PRELIMINARY DATA SHEET MOS INTEGRATED CIRCUIT μPD46128512-X 128M-BIT CMOS MOBILE SPECIFIED RAM 8M-WORD BY 16-BIT EXTENDED TEMPERATURE OPERATION Description The μPD46128512-X is a high speed, low power, 134,217,728 bits (8,388,608 words by 16 bits) CMOS Mobile Specified RAM featuring asynchronous page read and random write, synchronous burst read/write function. The μPD46128512-X is fabricated with advanced CMOS technology using one-transistor memory cell. Features • 8,388,608 words by 16 bits organization • Asynchronous page read mode • Synchronous read and write mode • Burst length: 8 words / 16 words / continuous • Clock latency: 5, 6, 7, 8, 9, 10 • Burst sequence: Linear burst • Max clock frequency: 108/83 MHz • Byte data control: /LB (DQ0 to DQ7), /UB (DQ8 to DQ15) • Low voltage operation: 1.7 to 2.0 V • Operating ambient temperature: TA = −30 to +85 °C • Chip Enable input: /CE1 pin • Standby Mode input: CE2 pin • Standby Mode 1: Normal standby (Memory cell data hold valid) • Standby Mode 2: Density of memory cell data hold is variable μPD46128512 Clock Asynchronous Operating Supply current Operating frequency initial access supply ambient At operating MHz time voltage temperature mA (MAX.) (TYP.) (MAX.) ns V °C (MAX.) Density of data hold Density of data hold (MAX.) At standby μA 128M 32M bits -E9X Note -E10X -E11X 108 Note 83 -E12X 70 1.7 to 2.0 −30 to +85 60 85 50 70 60 85 50 bits 16M 8M 0M bits bits bits bits 65 80 250 T.B.D. T.B.D. T.B.D. 128M 32M bits 16M 8M 0M bits bits bits T.B.D. T.B.D. T.B.D. Note Under consideration The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. M17507EJ2V0DS00 (2nd edition) Date Published September 2005 CP (K) Printed in Japan The mark shows major revised points. 2005 15 μ PD46128512-X Ordering Information μPD46128512-X is mainly shipping by wafer. Please consult with our sales offices for package samples and ordering information. 2 Preliminary Data Sheet M17507EJ2V0DS μ PD46128512-X Pin Configuration The following is pin configuration of package sample. /xxx indicates active low signal. 93-PIN TAPE FBGA (12x9) Top View Bottom View 10 9 8 7 6 5 4 3 2 1 A BCDE FGH J K LM N P P NM L K J HGF EDCBA Top View A 10 NC 9 B C NC NC NC NC NC 8 7 D J K A16 NC Vss A14 NC DQ15 DQ7 DQ14 A9 A10 DQ6 DQ13 DQ12 DQ5 E F G H NC NC A15 A21 A22 A11 A12 A13 A8 A19 M N P NC NC NC NC NC L NC 6 NC /WE CE2 A20 NC NC DQ4 VCC NC NC 5 NC CLK /ADV /WAIT NC NC DQ3 VCC DQ11 NC /LB /UB A18 A17 DQ1 DQ9 DQ10 DQ2 NC A7 A6 A5 A4 GND /OE DQ0 DQ8 NC NC NC A3 A2 A1 A0 NC /CE1 NC NC NC NC 4 3 2 1 NC A0 to A22 : Address inputs DQ0 to DQ15 : Data inputs / outputs NC NC NC NC NC CLK : Clock input /ADV : Address Valid Input /CE1 : Chip select input /WAIT : Wait output CE2 : Standby mode input VCC : Power supply /WE : Write enable input GND : Ground /OE : Output enable input NC Note : No Connection /LB, /UB : Byte data select input NC Note Some signals can be applied because this pin is not internally connected. Remark Refer to Package Drawing for the index mark. Preliminary Data Sheet M17507EJ2V0DS 3 μ PD46128512-X Block Diagram Standby mode control VCC VCCQ Refresh control GND Refresh counter A0 to A22 CLK /ADV Address buffer Memory cell array 134,217,728 bits Row decoder Address latch DQ0 to DQ7 Input data controller DQ8 to DQ15 /WAIT Internal state control /CE1 CE2 /LB /UB /WE /OE 4 Preliminary Data Sheet M17507EJ2V0DS Sense amplifier / Switching circuit Column decoder Output data controller μ PD46128512-X Truth Table Asynchronous Operation Mode /CE1 CE2 /ADV /OE /WE /LB /UB DQ /WAIT DQ0 to DQ7 DQ8 to DQ15 H H × × × × × High-Z High-Z High-Z × L × × × × × High-Z High-Z High-Z L H Note3 L H L L DOUT DOUT High-Z Lower byte read L H DOUT High-Z High-Z Upper byte read H L High-Z DOUT High-Z Output disable H H High-Z High-Z High-Z × × High-Z High-Z High-Z L L DIN DIN High-Z Lower byte write L H DIN High-Z High-Z Upper byte write H L High-Z DIN High-Z H H High-Z High-Z High-Z Not selected (Standby Mode 1) Not selected (Standby Mode 2) Word read Note1 Output disable H Word write Abort write Notes 1. L Note2 CE2 pin must be fixed HIGH except Standby Mode 2 (refer to 2.3 Standby Mode Status Transition). 2. If /WE = LOW and /LB = /UB = HIGH, memory does not accept write data, so write operation is not available. 3. Fixed LOW or toggle HIGH → LOW → HIGH Remark H, HIGH : VIH, L, LOW : VIL, ×: VIH or VIL Clock pin must be fixed either LOW or HIGH. Preliminary Data Sheet M17507EJ2V0DS 5 μ PD46128512-X Burst Operation Mode /CE1 Not selected (Standby Mode 1) Not selected (Standby Mode 2) Note1 Start address latch CE2 CLK /ADV /OE /WE /LB /UB DQ /WAIT DQ0 to DQ7 DQ8 to DQ15 Note8 H H × × × × × × High-Z High-Z High-Z × L × × × × × × High-Z High-Z High-Z L H Note4 L × Note7 × Note7 × Note9 × Note9 High-Z Note5 High-Z Note5 × H L H DOUT DOUT Output Advanced burst read to next address Note4 Valid Burst read suspend Burst read resume Note2 Note2 Burst read termination Note3 Advanced burst write to next address × L H High-Z High-Z HIGH L DOUT DOUT HIGH × High-Z High-Z High-Z DIN DIN Output H L Note4 Valid Burst write suspend Burst write resume Note2 Note2 Burst write termination Note3 Abort write Note6 Notes 1. 2. × × L × H High-Z High-Z HIGH L DIN DIN HIGH × High-Z High-Z High-Z High-Z High-Z HIGH Note10 HIGH HIGH CE2 pin must be fixed HIGH except Standby Mode 2 (refer to 2.3 Standby Mode Status Transition). Be sure to suspend or resume a burst read after outputting the first read access data. Be sure to suspend or resume a burst write after latching the first write data. Burst write suspend or resume is available when setting WC = 1 (/WE level control) through Mode Register Set. 3. /CE1 must be fixed HIGH during tTRB specification until next read or write operation. 4. Valid clock edge shall be set either positive or negative edge through Mode Register Set. 5. If /OE = LOW and /LB = /UB = LOW, output is valid. If /OE = LOW and /LB = /UB = HIGH, output is high impedance. If /WE = LOW, output is high impedance. If /OE = /WE = HIGH, output is high impedance. 6. If /WE = LOW and /LB = /UB = HIGH, memory does not accept write data, so write operation is not available. 7. Both of two pins (/OE and /WE) or either of two should be connected to HIGH. It is prohibited to bring the both /OE and /WE to LOW. 8. 9. Refer to the 4.10 /WAIT. For the Burst Read, the /UB, /LB setup time to CLK (tBC) must be satisfied. For the Burst Write, the /UB, /LB setup time to CLK (tBC) must be satisfied. Once /LB and /UB inputs are determined, they must not be changed until the end of burst operation. 10. In case of WC = 0, /WE is HIGH. In case of WC = 1, /WE is LOW. The explanation of WC refers to Table 5-2. Mode Register Definition (5th Bus Cycle) and 5.9 /WE control. Remark H, HIGH : VIH, L, LOW : VIL, ×: VIH or VIL, 6 : valid edge Preliminary Data Sheet M17507EJ2V0DS μ PD46128512-X CONTENTS 1. Initialization .................................................................................................................................................. 9 2. Partial Refresh ........................................................................................................................................... 11 2.1 Standby Mode.......................................................................................................................................................... 11 2.2 Density Switching .................................................................................................................................................... 11 2.3 Standby Mode Status Transition.............................................................................................................................. 11 2.4 Addresses for Which Partial Refresh Is Supported.................................................................................................. 13 3. Page Read Operation ................................................................................................................................ 14 3.1 Features of Page Read Operation ........................................................................................................................... 14 3.2 Page Length ............................................................................................................................................................ 14 3.3 Page-Corresponding Addresses.............................................................................................................................. 14 3.4 Page Start Address.................................................................................................................................................. 14 3.5 Page Direction ......................................................................................................................................................... 14 3.6 Interrupt during Page Read Operation..................................................................................................................... 14 3.7 When Page Read is not Used.................................................................................................................................. 14 4. Burst Operation ......................................................................................................................................... 15 4.1 Features of Burst Operation .................................................................................................................................... 15 4.2 Burst Length ............................................................................................................................................................ 15 4.3 Latency .................................................................................................................................................................... 15 4.4 Single Write ............................................................................................................................................................. 17 4.5 /WE Control ............................................................................................................................................................. 17 4.6 Burst Read Suspend/Resume ................................................................................................................................. 18 4.7 Burst Write Suspend/Resume ................................................................................................................................. 19 4.8 Burst Read Termination........................................................................................................................................... 20 4.9 Burst Write Termination ........................................................................................................................................... 21 4.10 /WAIT..................................................................................................................................................................... 22 4.10.1 Feature of /WAIT Output ............................................................................................................................. 22 4.10.2 Dummy Wait Cycles at Continuous Burst Operation ................................................................................... 25 4.11 Reset Function from Synchronous Burst Mode to Asynchronous Page Mode....................................................... 27 5. Mode Register Settings............................................................................................................................. 