ETC UPD16772B

DATA SHEET
MOS INTEGRATED CIRCUIT
µ PD16772B
480-OUTPUT TFT-LCD SOURCE DRIVER
(COMPATIBLE WITH 64-GRAY SCALES)
DESCRIPTION
The µ PD16772B is a source driver for TFT-LCDs capable of dealing with displays with 64-gray scales. Data input
is based on digital input configured as 6 bits by 6 dots (2 pixels), which can realize a full-color display of 260,000
colors by output of 64 values γ -corrected by an internal D/A converter and 5-by-2 external power modules. Because
the output dynamic range is as large as VSS2 + 0.1 V to VDD2 – 0.1 V, level inversion operation of the LCD’s common
electrode is rendered unnecessary. Also, to be able to deal with dot-line inversion, n-line inversion and column line
inversion when mounted on a single side, this source driver is equipped with a built-in 6-bit D/A converter circuit
whose odd output pins and even output pins respectively output gray scale voltages of differing polarity. Assuring a
clock frequency of 45 MHz when driving at 2.3 V, this driver is applicable to UXGA-standard TFT-LCD panels.
FEATURES
• CMOS level input (2.3 to 3.6 V)
• 480 outputs
• Input of 6 bits (gradation data) by 6 dots
• Capable of outputting 64 values by means of 5-by-2 external power modules (10 units) and a D/A converter (R-DAC)
• Logic power supply voltage (VDD1): 2.3 to 3.6 V
• Driver power supply voltage (VDD2): 8.5 V ± 0.5 V
• Output dynamic range: VSS2 + 0.1 V to VDD2 – 0.1 V
• High-speed data transfer: fCLK = 45 MHz (internal data transfer speed when operating at VDD1 = 2.3 V)
• Apply for dot-line inversion, n-line inversion and column line inversion
• Output voltage polarity inversion function (POL)
• Display data inversion function (POL21, POL22)
• Current consumption reduction function (LPC, Bcont)
ORDERING INFORMATION
Part Number
Package
µ PD16772BN-xxx
TCP (TAB package)
Remark
The TCP’s external shape is customized. To order the required shape, so please contact one of our
sales representatives.
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. S15996EJ1V0DS00 (1st edition)
Date Published July 2002 NS CP (K)
Printed in Japan
The mark ! shows major revised points.
©
2002
µPD16772B
★ 1. BLOCK DIAGRAM
STHR
R,/L
CLK
STB
STHL
VDD1
VSS1
80-bit bidirectional shift register
C1
C2
C79
D00 to D05
D10 to D15
D20 to D25
D30 to D35
D40 to D45
D50 to D55
POL21,
POL22
C80
Data register
Latch
POL
VDD2
Level shifter
VSS2
V0 to V9
D/A converter
Voltage follower output
LPC
Bcont
S1
S2
S3
S480
Remark /xxx indicates active low signal.
★ 2. RELATIONSHIP BETWEEN OUTPUT CIRCUIT AND D/A CONVERTER
S1
V5
S479
5
V0
V4
S2
Multiplexer
6-bit D/A converter
5
V9
POL
2
Data Sheet S15996EJ1V0DS
S480
µPD16772B
3. PIN CONFIGURATION (µPD16772B) (Copper Foil Surface, Face-up)
STHL
D55
D54
D53
D52
D51
D50
D45
D44
D43
D42
D41
D40
D35
D34
D33
D32
D31
D30
VDD1
R,/L
V9
V8
V7
V6
V5
VDD2
VSS2
Bcont
V4
V3
V2
V1
V0
VSS1
LPC
CLK
STB
POL
POL21
POL22
D25
D24
D23
D22
D21
D20
D15
D14
D13
D12
D11
D10
D05
D04
D03
D02
D01
D00
STHR
Remark
S480
S479
S478
S477
Copper Foil
Surface
S4
S3
S2
S1
This figure does not specify the TCP package.
Data Sheet S15996EJ1V0DS
3
µPD16772B
★ 4. PIN FUNCTIONS
(1/2)
Pin Symbol
Pin Name
S1 to S480
Driver
D00 to D05
Display data
I/O
Description
Output The D/A converted 64-gray-scale analog voltage is output.
Input
The display data is input with a width of 36 bits, viz., the gray scale data (6 bits) by 6
D10 to D15
dots (2 pixels).
D20 to D25
DX0: LSB, DX5: MSB
D30 to D35
D40 to D45
D50 to D55
R,/L
Shift direction control
Input
These refer to the start pulse I/O pins when driver ICs are connected in cascade.
The shift directions of the shift registers are as follows.
