WINBOND W83193R-01

W83193R-01
83.MHZ 3-DIMM CLOCK
1.0 GENERAL DESCRIPTION
The W83193R-01 is a Clock Synthesizer which provides all clocks required for high-speed RISC or
CISC microprocessor such as Intel PentiumPro , AMD or Cyrix. Eight different frequency of CPU and
PCI clocks are externally selectable with smooth transitions.
The W83193R-02/-04 also provides I2C serial bus interface to program the registers to enable or
disable each clock outputs and choose the 0.6% or 1.5% center type spread spectrum.
The W83193R-01 accepts a 14.318 MHz reference crystal as its input and runs on a 3.3V supply.
High drive PCI and SDRAM CLOCK outputs typically provide greater than 1 V /ns slew rate into 30
pF loads. CPU CLOCK outputs typically provide better than 1 V /ns slew rate into 20 pF loads as
maintaining 50¡Ó 5% duty cycle. The fixed frequency outputs as REF, 24MHz, and 48 MHz provide
better than 0.5V /ns slew rate.
2.0 PRODUCT FEATURES
•
Supports Pentium, Pentium Pro, Pentium II, AMD and Cyrix CPUs with I2C.
•
4 CPU clocks.
•
12 SDRAM clocks for 3 DIMs.
•
7 PCI synchronous clocks.
•
One IOAPIC clock for multiprocessor support.
•
Optional single or mixed supply:
(Vdd = Vddq3 = Vddq2 = 3.3V) or (Vdd = Vddq3 = 3.3V, Vddq2 = 2.5V)
•
< 250ps skew among CPU and SDRAM clocks.
•
< 250ps skew among PCI clocks.
•
Smooth frequency switch with selections from 50 MHz to 83.3 MHz CPU.
•
I2C 2-Wire serial interface.
•
0.6% or 1.5% center type spread spectrum function to reduce EMI.
•
Programmable registers to enable/stop each output and select modes.
(mode as Tri-state, or Normal )
•
MODE pin for power Management.
•
48 MHz for USB.
•
24 MHz for super I/O.
•
48-pin SSOP package.
-1-
Publication Release Date: May 1998
Revision 0.20
W83193R-01
PRELIMINARY
3.0 BLOCK DIAGRAM
Vdd
Xin
Xout
*SDATA
*SDCLK
REF
OSC
Vddq2
b
Register
CPU_stop#
Vddq2
Stop
clock
Buffers
REF[0:1]
IOAPIC
Buffers
CPUCLK[0:3]
Buffers
Vddq3
PLL
1
SDRAM[0:11]
Buffers
PCI_stop#
Stop
clock
*MODE
*CPU3.3#_2.5
*FS[0:2]
LATC
H
*CPU_STOP#
*PCI_STOP
#
Contr
ol
Logic
Vddq3
PCICLK[0:5]
Dela
y
Buffers
Vddq3
Buffers
PCICLK_F
Vddq3
48MHz
PLL2
Vddq3
Buffers
1/2
24MHz
Buffers
4.0 PIN CONFIGURATION
Vdd
REF0
Vss
Xin
Xout
Vddq3
PCICLK_F/*FS1
PCICLK0/*FS2
Vss
PCICLK1/*FTS
PCICLK2
PCICLK3
PCICLK4
Vddq3
PCICLK5/PCI_STOP#
Vss
SDRAM11
SDRAM10
Vddq3
SDRAM 9
SDRAM 8
Vss
*SDATA
*SDCLK
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
-2-
Vddq2
IOAPIC
REF1/CPU_STOP#
Vss
CPUCLK0
CPUCLK1
Vddq2
CPUCLK2
CPUCLK3
Vss
SDRAM 0
SDRAM 1
Vddq3
SDRAM 2
SDRAM 3
Vss
SDRAM 4
SDRAM 5
Vddq3
SDRAM 6
SDRAM 7
Vss
48MHz/*FS0
24MHz/*MODE
Publication Release Date: May 1998
Revision 0.20
W83193R-01
PRELIMINARY
5.0 PIN DESCRIPTION
IN - Input
OUT - Output
I/O - Bi-directional Pin
# - Active Low
* - Internal 250kΩ pull-up
5.1 Crystal I/O
SYMBOL
PIN
I/O
Xin
4
IN
Xout
5
OUT
FUNCTION
Crystal input with internal loading capacitors and
feedback resistors.
