stripe array color
filter. The µ PD16780 is constitute a shift register which generates the sampling time, and a sample-and-hold circuit
which samples the analog voltage. There are two sample-and-hold circuits which perform sampling holding
alternately.
The application with high free degree is possible from driver operation system to LCD-TV because a high picture
quality is realized.
FEATURES
• 5.0 V Drive (Dynamic range 4.6 VP-P, VDD2 = 5.0 V)
• 288/300 Output channel
• fMAX. = 20 MHz (VDD1 = 3.0 V)
• Corresponds only to LCD of Stripe array color filter
• Two on-chip sample-and-hold circuits
• Small output deviation between pins (deviation between chip pins: ±20 mV MAX.)
• Switch between right and left shift using the R,/L pin
ORDERING INFORMATION
Part Number
Package
µ PD16780N-xxx
TCP (TAB package)
Remark The TCP’s external shape is custom-order item. Users are requested to consult wiht a NEC sales
representative.
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No.
S12608EJ1V0DS00 (1st edition)
Date Published May 1999 NS CP(K)
Printed in Japan
The mark • shows major revised points.
©
1998
µ PD16780
1. BLOCK DIAGRAM
STHR
R,/L
CLK
Osel
STHL
VDD1 (3.3/5.0 V)
VSS1
100-bit Shift Register
C1 C2
C99 C100
Level Shifter
C1
C2
C3
CX
VDD2 (5.0 V)
VSS2
Sample And Hold
VSS3
S1 S 2
Remark
S299 S300
/xxx indicates active low signal.
2. SAMPLE-AND HOLD CIRCUIT AND OUTPUT CIRCUIT
SHPn
CX
S&H1
SW
–
+
Video Line (Cn)
SW
CH1
Sn
VSS3
SW
–
+
CH1
VSS3
S&H2
2
Data Sheet S12608EJ1V0DS00
SW
µ PD16780
3. PIN CONFIGURATION (µ PD16780N-xxx)
S300
S299
S298
STHL
C1
C2
C3
VDD2
VDD1
Copper foil
CLK
surface
R,/L
CX
TEST
VSS1
Osel
VSS3
VSS2
S3
STHR
S2
S1
Remark This figure does not specify the TCP package.
Data Sheet S12608EJ1V0DS00
3
µ PD16780
4. PIN FUNCTIONS
Pin Symbol
Pin Name
Description
C1,C2,C3
Video signal input
These pins are input video signals R,G, and B.
S1-S300
Video signal input
These pins are output video signals, which have been sampled and hold.
C1: S3n-2 (n = 1, 2, ··········96/100)
C2: S3n-1
C3: S3n
STHR,
Cascade I/O
STHL
These pins are inputs/outputs for the start pulse for sample and hold timing.
High level of STHR/STHL is read at rising edge of CLK and start sampling video signal.
STHR serves as the input pin and STHL serves as output pin for the right shift. For left
shift, STHL serves as the input pins and STHR serves as the output pin.
•
R,/L
Shift direction switching
The shift directions of the shift registers are as follows.
input
R,/L = H: STHR input, S1 → S300, STHL output.
R,/L = L: STHL input, S300 → S1, STHR output.
Osel
Selection of Number of
Selects number of outputs.
outputs switching input
Osel = L: 288 output mode
Osel = H: 300 output mode
Output pins S145 through S156 are invalid in 288 output mode.
The signal which is with S157 to S168 (R,/L = H) or S133 to S144 (R,/L = L) is output
identically.
CLK
Shift clock input
The start pulse is read at rising edge of CLK. The sampling pulse SHPn is generated
at rising edge of CLK.
µ PD16780 corresponds only to LCD of Stripe array color filter and only simultaneous
sampling. For details, refer to 6. TIMING CHART.
CX
Hold capacitance control
input
Two Sample & hold circuits are switched.
CX = H S&H1: Sampling, S&H2: Output
CX = L S&H1: Output, S&H2: Sampling
4
TEST
Test pin
Fix this pin to the L level.
VDD1
Logic power supply
3.3 V ± 0.3 V, or 5.0 V ± 0.5 V
VDD2
Driver power supply
5.0 V ± 0.5 V
VSS1
Logic ground
Grounding
VSS2
Driver ground
Grounding
VSS3
Sample & hold ground
It is ground of Sample & hold capacitance. Supply this terminal with the stable GND.
Data Sheet S12608EJ1V0DS00
µ PD16780
Cautions 1. To prevent latch-up-breakdown, the power should be turned on in order VDD1, Logic input VDD2,
video signal input. It should be turned off in the opposite order. This relationship should be
followed during transition periods as well.
2. The sampling of the video signal of this IC is only the simultaneous 3 output sampling of C 1, C2,
C3. Incidentally, it is designing abound of the input of the video signal in 10 MHz MAX.