R,/L = H: STHR input, S1 → S480, STHL output
R,/L = L: STHL input, S480 → S1, STHR output
STHR
Right shift start pulse
I/O
These refer to the start pulse I/O pins when driver ICs are connected in cascade.
Fetching of display data starts when H is read at the rising edge of CLK.
R,/L = H (right shift): STHR input, STHL output
STHL
Left shift start pulse
I/O
R,/L = L (left shift): STHL input, STHR output
A high level should be input as the pulse of one cycle of the clock signal.
If the start pulse input is more than 2 CLK, the fist 1 CLK of the high-level input is
valid.
CLK
Shift clock
Input
Refers to the shift register’s shift clock input. The display data is incorporated into
the data register at the rising edge. At the rising edge of the 80th clock after the start
pulse input, the start pulse output reaches the high level, thus becoming the start
pulse of the next-level driver. If 82 clock pulses are input after input of the start
pulse, input of display data is halted automatically. The contents of the shift register
are cleared at the STB’s rising edge.
STB
Latch
Input
The contents of the data register are transferred to the latch circuit at the rising
edge. And, at the falling edge, the gray scale voltage is supplied to the driver. It is
necessary to ensure input of one pulse per horizontal period.
POL
Polarity
Input
POL = L: The S2n–1 output uses V0 to V4 as the reference supply. The S2n output
uses V5 to V9 as the reference supply.
POL = H: The S2n–1 output uses V5 to V9 as the reference supply. The S2n output
uses V0 to V4 as the reference supply.
S2n–1 indicates the odd output: and S2n indicates the even output. Input of the POL
signal is allowed the setup time(tPOL-STB) with respect to STB’s rising edge.
POL21,
Data inversion
Input
POL22
Data inversion can invert when display data is loaded.
POL21, POL22 = H: Data inversion loads display data after inverting it.
POL21, POL22 = L: Data inversion does not invert input data.
POL21: D00 to D05, D10 to D15, D20 to D25
POL22: D30 to D35, D40 to D45, D50 to D55
LPC
Low power control
Input
The current consumption of VDD2 is lowered by controlling the constant current
source of the output amplifier. This pin is pulled up to the VDD1 power supply inside
the IC. For details, see 9. CURRENT CONSUMPTION REDUCTION FUNCTION.
Bcont
Bias control
Input
This pin can be used to finely control the bias current inside the output amplifier.
When this fine-control function is not required, leave this pin open. For details, see
9. CURRENT CONSUMPTION REDUCTION FUNCTION.
4
Data Sheet S15996EJ1V0DS
µPD16772B
(2/2)
Pin Symbol
V0 to V9
Pin Name
γ -corrected power
I/O
−
supplies
Description
Input the γ -corrected power supplies from outside by using operational amplifier.
Make sure to maintain the following relationships. During the gray scale voltage
output, be sure to keep the gray scale level power supply at a constant level.
VDD2 − 0.1 V ≥ V0 > V1 > V2 > V3 > V4 ≥ 0.5 VDD2
0.5 VDD2 ≥ V5 > V6 > V7 > V8 > V9 ≥ VSS2 + 0.1 V
VDD1
Logic power supply
−
2.3 to 3.6 V
VDD2
Driver power supply
−
8.5 V ± 0.5 V
VSS1
Logic ground
−
Grounding
VSS2
Driver ground
−
Grounding
Cautions 1. The power start sequence must be VDD1, logic input, and VDD2 & V0 to V9 in that order.
Reverse this sequence to shut down (Simultaneous power application to VDD2 and V0 to V9 is
possible.).
2. To stabilize the supply voltage, please be sure to insert a 0.1 µF bypass capacitor between
VDD1-VSS1 and VDD2-VSS2. Furthermore, for increased precision of the D/A converter, insertion
of a bypass capacitor of about 0.01 µF is also advised between the γ -corrected power supply
terminals (V0, V1, V2,....., V9) and VSS2.
Data Sheet S15996EJ1V0DS
5
µPD16772B
5. RELATIONSHIP BETWEEN INPUT DATA AND OUTPUT VOLTAGE VALUE
The µ PD16772B incorporates a 6-bit D/A converter whose odd output pins and even output pins output respectively
gray scale voltages of differing polarity with respect to the LCD’s counter electrode (common electrode) voltage. The
D/A converter consists of ladder resistors and switches.
The ladder resistors (r0 to r62) are designed so that the ratio of LCD panel γ -compensated voltages to V0’ to V63’
and V0” to V63” is almost equivalent. For the 2 sets of five γ -compensated power supplies, V0 to V4 and V5 to V9,
respectively, input gray scale voltages of the same polarity with respect to the common voltage. When fine gray
scale voltage precision is not necessary, there is no need to connect a voltage follower circuit to the γ -compensated
power supplies V1 to V3 and V6 to V8.
