DATA SHEET GaAs INTEGRATED CIRCUIT μPG2409TB HIGH POWER SPDT SWITCH FOR WiMAX TM DESCRIPTION The μPG2409TB is a GaAs MMIC high power SPDT (Single Pole Double Throw) switch which were designed for WiMAX. This device can operate frequency from 0.5 to 3.8 GHz, having the low insertion loss and high isolation. This device is housed in a 6-pin super minimold package (SC-88/SOT-363 type). And this package is suitable for high-density surface mounting. FEATURES • Switch control voltage : Vcont (H) = 3.0 V TYP. : Vcont (L) = 0 V TYP. • Low insertion loss : Lins = 0.35 dB TYP. @ f = 1.0 GHz : Lins = 0.45 dB TYP. @ f = 2.5 GHz : Lins = 0.50 dB TYP. @ f = 3.0 GHz • High isolation : ISL = 32 dB TYP. @ f = 1.0 GHz : ISL = 26 dB TYP. @ f = 2.5 GHz : ISL = 23 dB TYP. @ f = 3.0 GHz • Handling power : Pin (1 dB) = +35.0 dBm TYP. @ f = 0.5 to 3.8 GHz • High-density surface mounting : 6-pin super minimold package (SC-88/SOT-363 type) (2.0 × 1.25 × 0.9 mm) APPLICATIONS • WiMAX and wireless LAN (IEEE802.11b/g/n) ORDERING INFORMATION Part Number μPG2409TB-E4 Order Number μPG2409TB-E4-A Package 6-pin super minimold Marking G5T Supplying Form • Embossed tape 8 mm wide (SC-88/SOT-363 type) • Pin 4, 5, 6 face the perforation side of the tape (Pb-Free) • Qty 3 kpcs/reel Remark To order evaluation samples, please contact your nearby sales office. Part number for sample order: μPG2409TB Caution Although this device is designed to be as robust as possible, ESD (Electrostatic Discharge) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions must be employed at all times. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. PG10772EJ01V0DS (1st edition) Date Published July 2009 NS Printed in Japan 2009 μPG2409TB PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM (Top View) (Top View) (Bottom View) Vcont1 6 6 RF1 2 3 G5T 1 6 1 1 RFC GND 5 2 5 5 RF2 2 Vcont2 4 4 4 3 3 Pin No. Pin Name 1 RF1 2 GND 3 RF2 4 Vcont2 5 RFC 6 Vcont1 SW TRUTH TABLE On Path Vcont1 Vcont2 RFC-RF1 High Low RFC-RF2 Low High ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified) Parameter Symbol Switch Control Voltage Input Power Ratings Vcont +6.0 Unit Note V Vcont = 3 V Pin +35 dBm Vcont = 5 V Pin +37 Power Dissipation (average) PD 150 mW Operating Ambient Temperature TA −45 to +85 °C Storage Temperature Tstg −55 to +150 °C Note ⎪Vcont1 − Vcont2⎪ ≤ 6.0 V RECOMMENDED OPERATING RANGE (TA = +25°C, unless otherwise specified) Parameter Symbol MIN. TYP. MAX. Unit f 0.5 − 3.8 GHz Switch Control Voltage (H) Vcont (H) 2.7 3.0 5.3 V Switch Control Voltage (L) Vcont (L) −0.2 0 0.2 V Control Voltage Difference ΔVcont (H), ΔVcont (L)Note −0.1 0 0.1 V Operating Frequency Note ΔVcont (H) = Vcont1 (H) − Vcont2 (H) ΔVcont (L) = Vcont1 (L) − Vcont2 (L) 2 Data Sheet PG10772EJ01V0DS μPG2409TB ELECTRICAL CHARACTERISTICS (TA = +25°C, Vcont (H) = 3.0 V, Vcont (L) = 0 V, ZO = 50 Ω, DC blocking capacitors = 8 pF, unless otherwise specified) Parameter Insertion Loss 1 Symbol Lins1 Test Conditions MIN. TYP. MAX. Unit f = 0.5 to 1.0 GHz Note 1 − 0.35 0.60 dB Note 1 − 0.40 0.65 dB Insertion Loss 2 Lins2 f = 1.0 to 2.0 GHz Insertion Loss 3 Lins3 f = 2.0 to 2.5 GHz − 0.45 0.70 dB Insertion Loss 4 Lins4 f = 2.5 to 3.0 GHz − 0.50 0.75 dB Insertion Loss 5 Lins5 f = 3.0 to 3.8 GHz Isolation 1 ISL1 − 0.60 0.85 dB f = 0.5 to 1.0 GHz Note 1 29 32 − dB Note 1 25 28 − dB Isolation 2 ISL2 f = 1.0 