28 5.1 Mode Register Setting Method ................................................................................................................................ 28 5.2 Cautions for Setting Mode Register ......................................................................................................................... 28 5.3 Partial Refresh Density ............................................................................................................................................ 30 5.4 Burst Length ............................................................................................................................................................ 30 5.5 Function Mode ......................................................................................................................................................... 30 5.6 Valid Clock Edge ..................................................................................................................................................... 30 5.7 Read Latency (Write Latency) ................................................................................................................................. 30 5.8 Single Write ............................................................................................................................................................. 30 5.9 /WE Control ............................................................................................................................................................. 31 5.10 Reset to Page Mode .............................................................................................................................................. 31 5.11 Reserved Bits ........................................................................................................................................................ 31 5.12 Cautions for Timing Chart of Setting Mode Register.............................................................................................. 32 6. Electrical Specifications ........................................................................................................................... 33 Preliminary Data Sheet M17507EJ2V0DS 7 μ PD46128512-X 7. Asynchronous AC Specification, Timing Chart ..................................................................................... 36 8. Synchronous AC Specification, Timing Chart........................................................................................ 57 9. Mode Register Setting Timing.................................................................................................................. 74 10. Standby Mode Timing Chart................................................................................................................... 77 11. Package Drawing..................................................................................................................................... 78 12. Recommended Soldering Conditions ................................................................................................... 79 8 Preliminary Data Sheet M17507EJ2V0DS μ PD46128512-X 1. Initialization Initialize the μPD46128512-X at power application using the following sequence to stabilize internal circuits. There are 2 method of initialization. Initialization Timing 1 (1) Following power application, make CE2 HIGH after fixing CE2 to LOW for the period of tVHMH. Make /CE1 HIGH before making CE2 HIGH. (2) /CE1 and CE2 are fixed HIGH for the period of tMHCL. Normal operation is possible after the completion of initialization. Figure 1-1. Initialization Timing Chart 1 Nomal Operation Intialization /CE1 (Input) tCHMH tMHCL tVHMH CE2 (Input) VCC, VCCQ Cautions 1. 2. VCC (MIN.), VCCQ (MIN.) Make CE2 LOW when starting the power supply. tVHMH is specified from when the power supply voltage reaches the prescribed minimum value (VCC (MIN.), VCCQ (MIN.)). Initialization Timing 1 Parameter Symbol MIN. MAX. Unit Power application to CE2 LOW hold tVHMH 50 μs /CE1 HIGH to CE2 HIGH tCHMH 0 ns Following power application CE2 HIGH hold to /CE1 LOW tMHCL 300 μs Preliminary Data Sheet M17507EJ2V0DS 9 μ PD46128512-X Initialization Timing 2 (1) Following power application, make CE2 and /CE1 HIGH for the period of tMHCL. Normal operation is possible after the completion of initialization. Figure 1-2. Initialization Timing Chart 2 Nomal Operation Intialization /CE1 (Input) tMHCL CE2 (Input) VCC, VCCQ Cautions 1. VCC (MIN.), VCCQ (MIN.) tMHCL is specified from when the power supply voltage reaches the prescribed minimum value (VCC (MIN.), VCCQ (MIN.)). 2. If the period from power supplying to value VCC (MIN.), VCCQ (MIN.) is beyond 10 ms or power supply is not stable rise, should be used Initialization Timing Chart 1. Initialization Timing 2 Parameter Symbol Following power application /CE1, CE2 HIGH hold to /CE1 LOW 10 tMHCL Preliminary Data Sheet M17507EJ2V0DS MIN. 300 MAX. Unit μs μ PD46128512-X 2. Partial Refresh 2.1 Standby Mode In addition to the regular standby mode (Standby Mode 1) with a 128M bits density, Standby Mode 2, which performs partial refresh, is also provided. 2.2 Density Switching In Standby Mode 2, the densities that can be selected for performing refresh are 32M bits, 16M bits, 8M bits, and 0M bit. The density for performing refresh can be set with the mode register. Once the refresh density has been set in the mode register, these settings are retained until they are set again, while applying the power supply. However, the mode register setting will become undefined if the power is turned off, so set the mode register again after power application. (For how to perform mode register settings, refer to section 5. Mode Register Settings.) 2.3 Standby Mode Status Transition In Standby Mode 1, /CE1 and CE2 are HIGH. In Standby Mode 2, CE2 is LOW. In Standby Mode 2, if 0M bit is set as the density, it is necessary to perform initialization the same way as after applying power, in order to return to normal operation from Standby Mode 2. When the density has been set to 32M bits, 16M bits, or 8M bits in Standby Mode 2, it is not necessary to perform initialization to return to normal operation from Standby Mode 2. For the timing charts, refer to Figure 10-1. Standby Mode 2 Entry / Exit Timing Chart (Asynchronous Mode), Figure 10-2. Standby Mode 2 (data not held) Entry / Exit Timing Chart (Asynchronous Mode). Preliminary Data Sheet M17507EJ2V0DS 11 12 Figure 2-1. Standby Mode State Machine Power On Mode Register Setting Initialize Initialize Note /CE1 = VIH, CE2 = VIH Burst Mode Page Mode Burst Mode Page Mode /CE1 = V IH, CE2 = V IH Standby Mode1 Preliminary Data Sheet M17507EJ2V0DS /CE1 = V IH, CE2 = V IL /CE1 = V IH, CE2 = V IL (RP=0) /CE1 = V IH, CE2 = V IL /CE1 = V IL, CE2 = V IH /CE1 = V IH, CE2 = V IH /CE1 = V IH, CE2 = V IH CE2 = V IL (RP=0) CE2 = V IL /CE1 = V IH, CE2 = V IL (RP=1) /CE1 = V IL, CE2 = V IH /CE1 = V IH, CE2 = V IL (RP=0) /CE1 = V IH, CE2 = V IH Active Standby Mode1 /CE1 = V IH, CE2 = V IH CE2 = V IL (RP=1) Standby Mode2 (32Mbit/16Mbit/8Mbit) /CE1 = V IH, CE2 = V IL (RP=1) Standby Mode2 (32Mbit/16Mbit/8Mbit) Active CE2 = V IL (RP=0) CE2 = V IL (RP=1) CE2 = V IL Standby Mode2 (Data not held) μ PD46128512-X Note Case “Initialization Timing 2” : Following initialization, set mode register. Standby Mode2 (Data not held) μ PD46128512-X 2.4 Addresses for Which Partial Refresh Is Supported Data hold density Correspondence address 32M bits 000000H to 1FFFFFH 16M bits 000000H to 0FFFFFH 8M bits 000000H to 07FFFFH Preliminary Data Sheet M17507EJ2V0DS 13 μ PD46128512-X 3. Page Read Operation For the timing charts, refer to Figure 7-10. Asynchronous Page Read Cycle Timing Chart. 3.1 Features of Page Read Operation Features Item Page length 16 words Page read-corresponding addresses A3, A2, A1, A0 Page read start address Don’t care Page direction Don’t care Interrupt during page read operation Enabled Note Note /CE1 = HIGH, or any change in address A4 or higher will initiate a new read access specified as tAA or tACE. 3.2 Page Length 16 words is supported as the page lengths. Page length is not necessary to set through Mode Register. 3.3 Page-Corresponding Addresses The 16 words page read-enabled addresses are A3, A2, A1, and A0. Fix addresses other than A3, A2, A1, and A0 during page read operation. 3.4 Page Start Address Since random page read is supported, any address (A3, A2, A1 and A0 with the 16 words page) can be used as the page read start address. 3.5 Page Direction Since random page read is possible, there is not restriction on the page direction. 3.6 Interrupt during Page Read Operation When generating an interrupt during page read, make /CE1 HIGH or change A4 and higher addresses. 3.7 When Page Read is not Used Since random page read is supported, even when not using page read, random access is possible as usual. 14 Preliminary Data Sheet M17507EJ2V0DS μ PD46128512-X 4. Burst Operation Burst operation is valid when burst mode is set through mode register. 4.1 Features of Burst Operation Function Features Burst Length 8, 16, Continuous Read Latency 5, 6, 7, 8, 9, 10 Write Latency 4, 5, 6, 7, 8, 9 Burst Sequence Linear Single Write Single Write, Burst Write Valid Clock Edge Rising Edge, Falling Edge 4.2 Burst Length Burst length is the number of word to be read or written during synchronous burst read/write operation as the result of a single address latch cycle. It can be set on 8, 16words boundary or continuous for entire address through Mode Register Set sequence. Starting from initial address being latched, device internal address counter assign +1 to the previous address until reaching the end of boundary address. After completing read data out or write data latch for the set burst length, operation automatically end except for continuous burst. When continuous burst length is set, read /write is endless unless it is terminated by the rising edge of /CE1. 4.3 Latency Read Latency (RL) is the number of clock cycles between the address being latched and first read data becoming available during synchronous burst read operation. It is set through Mode Register Set sequence after power application. Once RL is set through Mode Register Set sequence, write latency, that is the number of clock cycles between address being latched and first write data being latched, is automatically set to RL−1. Latency Count Grade -E9X Asynchronous Frequency access time <108 MHz 70 ns 8, 9, 10 7, 8, 9 85 ns 10 9 70 ns 7, 8, 9, 10 6, 7, 8, 9 85 ns 8, 9, 10 7, 8, 9 70 ns 6, 7, 8, 9, 10 5, 6, 7, 8, 9 85 ns 7, 8, 9, 10 6, 7, 8, 9 70 ns 5, 6, 7, 8, 9, 10 4, 5, 6, 7, 8, 9 85 ns 5, 6, 7, 8, 9, 10 4, 5, 6, 7, 8, 9 -E10X -E9X, -E11X <83 MHz -E10X, -E12X -E9X, -E11X <66 MHz -E10X, -E12X -E9X, -E11X <52 MHz -E10X, -E12X Read Latency Write Latency Note Clock Note Write Latency = Read Latency−1 Preliminary Data Sheet M17507EJ2V0DS 15 μ PD46128512-X Figure 4-1. Latency Definition CLK (Input) Address (Input) Valid /ADV (Input) /CE1 (Input) RL = 5 DQ (Output) Read Latency = 5 High-Z Q0 Q1 Q2 Q3 Q4 Q5 D1 D2 D3 D4 D5 D6 Q0 Q1 Q2 Q3 Q4 D1 D2 D3 D4 D5 Q0 Q1 Q2 Q3 D1 D2 D3 D4 Q0 Q1 Q2 D1 D2 D3 Q0 Q1 D1 D2 Write Latency = 4 DQ (Input) High-Z Read Latency = 6 RL = 6 DQ (Output) D0 High-Z Write Latency = 5 DQ (Input) High-Z Read Latency = 7 RL = 7 DQ (Output) D0 High-Z Write Latency = 6 DQ (Input) High-Z Read Latency = 8 RL = 8 DQ (Output) D0 High-Z Write Latency = 7 DQ (Input) High-Z Read Latency = 9 RL = 9 DQ (Output) D0 High-Z Write Latency = 8 DQ (Input) High-Z Read Latency = 10 RL = 10 DQ (Output) D0 High-Z Q0 Write Latency = 9 DQ (Input) 16 High-Z D0 Preliminary Data Sheet M17507EJ2V0DS D1 μ PD46128512-X 4.4 Single Write Single write operation is a single-word length synchronous write operation. The μPD46128512-X is supporting two type of synchronous write operation, “Burst Read & Single Write” and “Burst Read & Burst Write”, configurable with SW bit in the mode register. When the device set to the “Burst Read & Single Write” operation mode, the burst length at the synchronous write operation is always fixed to single word length regardless of the burst length (BL) setting in the mode register, however, BL setting is still effective in synchronous read operation (Refer to 5. Mode Register Settings). Refer to Figure 8-8. Synchronous Burst Write Cycle Timing Chart (/WE level Control), Figure 8-9. Synchronous Burst Write Cycle Timing Chart (/WE single clock control), Figure 8-10. Synchronous Single Write Timing Chart. 