Figure 5–1 shows the relationship between the driving voltages such as liquid-crystal driving voltages VDD2 and VSS2,
common electrode potential VCOM, and γ -corrected voltages V0 to V9 and the input data. Be sure to maintain the
voltage relationships as follows.
VDD2 − 0.1 V ≥ V0 > V1 > V2 > V3 > V4 ≥ 0.5 VDD2
0.5 VDD2 ≥ V5 > V6 > V7 > V8 > V9 ≥ VSS2 + 0.1 V
Figure 5–2 shows γ -corrected power supply voltage and ladder resistors ratio and Figure 5–3 shows the
relationship between the input data and the output voltage and the resistance values of the resistor strings.
Figure 5–1. Relationship between Input Data and γ -corrected Power Supplies
VDD2
0.1 V
V0
16
V1
16
V2
V3
16
15
V4
0.5 VDD2
Split interval
V5
15
V6
16
V7
16
V8
16
V9
0.1 V
VSS2
00
6
10
20
Input data (HEX)
Data Sheet S15996EJ1V0DS
30
3F
µPD16772B
Figure 5–2. γ -corrected Power Supply Voltage and Ladder Resistors Ratio
V0
V0 ’
V5
r0
V63’’
r62
V1 ’
V62’’
r61
r1
V61’’
V2’
r60
r2
V60’’
V3’
r59
r3
r49
r14
V15’
V49’’
r48
r15
V16’
V1
V48’’
V6
r47
r16
V17’
V47’’
r46
r17
r17
r46
V47’
V17’’
r16
r47
V48’
V3
V16’’
V8
r15
r48
V49’
V15’’
r14
r49
r2
r60
V2’’
V61’
r1
r61
V62’
V1’’
r62
V4
r0
V63’
V9
V0’’
rn
r0
r1
r2
r3
r4
r5
r6
r7
r8
r9
r10
r11
r12
r13
r14
r15
r16
r17
r18
r19
r20
r21
r22
r23
r24
r25
r26
r27
r28
r29
r30
r31
r32
r33
r34
r35
r36
r37
r38
r39
r40
r41
r42
r43
r44
r45
r46
r47
r48
r49
r50
r51
r52
r53
r54
r55
r56
r57
r58
r59
r60
r61
r62
Value
722
628
628
596
596
502
470
454
454
408
330
298
266
266
236
220
204
204
172
156
156
142
142
142
142
126
126
110
110
110
110
110
110
110
94
94
94
110
110
94
110
94
110
94
110
126
110
110
110
126
126
126
142
142
126
188
188
220
220
236
360
564
2022
Ratio (1)
7.68
6.68
6.68
6.34
6.34
5.34
5.00
4.83
4.83
4.34
3.51
3.17
2.83
2.83
2.51
2.34
2.17
2.17
1.83
1.66
1.66
1.51
1.51
1.51
1.51
1.34
1.34
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.00
1.00
1.00
1.17
1.17
1.00
1.17
1.00
1.17
1.00
1.17
1.34
1.17
1.17
1.17
1.34
1.34
1.34
1.51
1.51
1.34
2.00
2.00
2.34
2.34
2.51
3.83
6.00
21.51
Ratio (2)
0.0454
0.0395
0.0395
0.0375
0.0375
0.0315
0.0295
0.0285
0.0285
0.0256
0.0207
0.0187
0.0167
0.0167
0.0148
0.0138
0.0128
0.0128
0.0108
0.0098
0.0098
0.0089
0.0089
0.0089
0.0089
0.0079
0.0079
0.0069
0.0069
0.0069
0.0069
0.0069
0.0069
0.0069
0.0059
0.0059
0.0059
0.0069
0.0069
0.0059
0.0069
0.0059
0.0069
0.0059
0.0069
0.0079
0.0069
0.0069
0.0069
0.0079
0.0079
0.0079
0.0089
0.0089
0.0079
0.0118
0.0118
0.0138
0.0138
0.0148
0.0226
0.0354
0.1271
rtotal
15912
169.28
1.0000
Remark The resistance ratio1 is a relative ratio in the case of setting the minimum resistance value to 1.
The resistance ratio2 is a relative ratio in the case of setting the total resistance to 1.
Caution
There is no connection between V4 and V5 terminal in the chip.