Crystal output at 14.318MHz nominally.
5.2 CPU, SDRAM, PCI Clock Outputs
SYMBOL
CPUCLK [ 0:3 ]
IOAPIC
SDRAM [ 0:11]
PCICLK_F/ *FS1
PIN
I/O
FUNCTION
40,41,43,44
OUT
Low skew (< 250ps) clock outputs for host
frequencies such as CPU, Chipset and Cache.
Vddq2 is the supply voltage for these outputs.
47
OUT
High drive buffered output of the crystal, and is
powered by VDDq2.
17,18,20,21,28
,29,31,32,34,
35,37,38
O
SDRAM clock outputs which have the same
frequency as CPU clocks.
7
I/O
Latched input for FS1 at initial power up for H/W
selecting the output frequency of CPU, SDRAM and
PCI clocks.
Free running PCI clock during normal operation.
PCICLK 0 / *FS2
8
I/O
Latched input for FS2 at initial power up for H/W
selecting the output frequency of CPU, SDRAM and
PCI clocks.
PCI clock during normal operation.
PCICLK 1/ *FTS
10
I/O
Latched input for FTS at initial power up for H/W
selecting the output frequency of CPU, SDRAM and
PCI clocks.
PCI clock during normal operation.
-3-
Publication Release Date: May 1998
Revision 0.20
W83193R-01
PRELIMINARY
5.2 CPU, SDRAM, PCI Clock Outputs, continued
SYMBOL
SDRAM [ 0: 11 ]
PCICLK [ 2:4 ]
PIN
I/O
17,18,20,21,
28,29,31,32,
34,35,37,38
O
11,12,13
OUT
15
I/O
PCICLK5/ PCI_STOP#
FUNCTION
Synchronous DRAM DIMs clocks which have the
same frequency as CPU clocks
Low skew (< 250ps) PCI clock outputs.
Internal 250kΩ pull-up.
If MODE = 1 (default), then this pin is a PCI5 clock
output. If MODE = 0 , then this pin is PCI_STOP #
and used in power management mode for
synchronously stopping the all PCI clocks.
2
5.3 I C Control Interface
SYMBOL
PIN
I/O
FUNCTION
*SDATA
23
I/O
Serial data of I2C 2-wire control interface with internal
pull-up resistor.
*SDCLK
24
IN
Serial clock of I2C 2-wire control interface with
internal pull-up resistor.
5.4 Fixed Frequency Outputs
SYMBOL
PIN
I/O
FUNCTION
REF0
2
I/O
Internal 250kΩ pull-up buffered output of the crystal.
REF1 / CPU_STOP#
46
I/O
Internal 250kΩ pull-up.
If MODE =1 (default), then this pin is a REF1
buffered output of the crystal. If MODE = 0 , then this
pin is CPU_STOP# input used in power
management mode for synchronously stopping the
all CPU clocks.
24MHz / *MODE
25
I/O
Internal 250kΩ pull-up.
Latched input for MODE at initial power up. 24MHz
output for super I/O during normal operation.
48MHz / *FS0
26
I/O
Internal 250kΩ pull-up.
Latched input for FS0 at initial power up for H/W
selecting the output frequency of CPU, SDRAM and
PCI clocks. 48MHz output for USB during normal
operation.
-4-
Publication Release Date: May 1998
Revision 0.20
W83193R-01
PRELIMINARY
5.5 Power Pins
SYMBOL
PIN
Vdd
FUNCTION
1
Power supply for Ref [0:1] crystal and core logic.