to 2.0 GHz Isolation 3 ISL3 f = 2.0 to 2.5 GHz 23 26 − dB Isolation 4 ISL4 f = 2.5 to 3.0 GHz 20 23 − dB Isolation 5 ISL5 f = 3.0 to 3.8 GHz 16 19 − dB 15 20 − dB − +33.5 − dBm Note 1 − +35 − dBm Note 1 − +37 − dBm Return Loss RL 0.1 dB Loss Compression Input Power Pin (0.1 dB) f = 0.5 to 3.8 GHz Note 1 f = 2.5 GHz Note 2 1 dB Loss Compression Input Power 1 Note 3 1 dB Loss Compression Input Power 2 Pin (1 dB) 1 f = 0.5 to 3.8 GHz Vcont = 3 V Pin (1 dB) 2 f = 0.5 to 3.8 GHz Note 3 Vcont = 5 V 2nd Harmonics 2f0 f = 2.5 GHz, Pin = +26 dBm − 75 − dBc 3rd Harmonics 3f0 f = 2.5 GHz, Pin = +26 dBm − 80 − dBc Input 3rd Order Intercept Point IIP3 f = 2.5 GHz − +60 − dBm Switch Control Current Icont No RF input − 0.1 10 μA Switch Control Speed tSW 50% CTL to 90/10% RF − 100 250 ns Notes 1. DC blocking capacitors = 56 pF at f = 0.5 to 2.0 GHz 2. Pin (0.1 dB) is the measured input power level when the insertion loss increases 0.1 dB more than that of the linear range. 3. Pin (1 dB) is the measured input power level when the insertion loss increases 1 dB more than that of the linear range. Caution It is necessary to use DC blocking capacitors with this device. Data Sheet PG10772EJ01V0DS 3 μPG2409TB EVALUATION CIRCUIT C1 1 1 000pF 6 Vcont1 RF1 2 5 C1 Note RFC 3 4 Vcont2 RF2 1 000pF C1 Note C1 : 0.5 to 2.0 GHz : 2.0 to 3.8 GHz 56 pF 8 pF The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. APPLICATION INFORMATION C1 Switch C1 LESD C1 • C1 are DC blocking capacitors external to the device. The value may be tailored to provide specific electrical responses. • The RF ground connections should be kept as short as possible and connected to directly to a good RF ground for best performance. • LESD provides a means to increase the ESD protection on a specific RF port, typically the port attached to the antenna. 4 Data Sheet PG10772EJ01V0DS μPG2409TB TYPICAL CHARACTERISTICS (TA = +25°C, Vcont (H) = 2.7 to 5.3 V, Vcont (L) = −0.2 to 0.2V, unless otherwise specified) RFC-RF1/RF2 INSERTION LOSS vs. FREQUENCY RFC-RF1/RF2 ISOLATION vs. FREQUENCY 0 0.0 –10 –0.4 –0.6 Isolation ISL (dB) Insertion Loss Lins (dB) –0.2 8 pF –0.8 –1.0 –1.2 DC blocking capacitors = 56 pF –1.4 –1.6 DC blocking capacitors = 56 pF –20 –30 –40 8 pF –50 –1.8 –2.0 0.0 1.0 2.0 3.0 4.0 5.0 –60 0.0 6.0 3.0 4.0 5.0 6.0 Frequency f (GHz) RFC RETURN LOSS vs. FREQUENCY RF1/RF2 RETURN LOSS vs. FREQUENCY 0 –5 –5 DC blocking capacitors = 56 pF DC blocking capacitors = 56 pF –10 Return Loss RL (dB) Return Loss RL (dB) 2.0 Frequency f (GHz) 0 –15 8 pF –20 –25 –30 –35 –40 0.0 –10 –15 8 pF –20 –25 –30 –35 1.0 2.0 3.0 4.0 5.0 –40 0.0 6.0 1.0 2.0 3.0 4.0 5.0 Frequency f (GHz) Frequency f (GHz) RFC-RF1/RF2 INSERTION LOSS, Icont vs. SWITCH CONTROL VOLTAGE (H) RFC-RF1/RF2 ISOLATION vs. SWITCH CONTROL VOLTAGE (H) f = 2.5 GHz –0.6 0.6 3.8 GHz –0.7 0.4 –0.8 0.2 Icont (No RF input) –0.9 2.0 2.5 3.0 3.5 4.0 –5 0.8 Lins 4.5 0.0 5.0 6.0 0 Isolation ISL (dB) –0.5 Switch Control Current Icont (μA) 1.0 –0.4 Insertion Loss Lins (dB) 1.0 –10 –15 f = 3.8 GHz –20 –25 2.5 GHz –30 –35 –40 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Switch Control Voltage (H) Vcont (H) (V) Switch Control Voltage (H) Vcont (H) (V) Remark The graphs indicate nominal characteristics. Data Sheet PG10772EJ01V0DS 5 μPG2409TB RF1/RF2 RETURN LOSS vs. SWITCH CONTROL VOLTAGE (H) 0 –5 –10 –10 –15 Return Loss RL (dB) 