Data Sheet S15996EJ1V0DS
7
µPD16772B
Figure 5−
−3. Relationship between Input Data and Output Voltage (POL21, POL22 = L)
★
(Output Voltage 1) VDD2 – 0.1 V ≥ V0 > V1 > V2 > V3 > V4 ≥ 0.5 VDD2
(Output Voltage 2) 0.5 VDD2 ≥ V5 > V6 > V7 > V8 > V9 ≥ VSS2 + 0.1 V
Input Data
00H
01H
02H
03H
04H
05H
06H
07H
08H
09H
0AH
0BH
0CH
0DH
0EH
0FH
10H
11H
12H
13H
14H
15H
16H
17H
18H
19H
1AH
1BH
1CH
1DH
1EH
1FH
20H
21H
22H
23H
24H
25H
26H
27H
28H
29H
2AH
2BH
2CH
2DH
2EH
2FH
30H
31H
32H
33H
34H
35H
36H
37H
38H
39H
3AH
3BH
3CH
3DH
3EH
3FH
8
V0'
V1'
V2'
V3'
V4'
V5'
V6'
V7'
V8'
V9'
V10'
V11'
V12'
V13'
V14'
V15'
V16'
V17'
V18'
V19'
V20'
V21'
V22'
V23'
V24'
V25'
V26'
V27'
V28'
V29'
V30'
V31'
V32'
V33'
V34'
V35'
V36'
V37'
V38'
V39'
V40'
V41'
V42'
V43'
V44'
V45'
V46'
V47'
V48'
V49'
V50'
V51'
V52'
V53'
V54'
V55'
V56'
V57'
V58'
V59'
V60'
V61'
V62'
V63'
Output Voltage1
V0
V1+(V0-V1)×
6352
V1+(V0-V1)×
5724
V1+(V0-V1)×
5096
V1+(V0-V1)×
4500
V1+(V0-V1)×
3904
V1+(V0-V1)×
3402
V1+(V0-V1)×
2932
V1+(V0-V1)×
2478
V1+(V0-V1)×
2024
V1+(V0-V1)×
1616
V1+(V0-V1)×
1286
V1+(V0-V1)×
988
V1+(V0-V1)×
722
V1+(V0-V1)×
456
V1+(V0-V1)×
220
V1
V2+(V1-V2)×
2058
V2+(V1-V2)×
1854
V2+(V1-V2)×
1682
V2+(V1-V2)×
1526
V2+(V1-V2)×
1370
V2+(V1-V2)×
1228
V2+(V1-V2)×
1086
V2+(V1-V2)×
944
V2+(V1-V2)×
802
V2+(V1-V2)×
676
V2+(V1-V2)×
550
V2+(V1-V2)×
440
V2+(V1-V2)×
330
V2+(V1-V2)×
220
V2+(V1-V2)×
110
V2
V3+(V2-V3)×
1570
V3+(V2-V3)×
1460
V3+(V2-V3)×
1366
V3+(V2-V3)×
1272
V3+(V2-V3)×
1178
V3+(V2-V3)×
1068
V3+(V2-V3)×
958
V3+(V2-V3)×
864
V3+(V2-V3)×
754
V3+(V2-V3)×
660
V3+(V2-V3)×
550
V3+(V2-V3)×
456
V3+(V2-V3)×
346
V3+(V2-V3)×
220
V3+(V2-V3)×
110
V3
V4+(V3-V4)×
4786
V4+(V3-V4)×
4660
V4+(V3-V4)×
4534
V4+(V3-V4)×
4408
V4+(V3-V4)×
4266
V4+(V3-V4)×
4124
V4+(V3-V4)×
3998
V4+(V3-V4)×
3810
V4+(V3-V4)×
3622
V4+(V3-V4)×
3402
V4+(V3-V4)×
3182
V4+(V3-V4)×
2946
V4+(V3-V4)×
2586
V4+(V3-V4)×
2022
V4
/
/
/
/
/
/
/
/
/
/
/
/
/
/
/
7074
7074
7074
7074
7074
7074
7074
7074
7074
7074
7074
7074
7074
7074
7074
/
/
/
/
/
/
/
/
/
/
/
/
/
/
/
2262
2262
2262
2262
2262
2262
2262
2262
2262
2262
2262
2262
2262
2262
2262
/
/
/
/
/
/
/
/
/
/
/
/
/
/
/
1680
1680
1680
1680
1680
1680
1680
1680
1680
1680
1680
1680
1680
1680
1680
/
/
/
/
/
/
/
/
/
/
/
/
/
/
4896
4896
4896
4896
4896
4896
4896
4896
4896
4896
4896
4896
4896
4896
V0''
V1''
V2''
V3''
V4''
V5''
V6''
V7''
V8''
V9''
V10''
V11''
V12''
V13''
V14''
V15''
V16''
V17''
V18''
V19''
V20''
V21''
V22''
V23''
V24''
V25''
V26''
V27''
V28''
V29''
V30''
V31''
V32''
V33''
V34''
V35''
V36''
V37''
V38''
V39''
V40''
V41''
V42''
V43''
V44''
V45''
V46''
V47''
V48''
V49''
V50''
V51''
V52''
V53''
V54''
V55''
V56''
V57''
V58''
V59''
V60''
V61''
V62''
V63''
