DATA SHEET GaAs INTEGRATED CIRCUIT µPG188GR GaAs MMIC DBS 4 × 2 IF SWITCH MATRIX DESCRIPTION The µPG188GR is intended for use in Direct Broadcast Satellite (DBS) applications within the Low Noise Block (LNB) down-converter for systems where at least multi LNB are required. FEATURES • High isolation : ISL = 30 dB TYP. (D/U-ratio) • Control voltage : Vcont = 0 V/+5 V • Insertion loss : LINS = 8 dB TYP. (ZO = 50 Ω) • 16-pin plastic HTSSOP package ORDERING INFORMATION Part Number Package µPG188GR-E1 16-pin plastic HTSSOP Supplying Form • Embossed tape 12 mm wide • Qty 3 kpcs/reel Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: µPG188GR Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices representative for availability and additional information. Document No. PG10192EJ01V0DS (1st edition) Date Published August 2002 CP(K) Printed in Japan NEC Compound Semiconductor Devices 2002 µPG188GR ABSOLUTE MAXIMUM RATINGS (TA = +25°°C, unless otherwise specified) Parameter Control Voltage 1 to 8 Symbol Ratings Unit Vcont1 to 8 −1.0 to +6.0 V Note Total Power Dissipation Ptot 2 Input Power Pin +10 dBm Operating Ambient Temperature TA −40 to +85 °C Storage Temperature Tstg −65 to +150 °C W Note Mounted on double-sided copper-clad 50 × 50 × 1.6 mm epoxy glass PWB, TA = +85°C RECOMMENDED OPERATING RENGE (TA = +25°°C) Parameter Symbol MIN. TYP. MAX. Unit Control Voltage (High) Vcont(H) +4.5 +5.0 +5.5 V Control Voltage (Low) Vcont(L) −0.5 0 +0.5 V ELECTRICAL CHARACTERISTICS (TA = +25°°C, Vcont = 0 V/+5 V, Pin = 0 dBm, ZO = 50 Ω, Each Port, unless otherwise specified) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Insertion Loss 1 LINS1 f = 0.95 to 1.5 GHz − 7.0 9.0 dB Insertion Loss 2 LINS2 f = 1.5 GHz to 2.15 GHz − 8.0 10.0 dB ∆LINS LINS (0.95 GHz) − LINS (2.15 GHz) − 1.5 3.0 dB Isolation D/U-ratio 1 Note1 ISL1 f = 0.95 to 1.5 GHz 29 32 − dB Isolation D/U-ratio 2 Note1 ISL2 f = 1.5 to 2.15 GHz 27 30 − dB RLOUT f = 0.95 to 2.15 GHz 10 15 − dB Vcont = +5 V/0 V, RF OFF − − 0.5 mA Insertion Loss Flatness Output Return Loss Control Current Note2 Icont Notes 1. ‘Isolation D/U-ratio’ = ‘signal leakage (off-state)’ − ‘insertion loss (on-state)’ 2. per 1 control pin 2 Data Sheet PG10192EJ01V0DS µPG188GR PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM Top View Pin No. Pin Name Pin No. Pin Name 1 IN-C 9 OUT1 2 GND 10 Vcont4 1 16 2 15 3 14 3 IN-D 11 Vcont3 4 13 4 Vcont5 12 Vcont2 5 12 5 Vcont6 13 Vcont1 6 11 7 10 6 Vcont7 14 IN-A 8 9 7 Vcont8 15 GND 8 OUT2 16 IN-B Remark Backside: GND TRUTH TABLE On Channel Control Pin OUT1 OUT2 Vcont1 Vcont2 Vcont3 Vcont4 Vcont5 Vcont6 Vcont7 Vcont8 IN-A − High Low High Low − − − − IN-B − Low High High Low − − − − IN-C − High Low Low High − − − − IN-D − Low High Low High − − − − − IN-A − − − − Low High Low High − IN-B − − − − High Low Low High − IN-C − − − − Low High High Low − IN-D − − − − High Low High Low Data Sheet PG10192EJ01V0DS 3 µPG188GR EVALUATION CIRCUIT (Reference Only) Vcont1 to Vcont8 = 0 V/+5 V, Pin = 0 dBm, ZO = 50 Ω, DC Blocking Capacitor = 56 pF Vcont1 Vcont2 Vcont3 Vcont4 56 pF IN-A 1 000 pF 51 Ω 56 pF 56 pF OUT1 IN-B 16 9 1 8 ZO = 50 Ω 56 pF ZO = 50 Ω OUT2 IN-C 56 pF 51 Ω 1 000 pF IN-D 56 pF Vcont5 Vcont6 Vcont7 Vcont8 Caution For DC lines, chip capacitors and resistors are used to suppress unintended resonance. 