4.5 /WE Control The μPD46128512-X is supporting two type of timing control with /WE input signal, “/WE level control” and “/WE single clock control” configurable with WC bit in the mode register at synchronous write operation. In case of /WE level controlling, /WE must be asserted LOW before the 2nd clock input timing (T1). Refer to Figure 8-8. Synchronous Burst Write Cycle Timing Chart (/WE level Control), Figure 8-9. Synchronous Burst Write Cycle Timing Chart (/WE single clock control). Figure 4-2. /WE Control T0 T1 T2 T3 T4 T5 T6 T7 CLK (Input) Address (Input) Add /ADV (Input) Read Latency = 5 /CE1 (Input) /WE Level Control tWES /WE (Input) DQ0 to DQ15 (Input) /WAIT (Output) High-Z D0 D1 D2 D3 D0 D1 D2 D3 High-Z /WE Single Clock Control tWES tWEH /WE (Input) DQ0 to DQ15 (Input) /WAIT (Output) High-Z High-Z Preliminary Data Sheet M17507EJ2V0DS 17 μ PD46128512-X 4.6 Burst Read Suspend/Resume A burst read operation can be suspended by bringing /OE signal from LOW to HIGH during the burst read operation. The /OE signal must be required to meet the specified setup / hold time to the clock which the data being suspended. Once the /OE is brought to HIGH, output data turns to be high impedance state after specific time duration. The burst read suspend will be effective after outputting first read data, or after outputting dummy wait cycles in case of dummy wait cycling insertion at continuous burst read mode. The burst suspend mode will be resumed by re-asserting /OE to LOW, and the first output data is from the same address location as of being suspended. Figure 4-3. Burst Read Suspend/Resume CLK (Input) A0 to A22 (Input) /ADV (Input) H /CE1 (Input) L tSOEH tSOES /OE (Input) tSOEH tSOES tSOP tOHZ tBACC DQ0 to DQ15 (Output) 18 Q0 tBDH Q1 tBACC High-Z Preliminary Data Sheet M17507EJ2V0DS tBDH Q2 Q3 μ PD46128512-X 4.7 Burst Write Suspend/Resume A burst write operation can be suspended by bringing /WE signal from LOW to HIGH during the burst write operation. The /WE signal must be required to meet the specified setup / hold time to the clock which the data being suspended. The burst write suspend will be effective after inputting first write data. The burst suspend mode will be resumed by re-asserting /WE to LOW, and the first write data is written to the same address location as of being suspended. Burst write suspend or resume is available only when WC = 1(/WE level control) is set to the mode register (refer to Table 5-2. Mode Register Definition (5th Bus Cycle). Figure 4-4. Burst Write Suspend/Resume T4 T5 T6 T7 T8 T9 T10 CLK (Input) A0 to A22 (Input) /ADV (Input) H /CE1 (Input) L tWEH tWES /WE (Input) tWEH tWES tSWHP tWDS tWDH DQ0 to DQ15 (Output) D0 D1 tWDS tWDH High-Z Preliminary Data Sheet M17507EJ2V0DS D2 D3 19 μ PD46128512-X 4.8 Burst Read Termination Burst read termination can be performed by transferring /CE1 LOW to HIGH during the burst read. When continuous burst length is set, burst read is endless unless it is terminated. Be sure to terminate a burst read after outputting the first read access data. In order to guarantee the last data output, the specified minimum value of /CE1 = LOW hold time (tCEH) against clock edge must be satisfied. In order to perform next operation after burst read termination, the specified minimum value of Burst Read Termination recovery time (tTRB) must be satisfied. Figure 4-5. Burst Read Termination CLK (Input) tACS A0 to A22 (Input) tACH Valid tAH tCHV tCSV tCHV /ADV (Input) tCEH tCES /CE1 (Input) tCEH tCES tTRB tCHZ /OE (Input) tBACC DQ0 to DQ15 (Output) 20 Q1 Q2 tBDH Q3 Preliminary Data Sheet M17507EJ2V0DS High-Z μ PD46128512-X 4.9 Burst Write Termination Burst write termination can be performed by transferring /CE1 LOW to HIGH during the burst write. When continuous burst length is set, burst write is endless unless it is terminated. Be sure to terminate a burst write after latching the first write data. In order to guarantee the last write data is latched, the specified minimum value of /CE1 = LOW hold time against clock edge must be satisfied. In order to perform next operation after burst write termination, the specified minimum value of Burst Write Termination recovery time (tTRB) must be satisfied. Figure 4-6. Burst Write Termination CLK (Input) tACS A0 to A22 (Input) tACH Valid tAH tCHV tCSV tCHV /ADV (Input) tWRB tCEH tCES /CE1 (Input) tCEH tCES tTRB /WE (Input) tWDS tWDH DQ0 to DQ15 (Output) D1 D2 D3 Preliminary Data Sheet M17507EJ2V0DS High-Z 21 μ PD46128512-X 4.10 /WAIT 4.10.1 Feature of /WAIT Output The /WAIT output signal indicates the internal status, busy (LOW) or ready (HIGH), during the burst read and burst write operation. The /WAIT output state changes depend on the /CE1 and /ADV condition. When /CE1 held entire LOW, the /WAIT output corresponds with /ADV state and turns to LOW by /ADV assertion. The /WAIT output stays high impedance at standby mode (/CE1 = HIGH) and turns to LOW at active mode brought by /CE1 assertion. The /WAIT output will be asserted to LOW after specific time duration triggered by falling edge of /CE1, or falling edge of /ADV when /CE1 held entire LOW. When the /WAIT output LOW, it indicates the output data is not valid at the next clock cycle. The /WAIT output asserts HIGH one clock cycle before the valid data output. The /WAIT output retains the same state as of the clock cycle right before being suspended with /OE brought to HIGH. Figure 4-7. Burst Read /WAIT Output (/CE1 = HIGH → LOW) T0 T1 T2 T3 T4 T5 CLK (Input) A0 to A22 (Input) Add /ADV (Input) /CE1 (Input) /WE (Input) H RL = 5 DQ0 to DQ15 (Output) High-Z Q0 tCEWA /WAIT (Output) 22 High-Z Preliminary Data Sheet M17507EJ2V0DS tCLWA μ PD46128512-X Figure 4-8. Burst Read /WAIT Output (/CE1 = LOW, /ADV = HIGH → LOW) T0 T1 T2 T3 T4 T5 CLK (Input) A0 to A22 (Input) Add /ADV (Input) tADWA /CE1 (Input) L /WE (Input) H RL = 5 DQ0 to DQ15 (Output) High-Z Q0 tCLWA /WAIT (Output) The /WAIT output will be asserted to LOW after specific time duration from the falling edge of the /CE1, or falling edge of the /ADV when /CE1 held LOW at burst write operation. When the /WAIT output LOW, it indicates the input data can not be accepted at the next clock cycle. The /WAIT output asserts HIGH one clock cycle before the valid data input. The /WAIT output retains the same state as of the clock cycle right before being suspended with /WE brought to HIGH. The /WAIT output always stay high impedance state under asynchronous mode setting. Preliminary Data Sheet M17507EJ2V0DS 23 μ PD46128512-X Figure 4-9. Burst Write /WAIT Output (/CE1 = HIGH → LOW) T0 T1 T2 T3 T4 T5 D0 D1 CLK (Input) A0 to A22 (Input) Add /ADV (Input) /CE1 (Input) tWES /WE (Input) (WC = 1) tWES tWEH /WE (Input) (WC = 0) RL = 5 DQ0 to DQ15 (Output) High-Z tCEWA /WAIT (Output) tCLWA High-Z Figure 4-10. Burst Write /WAIT Output (/CE1 = LOW, /ADV = HIGH → LOW) T0 T1 T2 T3 T4 T5 CLK (Input) A0 to A22 (Input) Add /ADV (Input) tADWA /CE1 (Input) tWES /WE (Input) (WC = 1) tWES tWEH /WE (Input) (WC = 0) RL = 5 DQ0 to DQ15 (Output) High-Z D0 tCLWA /WAIT (Output) 24 Preliminary Data Sheet M17507EJ2V0DS D1 μ PD46128512-X 4.10.2 Dummy Wait Cycles at Continuous Burst Operation In continuous burst operation, dummy wait cycles may be needed when a burst sequence crosses the first 16-word boundary. Whether dummy wait cycles is needed or not depends on start address and the number of dummy wait cycles depends on Read Latency (See Table 4-1. Burst Sequence and 4-2. Dummy Wait Cycles and Read Latency). During the dummy cycle period, /WAIT output LOW. Table 4-1. Burst Sequence Start Burst length = 8 Burst length = 16 Continuous Address Linear Linear Linear xx00 H 0-1-2-3-4-5-6-7 0-1-2-3-4-5-6-7-8-9-10-11-12-13-14-15 0-1-2-3-4-5-6-7-8-9-10-11-12-13-14-15-… xx01 H 1-2-3-4-5-6-7-0 1-2-3-4-5-6-7-8-9-10-11-12-13-14-15-0 1-2-3-4-5-6-7-8-9-10-11-12-13-14-15-16-… xx02 H 2-3-4-5-6-7-0-1 2-3-4-5-6-7-8-9-10-11-12-13-14-15-0-1 2-3-4-5-6-7-8-9-10-11-12-13-14-15-16-17-… xx03 H 3-4-5-6-7-0-1-2 3-4-5-6-7-8-9-10-11-12-13-14-15-0-1-2 3-4-5-6-7-8-9-10-11-12-13-14-15-16-17-18-… xx04 H 4-5-6-7-0-1-2-3 4-5-6-7-8-9-10-11-12-13-14-15-0-1-2-3 4-5-6-7-8-9-10-11-12-13-14-15-16-17-18-19-… xx05 H 5-6-7-0-1-2-3-4 5-6-7-8-9-10-11-12-13-14-15-0-1-2-3-4 5-6-7-8-9-10-11-12-13-14-15-16-17-18-19-20-… xx06 H 6-7-0-1-2-3-4-5 6-7-8-9-10-11-12-13-14-15-0-1-2-3-4-5 6-7-8-9-10-11-12-13-14-15-16-17-18-19-20-21-… xx07 H 7-0-1-2-3-4-5-6 7-8-9-10-11-12-13-14-15-0-1-2-3-4-5-6 7-8-9-10-11-12-13-14-15-16-17-18-19-20-21-22-… xx08 H 8-9-10-11-12-13-14-15-0-1-2-3-4-5-6-7 8-9-10-11-12-13-14-15-16-17-18-19-20-21-22-23-… xx09 H 9-10-11-12-13-14-15-0-1-2-3-4-5-6-7-8 9-10-11-12-13-14-15-16-17-18-19-20-21-22-23-24-… xx0A H 10-11-12-13-14-15-0-1-2-3-4-5-6-7-8-9 10-11-12-13-14-15-16-17-18-19-20-21-22-23-24-25-… xx0B H 11-12-13-14-15-0-1-2-3-4-5-6-7-8-9-10 11-12-13-14-15-W-16-17-18-19-20-21-22-23-24-25-… xx0C H 12-13-14-15-0-1-2-3-4-5-6-7-8-9-10-11 12-13-14-15-W-W-16-17-18-19-20-21-22-23-24-25-… xx0D H 13-14-15-0-1-2-3-4-5-6-7-8-9-10-11-12 13-14-15-W-W-W-16-17-18-19-20-21-22-23-24-25-… xx0E H 14-15-0-1-2-3-4-5-6-7-8-9-10-11-12-13 14-15-W-W-W-W-16-17-18-19-20-21-22-23-24-25-… xx0F H 15-0-1-2-3-4-5-6-7-8-9-10-11-12-13-14 15-W-W-W-W-W-16-17-18-19-20-21-22-23-24-25-… xx10 H … xx11 H … 16-17-18-19-20-21-22-23-24-25-26-… 17-18-19-20-21-22-23-24-25-26-27-… … … … xxnB H -xxnB -xxnC-xxnD-xxnE-xxnF-W-xx(n+1)0-xx(n+1)1-… xxnC H -xxnC-xxnD-xxnE-xxnF-W-W-xx(n+1)0-xx(n+1)1-… xxnD H -xxnD-xxnE-xxnF-W-W-W-xx(n+1)0-xx(n+1)1-… xxnE H -xxnE-xxnF-W-W-W-W-xx(n+1)0-xx(n+1)1-xx(n+1)2-… xxnF H -xxnF-W-W-W- W-W-xx(n+1)0-xx(n+1)1-xx(n+1)2-… … … … … Remarks 1. The above table assumes Read Latency is set 5. W shows Dummy Wait Cycles. 