PreliminaryData Sheet μPG2418TB GaAs Integrated Circuit 0.5 to 3.0 GHz SPDT Switch with 50 Ω Termination R09DS0007EJ0100 Rev.1.00 Aug 24, 2010 DESCRIPTION The μPG2418TB is a GaAs MMIC for L, S-band SPDT (Single Pole Double Throw) switch with 50 Ω termination for 2.4 GHz wireless LAN, mobile phone and other L, S-band applications. This device operates with dual control switching voltages of 2.5 to 5.3 V. This device can operate at frequencies from 0.5 to 3.0 GHz, with low insertion loss and high isolation. This device is housed in a 6-pin super minimold package (SC-88/SOT-363 type), and is suitable for high-density surface mounting. FEATURES • Switch control voltage • • • • : Vcont (H) = 3.0 V TYP. : Vcont (L) = 0 V TYP. Low insertion loss : Lins = 0.45 dB TYP. @ f = 2.5 GHz High isolation : ISL = 21 dB TYP. @ f = 2.5 GHz Handling power : Pin (0.1 dB) = +29.0 dBm TYP. @ f = 0.5 to 3.0 GHz High-density surface mounting : 6-pin super minimold package (SC-88/SOT-363 type) (2.0 × 1.25 × 0.9 mm) APPLICATIONS • W-LAN and BluetoothTM etc. • L, S-band digital cellular or cordless telephone ORDERING INFORMATION Part Number Order Number Package μPG2418TB-E4 μPG2418TB-E4-A 6-pin super minimold Marking G6H (SC-88/SOT-363 type) (Pb-Free) Supplying Form • Embossed tape 8 mm wide • Pin 4, 5, 6 face the perforation side of • the tape Qty 3 kpcs/reel Remark To order evaluation samples, please contact your nearby sales office. Part number for sample order: μPG2418TB CAUTION Although this device is designed to be as robust as possible, ESD (Electrostatic Discharge) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions must be employed at all times. R09DS0007EJ0100 Rev.1.00 Aug 24, 2010 Page 1 of 10 μPG2418TB PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM (Top View) (Top View) RF1 2 3 G6H 1 6 1 5 2 4 3 50 Ω (Bottom View) Vcont1 6 6 1 5 5 2 4 4 3 RFC GND Vcont2 RF2 50 Ω Pin No. Pin Name 1 2 3 4 5 6 RF1 GND RF2 Vcont2 RFC Vcont1 SW TRUTH TABLE ON Path RFC-RF1 RFC-RF2 Vcont1 High Low Vcont2 Low High ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified) Parameter Switch Control Voltage Symbol Vcont Ratings Note +6.0 Unit V Pin Pin TA Tstg +33.0 +20.0 −45 to +85 −55 to +150 dBm dBm °C °C Input Power (ON Port) Input Power (OFF Port) Operating Ambient Temperature Storage Temperature Note: ⎪Vcont1 − Vcont2⎪ ≤ 6.0 V RECOMMENDED OPERATING RANGE (TA = +25°C, unless otherwise specified) Parameter Operating Frequency Switch Control Voltage (H) Switch Control Voltage (L) Control Voltage Difference Symbol f Vcont (H) Vcont (L) ΔVcont (H), ΔVcont (L) MIN. 0.5 2.5 −0.2 −0.1 TYP. − 3.0 0 0 MAX. 3.0 5.3 0.2 0.1 Unit GHz V V V Note Note: ΔVcont (H) = Vcont1 (H) − Vcont2 (H) ΔVcont (L) = Vcont1 (L) − Vcont2 (L) R09DS0007EJ0100 Rev.1.00 Aug 24, 2010 Page 2 of 10 μPG2418TB ELECTRICAL CHARACTERISTICS (TA = +25°C, Vcont (H) = 3.0 V, Vcont (L) = 0 V, ZO = 50 Ω, DC blocking capacitors = 56 pF, unless otherwise specified) Parameter Insertion Loss Isolation Input Return Loss Output Return Loss Unused Port Return Loss 0.1 dB Loss Compression Note1 Input Power 1 dB Loss Compression Note2 Input Power Input 3rd Order Intercept Point Switch Control Current Switch Control Speed Symbol Lins ISL RLin RLout URL Pin (0.1 dB) Pin (1 dB) IIP3 Icont tSW Test Conditions f = 0.5 to 1.0 GHz f = 1.0 to 2.0 GHz f = 2.0 to 2.5 GHz f = 2.5 to 3.0 