0 –5 f = 3.8 GHz –20 –25 2.5 GHz –30 –35 3.5 4.0 4.5 –35 3.0 3.5 4.0 4.5 RFC-RF1/RF2 INSERTION LOSS, Icont vs. INPUT POWER RFC-RF1/RF2 Pin (0.1 dB) vs. SWITCH CONTROL VOLTAGE (H) Lins –0.4 18 16 5.0 V –0.6 3.0 V Vcont (H) = 2.7 V –0.8 5.0 V 14 12 10 8 6 4 –1.0 20 3.0 V 2.7 V 25 30 35 2 0 40 Input Power Pin (dBm) RFC-RF1/RF2 2f0, 3f0 vs. INPUT POWER –30 Vcont (H) = 3.0 V –40 Vcont (L) = 0 V DC blocking –50 capacitors = 8 pF f = 2.5 GHz –60 3f0 –70 2f0 –80 –90 –100 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 Output Power Pout (dBm) 3rd Order Intermoduration Distortion IM3 (dBm) 20 0.1 dB Loss Compression Input Power Pin (0.1 dB) (dBm) Switch Control Voltage (H) Vcont (H) (V) Icont 5.0 38 f = 2.5 GHz 36 34 32 30 28 26 2.0 3.0 2.5 3.5 4.5 4.0 5.0 Switch Control Voltage (H) Vcont (H) (V) RFC-RF1/RF2 OUTPUT POWER, IM3 vs. INPUT POWER 80 60 40 Pout 20 0 –20 Vcont (H) = 3.0 V Vcont (L) = 0 V DC blocking capacitors = 8 pF f = 2.5 GHz –40 IM3 –60 –80 0 Input Power Pin (dBm) 10 20 30 40 50 60 Input Power Pin (1 Tone) (dBm) Remark The graphs indicate nominal characteristics. 6 2.5 Switch Control Voltage (H) Vcont (H) (V) f = 2.5 GHz –1.2 15 –50 2.0 5.0 –0.2 Insertion Loss Lins (dB) –30 –45 3.0 2.5 GHz –25 –40 2.5 f = 3.8 GHz –20 –45 –50 2.0 2nd Harmonics 2f0 (dBc) 3rd Harmonics 3f0 (dBc) –15 –40 Switch Control Current Icont (μA) Return Loss RL (dB) RFC RETURN LOSS vs. SWITCH CONTROL VOLTAGE (H) Data Sheet PG10772EJ01V0DS 70 80 μPG2409TB MOUNTING PAD LAYOUT DIMENSIONS 6-PIN SUPER MINIMOLD (SC-88/SOT-363 type) (UNIT: mm) 1.9 0.8 0.4 0.65 0.65 Remark The mounting pad layout in this document is for reference only. When designing PCB, please consider workability of mounting, solder joint reliability, prevention of solder bridge and so on, in order to optimize the design. Data Sheet PG10772EJ01V0DS 7 μPG2409TB PACKAGE DIMENSIONS 6-PIN SUPER MINIMOLD (SC-88/SOT-363 type) (UNIT: mm) 2.1±0.1 0.2+0.1 –0.05 0.65 0.65 1.3 2.0+0.15 –0.20 1.25±0.1 8 Data Sheet PG10772EJ01V0DS 0.15+0.1 –0.05 0 to 0.1 0.7 0.9±0.1 0.1 MIN. μPG2409TB RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Wave Soldering Soldering Conditions Condition Symbol Peak temperature (package surface temperature) : 260°C or below Time at peak temperature : 10 seconds or less Time at temperature of 220°C or higher : 60 seconds or less Preheating time at 120 to 180°C : 120±30 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (molten solder temperature) : 260°C or below Time at peak temperature : 10 seconds or less IR260 WS260 Preheating temperature (package surface temperature) : 120°C or below Partial Heating Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (terminal temperature) : 350°C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below HS350 Caution Do not use different soldering methods together (except for partial heating). Data Sheet PG10772EJ01V0DS 9 μPG2409TB WiMAX is a trademark or a registered trademark of the WiMAX Forum. • The information in this document is current as of July, 2009. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. 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GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. • Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. • Do not burn, destroy, cut, crush, or chemically dissolve the product. • Do not lick the product or in any way allow it to enter the mouth.