2. Address is in HEX. Preliminary Data Sheet M17507EJ2V0DS 25 μ PD46128512-X Table 4-2. Dummy Wait Cycles and Read Latency Start Read Latency Read Latency Read Latency Read Latency Read Latency Address =5 =6 =9 = 10 =n (Write Latency = 4) (Write Latency (Write Latency (Write Latency (Write Latency = 5) = 6) = 7) = n−1) xxx0 H No wait No wait … No wait No wait No wait xxx1 H No wait No wait … No wait No wait No wait xxx2 H No wait No wait … No wait No wait No wait xxx3 H No wait No wait … No wait No wait No wait xxx4 H No wait No wait … No wait No wait No wait xxx5 H No wait No wait … No wait No wait No wait xxx6 H No wait No wait … No wait 1 cycle xxx7 H xxx8 H xxx9 H No wait No wait No wait No wait No wait No wait … … … … 1 cycle 2 cycle 3 cycle 2 cycle 3 cycle 4 cycle xxxA H No wait 1 cycle … 4 cycle 5 cycle xxxB H 1 cycle 2 cycle … 5 cycle 6 cycle xxxC H xxxD H 2 cycle 3 cycle 3 cycle 4 cycle … … 6 cycle 7 cycle 7 cycle 8 cycle xxxE H 4 cycle 5 cycle … 8 cycle 9 cycle xxxF H 5 cycle 6 cycle … 9 cycle 10 cycle Remark Address is in HEX. 26 Preliminary Data Sheet M17507EJ2V0DS (n−9) Wait cycles are needed after boundary data output (n = 10). (n−8) Wait cycles are needed after boundary data output. (n =/> 9) (n−7) Wait cycles are needed after boundary data output. (n =/> 8) (n−6) Wait cycles are needed after boundary data output. (n =/> 7) (n−5) Wait cycles are needed after boundary data output. (n =/> 6) (n−4) Wait cycles are needed after boundary data output. (n =/> 5) (n−3) Wait cycles are needed after boundary data output. (n =/> 5) (n−2) Wait cycles are needed after boundary data output. (n =/> 5) (n−1) Wait cycles are needed after boundary data output. (n =/> 5) n Wait cycles are needed after boundary data output. (n =/> 5) μ PD46128512-X 4.11 Reset Function from Synchronous Burst Mode to Asynchronous Page Mode Even during the burst operation mode, the μ PD46128512-X has the reset feature of changing synchronous burst mode to asynchronous page mode. This reset is achieved by toggling CE2 signal HIGH → LOW → HIGH. This reset to asynchronous page mode can be enable / disable with mode register setting. Since the CE2 signal originally controls partial refresh function, the partial refresh operation can also be performed during the reset operation according to the density specified in the mode register. Please refer to the timing diagram and requirement below. Note that the timing requirement differs with the partial refresh density. In case when the reset to asynchronous page mode is disabled in the mode register, only the partial refresh operation can be performed with CE2 signal toggling. Refer to Figure 2-1. Standby Mode State Machine. Figure 4-11. Reset Entry Timing Chart to Asynchronous Page Mode CLK (Input) tCE2S tRST CE2 (Input) tCES tCHML tMHCL /CE1 (Input) Synchronous Burst Operation Reset to Page Standby Mode2 Parameter Symbol Reset to asynchronous page and standby mode2 entry Asynchronous Page Operation MIN. MAX. Unit Note tCHML 0 ns tMHCL 30 ns 1 300 μs 2 /CE1 HIGH to CE2 LOW Reset to asynchronous page and standby mode2 to normal operation CE2 HIGH to /CE1 LOW /CE1 = HIGH setup time to CLK tCES 5 ns CE2 = LOW hold time to CLK tCE2S 1 ns Reset time to asynchronous page mode tRST 70 ns Notes 1. 2. In case the density for partial refresh are 32M bits / 16M bits / 8M bits in standby mode2 In case the density for partial refresh is 0M bits in standby mode2 Preliminary Data Sheet M17507EJ2V0DS 27 μ PD46128512-X 5. Mode Register Settings The μPD46128512-X has several modes, Page Read mode, Burst Read mode, Burst write mode, Single Write mode, Asynchronous Write mode, Deep Power Down mode, Partial Refresh mode. Mode Resister setting defines Partial Refresh Density, Burst Length, Latency, Burst Sequence, Write mode (Burst or Single), Valid Clock Edge, Support burst write suspend/resume or not . The several modes can be set using mode register. Since the initial value of the mode register at power application is undefined, be sure to set the mode register after initialization at power application. 5.1 Mode Register Setting Method To set each mode, write any data twice, write specific data twice, read any address in succession after the highest address (7FFFFFH) is read (6 cycles in total). Cycle Operation Address Data 1st cycle Read 7FFFFFH Read Data (RDa) 2nd cycle Write 7FFFFFH RDa Note or Don’t care Note or Don’t care 3rd cycle Write 7FFFFFH RDa 4th cycle Write 7FFFFFH Code 1 5th cycle Write 7FFFFFH Code 2 6th cycle Read Don’t care Read Data (RDb) Note In order to hold the highest address (7FFFFFH) cell data during mode register setting, be sure to set the same data with 1st cycle read data in the 2nd and 3rd cycle (write cycle). Commands are written to the command register. The command register is used to latch the addresses and data required for executing commands, and it does not have an exclusive memory area. For the timing chart and flow chart, refer to Figure 9-1. Mode Register Setting Timing Chart (Asynchronous Timing + CLK fixed LOW/HIGH), Figure 9-2. Mode Register Setting Timing Chart (Asynchronous Timing + toggle CLK), Figure 9-3. Mode Register Setting Timing Char t (Synchronous Timing), Figure 9-4. Mode Register Setting Flow Chart. Table 5-1, Table 5-2 shows the commands and command sequences. 5.2 Cautions for Setting Mode Register Since, for the mode register setting, the internal counter status is judged by toggling /CE1 and /OE, toggle /CE1 at every cycle during entry (one read cycle, four write cycles and one read cycle), and toggle /OE like /CE1 at the first and the 6th read cycles. If incorrect addresses or data are written, or if addresses or data are written in the incorrect order, the setting of the mode register is not performed correctly. Cancellation of the mode register setting must be performed before the write in the 3rd bus cycle is determined. Cancellation in the 4th bus cycle or later should not be performed. If performed, data and previous register setting are not guaranteed, so the mode register must be re-setup after the 6th bus cycle is complete. When the highest address (7FFFFFH) is read consecutively two or more times, the mode register setting entries are not performed correctly. Mode setting is available after power application and read or write operation other than the highest address (7FFFFFH) are performed. Once the several modes have been set in the mode register, these settings are retained until they are set again, while applying the power supply. However, the mode register setting will become undefined except page mode (M = 1) if the power is turned off, so set the mode register again after power application. 28 Preliminary Data Sheet M17507EJ2V0DS μ PD46128512-X For the timing chart and flow chart, refer Figure 9-1. Mode Register Setting Timing Chart (Asynchronous Timing + CLK fixed LOW/HIGH), Figure 9-2. Mode Register Setting Timing Chart (Asynchronous Timing + toggle CLK), Figure 9-3. Mode Register Setting Timing Char t (Synchronous Timing), Figure 9-4. Mode Register Setting Flow Chart. Table 5-1. Mode Register Definition (4th Bus Cycle) Data Code DQ1, DQ0 DQ4 to DQ2 Symbol PS Function Partial Refresh Density BL Burst Length Value 00 32M bit 01 16M bit 10 8M bit 11 0M bit 010 8 word 011 16 word 111 Continuous Others DQ5 M DQ6 Function Mode VE Valid Clock Edge − DQ15 to DQ7 − Description Reserved 0 Burst 1 Page 0 Falling Edge 1 Rising Edge 111111111 Reserved (All “1” are necessary) Table 5-2. Mode Register Definition (5th Bus Cycle) Data Code DQ2 to DQ0 Symbol RL Function Value Read Latency 010 5 (Write Latency = 4) (Write Latency) 011 6 (5) 100 7 (6) 101 8 (7) 110 9 (8) 111 10 (9) Others DQ3 DQ4 SW DQ15 to DQ8 RP − Reserved 0 Burst Read & Burst Write 1 Burst Read & Single Write 0 Single clock control without suspend 1 Level control with suspend − 11 Reserved (All “1” are necessary) Reset to Page mode 0 Reset available to Page mode 1 Reset not available to Page mode /WE Control − DQ6, DQ5 DQ7 Single Write WC Description − 11111111 Preliminary Data Sheet M17507EJ2V0DS Reserved (All “1” are necessary) 29 μ PD46128512-X 5.3 Partial Refresh Density The density for performing refresh in power down mode can be set with mode register. Setting DQ1 and DQ0 to 00 at the 4th bus cycle sets a partial refresh density of 32 M-bit hold; setting DQ1 and DQ0 to 01 at the 4th bus cycle sets a partial refresh density of 16 M-bit hold; setting DQ1 and DQ0 to 10 at the 4th bus cycle sets a partial refresh density of 8 M-bit hold; and setting DQ1 and DQ0 to 11 at the 4th bus cycle sets a partial refresh density of 0 (no hold). Since the Partial Refresh mode is not entered unless CE2 = LOW, when partial refresh is not used, it is not necessary to set the mode register. 5.4 Burst Length Sets the burst length in the burst mode. Setting DQ4 to DQ2 to 010 at the 4th bus sets 8word of burst length; setting DQ4 to DQ2 to 011 at the 4th bus cycle sets 16word of burst length; setting DQ4 to DQ2 to 111 at the 4th bus cycle sets continuous of burst length 5.5 Function Mode Select function mode. Setting DQ5 to 0 at the 4th bus sets a function mode of burst and setting DQ5 to 1 at the 4th bus sets a function mode of page. After power application, page mode is set as an initial state. 5.6 Valid Clock Edge Select valid clock edge (Rising edge or Falling edge) in the burst mode. Setting DQ6 to 0 at the 4th bus cycle sets clock falling edge; setting DQ6 to 1 at the 4th bus cycle sets clock rising edge. 5.7 Read Latency (Write Latency) Sets the number of clock cycles (latency) between the address input and the output of the first data in the burst read mode, the address input and the write data input in the burst write mode. Setting DQ2 to DQ0 to 010 at the 5th bus cycle sets read latency of 5; setting DQ2 to DQ0 to 011 at the 5th bus sets read latency of 6; setting DQ2 to DQ0 to 100 at the 5th bus sets read latency of 7; setting DQ2 to DQ0 to 101 at the 5th bus sets read latency of 8; setting DQ2 to DQ0 to 110 at the 5th bus sets read latency of 9; setting DQ2 to DQ0 to 111 at the 5th bus sets read latency of 10. Once specific RL is set through Mode Register Setting sequence, write latency, that is the number of clock cycles between address input and first write data input, is automatically set to RL−1. For the latency count, refer to Figure 4-1. Latency Definition 5.8 Single Write Sets the write mode. Setting DQ3 to 0 at the 5th bus cycle sets burst write mode; setting DQ3 to 1 at the 5th bus cycle sets single write mode. 30 Preliminary Data Sheet M17507EJ2V0DS μ PD46128512-X 5.9 /WE Control Sets the /WE timing in burst write operation and burst write suspend / resume available or not. Setting DQ4 to 0 at the 5th bus cycle sets /WE single clock control, and burst write suspend / resume are not supported. In single clock control, /WE is available at the 1st clock edge of /ADV = LOW; setting DQ4 to 1 at the 5th bus cycle sets /WE level control, and burst write suspend / resume are supported. In level control, /WE is sure to transfer LOW to HIGH after latching last write data in burst write operation. Refer to Figure 8-8. Synchronous Burst Write Cycle Timing Chart (/WE level Control), Figure 8-9. Synchronous Burst Write Cycle Timing Chart (/WE single clock control), Figure 8-11. Synchronous Burst Write Suspend Timing Chart. 5.10 Reset to Page Mode Sets the Reset function from synchronous burst mode to asynchronous page mode. Setting DQ7 to 0 at the 5th bus cycle sets reset available from synchronous burst mode to asynchronous page mode. Setting DQ7 to 1 at the 5th bus cycle sets reset unavailable. 5.11 Reserved Bits Reserved bits must be 1 because reserved bits are used for internal test mode entry. Be sure to set DQ15 to DQ7 to 1 at the 4th and DQ15 to DQ8 and DQ6 and DQ5 at the 5th bus cycles. Preliminary Data Sheet M17507EJ2V0DS 31 μ PD46128512-X 5.12 Cautions for Timing Chart of Setting Mode Register Timing charts for setting mode register are following 3 methods. <Setting 1> Setting method by CLK fixed HIGH or LOW at asynchronous timing (asynchronous timing) <Setting 2> Setting method by toggling CLK at asynchronous timing (asynchronous timing+ toggle CLK) <Setting 3> Setting method at synchronous timing (synchronous timing) For timing chart, refer to Figure 9-1. Mode Register Setting Timing Chart (asynchronous timing+ CLK fixed LOW/HIGH), Figure 9-2. Mode Register Setting Timing Chart (asynchronous timing+ toggle CLK), Figure 9-3. Mode Register Setting Timing Chart (synchronous timing). It is recommended to set Mode Register contents through <Setting 1>, since <Setting 1> is used regardless of device status, asynchronous or synchronous. <Setting 2> procedure can be performed when the device is in the asynchronous (page) mode. In case the mode register setting is possible only with <Setting 2> procedure, “reset to page” function using the CE2 signal toggling will be required in changing the operation from synchronous (burst) mode to asynchronous (page) mode. (Refer to 4.11 Reset Function from Synchronous Burst Mode to Asynchronous Page Mode) <Setting 3> procedure can be performed when the device is in the synchronous (burst) mode. Figure 5-1. Mode Register Setting State Machine Power On Asynchronous Mode (Default) <Setting 1> <Setting 2> <Setting 1> <Setting 2> <Setting 1> <Setting 2> Asynchronous Mode Synchronous Mode <Setting 1> <Setting 3> <Setting 1> <Setting 2> 32 <Setting 1> <Setting 3> Preliminary Data Sheet M17507EJ2V0DS μ PD46128512-X 6. Electrical Specifications Absolute Maximum Ratings Parameter Supply voltage Symbol Condition Rating VCC Supply voltage for Output VCCQ Unit –0.5 Note to +2.5 V –0.5 Note to +2.5 V –0.5 Note Input / Output voltage VT to 2.5 V Operating ambient temperature TA –30 to +85 °C Storage temperature Tstg –55 to +125 °C Note –1.0 V (MIN.) (Pulse width: 30 ns) Caution Exposing the device to stress above those listed in Absolute Maximum Rating could cause permanent damage. The device is not meant to be operated under conditions outside the limits described in the operational section of this specification. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Recommended Operating Conditions Parameter Supply voltage Symbol VCC VCCQ Input HIGH voltage VIH VIL Operating ambient temperature TA Notes 1. 2. MIN. MAX. Unit 1.7 2.0 V 1.7 2.0 V 0.8VCC VCC+0.3 V 0.2VCC V +85 °C Note1 Supply voltage for Output Input LOW voltage Condition Note1 –0.3 Note2 –30 Use same voltage condition (VCC = VCCQ) –0.5 V (MIN.) (Pulse width: 30 ns) Capacitance (TA = 25°C, f = 1 MHz) Parameter Symbol Test condition MIN. TYP. MAX. Unit Input capacitance CIN VIN = 0 V 8 pF Input / Output capacitance CDQ VDQ = 0 V 10 pF Remarks 1. 2. VIN: Input voltage, VDQ: Input / Output voltage These parameters are not 100% tested. Preliminary Data Sheet M17507EJ2V0DS 33 μ PD46128512-X DC Characteristics (Recommended Operating Conditions Unless Otherwise Noted) Parameter Symbol Test condition Density of MIN. TYP. Note1 MAX. Unit data hold Input leakage current ILI VIN = 0 V to VCC –1.0 +1.0 μA DQ leakage current ILO VDQ = 0 V to VCCQ, /CE1 = VIH or –1.0 +1.0 μA mA /WE = VIL or /OE = VIH Operating supply ICCA1 current ICCA2 /CE1 = VIL, IDQ = 0 mA, Cycle time = 70 ns 60 Asynchronous mode Cycle time = 85 ns 50 /CE1 = VIL, Frequency = 83 MHz, RL = 7, 50 mA 30 mA μA IDQ = 0 mA, burst length = 1, Synchronous mode Operating supply Burst ICCA3 current /CE1 = VIL, Frequency = 83MHz, RL = 7, IDQ = 0 mA, burst length = Continuous Standby supply current ISB1 ISB2 /CE1 ≥ VCC − 0.2 V, CE2 ≥ VCC − 0.2 V /CE1 ≥ VCC − 0.2 V, CE2 ≤ 0.2 V 128M bits Note2 80 250 32M bits Note2 T.B.D. T.B.D. 16M bits Note2 T.B.D. T.B.D. T.B.D. T.B.D. 15 65 8M bits Note2 0M bit Output HIGH voltage VOH IOH = –0.5 mA Output LOW voltage VOL IOL = 1 mA Notes 1. 2. 0.8VCCQ 0.2VCCQ V TYP. means reference value measured at TA = 25°C. This value is not a guarantee value. The current measured more than 30 ms after standby mode entry (/CE1 changes from LOW to HIGH). It is specified as 2 mA (MAX.) in case of less than 30 ms after /CE1 transition. Remark VIN: Input voltage, VDQ: Input / Output voltage 34 V Preliminary Data Sheet M17507EJ2V0DS μ PD46128512-X AC Characteristics (Recommended Operating Conditions Unless Otherwise Noted) AC Test Conditions [For DQ pins] Input Waveform (Rise and Fall Time ≤ 3 ns) Vcc 0.8Vcc Vcc / 2 0.2Vcc GND Test Points Vcc / 2 tT Parameter Symbol Transition time tT Test Condition The transition time from 0.8VCC to 0.2VCC MAX. Unit 3 ns MAX. Unit 3 ns and from 0.2VCC to 0.8VCC Output Waveform VccQ / 2 Test Points VccQ / 2 Output Load 30 pF [For all other input pins] Input Waveform (Rise and Fall Time ≤ 3 ns) Vcc 0.8Vcc Vcc / 2 0.2Vcc GND Test Points Vcc / 2 tT Parameter Transition time Symbol tT Test Condition The transition time from 0.8VCC to 0.2VCC and from 0.2VCC to 0.8VCC Preliminary Data Sheet M17507EJ2V0DS 35 μ PD46128512-X 7. Asynchronous AC Specification, Timing Chart Asynchronous Read Cycle Parameter Symbol -E9X, -E11X MIN. Read cycle time tRC -E10X, -E12X MAX. 70 MIN. Unit Note ns 1 MAX. 85 Address access time tAA 70 85 /CE1 access time tACE 70 85 ns /OE to output valid tOE 45 60 ns /LB, /UB to output valid tBA Output hold from address change tOH 3 Page read cycle time tPRC 20 Page access time tPAA /CE1 to output in low impedance tCLZ 10 10 ns /OE to output in low impedance tOLZ 5 5 ns /LB, /UB to output in low impedance tBLZ 5 5 /CE1 to output in high impedance tCHZ 9 9 ns /OE to output in high impedance tOHZ 9 9 ns /LB, /UB to output in high impedance tBHZ 9 9 ns 15 ns 45 60 3 –15 ns ns 25 20 ns ns 25 ns ns Address set to /CE1 LOW tASC Address invalid time tAX –15 Address set to /OE LOW tASO 0 0 ns /OE HIGH to address hold tOHAH −5 −5 ns /CE1 HIGH to address hold tCHAH 0 0 ns 15 tCLOL −5 /OE LOW to /CE1 HIGH tOLCH 45 60 ns Address set to /ADV HIGH tASV 7 7 ns /ADV HIGH to address hold tAH 3 3 ns /ADV LOW pulse width tVPL 7 7 ns /CE1 HIGH pulse width tCP 10 10 ns /LB, /UB HIGH pulse width tBP 10 10 /OE HIGH pulse width tOP 10 /OE HIGH to /WE set tOES 10 10,000 10 10,000 ns /WE HIGH to /OE set tOEH 10 10,000 10 10,000 ns 10,000 −5 ns /CE1 LOW to /OE LOW Notes 1. +10,000 10 Output load: 30 pF 2. Output load: 5 pF 3. tAX (MAX.) is applied while /CE1, /OE and /ADV are being hold at LOW. 4. When tASO ≥ | tCHAH |, tCHAH (MIN.) is −15 ns. t CHAH Address (Input) /CE1 (Input) /OE (Input) t ASO 5. 36 tOP, tOES and tOEH (MAX.) are applied while /CE1 is being hold at LOW. Preliminary Data Sheet M17507EJ2V0DS 2 +10,000 3 4 ns ns 10,000 ns 5 μ PD46128512-X Asynchronous Write Cycle Parameter Symbol -E9X, -E11X MIN. MAX. -E10X, -E12X MIN. Unit MAX. Write cycle time tWC 70 85 ns /CE1 to end of write tCW 50 60 ns Address valid to end of write tAW 55 60 ns /LB, /UB to end of write tBW 50 60 ns Write pulse width tWP 50 55 ns Write recovery time tWR 0 0 ns Write recovery time (/WE = HIGH → /CE1 = HIGH) tWHCH 0 /CE1 pulse width tCP 10 10 ns /LB, /UB HIGH pulse width tBP 10 10 ns /WE HIGH pulse width tWHP 10 10 ns /WE HIGH pulse width (/CE1 = LOW) tWHP1 10 Address setup time tAS 0 0 ns /CE1 HIGH to address hold tCHAH 0 0 ns /LB, /UB HIGH to address hold tBHAH 0 0 ns /LB, /UB byte mask setup time tBS 0 0 ns /LB, /UB byte mask hold time tBH 0 0 ns /LB, /UB byte mask over wrap time tBWO 30 30 ns Data valid to end of write tDW 25 25 ns Data hold time tDH 0 0 ns Address set to /ADV HIGH tASV 7 7 ns /ADV HIGH to address hold tAH 3 3 ns /ADV LOW pulse width tVPL 7 7 ns /OE HIGH to /WE set tOES 10 10,000 10 10,000 ns /WE HIGH to /OE set tOEH 10 10,000 10 10,000 ns Notes 1. 10,000 10,000 0 10 Note 10,000 10,000 ns ns 1 2 When tAS ≥ | tCHAH | and tCP ≥ 18 ns, tCHAH (MIN.) is –15 ns. tCHAH Address (Input) /CE1 (Input) /OE (Input) tASO 2. tOES and tOEH (MAX.) are applied while /CE1 is being hold at LOW. Preliminary Data Sheet M17507EJ2V0DS 37 μ PD46128512-X Figure 7-1. Asynchronous Read Cycle Timing Chart 1 (Basic Timing1) tRC A1 Address (Input) /ADV (Input) L tACE tASC tCHAH /CE1 (Input) tCP tCLZ tCLOL tCHZ tOE /OE (Input) tOHZ tOLZ tBA /LB, /UB (Input) tBHZ tBLZ High-Z DQ (Output) Cautions 1. 2. High-Z Data Out Q1 In read cycle, CE2 and /WE should be fixed HIGH. CLK should be fixed HIGH or LOW. Figure 7-2. Asynchronous Read Cycle Timing Chart 2-1 (Basic Timing2-1) tRC Address (Input) A1 A2 tASV tAH tVPL /ADV (Input) tASC tVPL tASC tACE /CE1 (Input) tCP tCLOL tCHZ tOE /OE (Input) tOHZ tOLZ tBA /LB, /UB (Input) tBHZ tBLZ DQ (Output) Cautions 1. 2. 38 High-Z Data Out Q1 In read cycle, CE2 and /WE should be fixed HIGH. CLK should be fixed HIGH or LOW. Preliminary Data Sheet M17507EJ2V0DS High-Z μ PD46128512-X Figure 7-3. Asynchronous Read Cycle Timing Chart 2-2 (Basic Timing2-2) tRC Address (Input) A1 A2 tASV tAH tVPL /ADV (Input) tASC tVPL tASC tACE /CE1 (Input) tCP tCHZ /OE (Input) L tBA /LB, /UB (Input) tBHZ tBLZ High-Z DQ (Output) Cautions 1. 2. High-Z Data Out Q1 In read cycle, CE2 and /WE should be fixed HIGH. CLK should be fixed HIGH or LOW. Figure 7-4. Asynchronous Read Cycle Timing Chart 2-3 (Basic Timing2-3) Address (Input) A1 A2 tASV tAH tVPL /ADV (Input) tRC tAA /CE1 (Input) tASO L tASO tOE /OE (Input) tOHZ tOLZ tBA /LB, /UB (Input) tBHZ tBLZ DQ (Output) Cautions 1. 2. High-Z Data Out Q1 High-Z In read cycle, CE2 and /WE should be fixed HIGH. CLK should be fixed HIGH or LOW. Preliminary Data Sheet M17507EJ2V0DS 39 μ PD46128512-X Figure 7-5. Asynchronous Read Cycle Timing Chart 3 (/CE1 Controlled) tRC tRC tCHAH tACE tASC A3 A2 A1 Address (Input) tASC tCHAH tACE /CE1 (Input) tCP tCP tCLZ /OE (Input) L /LB, /UB (Input) L tCLZ tCHZ High-Z DQ (Output) tCHZ High-Z Cautions 1. High-Z Data Out Q2 Data Out Q1 In read cycle, CE2 and /WE should be fixed HIGH. 2. /ADV should be fixed LOW or toggled HIGH → LOW → HIGH. CLK should be fixed HIGH or LOW. Figure 7-6. Asynchronous Read Cycle Timing Chart 4 (/OE Controlled) tRC Address (Input) tRC tAA tAA /CE1 (Input) A3 A2 A1 L tASO tOE tASO tOHAH tOE tASO tOHAH /OE (Input) tOP tOP /LB, /UB (Input) tOLZ High-Z DQ (Output) tOLZ High-Z Data Out Q1 Cautions 1. 2. 40 tOHZ tOHZ Data Out Q2 High-Z In read cycle, CE2 and /WE should be fixed HIGH. /ADV should be fixed LOW or toggled HIGH → LOW → HIGH. CLK should be fixed HIGH or LOW. Preliminary Data Sheet M17507EJ2V0DS μ PD46128512-X Figure 7-7. Asynchronous Read Cycle Timing Chart 5 (/CE1, /OE Controlled) tRC Address (Input) tRC A2 A1 tCHAH tAA tOHAH tACE A3 tOLCH /CE1 (Input) tCHZ tCLZ tCLOL /OE (Input) tOE tOE tASO tOHZ tOHAH tASO tOHZ tOLZ tOLZ /LB, /UB (Input) High-Z DQ (Output) Cautions 1. 2. High-Z Data Out Q1 High-Z Data Out Q2 In read cycle, CE2 and /WE should be fixed HIGH. /ADV should be fixed LOW or toggled HIGH → LOW → HIGH. CLK should be fixed HIGH or LOW. Figure 7-8. Asynchronous Read Cycle Timing Chart 6 (Address Controlled) tRC tRC A2 A1 Address (Input) tAX /CE1 (Input) L /OE (Input) L /LB, /UB (Input) L tAA tAX tOH DQ (Output) tAA 2. tOH tOH Data Out Q1 Cautions 1. A3 Data Out Q2 In read cycle, CE2 and /WE should be fixed HIGH. /ADV should be fixed LOW or toggled HIGH → LOW → HIGH. CLK should be fixed HIGH or LOW. Preliminary Data Sheet M17507EJ2V0DS 41 μ PD46128512-X Figure 7-9. Asynchronous Read Cycle Timing Chart 7 (/LB, /UB Controlled) tRC tRC Address (Input) A2 A1 tAX /CE1 (Input) L /OE (Input) L tAX tAA /LB, /UB (Input) A3 tAA tBP tBP tBA tBA tBHZ tBLZ High-Z DQ (Output) Cautions 1. 2. tBHZ tBLZ High-Z Data Out Q1 High-Z Data Out Q2 In read cycle, CE2 and /WE should be fixed HIGH. /ADV should be fixed LOW or toggled HIGH → LOW → HIGH. CLK should be fixed HIGH or LOW. Figure 7-10. Asynchronous Page Read Cycle Timing Chart tRC tPRC tPRC tPRC tPRC tPRC tPRC tPRC AN+2 AN+3 AN+4 AN+5 AN+6 AN+7 Address (A4-A22) (Input) Page Address (A0-A3) (Input) AN AN+1 tOH /CE1 (Input) tCHZ tASO tOE /OE (Input) tAA tPAA tPAA tPAA tPAA tPAA tPAA tOH tOH tOH tOH tOH tOH tOH High-Z DQ (Output) QN Cautions 1. 2. 42 tOHZ tPAA QN+1 QN+2 QN+3 QN+4 QN+5 In read cycle, CE2 and /WE should be fixed HIGH. /LB and /UB should be fixed LOW. 3. /ADV should be fixed LOW. CLK should be fixed HIGH or LOW. 4. Fix /CE1 and /OE to LOW throughout a page operation. 5. Arbitrary order and combination of A0-A3 is possible in the page operation. Preliminary Data Sheet M17507EJ2V0DS QN+6 QN+7 μ PD46128512-X Figure 7-11. Asynchronous Write Cycle Timing Chart 1 (Basic Timing1) tWC A1 Address (Input) /ADV (Input) L tAS tCW tWR /CE1 (Input) tAS tWP tWR tAS tBW tWR /WE (Input) /LB, /UB (Input) tOES /OE (Input) tDW High-Z DQ (Input) Cautions 1. tDH High-Z Data In D1 During address transition, at least one of pins /CE1 and /WE, or both of /LB and /UB pins should be inactivated. 2. Do not input data to the DQ pins while they are in the output state. 