Vddq2
42, 48
Power supply for IOAPIC output and CPUCLK[0:3],
either 2.5V or 3.3V.
Vddq3
6,14,19, 30, 36
Power supply for SDRAM, PCICLK and 48/24MHz
outputs.
Vss
3,9,16,22,27,
33,39,45
Circuit Ground.
6.0 FREQUENCY SELECTION
FTS = 1 (MHz)
FTS = 0 (MHz)
REF,IOAPIC (MHz)
FS2
FS1
FS0
CPU
PCI
CPU
PCI
0
0
0
61.8
30.9
62.4
31.2
14.318
0
0
1
75
30
78
39
14.318
0
1
0
83.3
33.3
85.8
42.8
14.318
0
1
1
68.5
34.25
69.5
34.74
14.318
1
0
0
55
27.5
83.3
41.7
14.318
1
0
1
75
37.5
75
32
14.318
1
1
0
60
30
80
40
14.318
1
1
1
66.8
33.4
50
25
14.318
-5-
Publication Release Date: May 1998
Revision 0.20
W83193R-01
PRELIMINARY
7.0 FUNTION DESCRIPTION
7.1 POWER MANAGEMENT FUNCTIONS
All clocks can be individually enabled or disabled via the 2-wire control interface. On power up,
external circuitry should allow 3 ms for the VCO’s to stabilize prior to enabling clock outputs to
assure correct pulse widths.
When MODE=0, pins 15 and 46 are inputs (PCI_STOP#),
(CPU_STOP#), when MODE=1, these functions are not available. A particular clock could be
enabled as both the 2-wire serial control interface and one of these pins indicate that it should be
enable.
The W83193R-01 may be disabled in the low state according to the following table in order to reduce
power consumption. All clocks are stopped in the low state, but maintain a valid high period on
transitions from running to stop. The CPU and PCI clocks transform between running and stop by
waiting for one positive edge on PCICLK_F followed by negative edge on the clock of interest, after
which high levels of the output are either enabled or disabled.
CPU_STOP#
PCI_STOP#
CPU
PCI
OTHER CLKs
XTAL & VCOs
0
0
LOW
LOW
RUNNING
RUNNING
0
1
LOW
RUNNING
RUNNING
RUNNING
1
0
RUNNING
LOW
RUNNING
RUNNING
1
1
RUNNING
RUNNING
RUNNING
RUNNING
2
7.2 2-WIRE I C CONTROL INTERFACE
The 2-wire control interface implements a write only slave interface and cannot be read back. All
proceeding bytes must be sent to change one of the control bytes. The 2-wire control interface allows
each clock output individually enabled or disabled. On power up, the W83193R-01 initializes with
default register settings, and then it’s optional to use the 2-wire control interface.
The SDATA signal only changes when the SDCLK signal is low, and is stable when SDCLK is high
during normal data transfer. There are only two exceptions. One is a high-to-low transition on
SDATA while SDCLK is high used to indicate the beginning of a data transfer cycle. The other is a
low-to-high transition on SDATA while SDCLK is high used to indicate the end of a data transfer
cycle. Data is always sent as complete 8-bit bytes followed by an acknowledge generated.
Byte writing starts with a “start” condition followed by 7-bit slave address and a write command bit
[1101 0010], command code checking [0000 0000], and byte count checking. After successful
reception of each byte, an “acknowledge“ (low) on the SDATA wire will be generated by the clock
2
chip. Controller can start to write to internal I C registers after the string of data. The sequence
order is as follows:
-6-
Publication Release Date: May 1998
Revision 0.20
W83193R-01
PRELIMINARY
Bytes sequence order for I2C controller :
Clock Address
A(6:0) & R/W
Ack
8 bits dummy
Command code
Ack
8 bits dummy
Byte count
Ack
Byte0,1,2...
until Stop
7.3 SERIAL CONTROL REGISTERS
The Pin column lists the affected pin number and the @PowerUp column gives the state at true
power up. Registers are set to the values shown only on true power up. "Command Code" byte and
"Byte Count" byte must be sent following the acknowledge of the Address Byte. Although the data
(bits) in these two bytes are considered "don't care", they must be sent and will be acknowledge.