Data Sheet S15996EJ1V0DS
Output Voltage2
V9
V9+(V8-V9)×
722
V9+(V8-V9)×
1350
V9+(V8-V9)×
1978
V9+(V8-V9)×
2574
V9+(V8-V9)×
3170
V9+(V8-V9)×
3672
V9+(V8-V9)×
4142
V9+(V8-V9)×
4596
V9+(V8-V9)×
5050
V9+(V8-V9)×
5458
V9+(V8-V9)×
5788
V9+(V8-V9)×
6086
V9+(V8-V9)×
6352
V9+(V8-V9)×
6618
V9+(V8-V9)×
6854
V8
V8+(V7-V8)×
204
V8+(V7-V8)×
408
V8+(V7-V8)×
580
V8+(V7-V8)×
736
V8+(V7-V8)×
892
V8+(V7-V8)×
1034
V8+(V7-V8)×
1176
V8+(V7-V8)×
1318
V8+(V7-V8)×
1460
V8+(V7-V8)×
1586
V8+(V7-V8)×
1712
V8+(V7-V8)×
1822
V8+(V7-V8)×
1932
V8+(V7-V8)×
2042
V8+(V7-V8)×
2152
V7
V7+(V6-V7)×
110
V7+(V6-V7)×
220
V7+(V6-V7)×
314
V7+(V6-V7)×
408
V7+(V6-V7)×
502
V7+(V6-V7)×
612
V7+(V6-V7)×
722
V7+(V6-V7)×
816
V7+(V6-V7)×
926
V7+(V6-V7)×
1020
V7+(V6-V7)×
1130
V7+(V6-V7)×
1224
V7+(V6-V7)×
1334
V7+(V6-V7)×
1460
V7+(V6-V7)×
1570
V6
V6+(V5-V6)×
110
V6+(V5-V6)×
236
V6+(V5-V6)×
362
V6+(V5-V6)×
488
V6+(V5-V6)×
630
V6+(V5-V6)×
772
V6+(V5-V6)×
898
V6+(V5-V6)×
1086
V6+(V5-V6)×
1274
V6+(V5-V6)×
1494
V6+(V5-V6)×
1714
V6+(V5-V6)×
1950
V6+(V5-V6)×
2310
V6+(V5-V6)×
2874
V5
/
/
/
/
/
/
/
/
/
/
/
/
/
/
/
7074
7074
7074
7074
7074
7074
7074
7074
7074
7074
7074
7074
7074
7074
7074
/
/
/
/
/
/
/
/
/
/
/
/
/
/
/
2262
2262
2262
2262
2262
2262
2262
2262
2262
2262
2262
2262
2262
2262
2262
/
/
/
/
/
/
/
/
/
/
/
/
/
/
/
1680
1680
1680
1680
1680
1680
1680
1680
1680
1680
1680
1680
1680
1680
1680
/
/
/
/
/
/
/
/
/
/
/
/
/
/
4896
4896
4896
4896
4896
4896
4896
4896
4896
4896
4896
4896
4896
4896
µPD16772B
6. RELATIONSHIP BETWEEN INPUT DATA AND OUTPUT PIN
Data format : 6 bits x 2 RGBs (6 dots)
Input width : 36 bits (2-pixel data)
(1) R,/L = H (Right shift)
Output
S1
S2
S3
S4
"""
S479
S480
Data
D00 to D05
D10 to D15
D20 to D25
D30 to D35
"""
D40 to D45
D50 to D55
(2) R,/L = L (Left shift)
Output
S1
S2
S3
S4
"""
S479
S480
Data
D00 to D05
D10 to D15
D20 to D25
D30 to D35
"""
D40 to D45
D50 to D55
Note
Note
S2n–1
S2n
L
V0 to V4
V5 to V9
H
V5 to V9
V0 to V4
POL
Note S2n–1 (Odd output), S2n (Even output)
★ 7. RELATIONSHIP BETWEEN STB, POL AND OUTPUT WAVEFORM
The output voltage is written to the LCD panel synchronized with the STB falling edge.
STB
POL
S2n-1
Selected voltage V0 to V4
Selected voltage V5 to V9
Selected voltage V0 to V4
S2n
Selected voltage V0 to V4
Selected voltage V5 to V9
Hi-Z
Hi-Z
Data Sheet S15996EJ1V0DS
Selected voltage V5 to V9
Hi-Z
9
µPD16772B
★ 8. RELATIONSHIP BETWEEN STB, CLK AND OUTPUT WAVEFORM
Figure 8–1. Output Circuit Block Diagram
Output Amp
−
DAC
+
SW1
Sn
(VX)
VAMP(IN)
Figure 8–2. Output Circuit Timing Waveform
[1]
[1']
CLK
tSTB-CLK
STB
SW1: OFF
VAMP(IN)
Sn (VX)
Hi-Z
The output voltage is written to the LCD panel synchronized with the STB falling edge.