GHz f = 0.5 to 2.0 GHz f = 2.0 to 2.5 GHz f = 2.5 to 3.0 GHz f = 0.5 to 3.0 GHz f = 0.5 to 3.0 GHz f = 2.0 to 3.0 GHz f = 2.0/2.5 GHz f = 0.5 to 3.0 GHz f = 2.0/2.5 GHz f = 0.5 to 3.0 GHz f = 0.5 to 3.0 GHz, 2 tone, 5 MHz spicing No RF input 50% CTL to 90/10% RF MIN. − − − − 19 17 16 15 15 10 +26.0 − +29.0 − − TYP. 0.30 0.37 0.45 0.50 23 21 20 20 20 20 +29.0 +29.0 +32.0 +32.0 +60 MAX. 0.50 0.57 0.65 0.70 − − − − − − − − − − − Unit dB dB dB dB dB dB dB dB dB dB dBm dBm dBm dBm dBm − − 0.3 50 20 500 μA ns Notes: 1. Pin (0.1 dB) is the measured input power level when the insertion loss increases 0.1 dB more than that of the linear range. 2. Pin (1 dB) is the measured input power level when the insertion loss increases 1 dB more than that of the linear range. CAUTION It is necessary to use DC blocking capacitors with this device. The value of DC blocking capacitors should be chosen to accommodate the frequency of operation, bandwidth, switching speed and the condition with actual board of your system. R09DS0007EJ0100 Rev.1.00 Aug 24, 2010 Page 3 of 10 μPG2418TB EVALUATION CIRCUIT C2 C1 1 Vcont1 RF1 6 2 RFC 5 C1 Note 3 Vcont2 RF2 4 C1 C2 Note: C1: 56 pF C2: 1 000 pF The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. APPLICATION INFORMATION C1 Switch C1 LESD C1 • LESD provides a means to increase the ESD protection on a specific RF port, typically the port attached to the antenna. • The value may be tailored to provide specific electrical responses. • The RF ground connections should be kept as short as possible and connected to directly to a good RF ground for best performance. R09DS0007EJ0100 Rev.1.00 Aug 24, 2010 Page 4 of 10 μPG2418TB TYPICAL CHARACTERISTICS (TA = +25°C, Vcont (H) = 3.0 V, Vcont (L) = 0 V, ZO = 50 Ω, DC blocking capacitors = 56 pF, unless otherwise specified) RFC-RF1/RF2 ISOLATION vs. FREQUENCY RFC-RF1/RF2 INSERTION LOSS vs. FREQUENCY 0 0 –5 –10 –0.2 Isolation ISL (dB) Insertion Loss Lins (dB) –0.1 –0.3 –0.4 –0.5 –20 –25 –30 –35 –40 –0.6 –0.7 0.0 –45 0.5 1.0 1.5 2.0 2.5 –50 0.0 3.0 1.0 1.5 2.5 2.0 3.0 Frequency f (GHz) INPUT (RFC) RETURN LOSS vs. FREQUENCY OUTPUT (RF1/RF2) RETURN LOSS vs. FREQUENCY 0 0 –5 –5 –10 –15 –20 –25 –30 –35 –40 0.0 0.5 Frequency f (GHz) Output Return Loss RLout (dB) Input Return Loss RLin (dB) –15 0.5 1.0 1.5 2.0 2.5 –10 –15 –20 –25 –30 –35 –40 0.0 3.0 0.5 1.0 1.5 2.5 2.0 3.0 Frequency f (GHz) RFC-RF1/RF2 UNUSED PORT RETURN LOSS vs. FREQUENCY RFC-RF1/RF2 INSERTION LOSS, vs. SWITCH CONTROL VOLTAGE (H) 0 0.00 –5 –0.10 Insertion Loss Lins (dB) Unused Port Return Loss URL (dB) Frequency f (GHz) –10 –15 –20 –25 –30 –0.30 –0.40 –0.50 2.5 GHz 3.0 GHz –0.60 –35 –40 0.0 f = 2.0 GHz –0.20 0.5 1.0 1.5 2.0 2.5 3.0 Frequency f (GHz) –0.70 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Switch Control Voltage (H) Vcont (H) (V) Remark The graphs indicate nominal characteristics. R09DS0007EJ0100 Rev.1.00 Aug 24, 2010 Page 5 of 10 μPG2418TB RFC-RF1/RF2 ISOLATION vs. SWITCH CONTROL VOLTAGE (H) RFC-RF1/RF2 INSERTION LOSS, Icont vs. INPUT POWER 0 60 f = 2.5 GHz –5 Isolation ISL (dB) Insertion Loss Lins (dB) –0.5 –10 f = 3.0 GHz –15 –20 –25 –30 2.0 GHz 2.5 GHz –35 –40 50 Lins 40 2.5 V –1.5 30 –2.0 20 –2.5 10 Icont –50 2.0 2.5 3.5 3.0 4.0 4.5 5.0 5.5 –3.0 20 6.0 25 0 35 30 Switch Control Voltage (H) Vcont (H) (V) Input Power Pin (dBm) RFC-RF1/RF2 Pin (1 dB), Pin (0.1 dB) vs. SWITCH CONTROL VOLTAGE (H) RFC-RF1/RF2 2f0, 3f0 vs. SWITCH CONTROL VOLTAGE (H) 34 –60 f = 2.5 GHz f = 2.5 GHz –65 Pin (1 dB) 33 2nd Harmonics 2f0 (dBc) 3rd Harmonics 3f0 (dBc) 35 32 31 30 29 28 Pin (0.1 dB) 27 26 24 2.0 –70 –75 2f0 –80 –85 –90 3f0 –95 25 2.5 3.0 3.5 4.0 4.5 5.0 5.5 –100 2.0 6.0 2.5 3.0 3.5 4.0 4.5 5.5 5.0 6.0 Switch Control Voltage (H) Vcont (H) (V) Switch Control Voltage (H) Vcont (H) (V) RFC-RF1/RF2 2f0, 3f0 vs. INPUT POWER RFC-RF1/RF2 OUTPUT POWER, IM3 vs. INPUT POWER 0 –10 f = 2.5 GHz –20 –30 3f0 –40 –50 –60 2f0 –70 –80 –90 –100 20 25 30 35 Input Power Pin (dBm) Output Power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBm) 1 dB Loss Compression Input Power Pin (1 dB) (dBm) 0.1 dB Loss Compression Input Power Pin (0.1 dB) (dBm) 3.0 V –1.0 –45 2nd Harmonics 2f0 (dBc) 3rd Harmonics 3f0 (dBc) Vcont = 5.3 V Switch Control Current Icont (μA) 0 60 f = 2.5 GHz 50 40 30 20 Pout 10 0 –10 –20 –30 –40 –50 –60 IM3 –70 15 20 25 30 35 40 45 50 55 60 65 Input Power Pin (1Tone) (dBm) Remark The graphs indicate nominal characteristics. R09DS0007EJ0100 Rev.1.00 Aug 24, 2010 Page 6 of 10 μPG2418TB MOUNTING PAD LAYOUT DIMENSIONS 6-PIN SUPER MINIMOLD (SC-88/SOT-363 TYPE) (UNIT: mm) 1.9 0.8 0.4 0.65 0.65 Remark The mounting pad layout in this document is for reference only. When designing PCB, please consider workability of mounting, solder joint reliability, prevention of solder bridge and so on, in order to optimize the design. R09DS0007EJ0100 Rev.1.00 Aug 24, 2010 Page 7 of 10 μPG2418TB PACKAGE DIMENSIONS 6-PIN SUPER MINIMOLD (SC-88/SOT-363 TYPE) (UNIT: mm) 2.1±0.1 0.2+0.1 –0.05 0.65 0.65 1.3 2.0+0.15 –0.20 1.25±0.1 R09DS0007EJ0100 Rev.1.00 Aug 24, 2010 0.15+0.1 –0.05 0 to 0.1 0.7 0.9±0.1 0.1 MIN. Page 8 of 10 μPG2418TB RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Soldering Conditions Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220°C or higher Preheating time at 120 to 180°C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) : 260°C or below : 10 seconds or less : 60 seconds or less : 120±30 seconds : 3 times : 0.2%(Wt.) or below Condition Symbol IR260 Wave Soldering Peak temperature (molten solder temperature) : 260°C or below Time at peak temperature : 10 seconds or less Preheating temperature (package surface temperature) : 120°C or below Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below WS260 Partial Heating Peak temperature (terminal temperature) : 350°C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below HS350 CAUTION Do not use different soldering methods together (except for partial heating). R09DS0007EJ0100 Rev.1.00 Aug 24, 2010 Page 9 of 10 μPG2418TB Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. • Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. • Do not burn, destroy, cut, crush, or chemically dissolve the product. • Do not lick the product or in any way allow it to enter the mouth. R09DS0007EJ0100 Rev.1.00 Aug 24, 2010 Page 10 of 10 μPG2418TB Data Sheet Revision History Rev. 1.00 Date Aug 24, 2010 Description Summary Page − First edition issued Bluetooth is a trademark owned by Bluetooth SIG, Inc., U.S.A. All trademarks and registered trademarks are the property of their respective owners. C-1 Notice 1. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website. 2. 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