After that, the below described sequence (Register 0, Register 1, Register 2, ....) will be valid and
acknowledged.
7.3.1 Register 0: CPU Frequency Select Register (1 = enable, 0 = Stopped)
Bit
@PowerUp
Pin
Description
7
1
-
FTS(for frequency table selection by software via I2C)
6
5
1
1
-
FS2 (for frequency table selection by software via I2C)
FS1 (for frequency table selection by software via I2C)
4
3
1
0
-
2
x
n/a
FS0 (for frequency table selection by software via I2C)
0 = Selection by hardware
1 = Selection by software I2C
Reserved
1
0
0
0
-
Bit1 Bit0
1 1 Tri-state all outputs
1 0 ±0.6% Spread Spectrum
0 1 ±1.5% Spread Spectrum
0 0 Normal
FUNCTION TABLE
Function
Outputs
Description
CPU
PCI
SDRAM
REF
IOAPIC
Tri-State
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Normal
see table
see table
CPU
14.318
14.318
-7-
Publication Release Date: May 1998
Revision 0.20
W83193R-01
PRELIMINARY
7.3.2 Register 1 : CPU , 48/24 MHz Clock Register (1 = enable, 0 = Stopped)
Bit
@PowerUp
Pin
Description
7
1
26
48MHz (Active / Inactive)
6
1
25
24 MHz (Active / Inactive)
5
1
-
0 - test mode, 1 - normal mode
4
X
-
Reserved
3
1
40
CPUCLK3 (Active / Inactive)
2
1
41
CPUCLK2 (Active / Inactive)
1
1
43
CPUCLK1 (Active / Inactive)
0
1
44
CPUCLK0 (Active / Inactive)
7.3.3 Register 2: PCI Clock Register (1 = enable, 0 = Stopped)
Bit
@PowerUp
Pin
Description
7
x
-
Reserved
6
1
7
PCICLK_F / FS1 (Active / Inactive)
5
1
15
PCICLK5 / PCI_STOP# (Active / Inactive)
4
1
13
PCICLK4 (Active / Inactive)
3
1
12
PCICLK3 (Active / Inactive)
2
1
11
PCICLK2 (Active / Inactive)
1
1
10
PCICLk1/FTS (Active / Inactive)
0
1
8
PCICLK0 / FS2 (Active / Inactive)
7.3.4 Register 3: SDRAM Clock Register ( 1 = enable, 0 = Stopped )
Bit
@PowerUp
Pin
Description
7
1
28
SDRAM7 (Active / Inactive)
6
1
29
SDRAM6 (Active / Inactive)
5
1
31
SDRAM5 (Active / Inactive)
4
1
32
SDRAM4 (Active / Inactive)
3
1
34
SDRAM3 (Active / Inactive)
2
1
35
SDRAM2 (Active / Inactive)
1
1
37
SDRAM1 (Active / Inactive)
0
1
38
SDRAM0 (Active / Inactive)
-8-
Publication Release Date: May 1998
Revision 0.20
W83193R-01
PRELIMINARY
7.3.5 Register 4: Additional SDRAM Clock Register (1 = enable, 0 = Stopped)
Bit
@PowerUp
Pin
Description
7
x
-
Reserved
6
x
-
Reserved
5
x
-
Reserved
4
x
-
Reserved
3
1
17
SDRAM11 (Active / Inactive)
2
1
18
SDRAM10 (Active / Inactive)
1
1
20
SDRAM9 (Active / Inactive)
0
1
21
SDRAM8 (Active / Inactive)
7.3.6 Register 5: Peripheral Control (1 = enable, 0 = Stopped)
Bit
@PowerUp
Pin
Description
7
x
-
Reserved
6
x
-
Reserved
5
x
-
Reserved
4
1
47
3
x
-
Reserved
2
x
-
Reserved
1
1
46
REF1 / CPU_STOP# (Active / Inactive)
0
1
2
REF0 (Active / Inactive)
IOAPIC (Active / Inactive)
7.3.7 Register 6: Reserved Register
Bit
@PowerUp
Pin
Description
7
x
-
Reserved
6
x
-
Reserved
5
x
-
Reserved
4
x
-
Reserved
3
x
-
Reserved
2
x
-
Reserved
1
x
-
Reserved
0
x
-
Reserved
-9-
Publication Release Date: May 1998
Revision 0.20
W83193R-01
PRELIMINARY
8.0 SPECIFICATIONS
8.1 ABSOLUTE MAXIMUM RATINGS
Stresses greater than those listed in this table may cause permanent damage to the device.