STB = H is loaded with the rising edge of CLK [1]. However, when not satisfying the specification of tSTB-CLK, STB = H
is loaded with the rising edge of the next CLK [1']. Latch operation of display data is completed with the falling edge of
the next CLK which loaded STB = H. Therefore, in order to complete latch operation of display data, it is necessary to
input at least 2 CLK in STB = H period. Besides, after loading STB = H to the timing of [1], it is necessary to continue
inputting CLK.
10
Data Sheet S15996EJ1V0DS
µPD16772B
9. CURRENT CONSUMPTION REDUCTION FUNCTION
The µ PD16772B has a low power control function (LPC) which can switch the bias current of the output amplifier
between two levels and a bias control function (Bcont) which can be used to finely control the bias current.
• Low Power Control Function (LPC)
The bias current of the output amplifier can be switched between two levels using this pin (Bcont: Open).
LPC = H or Open: Low power mode
LPC = L: Normal power mode
The VDD2 of static current consumption can be reduced to two thirds of that in normal mode. Input a stable DC
current (VDD1/VSS1) to this pin.
• Bias Current Control Function (Bcont)
It is possible to fine-control the current consumption by using the bias current control function (Bcont pin). When
using this function, connect this pin to the stabilized ground potential (VSS2) via an external resistor (REXT). When
not using this function, leave this pin open.
Figure 9–1. Bias Current Control Function (Bcont)
µ PD16772B
Bcont
LPC
REXT
H/L
VSS2
Refer to the table below for the percentage of current regulation when using the bias current control function.
Table 9–1. Current Consumption Regulation Percentage Compared to Normal Mode (VDD1 = 3.3 V, VDD2 = 8.7 V)
REXT (kΩ)
Current Consumption Regulation Percentage (%)
LPC = L
LPC = H/Open
∞ (Open)
100
65
50
120
80
20
140
100
0
240
210
Remark The above current consumption regulation percentages are not product-characteristic
guaranteed as they re based on the results of simulation.
Caution
Because the low-power and bias-current control functions control the bias current in the output
amplifier and regulate the over-all current consumption of the driver IC, when this occurs, the
characteristics of the output amplifier will simultaneously change. Therefore, when using these
functions, be sure to sufficiently evaluate the picture quality.
Data Sheet S15996EJ1V0DS
11
µPD16772B
10. ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings (TA = 25°°C, VSS1 = VSS2 = 0 V)
Parameter
Symbol
Rating
Unit
–0.5 to +4.0
V
–0.5 to +10.0
V
–0.5 to VDD1 + 0.5
V
Logic Part Supply Voltage
VDD1
Driver Part Supply Voltage
VDD2
Logic Part Input Voltage
VI1
Driver Part Input Voltage
VI2
–0.5 to VDD2 + 0.5
V
Logic Part Output Voltage
VO1
–0.5 to VDD1 + 0.5
V
Driver Part Output Voltage
VO2
–0.5 to VDD2 + 0.5
V
Operating Ambient Temperature
TA
–10 to +75
°C
Storage Temperature
Tstg
–55 to +125
°C
Caution Product quality may suffer if the absolute maximum rating is exceeded even momentarily for any
parameter. That is, the absolute maximum ratings are rated values at which the product is on the
verge of suffering physical damage, and therefore the product must be used under conditions that
ensure that the absolute maximum ratings are not exceeded.
Recommended Operating Range (TA = –10 to +75°C, VSS1 = VSS2 = 0 V)
Parameter
★
Symbol
Condition
MIN.
TYP.
MAX.
Unit
3.6
V
8.5
9.0
V
Logic Part Supply Voltage
VDD1
2.3
Driver Part Supply Voltage
VDD2
8.0
High-Level Input Voltage
VIH
0.7 VDD1
VDD1
V
Low-Level Input Voltage
VIL
γ -Corrected Voltage
V0 to V4
0
0.5 VDD2
0.3 VDD1
VDD2 − 0.1
V
V5 to V9
0.1
0.5 VDD2
V
Driver Part Output Voltage
VO
0.1
VDD2 – 0.1
V
Clock Frequency
fCLK
45
MHz
12
VDD1 = 2.3 V
Data Sheet S15996EJ1V0DS
V
µPD16772B
Electrical Characteristics (TA = –10 to +75°C, VDD1 = 2.3 to 3.6 V, VDD2 = 8.5 V ± 0.5 V, VSS1 = VSS2 = 0 V, unless
otherwise specified, the input level is defined to be LPC = L, Bcont = Open)
Parameter
Symbol
Input Leak Current
Condition
MIN.