3. In write cycle, CE2 and /OE should be fixed HIGH. 4. CLK should be fixed HIGH or LOW. Remark Write operation is done during the overlap time of LOW of following signals. • /CE1 • /WE • /LB and/or /UB Preliminary Data Sheet M17507EJ2V0DS 43 μ PD46128512-X Figure 7-12. Asynchronous Write Cycle Timing Chart 2 (Basic Timing2) tWC tWC A1 Address (Input) A2 tASV tAH tVPL /ADV (Input) tVPL tASC tCW tWR tAS /CE1 (Input) tAS tWP tWR tAS tAS tBW tWR tAS /WE (Input) /LB, /UB (Input) tOES /OE (Input) tDW High-Z DQ (Input) Cautions 1. tDH Data In D1 During address transition, at least one of pins /CE1 and /WE, or both of /LB and /UB pins should be inactivated. 2. Do not input data to the DQ pins while they are in the output state. 3. In write cycle, CE2 and /OE should be fixed HIGH. 4. CLK should be fixed HIGH or LOW. Remark Write operation is done during the overlap time of LOW of following signals. • /CE1 • /WE • /LB and/or /UB 44 High-Z Preliminary Data Sheet M17507EJ2V0DS μ PD46128512-X Figure 7-13. Asynchronous Write Cycle Timing Chart 3 (/CE1 Controlled) Address (Input) tAS tWC tWC A1 A2 tAS tWR tCW A3 tCW tWR /CE1 (Input) tCP /WE (Input) L /LB, /UB (Input) L tCP tASO tOHAH tOES tOEH /OE (Input) tDW High-Z DQ (Input) Cautions 1. tDH Data In D1 tDW High-Z tDH Data In D2 High-Z During address transition, at least one of pins /CE1 and /WE, or both of /LB and /UB pins should be inactivated. 2. Do not input data to the DQ pins while they are in the output state. 3. In write cycle, CE2 and /OE should be fixed HIGH. 4. /ADV should be fixed LOW or toggled HIGH → LOW → HIGH. CLK should be fixed HIGH or LOW. Remark Write operation is done during the overlap time of LOW of following signals. • /CE1 • /WE • /LB and/or /UB Preliminary Data Sheet M17507EJ2V0DS 45 μ PD46128512-X Figure 7-14. Asynchronous Write Cycle Timing Chart 4 (/WE Controlled) tWC Address (Input) tWC A3 A2 A1 tCHAH tCW tCHAH tCW /CE1 (Input) tAS tWP tWHCH /WE (Input) tCP tAS tWP tWHCH tCP tWHP /LB, /UB (Input) tOHAH tASO tOES tOEH /OE (Input) tDW High-Z DQ (Input) Cautions 1. tDH Data In D1 tDW High-Z tDH Data In D2 High-Z During address transition, at least one of pins /CE1 and /WE, or both of /LB and /UB pins should be inactivated. 2. Do not input data to the DQ pins while they are in the output state. 3. In write cycle, CE2 and /OE should be fixed HIGH. 4. /ADV should be fixed LOW or toggled HIGH → LOW → HIGH. CLK should be fixed HIGH or LOW. Remark Write operation is done during the overlap time of LOW of following signals. • /CE1 • /WE • /LB and/or /UB 46 Preliminary Data Sheet M17507EJ2V0DS μ PD46128512-X Figure 7-15. Asynchronous Write Cycle Timing Chart 5 (/WE Controlled) Address (Input) tWC tWC A1 A2 tAW /CE1 (Input) A3 tAW L tAS tWP tWR tAS tWP tWR /WE (Input) tWHP1 /LB, /UB (Input) tOHAH tASO tOES tOEH /OE (Input) tDW High-Z DQ (Input) Cautions 1. tDH Data In D1 tDW High-Z tDH Data In D2 High-Z During address transition, at least one of pins /CE1 and /WE, or both of /LB and /UB pins should be inactivated. 2. Do not input data to the DQ pins while they are in the output state. 3. In write cycle, CE2 and /OE should be fixed HIGH. 4. /ADV should be fixed LOW or toggled HIGH → LOW → HIGH. CLK should be fixed HIGH or LOW. Remark Write operation is done during the overlap time of LOW of following signals. • /CE1 • /WE • /LB and/or /UB Preliminary Data Sheet M17507EJ2V0DS 47 μ PD46128512-X Figure 7-16. Asynchronous Write Cycle Timing Chart 6 (/LB, /UB Controlled) Address (Input) /CE1 (Input) tWC tWC A1 A2 A3 L /WE (Input) tAS tBW /LB, /UB (Input) tBW tAS tWR tWR tBP tBP tOHAH tASO tOES tOEH /OE (Input) tDW High-Z DQ (Input) Cautions 1. tDH Data In D1 tDW High-Z tDH Data In D2 High-Z During address transition, at least one of pins /CE1 and /WE, or both of /LB and /UB pins should be inactivated. 2. Do not input data to the DQ pins while they are in the output state. 3. In write cycle, CE2 and /OE should be fixed HIGH. 4. /ADV should be fixed LOW or toggled HIGH → LOW → HIGH. CLK should be fixed HIGH or LOW. Remark Write operation is done during the overlap time of LOW of following signals. • /CE1 • /WE • /LB and/or /UB 48 Preliminary Data Sheet M17507EJ2V0DS μ PD46128512-X Figure 7-17. Asynchronous Write Cycle Timing Chart 7 (/LB, /UB Independent Controlled 1) Address (Input) /CE1 (Input) tWC tWC A1 A2 A3 L /WE (Input) tAS tWR tBW /LB (Input) tAS /UB (Input) tBW tWR tBP tOHAH tASO tOES tOEH /OE (Input) tDW High-Z DQ0 to DQ7 (Input) tDH Data In D1 High-Z tDW High-Z DQ8 to DQ15 (Input) Cautions 1. tDH Data In D2 High-Z During address transition, at least one of pins /CE1 and /WE, or both of /LB and /UB pins should be inactivated. 2. Do not input data to the DQ pins while they are in the output state. 3. In write cycle, CE2 and /OE should be fixed HIGH. 4. /ADV should be fixed LOW or toggled HIGH → LOW → HIGH. CLK should be fixed HIGH or LOW. Remark Write operation is done during the overlap time of LOW of following signals. • /CE1 • /WE • /LB and/or /UB Preliminary Data Sheet M17507EJ2V0DS 49 μ PD46128512-X Figure 7-18. Asynchronous Write Cycle Timing Chart 8 (/LB, /UB Independent Controlled 2) Address (Input) /CE1 (Input) tWC tWC A1 A2 A3 L tBW tAS tWR /WE (Input) tWP tBH tWR /LB (Input) tBS tAS /UB (Input) tBP tASO tOHAH tOES tOEH /OE (Input) tDW High-Z DQ0 to DQ7 (Input) tDH Data In D1 High-Z tDW High-Z DQ8 to DQ15 (Input) Cautions 1. tDH Data In D2 High-Z During address transition, at least one of pins /CE1 and /WE, or both of /LB and /UB pins should be inactivated. 2. Do not input data to the DQ pins while they are in the output state. 3. In write cycle, CE2 and /OE should be fixed HIGH. 4. /ADV should be fixed LOW or toggled HIGH → LOW → HIGH. CLK should be fixed HIGH or LOW. Remark Write operation is done during the overlap time of LOW of following signals. • /CE1 • /WE • /LB and/or /UB 50 Preliminary Data Sheet M17507EJ2V0DS μ PD46128512-X Figure 7-19. Asynchronous Write Cycle Timing Chart 9 (/LB, /UB Independent Controlled 3) Address (Input) /CE1 (Input) tWC tWC A1 A2 A3 L tAS tWP tAS tWR tWP tWR /WE (Input) tWHP1 tBH tBS /LB (Input) tBH tBS /UB (Input) tOHAH tASO tOES tOEH /OE (Input) tDW High-Z DQ0 to DQ7 (Input) tDH High-Z Data In D1 tDW High-Z DQ8 to DQ15 (Input) Cautions 1. tDH Data In D2 High-Z During address transition, at least one of pins /CE1 and /WE, or both of /LB and /UB pins should be inactivated. 2. Do not input data to the DQ pins while they are in the output state. 3. In write cycle, CE2 and /OE should be fixed HIGH. 4. /ADV should be fixed LOW or toggled HIGH → LOW → HIGH. CLK should be fixed HIGH or LOW. Remark Write operation is done during the overlap time of LOW of following signals. • /CE1 • /WE • /LB and/or /UB Preliminary Data Sheet M17507EJ2V0DS 51 μ PD46128512-X Figure 7-20. Asynchronous Write Cycle Timing Chart 10 (/LB, /UB Independent Controlled 4) Address (Input) /CE1 (Input) tWC tWC A1 A2 A3 L tAS tWR tBW tAS tBW tWR /WE (Input) tWHP1 tBH tBS /LB (Input) tBS tBH /UB (Input) tOHAH tASO tOES tOEH /OE (Input) tDW High-Z DQ0 to DQ7 (Input) tDH High-Z Data In D1 tDW High-Z DQ8 to DQ15 (Input) Cautions 1. tDH Data In D2 High-Z During address transition, at least one of pins /CE1 and /WE, or both of /LB and /UB pins should be inactivated. 2. Do not input data to the DQ pins while they are in the output state. 3. In write cycle, CE2 and /OE should be fixed HIGH. 4. /ADV should be fixed LOW or toggled HIGH → LOW → HIGH. CLK should be fixed HIGH or LOW. Remark Write operation is done during the overlap time of LOW of following signals. • /CE1 • /WE • /LB and/or /UB 52 Preliminary Data Sheet M17507EJ2V0DS μ PD46128512-X Figure 7-21. Asynchronous Write Cycle Timing Chart 11 (/LB, /UB Independent Controlled 5) Address (Input) /CE1 (Input) tWC tWC A1 A2 A3 L tAS tBW tAS tWR tBW tWR /WE (Input) tWHP1 tBS tBH /LB (Input) tBS tBH /UB (Input) tOHAH tASO tOES tOEH /OE (Input) tDW High-Z DQ0 to DQ7 (Input) tDH High-Z Data In D1 tDW High-Z DQ8 to DQ15 (Input) Cautions 1. tDH Data In D2 High-Z During address transition, at least one of pins /CE1 and /WE, or both of /LB and /UB pins should be inactivated. 2. Do not input data to the DQ pins while they are in the output state. 3. In write cycle, CE2 and /OE should be fixed HIGH. 4. /ADV should be fixed LOW or toggled HIGH → LOW → HIGH. CLK should be fixed HIGH or LOW. Remark Write operation is done during the overlap time of LOW of following signals. • /CE1 • /WE • /LB and/or /UB Preliminary Data Sheet M17507EJ2V0DS 53 μ PD46128512-X Figure 7-22. Asynchronous Write Cycle Timing Chart 12 (/LB, /UB Independent Controlled 6) tWC Address (Input) tWC A1 /CE1 (Input) A3 A2 L /WE (Input) tBW tAS tAS tWR tWR tBW /LB (Input) tAS tBW tWR tAS tBWO tBW tWR tBWO /UB (Input) tOHAH tASO tOES tOEH /OE (Input) tDW High-Z DQ0 to DQ7 (Input) Data In D1 tDW High-Z DQ8 to DQ15 (Input) Cautions 1. tDW tDH tDH Data In D1 tDH Data In D2 tDW High-Z tDH Data In D2 High-Z During address transition, at least one of pins /CE1 and /WE, or both of /LB and /UB pins should be inactivated. 2. Do not input data to the DQ pins while they are in the output state. 3. In write cycle, CE2 and /OE should be fixed HIGH. 4. /ADV should be fixed LOW or toggled HIGH → LOW → HIGH. CLK should be fixed HIGH or LOW. Remark Write operation is done during the overlap time of LOW of following signals. • /CE1 • /WE • /LB and/or /UB 54 Preliminary Data Sheet M17507EJ2V0DS μ PD46128512-X Figure 7-23. Asynchronous Write-Read Cycle Timing Chart tWC Address (Input) tRC A1 tAS tCW tRC tAA /CE1 (Input) tCHZ tAS tWP /WE (Input) tOEH tOE tOHZ /OE (Input) tOLZ tAS tBW tBHZ /LB, /UB (Input) tDW High-Z DQ (Input/Output) Cautions 1. tDH Data In D1 High-Z Data Out Q1 High-Z During address transition, at least one of pins /CE1 and /WE, or both of /LB and /UB pins should be inactivated. 2. Do not input data to the DQ pins while they are in the output state. 3. In write cycle, CE2 and /OE should be fixed HIGH. 4. /ADV should be fixed LOW or toggled HIGH → LOW → HIGH. CLK should be fixed HIGH or LOW. Remark Write operation is done during the overlap time of LOW of following signals. • /CE1 • /WE • /LB and/or /UB Preliminary Data Sheet M17507EJ2V0DS 55 μ PD46128512-X Figure 7-24. Asynchronous Read-Write Cycle Timing Chart tRC tRC tWC Address (Input) A1 tAA tWR tACE tCW /CE1 (Input) tCLZ tWP tWR /WE (Input) tASO tOE tOES /OE (Input) tOLZ tOHZ tWR tBA tBW /LB, /UB (Input) tBLZ tDW High-Z DQ (Input/Output) Cautions 1. High-Z Data Out Q1 tDH Data In D1 High-Z During address transition, at least one of pins /CE1 and /WE, or both of /LB and /UB pins should be inactivated. 2. Do not input data to the DQ pins while they are in the output state. 