Precautions should be taken to avoid application of any voltage higher than the maximum rated
voltages to this circuit. Maximum conditions for extended periods may affect reliability. Unused
inputs must always be tied to an appropriate logic voltage level (Ground or Vdd).
Symbol
Parameter
Rating
Vdd , VIN
Voltage on any pin with respect to GND
- 0.5 V to + 7.0 V
TSTG
Storage Temperature
- 65°C to + 150°C
TB
Ambient Temperature
- 55°C to + 125°C
TA
Operating Temperature
0°C to + 70°C
8.2 AC CHARACTERISTICS
Vdd = Vddq3 = 3.3V ± 5 %, Vddq2= 2.375V~2.9V , TA = 0°C to +70°C
Parameter
Symbol
Output Duty Cycle
Min
Typ
Max
Units
45
50
55
%
Measured at 1.5V
4
ns
15 pF Load Measured at 1.5V
15 pF Load Measured at 1.5V
CPU/SDRAM to PCI Offset
tOFF
Skew (CPU-CPU), (PCIPCI), (SDRAM-SDRAM)
tSKEW
250
ps
tCCJ
¡Ó250
ps
tJA
500
ps
BWJ
500
KHz
0.4
1.6
ns
15 pF Load on CPU and PCI
outputs
CPU/SDRAM
1
Test Conditions
Cycle to Cycle Jitter
CPU/SDRAM
Absolute Jitter
Jitter Spectrum 20 dB
Bandwidth from Center
Output Rise (0.4V ~ 2.0V)
tTLH
& Fall (2.0V ~0.4V) Time
tTHL
Overshoot/Undershoot
Vover
0.7
1.5
V
22 Ω at source of 8 inch PCB
run to 15 pF load
VRBE
0.7
2.1
V
Ring Back must not enter this
range.
Beyond Power Rails
Ring Back Exclusion
- 10 -
Publication Release Date: May 1998
Revision 0.20
W83193R-01
PRELIMINARY
8.3 DC CHARACTERISTICS
Vdd = Vddq3 = 3.3V ± 5 %, Vddq2 = 2.375V~2.9V , TA = 0°C to +70°C
Parameter
Symbol
Min
Typ
Max
Units
0.8
Vdc
Test Conditions
Input Low Voltage
VIL
Input High Voltage
VIH
Input Low Current
IIL
-66
µA
Input High Current
IIH
5
µA
Output Low Voltage
VOL
0.4
Vdc
All outputs
Vdc
All outputs using 3.3V power
2.0
Vdc
IOL = 4 mA
Output High Voltage
VOH
2.4
IOH = 4mA
Tri-State leakage Current
Ioz
Dynamic Supply Current
Idd3
10
µA
mA
PCI = 33.3 Mhz with load
for Vdd + Vddq3
Dynamic Supply Current
CPU = 66.6 MHz
Idd2
mA
Same as above
ICPUS3
mA
Same as above
ICPUS2
mA
Same as above
IPD3
mA
for Vddq2 + Vddq2b
CPU Stop Current
for Vdd + Vddq3
CPU Stop Current
for Vddq2 + Vddq2b
PCI Stop Current
for Vdd + Vddq3
- 11 -
Publication Release Date: May 1998
Revision 0.20
W83193R-01
PRELIMINARY
8.4 BUFFER CHARACTERISTICS
8.4.1 TYPE 1 BUFFER FOR CPU (0:3)
Parameter
Symbol
Min
Pull-Up Current Min
IOH(min)
-27
Pull-Up Current Max
IOH(max)
Pull-Down Current Min
IOL(min)
Pull-Down Current Max
IOL(max)
Rise/Fall Time Min
Between 0.4 V and 2.0 V
TRF(min)
Rise/Fall Time Max
Between 0.4 V and 2.0 V
TRF(max)
Typ
Max
-27
27
0.4
1.6
Units
Test Conditions
mA
Vout = 1.0 V
mA
Vout = 2.0V
mA
Vout = 1.2 V
mA
Vout = 0.3 V
ns
10 pF Load