TYP.
Except LPC
IIL
LPC
T.B.D.
STHR (STHL), IOH = 0 mA
MAX.
Unit
±1.0
T.B.D.
µA
µA
High-Level Output Voltage
VOH
VDD1 – 0.1
Low-Level Output Voltage
VOL
STHR (STHL), IOL = 0 mA
γ -Corrected Resistance
Rγ
V0 to V4 = V5 to V9 = 4.0 V
Driver Output Current
IVOH
VX = 7.0 V, VOUT = 6.5 V
IVOL
VX = 1.0 V, VOUT = 1.5 V
Output Voltage Deviation
∆VO
TA = 25°C, VDD1 = 3.3 V, VDD2 = 8.5 V,
±7
±20
mV
Output Swing Difference
∆VP–P
VOUT = 2.0 V, 4.25 V, 6.5 V
±2
±15
mV
IDD1
VDD1
1.0
7.5
mA
IDD2
VDD2, with no load
3.5
7.5
mA
T.B.D.
V
T.B.D.
0.1
V
T.B.D.
kΩ
–30
µA
Note
Note
µA
30
Deviation
Logic Part Dynamic Current
Consumption
Driver Part Dynamic Current
Consumption
Note VX refers to the output voltage of analog output pins S1 to S480.
VOUT refers to the voltage applied to analog output pins S1 to S480.
★ Remark T.B.D. (To be determined.)
Cautions 1. fSTB = 50 kHz, fCLK = 40 MHz.
2. The TYP. values refer to an all black or all white input pattern. The MAX. value refers to the
measured values in the dot checkerboard input pattern.
3. Refers to the current consumption per driver when cascades are connected under the
assumption of UXGA single-sided mounting (10 units).
Switching Characteristics (TA = –10 to +75°°C, VDD1 = 2.3 to 3.6 V, VDD2 = 8.5 V ± 0.5 V, VSS1 = VSS2 = 0 V, unless
otherwise specified, the input level is defined to be LPC = L, Bcont = Open)
Parameter
Symbol
Start Pulse Delay Time
TYP.
MAX.
Unit
CL = 10 pF
10
20
ns
10
20
ns
CL = 75 pF, RL = 5 kΩ
2.5
5
µs
tPLH3
5
8
µs
tPHL2
2.5
5
µs
tPLH1
Condition
MIN.
tPHL1
Driver Output Delay Time
tPLH2
5
8
µs
CI1
STHR (STHL) excluded, TA = 25°C
5
10
pF
CI2
STHR (STHL), TA = 25°C
8
10
pF
tPHL3
Input Capacitance
<Test Condition>
RL1
RL2
RL3
RL4
Measurement
point
RL5
Output
CL1
CL2
CL3
CL4
CL5
GND
RLn = 1 kΩ
CLn = 15 pF
Data Sheet S15996EJ1V0DS
13
µPD16772B
Timing Requirements (TA = –10 to +75°°C, VDD1 = 2.3 to 3.6 V, VSS1 = 0 V, tr = tf = 5.0 ns)
Parameter
Symbol
Clock Pulse Width
PW CLK
Clock Pulse High Period
PW CLK(H)
Clock Pulse Low Period
PW CLK(L)
Condition
MIN.
TYP.
22
MAX.
Unit
ns
4
ns
2.3 V ≤ VDD1 < 3.0 V
7
ns
3.0 V ≤ VDD1 ≤ 3.6 V
4
ns
Data Setup Time
tSETUP1
3
ns
Data Hold Time
tHOLD1
0
ns
Start Pulse Setup Time
tSETUP2
3
ns
Start Pulse Hold Time
tHOLD2
0
ns
POL21, POL22 Setup Time
tSETUP3
POL21, POL22 Hold Time
tHOLD3
3
ns
2.3 V ≤ VDD1 < 3.0 V
1
ns
3.0 V ≤ VDD1 ≤ 3.6 V
0
ns
STB Pulse Width
PW STB
2
CLK
Last Data Timing
tLDT
2
CLK
CLK-STB Time
tCLK-STB
CLK ↑ → STB ↑
6
ns
STB-CLK Time
tSTB-CLK
STB ↑ → CLK ↑
2.3 V ≤ VDD1 < 3.0 V
14
ns
STB ↑ → CLK ↑
3.0 V ≤ VDD1 ≤ 3.6 V
6
ns
Time Between STB and Start Pulse
tSTB-STH
STB ↑ → STHR(STHL) ↑
2
CLK
POL-STB Time
tPOL-STB
POL ↑ or ↓ → STB ↑
–5
ns
STB-POL Time
tSTB-POL
STB ↓ → POL ↓ or ↑
6
ns
Remark Unless otherwise specified, the input level is defined to be VIH = 0.7 VDD1, VIL = 0.3 VDD1.