If a video signal with a higher frequency is input, the data may not be correctly displayed.
3. Insert a capacitor of 0.1 µ F between VDD1 and VSS1, and VDD2 and VSS2. Unless the power supply
is reinforced, the supply voltage may fluctuate, making the sampling voltage abnormal.
4. If noise is superimposed on the start pulse pin, the data may not be displayed. For this reason,
be sure to input CX signal during the vertical blanking period.
5. If the start pulse width is extended by half the clock or longer, the sampling start timing SHP1
does not change from normal timing; therefore, the sampling operation is performed normally.
Data Sheet S12608EJ1V0DS00
5
µ PD16780
5. FUNCTION DESCRIPTION
5.1 Switching of Sample & Hold Circuits
Two sample-and-hold circuits are switched.
CX
Output
Sample & hold operation
L
Sample & Hold Circuit 1 (S&H1)
Sample & Hold Circuit 2 (S&H2)
H
Sample & Hold Circuit 2 (S&H2)
Sample & Hold Circuit 1 (S&H1)
5.2 Sample & Hold and Output
Relation between video signals C1, C2 and C3 and output pins and two sample & hold circuits.
5.2.1 300 output
CX
L
H
Remark
S1 (S300)
S2 (S299)
S3 (S298)
S4 (S297)
···
S299 (S2)
S300 (S1)
Sampling
C1-2 (C3-2)
C2-2 (C2-2)
C3-2 (C1-2)
C1-2 (C3-2)
···
C2-2 (C2-2)
C3-2 (C1-2)
Output
C1-1 (C3-1)
C2-1 (C2-1)
C3-1 (C1-1)
C1-1 (C3-1)
···
C2-1 (C2-1)
C3-1 (C1-1)
Sampling
C1-1 (C3-1)
C2-1 (C2-1)
C3-1 (C1-1)
C1-1 (C3-1)
···
C2-1 (C2-1)
C3-1 (C1-1)
Output
C1-2 (C3-2)
C2-2 (C2-2)
C3-2 (C1-2)
C1-2 (C3-2)
···
C2-2 (C2-2)
C3-2 (C1-2)
Cm-n = m: Video input, n: Sample & Hold
5.2.2 288 output
CX
L
H
Remark
6
S1 (S288)
S2 (S287)
S3 (S286)
S4 (S285)
···
S287 (S2)
S288 (S1)
Sampling
C1-2 (C3-2)
C2-2 (C2-2)
C3-2 (C1-2)
C1-2 (C3-2)
···
C2-2 (C2-2)
C3-2 (C1-2)
Output
C1-1 (C3-1)
C2-1 (C2-1)
C3-1 (C1-1)
C1-1 (C3-1)
···
C2-1 (C2-1)
C3-1 (C1-1)
Sampling
C1-1 (C3-1)
C2-1 (C2-1)
C3-1 (C1-1)
C1-1 (C3-1)
···
C2-1 (C2-1)
C3-1 (C1-1)
Output
C1-2 (C3-2)
C2-2 (C2-2)
C3-2 (C1-2)
C1-2 (C3-2)
···
C2-2 (C2-2)
C3-2 (C1-2)
Cm-n = m: Video input, n: Sample & Hold
Data Sheet S12608EJ1V0DS00
µ PD16780
6. TIMING CHART (Right shift, 300 output)
1
2
3
99
100
(1)
(2)
(3)
CLK
STHR
(STHL)
SHP1-SHP3
(SHP300-SHP298)
SHP4-SHP6
(SHP297-SHP295)
SHP7-SHP9
(SHP294-SHP292)
S1-S3
(S300-S298)
S4-S6
(S297-S295)
S7-S9
(S294-S292)
SHP295-SHP297
(SHP6-SHP4)
S295-S297
(S6-S4)
SHP298-SHP300
(SHP3-SHP1)
S298-S300
(S3-S1)
STHR
(STHL)
SHP1-SHP3
(SHP300-SHP298)
S1-S3
(S300-S298)
SHP4-SHP6
(SHP297-SHP295)
S4-S6
(S297-S295)
Data Sheet S12608EJ1V0DS00
7
µ PD16780
7. ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings (TA = +25 °C, VSS1 =VSS2 = 0 V)
Parameter
Symbol
Rating
Unit
Logic Part Supply Voltage
VDD1
−0.3 to +7.0
V
Driver Part Supply Voltage
VDD2
−0.3 to +7.0
V
Input Voltage
VI
−0.3 to VDD1/2 + 0.3
V
Output Voltage
VO
−0.3 to VDD1/2 + 0.3
V
Operating Ambient Temperature
TA
−30 to +85
°C
Storage Temperature
Tstg
−55 to +125
°C
Caution
If the absolute maximum rating of even one of the above parameters is exceeded even
momentarily, the quality of the product may be degraded. Absolute maximum ratings, therefore,
specify the values exceeding which the product may be physically damaged. Be sure to use the
product within the range of the absolute maximum ratings.