ns
20 pF Load
8.4.2 TYPE 2 BUFFER FOR IOAPIC
Parameter
Symbol
Pull-Up Current Min
IOH(min)
Pull-Up Current Max
IOH(max)
Pull-Down Current Min
IOL(min)
Pull-Down Current Max
IOL(max)
Rise/Fall Time Min
Between 0.7 V and 1.7 V
TRF(min)
Rise/Fall Time Max
Between 0.7 V and 1.7 V
TRF(max)
Min
Typ
Max
-29
28
0.4
1.8
- 12 -
Units
Test Conditions
mA
Vout = 1.4 V
mA
Vout = 2.7V
mA
Vout = 1.0 V
mA
Vout = 0.2 V
ns
10 pF Load
ns
20 pF Load
Publication Release Date: May 1998
Revision 0.20
W83193R-01
PRELIMINARY
8.4.3 TYPE 3 BUFFER FOR REF1, 24MHZ, 48MHZ
Parameter
Symbol
Min
Pull-Up Current Min
IOH(min)
-29
Pull-Up Current Max
IOH(max)
Pull-Down Current Min
IOL(min)
Pull-Down Current Max
IOL(max)
Rise/Fall Time Min
Between 0.8 V and 2.0 V
TRF(min)
Rise/Fall Time Max
TRF(max)
Typ
Max
Units
Test Conditions
mA
Vout = 1.0 V
mA
Vout = 3.135V
mA
Vout = 1.95 V
mA
Vout = 0.4 V
ns
10 pF Load
4.0
ns
20 pF Load
Max
Units
-23
29
1.0
Between 0.8 V and 2.0 V
8.4.4 TYPE 4 BUFFER FOR SDRAM(0:11)
Parameter
Symbol
Pull-Up Current Min
IOH(min)
Pull-Up Current Max
IOH(max)
Pull-Down Current Min
IOL(min)
Pull-Down Current Max
IOL(max)
Rise/Fall Time Min
Between 0.8 V and 2.0 V
TRF(min)
Rise/Fall Time Max
TRF(max)
Min
Typ
Test Conditions
mA
Vout = 1.65V
mA
Vout = 3.135V
mA
Vout = 1.65 V
mA
Vout = 0.4 V
ns
20 pF Load
1.3
ns
30 pF Load
Max
Units
-46
53
0.5
Between 0.8 V and 2.0 V
8.4.5 TYPE 5 BUFFER FOR PCICLK(0:5,F)
Parameter
Symbol
Min
Pull-Up Current Min
IOH(min)
-33
Pull-Up Current Max
IOH(max)
Pull-Down Current Min
IOL(min)
Pull-Down Current Max
IOL(max)
Rise/Fall Time Min
Between 0.8 V and 2.0 V
TRF(min)
Rise/Fall Time Max
TRF(max)
Typ
-33
30
38
0.5
2.0
Test Conditions
mA
Vout = 1.0 V
mA
Vout = 3.135 V
mA
Vout = 1.95 V
mA
Vout = 0.4 V
ns
15 pF Load
ns
30 pF Load
Between 0.8 V and 2.0 V
- 13 -
Publication Release Date: May 1998
Revision 0.20
W83193R-01
PRELIMINARY
9.0 POWER MANAGEMENT TIMING
9.1 CPU_STOP# Timing Diagram ( synchronous )
CPUCLK
(Internal)
2
1
2
1
PCICLK
(Internal)
PCICLK_F
CPU_STOP#
CPUCLK[0:3]
SDRAM
For synchronous Chipset, CPU_STOP# pin is a synchronous “ active low ” input pin used to stop the
CPU clocks for low power operation. This pin is asserted synchronously by the external control logic
at the rising edge of free running PCI clock(PCICLK_F). All other clocks will continue to run while
the CPU clocks are stopped. The CPU clocks will always be stopped in a low state and resume
output with full pulse width. In this case, CPU “clocks on latency“ is less than 2 CPU clocks and
“clocks off latency” is less then 2 CPU clocks.