3. In write cycle, CE2 and /OE should be fixed HIGH. 4. /ADV should be fixed LOW or toggled HIGH → LOW → HIGH. CLK should be fixed HIGH or LOW. Remark Write operation is done during the overlap time of LOW of following signals. • /CE1 • /WE • /LB and/or /UB 56 Preliminary Data Sheet M17507EJ2V0DS μ PD46128512-X 8. Synchronous AC Specification, Timing Chart Synchronous Read / Write Common Specification Parameter Symbol -E9X, -E10X -E11X, -E12X MIN. MAX. MIN. MAX. 0.1 108 0.1 83 Unit Note MHz 1 Clock Specifications Cycle frequency tCYCLE CLK HIGH width tCH 3 3 ns CLK LOW width tCL 3 3 ns CLK rise / fall time tCHCL 3 3 ns Address Latching Specifications Address setup time to CLK tACS 5 5 ns Address hold time to CLK tACH 4 4 ns /ADV setup time to CLK tCSV 5 /ADV hold time from CLK tCHV 1 1 ns /ADV = LOW pulse width tVPL 7 7 ns Address hold time from /ADV = HIGH tAH 3 3 ns /CE1 setup time to CLK tCES 5 5 ns /CE1 to output in low impedance tCLZ 10 10 ns /OE to output in low impedance tOLZ 5 5 ns /LB, /UB to output in low impedance tBLZ 5 5 ns /CE1 to output in high impedance tCHZ 9 9 ns /OE to output in high impedance tOHZ 9 9 ns /LB, /UB to output in high impedance tBHZ 9 9 ns /WAIT output time from /CE1 = LOW tCEWA 10 13 ns /WAIT output time from /ADV = LOW tADWA 10 13 ns /WAIT = HIGH output time from CLK tCLWA 7 8 ns /WAIT in high impedance from /CE1 = HIGH tCWHZ 10 10 ns 10,000 5 10,000 ns Asynchronous Specification 2 /WAIT Specification 3 2 Others /CE1 hold time tCEH 1 1 ns /LB, /UB hold time tLUH 1 1 ns /CE1 HIGH pulse width tCP 10 10 ns Notes 1. Case BL (Burst Length) = Continuous : 2 MHz (MIN.) 2. Output load: 5 pF 3. Output load: 30 pF Preliminary Data Sheet M17507EJ2V0DS 57 μ PD46128512-X Synchronous Burst Read Cycle Parameter Symbol -E9X, -E10X MIN. MAX. -E11X, -E12X MIN. Unit Note ns 1 MAX. Synchronous Read Specifications Burst access time tBACC Output data hold time tBDH 2 2 ns /OE setup time to CLK for data output tOC 30 30 ns /LB, /UB setup time to CLK for data output tBC 30 30 ns /OE setup time for burst read suspend tSOES 5 5 ns /OE hold time for burst read suspend tSOEH 1 1 ns Burst read suspend time (/OE = HIGH) tSOP 9 Burst read termination recovery time tTRB 18 Note1. 7 10,000 8 12 10,000 24 ns ns Output load: 30 pF Synchronous Burst Write Cycle Parameter Symbol -E9X, -E10X MIN. MAX. -E11X, -E12X MIN. Unit MAX. Synchronous Write Specifications /LB, /UB setup time to CLK tBC 30 30 ns tWES 5 5 ns tWEH 1 1 ns Write data setup time tWDS 5 5 ns Write data hold time tWDH 1 1 ns /WE HIGH pulse width tSWHP 9 tWRB 2 2 CLK tTRB 18 24 ns for latching data /WE setup time for CLK (In /WE single clock control operation) (In burst write suspend operation) /WE hold time in the write operation (In /WE single clock control operation) (In burst write suspend operation) /ADV LOW from CLK for latching the latest data Burst write termination recovery time 58 10,000 Preliminary Data Sheet M17507EJ2V0DS 12 10,000 ns Note μ PD46128512-X Figure 8-1. Synchronous CLK Input Timing Chart tCL tCYCLE tCH tCHCL VIH CLK (Input) VIL Figure 8-2. Synchronous Burst Read Cycle Timing Chart (/CE1 Control) T0 T1 T2 T3 T4 T5 T6 Tm Tn T0 T1 T2 T3 T4 tCYCLE CLK (Input) tCH tACH tACS tCL tCHCL tCHCL tACS tACH Valid Valid Address (Input) tAH tAH tCHV tCSV tCHV tCHV tCSV tCHV /ADV (Input) tVPL tVPL tCES tCES tCLZ tCEH tCLZ tCEWA /CE1 (Input) tCP tCEWA tCWHZ /OE (Input) L /WE (Input) H /LB, /UB (Input) L tCLWA High-Z High-Z /WAIT (Output) tCHZ RL = 5 tBACC High-Z DQ (Output) Remarks 1. tBDH tBDH Q0 Q1 QBL High-Z The above timing chart assumes Read Latency is 5 and Burst Length is 8 or 16. QBL means the latest data out of burst length. 2. CE2 should be fixed HIGH. 3. Valid clock edge is the rising edge. Preliminary Data Sheet M17507EJ2V0DS 59 μ PD46128512-X Figure 8-3. Synchronous Burst Read Cycle Timing Chart (/ADV Control) T0 T1 T2 T3 T4 T5 T6 Tm Tn T0 T1 T2 T3 tCYCLE CLK (Input) tACH tACS tCH tCL tCHCL tCHCL tACS tACH Valid Valid Address (Input) tAH tAH tCHV tCSV tCHV tCHV tCSV tCHV /ADV (Input) tVPL tVPL tADWA /CE1 (Input) L /OE (Input) L /WE (Input) H /LB, /UB (Input) L tADWA tCLWA tCLWA /WAIT (Output) RL = 5 tBACC DQ (Output) tBDH Q0 Remarks 1. tBDH Q1 QBL The above timing chart assumes Read Latency is 5 and Burst Length is 8 or 16. QBL means the latest data out of burst length. 60 2. CE2 should be fixed HIGH. 3. Valid clock edge is the rising edge. Preliminary Data Sheet M17507EJ2V0DS T4 μ PD46128512-X Figure 8-4. Synchronous Burst Read Cycle Timing Chart (/OE Control) T0 T1 T2 T3 T4 T5 T6 Tm Tn T0 T1 T2 T3 T4 tCYCLE CLK (Input) tACS tCH tACH tCL tCHCL tCHCL tACS Valid Address (Input) tACH Valid tAH tAH tCHV tCSV tCHV tCHV tCSV tCHV /ADV (Input) tVPL tVPL tADWA /CE1 (Input) tADWA L tSOEH tOC /OE (Input) tOLZ /WE (Input) tOHZ tOLZ tBHZ tBLZ H tBC /LB, /UB (Input) tBLZ tCLWA tCLWA /WAIT (Output) RL = 5 tBACC High-Z DQ (Output) Remarks 1. tBDH Q0 tBDH Q1 QBL High-Z The above timing chart assumes Read Latency is 5 and Burst Length is 8 or 16. QBL means the latest data out of burst length. 2. CE2 should be fixed HIGH. 3. Valid clock edge is the rising edge. 4. tOC and tBC are defined from CLK rising edge of RL−1 to /OE = LOW, /LB and /UB = LOW. Preliminary Data Sheet M17507EJ2V0DS 61 μ PD46128512-X Figure 8-5. Synchronous Burst /WAIT Timing Chart (Continuous) T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 tCYCLE CLK (Input) tACS tCH tACH tCL tCHCL tCHCL ADDmf Address (Input) tAH tCHV tCSV tCHV /ADV (Input) tVPL tCES /CE1 (Input) tCEWA tCLZ tOC /OE (Input) tOLZ /WE (Input) H tBC /LB, /UB (Input) tBLZ tCLWA tCLWA tCLWA High-Z /WAIT (Output) RL = 5 tBACC High-Z DQ (Output) Remarks 1. tBDH Qmf Qn1 The above timing chart assumes Burst length is continuous. 2. CE2 should be fixed HIGH. 3. Valid clock edge is the rising edge. 4. tOC and tBC are defined from CLK rising edge of RL−1 to /OE = LOW, /LB and /UB = LOW. 5. The above timing chart assumes Read Latency is 5 and start address is from xxxfH and the number of dummy wait cycles are 5 cycles. 62 Qn0 Preliminary Data Sheet M17507EJ2V0DS μ PD46128512-X Figure 8-6. Synchronous Burst Read Suspend Timing Chart T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 tCYCLE CLK (Input) tACS tCH tACH tCL tCHCL tCHCL Valid Address (Input) tAH tCHV tCSV tCHV /ADV (Input) tVPL tCES tCLZ tCEWA /CE1 (Input) tOC tSOEH tSOES tSOEH tSOES tOLZ /OE (Input) tSOP /WE (Input) H tBC tBLZ /LB, /UB (Input) tCLWA High-Z /WAIT (Output) RL = 5 tBACC High-Z DQ (Output) Remarks 1. tBDH Q0 tBACC High-Z tBDH Q1 Q2 Q3 Q4 The above timing chart assumes Read Latency is 5 and Burst Length is 8 or 16. 2. CE2 should be fixed HIGH. 3. Valid clock edge is the rising edge. 4. tOC and tBC are defined from CLK rising edge of RL−1 to /OE = LOW, /LB and /UB = LOW. 5. Burst read suspend is valid after outputting the first read access data (Q0). Preliminary Data Sheet M17507EJ2V0DS 63 μ PD46128512-X Figure 8-7. Synchronous Burst Read Termination Cycle Timing Chart T0 T1 T2 T3 T4 T0 T1 T2 T3 tCYCLE CLK (Input) tACS tCH tACH tCL tCHCL tCHCL Valid Address (Input) tACS tACH Valid tAH tAH tCHV tCSV tCHV tCHV tCSV tCHV /ADV (Input) tVPL tVPL tCES tCES tCLZ tCLZ tCEH tCES tCEWA tCEWA /CE1 (Input) tTRB tOC tOLZ /OE (Input) /WE (Input) H tBC tBLZ /LB, /UB (Input) tCWHZ tCLWA High-Z High-Z /WAIT (Output) tCHZ RL = 5 tBACC High-Z Remarks 1. 64 tBDH Q0 DQ (Output) High-Z The above timing chart assumes Read Latency is 5. 2. CE2 should be fixed HIGH. 3. Valid clock edge is the rising edge. 4. tOC and tBC are defined from CLK rising edge of RL−1 to /OE = LOW, /LB and /UB = LOW. 5. tTRB is specified from /CE1 de-assert to /CE1 assert for next operation. 6. Burst read termination is valid after outputting the first read access data (Q0). 7. In case continuous burst read is set, /CE1 de-assert is needed for burst read termination. Preliminary Data Sheet M17507EJ2V0DS T4 μ PD46128512-X Figure 8-8. Synchronous Burst Write Cycle Timing Chart (/WE Level Control) T0 T1 T2 T3 T4 T5 Tl Tm Tn T0 T1 tCYCLE CLK (Input) tACS tACH tCH tCL tACS Valid Address (Input) tACH Valid tAH tAH tCHV tCSV tCHV tCHV tCSV tCHV /ADV (Input) tVPL tVPL tWRB tCES tCEH tCES tCEWA tCEH tCWHZ tCEWA /CE1 (Input) /OE (Input) H tWEH tWES /WE (Input) tLUH tBC /LB, /UB (Input) tCLWA /WAIT (Output) High-Z High-Z RL = 5 tWDS tWDH DQ (Input) Remarks 1. High-Z D0 D1 DBL High-Z The above timing chart assumes Read Latency is 5 and Burst Length is 8 or 16. DBL means the latest data input of burst length. 2. CE2 should be fixed HIGH. 3. Valid clock edge is the rising edge. 4. tBC is defined from CLK rising edge of RL−1 to /LB and /UB = LOW. Preliminary Data Sheet M17507EJ2V0DS 65 μ PD46128512-X Figure 8-9. Synchronous Burst Write Cycle Timing Chart (/WE Single Clock Control) T0 T1 T2 T3 T4 T5 Tl Tm Tn T0 T1 tCYCLE CLK (Input) tACS tACH tCH tCL tACS Valid Address (Input) tACH Valid tAH tAH tCHV tCSV tCHV tCHV tCSV tCHV /ADV (Input) tVPL tVPL tWRB tCES tCEH tCES tCEWA tCEH tCWHZ tCEWA /CE1 (Input) /OE (Input) H tWES tWEH tWES tWEH /WE (Input) tLUH tBC /LB, /UB (Input) tCLWA /WAIT (Output) High-Z High-Z RL = 5 tWDS tWDH DQ (Input) Remarks 1. High-Z D0 D1 DBL The above timing chart assumes Read Latency is 5 and Burst Length is 8 or 16. DBL means the latest data input of burst length. 66 2. CE2 should be fixed HIGH. 3. Valid clock edge is the rising edge. 4. tBC is defined from CLK rising edge of RL−1 to /LB and /UB = LOW. Preliminary Data Sheet M17507EJ2V0DS High-Z μ PD46128512-X Figure 8-10. Synchronous Single Write Cycle Timing Chart (/WE level Control) T0 T1 T2 T3 T4 T0 T1 T2 T3 tCYCLE CLK (Input) tCH tACH tACS tCL tACS Valid Valid Address (Input) tACH tAH tAH tCHV tCSV tCHV tCHV tCSV tCHV /ADV (Input) tVPL tVPL tWRB tADWA tCEH tCES tCES /CE1 (Input) tCEWA /OE (Input) tCEWA H tWEH tWES /WE (Input) tBC tLUH /LB, /UB (Input) tCLWA High-Z /WAIT (Output) RL = 5 tWDS tWDH High-Z D0 DQ (Input) Remarks 1. High-Z The above timing chart assumes Read Latency is 5. 2. CE2 should be fixed HIGH. 3. Valid clock edge is the rising edge. 4. tBC is defined from CLK rising edge of RL−1 to /LB and /UB = LOW. Preliminary Data Sheet M17507EJ2V0DS 67 μ PD46128512-X Figure 8-11. Synchronous Burst Write Suspend Timing Chart T0 T1 T2 T3 T4 T5 T6 T7 T8 tCYCLE CLK (Input) tACS tACH tCH tCL tCHCL tCHCL Valid Address (Input) tAH tCHV tCSV tCHV /ADV (Input) tVPL tCES tCEWA /CE1 (Input) /OE (Input) H tWEH tWES tWES tWEH tWES /WE (Input) tSWHP tBC /LB, /UB (Input) tCLWA High-Z /WAIT (Output) RL = 5 tWDS tWDH High-Z DQ (Input) Remarks 1. 68 D0 tWDS tWDH High-Z The above timing chart assumes Read Latency is 5. 2. CE2 should be fixed HIGH. 3. Valid clock edge is the rising edge. 4. tBC is defined from CLK rising edge of RL−1 to /LB and /UB = LOW. 5. Burst write suspend is valid after latching the first write data Preliminary Data Sheet M17507EJ2V0DS D1 D2 D3 D4 T9 μ PD46128512-X Figure 8-12. Synchronous Burst Write Termination Timing Chart T0 T1 T2 T3 T4 T0 T1 T2 T3 T4 tCYCLE CLK (Input) tCH tCL tCHCL tCHCL tACH tACS tACS tACH Valid Valid Address (Input) tAH tAH tCHV tCSV tCHV tCHV tCSV tCHV /ADV (Input) tVPL tWRB tVPL tCES tCES tCEH tCES tCEWA tCEWA /CE1 (Input) tTRB /OE (Input) H tWES /WE (Input) tBC /LB, /UB (Input) tCWHZ tCLWA tCLWA High-Z High-Z /WAIT (Output) RL = 5 tWDS tWDH High-Z D0 DQ (Input/Output) Remarks 1. tWDS tWDH High-Z D0 High-Z The above timing chart assumes Read Latency is 5. 2. CE2 should be fixed HIGH. 3. Valid clock edge is the rising edge. 4. tBC is defined from CLK rising edge of RL−1 to /LB and /UB = LOW. 5. Burst write suspend is valid after latching the first write data 6. In case continuous burst write is set, /CE1 de-assert is needed for burst write termination. Preliminary Data Sheet M17507EJ2V0DS 69 μ PD46128512-X Figure 8-13. Synchronous Burst Read – Burst Write Cycle Timing Chart (/CE1 Control) tCYCLE CLK (Input) tCH tCL tACH tACS Valid Address (Input) tAH tCHV tCSV tCHV /ADV (Input) tVPL tCES tCEWA tCEH tCEH /CE1 (Input) tCP tCHZ tCWHZ tCWHZ tSOEH /OE (Input) tOHZ tWES tWEH /WE (Input) tLUH tLUH tBC /LB, /UB (Input) tCLWA tBHZ High-Z /WAIT (Output) High-Z RL = 5 tBACC DQ (Input/Output) Remarks 1. tBDH tWDS tWDH High-Z QBL D0 DBL The above timing chart assumes Read Latency is 5 and Burst Length is 8 or 16. QBL means the latest data out of burst length. DBL means the latest data input of burst length. 70 2. CE2 should be fixed HIGH. 3. Valid clock edge is the rising edge. 4. tBC is defined from CLK rising edge of RL−1 to /LB and /UB = LOW. Preliminary Data Sheet M17507EJ2V0DS High-Z μ PD46128512-X Figure 8-14. Synchronous Burst Read – Burst Write Cycle Timing Chart (/ADV Control) tCYCLE CLK (Input) tCH tCL tACH tACS Valid Address (Input) tAH tCHV tCSV tCHV /ADV (Input) tVPL /CE1 (Input) L tSOEH /OE (Input) tOHZ tWES tWEH /WE (Input) tLUH tLUH tBC /LB, /UB (Input) tBHZ tCLWA tADWA High-Z /WAIT (Output) RL = 5 tBACC DQ (Input/Output) Remarks 1. tBDH tWDS tWDH High-Z QBL D0 DBL High-Z The above timing chart assumes Read Latency is 5 and Burst Length is 8 or 16. QBL means the latest data out of burst length. DBL means the latest data input of burst length. 