14
Data Sheet S15996EJ1V0DS
2
3
1
64
65
66
513
tr
2
tf
VDD1
90%
514
10%
tSETUP2
tHOLD2
VSS1
tCLK-STB tSTB-CLK
VDD1
STHR
(1st Dr.)
VSS1
tSETUP1
Dn0 to Dn5
INVALID
D1 to D6
D7 to D12
tSETUP3
POL21,
POL22
tHOLD1
tSTB-STH
D373 to
D378
D379 to
D384
D385 to
D390
VDD1
D3067 to
D3072
INVALID
D1 to D6
D7 to D12
VSS1
tHOLD3
VDD1
INVALID
INVALID
Data Sheet S15996EJ1V0DS
VSS1
tPLH1
tPHL1
VDD1
STHL
(1st Dr.)
VSS1
tLDT
PWSTB
VDD1
STB
VSS1
tPOL-STB
tSTB-POL
VDD1
POL
VSS1
tPLH3
Hi-Z
tPLH2
Sn
(VX)
★ Switching Characteristic Waveform (R,/L = H)
1
CLK
PWCLK(H)
Unless otherwise specified, the input level is defined to be VIH = 0.7 VDD1, VIL = 0.3 VDD1.
PWCLK(L) PWCLK
Target Voltage ± 0.1 VDD2
6-bit accuracy
tPHL3
15
µPD16772B
tPHL2
µPD16772B
11. RECOMMENDED MOUNTING CONDITIONS
The following conditions must be met for mounting conditions of the µ PD16772B.
For more details, refer to the Semiconductor Device Mounting Technology Manual (C10535E).
Please consult with our sales offices in case other mounting process is used, or in case the mounting is done under
different conditions.
µ PD16772BN-xxx: TCP (TAB Package)
Mounting Condition
Thermocompression
Mounting Method
Soldering
Condition
Heating tool 300 to 350°C, heating for 2 to 3 seconds : pressure 100 g
(per solder)
ACF
Temporary bonding 70 to 100°C : pressure 3 to 8 kg/cm2: time 3 to 5
(Adhesive
sec. Real bonding 165 to 180°C: pressure 25 to 45 kg/cm2: time 30 to
Conductive Film)
40 sec. (When using the anisotropy conductive film SUMIZAC1003 of
Sumitomo Bakelite, Ltd).
Caution
To find out the detailed conditions for mounting the ACF part, please contact the ACF
manufacturing company. Be sure to avoid using two or more mounting methods at a time.
16
Data Sheet S15996EJ1V0DS
µPD16772B
[MEMO]
Data Sheet S15996EJ1V0DS
17
µPD16772B
[MEMO]
18
Data Sheet S15996EJ1V0DS
µPD16772B
NOTES FOR CMOS DEVICES
1
PRECAUTION AGAINST ESD FOR SEMICONDUCTORS
Note:
Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and
ultimately degrade the device operation. Steps must be taken to stop generation of static electricity
as much as possible, and quickly dissipate it once, when it has occurred. Environmental control
must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using
insulators that easily build static electricity. Semiconductor devices must be stored and transported
in an anti-static container, static shielding bag or conductive material. All test and measurement
tools including work bench and floor should be grounded. The operator should be grounded using
wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need
to be taken for PW boards with semiconductor devices on it.
2
HANDLING OF UNUSED INPUT PINS FOR CMOS
Note:
No connection for CMOS device inputs can be cause of malfunction. If no connection is provided
to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence
causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels
of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused
pin should be connected to V DD or GND with a resistor, if it is considered to have a possibility of
being an output pin. All handling related to the unused pins must be judged device by device and
related specifications governing the devices.
3
STATUS BEFORE INITIALIZATION OF MOS DEVICES
Note:
Power-on does not necessarily define initial status of MOS device. Production process of MOS
does not define the initial operation status of the device. Immediately after the power source is
turned ON, the devices with reset function have not yet been initialized. Hence, power-on does
not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the
reset signal is received. Reset operation must be executed immediately after power-on for devices
having reset function.
Data Sheet S15996EJ1V0DS
19
µPD16772B
Reference Documents
NEC Semiconductor Device Reliability/Quality Control System(C10983E)
Quality Grades On NEC Semiconductor Devices(C11531E)
• The information in this document is current as of July 2002. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data
books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products
and/or types are available in every country. Please check with an NEC sales representative for
availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
• NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
• While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
• NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
M8E 00. 4