4 Data Sheet PG10192EJ01V0DS µPG188GR TYPICAL CHARACTERISTICS ON ROUTE A 1 B C D 2 AC mode IN-A to OUT1 INSERTION LOSS vs. FREQUENCY INPUT RETURN LOSS vs. FREQUENCY 0 Insertion Loss LINS (dB) Input Return Loss RLIN (dB) 0 –10 –20 –30 –40 0 0.5 1.0 1.5 2.0 2.5 3.0 –5 –10 –15 –20 0 0.5 1.0 1.5 2.0 2.5 3.0 Frequency f (GHz) Frequency f (GHz) OUTPUT RETURN LOSS vs. FREQUENCY Output Return Loss RLOUT (dB) 0 –10 –20 –30 –40 0 0.5 1.0 1.5 2.0 2.5 3.0 Frequency f (GHz) Data Sheet PG10192EJ01V0DS 5 µPG188GR OFF ROUTE A 1 B C D 2 DC mode IN-A to OUT1 SIGNAL LEAKAGE vs. FREQUENCY INPUT RETURN LOSS vs. FREQUENCY 0 –10 –10 Signal Leakage (dB) Input Return Loss RLIN (dB) 0 –20 –30 –20 –30 –40 –50 –40 0 0.5 1.0 1.5 2.0 2.5 3.0 –60 0 OUTPUT RETURN LOSS vs. FREQUENCY Output Return Loss RLOUT (dB) 0 –10 –20 –30 0.5 1.0 1.5 2.0 2.5 3.0 Frequency f (GHz) Remark The graphs indicate nominal characteristics. 6 1.0 1.5 2.0 Frequency f (GHz) Frequency f (GHz) –40 0 0.5 Data Sheet PG10192EJ01V0DS 2.5 3.0 µPG188GR PACKAGE DIMENSIONS 16-PIN PLASTIC HTSSOP (UNIT: mm) (0.4) 8 16 1 (2.7) 5.5±0.3 9 0.20±0.10 0.65±0.1 (1.8) (0.5) 0.20±0.10 6.4±0.3 (0.1) 5.2±0.2 0.9±0.2 (2.5) (1.5) Remark ( ): Reference value Data Sheet PG10192EJ01V0DS 7 µPG188GR RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Soldering Conditions Condition Symbol Infrared Reflow Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220°C or higher Preheating time at 120 to 180°C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) : 260°C or below : 10 seconds or less : 60 seconds or less : 120±30 seconds : 3 times : 0.2%(Wt.) or below IR260 VPS Peak temperature (package surface temperature) Time at temperature of 200°C or higher Preheating time at 120 to 150°C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) : 215°C or below : 25 to 40 seconds : 30 to 60 seconds : 3 times : 0.2%(Wt.) or below VP215 Wave Soldering Peak temperature (molten solder temperature) Time at peak temperature Preheating temperature (package surface temperature) Maximum number of flow processes Maximum chlorine content of rosin flux (% mass) : 260°C or below : 10 seconds or less : 120°C or below : 1 time : 0.2%(Wt.) or below WS260 Partial Heating Peak temperature (pin temperature) Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 350°C or below : 3 seconds or less : 0.2%(Wt.) or below HS350 Caution Do not use different soldering methods together (except for partial heating). 8 Data Sheet PG10192EJ01V0DS µPG188GR • The information in this document is current as of August 2002. 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