• Recommended Operating Range (TA = −30 to +85 °C, VDD2 ≥ VDD1, VSS1 = VSS2 = 0 V)
Parameter
Symbol
Conditions
MIN.
TYP.
MAX.
Unit
5.5
V
5.5
V
Logic Part Supply Voltage
VDD1
3.0
Driver Part Supply Voltage
VDD2
4.5
Video Input Voltage
VVI
VSS2 + 0.2
VDD2 − 0.2
V
Driver Part Output Voltage
VO2
VSS2 + 0.2
VDD2 − 0.2
V
Maximum Clock Frequency
fMAX.
Output Load Capacitance
8
CL
CLK
5.0
20
1 output
Data Sheet S12608EJ1V0DS00
MHz
50
pF
µ PD16780
• Electrical Characteristics (TA = –30 to +85 °C, VDD1 = 3.0 V to 5.5 V, VDD2 = 5.0 V ± 0.5 V, VDD2 ≥ VDD1,
VSS1 = VSS2 = 0 V)
Parameter
Symbol
Low-Level Driver Part Output Voltage
VVOL
High-Level Driver Part Output Voltage
VVOH
High-Level Input Voltage
VIH
Low-Level Input Voltage
VIL
Input Leak Current
IIL
Conditions
MIN.
TYP.
S1 to S300
MAX.
Unit
VSS2 + 0.2
V
VDD2 – 0.2
CLK, STHR (L), R,/L, Osel, CX
All Inputs
High-Level Output Voltage
VLOH
STHR (STHL), IOH = –1.0 mA
Low-Level Output Voltage
VLOH
STHR (STHL), IOL = +1.0 mA
Reference Voltage
VREF1
VDD2 = 5.0 V, VVI = 0.5 V,
V
0.7 VDD1
VDD1
V
VSS1
0.3 VDD1
V
–1.0
+1.0
µA
0.85 VDD1
V
0.15 VDD1
V
0.5
V
2.5
V
4.5
V
TA = 25°C
VREF2
VDD2 = 5.0 V, VVI = 2.5 V,
TA = 25°C
VREF3
VDD2 = 5.0 V, VVI = 4.5 V,
TA = 25°C
Output Voltage Deviation
∆VVO1
±20
mV
±20
mV
±20
mV
1.0
3.5
mA
5.6
8.5
mA
VDD2 = 5.0 V, VVI = 0.5 V,
TA = 25°C
∆VVO2
VDD2 = 5.0 V, VVI = 2.5 V,
TA = 25°C
∆VVO3
VDD2 = 5.0 V, VVI = 4.5 V,
TA = 25°C
Logic Dynamic Current Consumption
Driver Dynamic Current Consumption
IDD1
IDD2
Note
VDD1 = 5.0 V with no load
Note
VDD2 = 5.0 V with no load
Note fCLK = 15 MHz, fCX = 17 kHz.
Data Sheet S12608EJ1V0DS00
9
µ PD16780
• Switching Characteristics (TA = –30 to +85 °C, VDD1 = 3.0 V to 5.5 V, VDD2 = 5.0 V ± 0.5 V, VDD2 ≥ VDD1,
VSS1 = VSS2 = 0 V)
Parameter
Symbol
Start Pulse Delay Time
Driver Output Delay Time
Condition
MIN.
TYP.
Unit
tPHL1
CL = 20 pF
7
43
ns
tPLH1
CLK → STHL(STHR)
7
43
ns
tPLH2
VDD2 = 5.0 V
8
µs
tPLH3
RL = 2 kΩ
16
µs
tPHL2
CL = 25 pF x 2
8
µs
16
µs
tPHL3
Input Capacitance
MAX.
CI1
STHR(STHL), TA=25 °C
10
20
pF
CI2
C1,C2,C3, TA=25 °C
40
60
pF
CI3
STHR(STHL),C1,C2,C3
7
15
pF
excluded input, TA=25 °C
• Timing Requirement (TA = –30 to +85 °C, VDD1 = 3.0 V to 5.5 V, VDD2= 5.0 V ± 0.5 V, VDD2 ≥ VDD1, VSS1 = VSS2 = 0 V)
Parameter
Clock Pulse Width
Symbol
Condition
MIN.
TYP.
MAX.