2. CE2 should be fixed HIGH. 3. Valid clock edge is the rising edge. 4. tBC is defined from CLK rising edge of RL−1 to /LB and /UB = LOW. Preliminary Data Sheet M17507EJ2V0DS 71 μ PD46128512-X Figure 8-15. Synchronous Burst Write – Burst Read Cycle Timing Chart (/CE1 Control) tCYCLE CLK (Input) tCH tCL tACS tACH Valid Address (Input) tAH tCHV tCSV tCHV /ADV (Input) tWRB tVPL tCES tCEH tCLZ /CE1 (Input) tCP tCEWA tCWHZ tOC /OE (Input) tOLZ tWEH /WE (Input) tLUH tBC /LB, /UB (Input) tBLZ tCLWA High-Z /WAIT (Output) RL = 5 tWDS tWDH DQ (Input/Output) Remarks 1. tBACC High-Z DBL tBDH Q0 The above timing chart assumes Read Latency is 5 and Burst Length is 8 or 16. DBL means the latest data input of burst length. 72 2. CE2 should be fixed HIGH. 3. Valid clock edge is the rising edge. 4. tOC and tBC are defined from CLK rising edge of RL−1 to /OE = LOW, /LB and /UB = LOW. Preliminary Data Sheet M17507EJ2V0DS μ PD46128512-X Figure 8-16. Synchronous Burst Write – Burst Read Cycle Timing Chart (/ADV Control) tCYCLE CLK (Input) tCH tCL tACS tACH Valid Address (Input) tAH tCHV tCSV tCHV /ADV (Input) tWRB /CE1 (Input) tVPL L tOC /OE (Input) tOLZ tWEH /WE (Input) tLUH tBC /LB, /UB (Input) tBLZ tADWA tCLWA /WAIT (Output) RL = 5 tWDS tWDH DQ (Input/Output) Remarks 1. tBACC High-Z DBL tBDH Q0 The above timing chart assumes Read Latency is 5 and Burst Length is 8 or 16. DBL means the latest data input of burst length. 2. CE2 should be fixed HIGH. 3. Valid clock edge is the rising edge. 4. tOC and tBC are defined from CLK rising edge of RL−1 to /OE = LOW, /LB and /UB = LOW. Preliminary Data Sheet M17507EJ2V0DS 73 μ PD46128512-X 9. Mode Register Setting Timing Figure 9-1. Mode Register Setting Timing Chart (Asynchronous Timing + CLK fixed LOW/HIGH) H CLK (Input) L Address (Input) tRC tWC tWC tWC tWC tRC 7FFFFFH 7FFFFFH 7FFFFFH 7FFFFFH 7FFFFFH Don't care /CE1 (Input) tCE tCHZ tOE tOHZ tCE tCHZ tOE tOHZ /OE (Input) tWP tWR tWP tWR tWP tWR tWP tWR /WE (Input) tDW DQ (Input/Output) High-Z RDa tDW tDH High-Z tDH High-Z Don't care tDW tDH High-Z tDW tDH High-Z High-Z Code1 Don't care High-Z Code2 RDb /LB, /UB (Input) Remarks 1. For the data of Code1 and Code2, refer to Table 5-1. Mode Register Definition (4th Bus Cycle) and Table 5-2. Mode Register Definition (5th Bus Cycle). 2. RDa and RDb are the output data. 3. /ADV fixed LOW or toggle HIGH → LOW → HIGH. Figure 9-2. Mode Register Setting Timing Chart (Asynchronous Timing + Toggle CLK) CLK (Input) Address (Input) tRC tWC tWC tWC tWC tRC 7FFFFFH 7FFFFFH 7FFFFFH 7FFFFFH 7FFFFFH Don't care /CE1 (Input) tCE tCHZ tOE tOHZ tCE tCHZ tOE tOHZ /OE (Input) tWP tWR tWP tWR tWP tWR tWP tWR /WE (Input) tDW DQ (Input/Output) High-Z RDa tDW tDH High-Z tDH High-Z Don't care tDW tDH High-Z Don't care tDW tDH High-Z High-Z Code1 Code2 High-Z RDb /LB, /UB (Input) Remarks 1. For the data of Code1 and Code2, refer to Table 5-1. Mode Register Definition (4th Bus Cycle) and Table 5-2. Mode Register Definition (5th Bus Cycle). 74 2. RDa and RDb are the output data. 3. /ADV fixed LOW or toggle HIGH → LOW → HIGH. Preliminary Data Sheet M17507EJ2V0DS μ PD46128512-X Figure 9-3. Mode Register Setting Timing Chart (Synchronous Timing) CLK (Input) Address (Input) *A High-Z *A High-Z *A High-Z *A High-Z *A High-Z Don't care High-Z /ADV (Input) /CE1 (Input) /OE (Input) /WE (Output) /LB, /UB (Input) DQ (Input/Output) High-Z RDa High-Z Don't care High-Z Don't care High-Z Code1 High-Z Code2 High-Z RDb High-Z Caution Refer to 8. Synchronous Read/Write specification. Remarks 1. 2. *A means the highest address (7FFFFFH). For the data of Code1 and Code2, refer to Table 5-1. Mode Register Definition (4th Bus Cycle) and Table 5-2. Mode Register Definition (5th Bus Cycle). 3. RDa and RDb are the output data. Preliminary Data Sheet M17507EJ2V0DS 75 μ PD46128512-X Figure 9-4. Mode Register Setting Flow Chart Start No Read Operation Address = 7FFFFFH toggled the /CE1 and /OE Yes No Write Operation Address = 7FFFFFH toggled the /CE1 Yes No Write Operation Address = 7FFFFFH toggled the /CE1 Yes Write Operation Address = 7FFFFFH toggled the /CE1 Mode Register Setting Exit No Yes Write Data = Code 1 Note1 No Yes Write Operation Address = 7FFFFFH toggled the /CE1 No Yes Write Data = Code 2 Note2 No Yes Read Operation Address = Don't Care toggled the /CE1 and /OE End Notes 1. Refer to Table 5-1. 2. Refer to Table 5-2. 76 Preliminary Data Sheet M17507EJ2V0DS Re-setup the mode register μ PD46128512-X 10. Standby Mode Timing Chart Figure 10-1. Standby Mode 2 Entry / Exit Timing Chart (Asynchronous Mode) CE2 (Input) tMHCL tCHML /CE1 (Input) Standby Mode 1 Standby Mode 2 Figure 10-2. Standby Mode 2 Entry / Exit Timing Chart (Synchronous Mode) CLK (Input) tCE2S CE2 (Input) tCES tCES tMHCL /CE1 (Input) Standby Mode 1 Standby Mode 2 Standby Mode 2 Entry / Exit Parameter Symbol MIN. MAX. Unit Note Standby mode 2 entry /CE1 HIGH to CE2 LOW tCHML 0 ns Standby mode 2 exit to normal operation CE2 HIGH to /CE1 LOW tMHCL 30 ns 1 300 μs 2 /CE1 = HIGH setup time to CLK tCES 5 ns CE2 = LOW hold time to CLK tCE2S 1 ns Notes 1. This is the time it takes to return to normal operation from Standby Mode 2 (data hold: 32M bits / 16M bits / 8M bits). 2. This is the time it takes to return to normal operation from Standby Mode 2 (data not held). Preliminary Data Sheet M17507EJ2V0DS 77 μ PD46128512-X 11. Package Drawing The following is a package drawing of package sample. 93-PIN TAPE FBGA (12x9) w S B E ZD ZE B 10 9 8 7 6 5 4 3 2 1 D A PNM L K J H G F E D C B A INDEX MARK w S A ITEM D A y1 A2 S S y e S φb 78 φx M A1 S AB Preliminary Data Sheet M17507EJ2V0DS MILLIMETERS 9.0±0.1 E 12.0±0.1 w 0.2 e 0.8 A 1.3±0.1 A1 0.16±0.05 A2 1.14 b 0.40±0.05 x 0.08 y 0.1 y1 0.2 ZD 0.9 ZE 0.8 P93F9-80-CR2 μ PD46128512-X 12. Recommended Soldering Conditions Please consult with our sales offices for soldering conditions of the μPD46128512-X package sample. Type of Surface Mount Device μPD46128512F9-CR2 : 93-pin TAPE FBGA (12x9) Preliminary Data Sheet M17507EJ2V0DS 79 μ PD46128512-X Revision History Edition/ Date 2nd edition/ Page Type of Location (Previous edition → This edition) This Previous edition edition p.6 p.6 Modification Burst Operation p.14 p.14 Modification 3. Page Read Operation Sep. 2005 Description revision Addition Notes 3 and 8 have been modified. Note 10 has been added. 3.1 Features of Page Read Text has been modified. Note has been modified. Operation p.17 p.18 p.17 p.18 Modification 4.4 Single Write Text has been modified. 4.5 /WE Control Text has been modified. Modification 4.6 Burst Read Suspend/ Text has been modified. Resume p.19 p.19 Modification 4.7 Burst Write Suspend/ Text has been modified. Resume p.22 p.22 p.23 p.23 Modification 4.10.1 Feature of /WAIT output Addition Text has been modified. Figure 4-8. Read /WAIT Output Text has been added. (/CE1 = LOW, /ADV = HIGH → LOW) p.25 p.25 Addition Table 4-1. Burst Sequence Remark 2 has been added. p.26 p.26 Addition Table 4-2. Dummy Wait Cycles “(Write Latency = n-1)” has been added in and Read Latency parameter of table. Modification p.27 p.27 Addition Remark has been modified. 4.11 Reset Function from “Refer to Figure 2-1. Standby Mode State Synchronous Burst Mode to Machine.” has been added. Asynchronous Page Mode p.28 p.28 Modification 5.1 Mode Register Setting Addition “read a specific address” Method → “read any address” 5.2 Cautions for Setting Mode “except page mode (M = 1)” has been added. Register p.32 p.32 Modification 5. 12 Caution for Timing Chart Text has been modified. of Setting Mode p.42 p.42 Addition Figure 7-10. Asynchronous Cautions 4 and 5 have been added. Page Read Cycle Timing Chart pp.43-56 pp.43-56 Modification Each Figures p.57 p.57 Modification 8. Synchronous AC Remark has been modified. Title has been modified. Specification, Timing Chart p.77 p.77 Modification Figure 10-2. Standby Mode 2 Title has been modified. Entry / Exit Timing Chart (Synchronous Mode) 80 Preliminary Data Sheet M17507EJ2V0DS μ PD46128512-X NOTES FOR CMOS DEVICES 1 VOLTAGE APPLICATION WAVEFORM AT INPUT PIN Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the CMOS device stays in the area between VIL (MAX) and VIH (MIN) due to noise, etc., the device may malfunction. Take care to prevent chattering noise from entering the device when the input level is fixed, and also in the transition period when the input level passes through the area between VIL (MAX) and VIH (MIN). 2 HANDLING OF UNUSED INPUT PINS Unconnected CMOS device inputs can be cause of malfunction. If an input pin is unconnected, it is possible that an internal input level may be generated due to noise, etc., causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or low by using pull-up or pull-down circuitry. Each unused pin should be connected to VDD or GND via a resistor if there is a possibility that it will be an output pin. All handling related to unused pins must be judged separately for each device and according to related specifications governing the device. 3 PRECAUTION AGAINST ESD A strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it when it has occurred. Environmental control must be adequate. When it is dry, a humidifier should be used. It is recommended to avoid using insulators that easily build up static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work benches and floors should be grounded. The operator should be grounded using a wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with mounted semiconductor devices. 4 STATUS BEFORE INITIALIZATION Power-on does not necessarily define the initial status of a MOS device. Immediately after the power source is turned ON, devices with reset functions have not yet been initialized. Hence, power-on does not guarantee output pin levels, I/O settings or contents of registers. A device is not initialized until the reset signal is received. A reset operation must be executed immediately after power-on for devices with reset functions. 5 POWER ON/OFF SEQUENCE In the case of a device that uses different power supplies for the internal operation and external interface, as a rule, switch on the external power supply after switching on the internal power supply. When switching the power supply off, as a rule, switch off the external power supply and then the internal power supply. Use of the reverse power on/off sequences may result in the application of an overvoltage to the internal elements of the device, causing malfunction and degradation of internal elements due to the passage of an abnormal current. The correct power on/off sequence must be judged separately for each device and according to related specifications governing the device. 6 INPUT OF SIGNAL DURING POWER OFF STATE Do not input signals or an I/O pull-up power supply while the device is not powered. The current injection that results from input of such a signal or I/O pull-up power supply may cause malfunction and the abnormal current that passes in the device at this time may cause degradation of internal elements. Input of signals during the power off state must be judged separately for each device and according to related specifications governing the device. Preliminary Data Sheet M17507EJ2V0DS 81 μ PD46128512-X • The information in this document is current as of September, 2005. 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(2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E 02. 11-1