Unit
PWCLK
50
ns
Clock Pulse High Period
PWCLK(H)
15
ns
Clock Pulse Low Period
PWCLK(L)
15
ns
Start Pulse Setup Time
tsetup
7
ns
Start Pulse Setup Time
thold
7
ns
tSTH-CX
50
ns
tCXsetup
1.0
µs
tCXhold
50
ns
• Start Pulse – CX Time
CX Setup Time
CX Hold Time
Note
CLK Stop Period
tCLKstop
Refer to 8. SWITHING CHARACTERISTICS WAVEFORM.
Note This shows the period where it is possible for CLK stop.
10
Data Sheet S12608EJ1V0DS00
2
3
100
101
102
399
400
401





1
0
1
2
VDD1
CLK
VSS1
tsetup
thold
VDD1
STHR
(1st Dr.)
C1 to C3
VSS1
INVALID
S1 to S3
S4 to S6
S7 to
S9
S295 to
S297
S298 to
S300
tPLH1
S301 to
S303
tPHL1
VDD1
S1195 to
S1197
S1198 to
S1200
INVALID
S1 to S3
VSS1
tSTH-CX
Data Sheet S12608EJ1V0DS00
VDD1
STHL
(1st Dr.)
VSS1
tPLH1
tPHL1
VDD1
STHL
(4th Dr.)
VSS1
tCXhold
tCXsetup
VDD1
CX
VSS1
tPLH3
• 8. SWITCHING CHARACTERISTICS WAVEFORM (R,/L=H)
0
tCLKstop : It is possible for the clock among this to stop.
PWCLK(L)
Unless otherwise specified, the input level is defined to be VIH = 0.7 VDD1, VIL = 0.3 VDD1.
PWCLK
PWCLK(H)
tPLH2
Target Voltage ± 0.1 VDD1
Target Voltage ± 20 mV
VOUT
tPHL3
11
µ PD16780
tPHL2
µ PD16780
9. RECOMMENDED MOUNTING CONDITIONS
The following conditions must be met for mounting conditions of the µ PD16780.
For more details, refer to the Semiconductor Device Mounting Technology Manual(C10535E).
Please consult with our sales offices in case other mounting process is used, or in case the mounting is done under
different conditions.
µ PD16780N-xxx : TCP(TAB Package)
Mounting Condition
Thermocompression
Mounting Method
Condition
Heating tool 300 to 350 °C, heating for 2 to 3 sec ; pressure 100g(per
Soldering
solder)
ACF
Temporary bonding 70 to 100 °C ; pressure 3 to 8 kg/cm2; time 3 to 5
(Adhesive Conductive
sec. Real bonding 165 to 180 °C pressure 25 to 45 kg/cm2 time 30 to
Film)
40secs(When using the anisotropy conductive film SUMIZAC1003 of
Sumitomo Bakelite,Ltd).
Caution
To find out the detailed conditions for mounting the ACF part, please contact the ACF
manufacturing company. Be sure to avoid using two or more mounting methods at a time.
12
Data Sheet S12608EJ1V0DS00
µ PD16780
[MEMO]
Data Sheet S12608EJ1V0DS00
13
µ PD16780
[MEMO]
14
Data Sheet S12608EJ1V0DS00
µ PD16780
NOTES FOR CMOS DEVICES
1
PRECAUTION AGAINST ESD FOR SEMICONDUCTORS
Note:
Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and
ultimately degrade the device operation. Steps must be taken to stop generation of static electricity
as much as possible, and quickly dissipate it once, when it has occurred. Environmental control
must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using
insulators that easily build static electricity. Semiconductor devices must be stored and transported
in an anti-static container, static shielding bag or conductive material. All test and measurement
tools including work bench and floor should be grounded. The operator should be grounded using
wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need
to be taken for PW boards with semiconductor devices on it.
2
HANDLING OF UNUSED INPUT PINS FOR CMOS
Note:
No connection for CMOS device inputs can be cause of malfunction. If no connection is provided
to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence
causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels
of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused
pin should be connected to V DD or GND with a resistor, if it is considered to have a possibility of
being an output pin. All handling related to the unused pins must be judged device by device and
related specifications governing the devices.
3
STATUS BEFORE INITIALIZATION OF MOS DEVICES
Note:
Power-on does not necessarily define initial status of MOS device. Production process of MOS
does not define the initial operation status of the device. Immediately after the power source is
turned ON, the devices with reset function have not yet been initialized. Hence, power-on does
not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the
reset signal is received. Reset operation must be executed immediately after power-on for devices
having reset function.
Data Sheet S12608EJ1V0DS00
15
µPD16780
Reference Documents
NEC Semiconductor Device Reliability/Quality Control System(C10983E)
Quality Grades to NEC’s Semiconductor Devices(C11531E)
• The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
• No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
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rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
• Descriptions of circuits, software, and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software, and information in the design of the customer's equipment shall be done under the full responsibility
of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third
parties arising from the use of these circuits, software, and information.
• While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
• NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
M7 98. 8