9.2 PCI_STOP# Timing Diagram ( synchronous )
CPUCLK
(Internal)
PCICLK
(Internal)
1
2
1
2
PCICLK_F
PCI_STOP#
PCICLK[0:5]
For synchronous Chipset, PCI_STOP# pin is a synchronous “active low” input pin used to stop the
PCICLK [0:5] for low power operation. This pin is asserted synchronously by the external control logic
at the rising edge of free running PCI clock(PCICLK_F). All other clocks will continue to run while
the PCI clocks are stopped. The PCI clocks will always be stopped in a low state and resume output
with full pulse width. In this case, PCI “clocks on latency“ is less than 1 PCI clocks and “clocks off
latency” is less then 1 PCI clocks.
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Publication Release Date: May 1998
Revision 0.20
W83193R-01
PRELIMINARY
10.0 OPERATION OF DUAL FUCTION PINS
Pins 7, 8, 10, 25, and 26 are dual function pins and are used for selecting different functions in this
device (see Pin description). During power up, these pins are in input mode (see Fig1), therefore,
and are considered input select pins. When Vdd reaches 2.5V, the logic level that is present on these
pins are latched into their appropriate internal registers. Once the correct information are properly
latched, these pins will change into output pins and will be pulled low by default. At the end of the
power up timer (within 3 ms) outputs starts to toggle at the specified frequency.
2.5V
#2 REF0/CPU3.3#_2.5
#7 PCICLK_F/FS1
#8 PCICLK0/FS2
#25 24/MODE
#26 48/FS0
Vdd
Output
pull-low
Output
tri-state
Within 3ms
Input
All other clocks
Output
Output
pull-low
Output
tri-state
Each of these pins are a large pull-up resistor ( 250 kΩ @3.3V ) inside. The default state will be logic
1, but the internal pull-up resistor may be too large when long traces or heavy load appear on these
dual function pins. Under these conditions, an external 10 kΩ resistor is recommended to be
connected to Vdd if logic 1 is expected. Otherwise, the direct connection to ground if a logic 0 is
desired. The 10 kΩ resistor should be place before the serious terminating resistor. Note that these
logic will only be latched at initial power on.
If optional EMI reducing capacitor are needed, they should be placed as close to the series
terminating resistor as possible and after the series terminating resistor. These capacitor has typical
values ranging from 4.7pF to 22pF .
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Publication Release Date: May 1998
Revision 0.20
W83193R-01
PRELIMINARY
Vdd
10kΩ
Series
Terminating
Resistor
Device
Pin
Clock
Trace
EMI
Reducing
Cap
10kΩ
Optional
Ground
Ground
Programming Header
Vdd Pad
Ground Pad
10kΩ
Series
Terminating
Resistor
Device
Pin
Clock
Trace
EMI
Reducing
Cap
Optional
Ground
- 16 -
Publication Release Date: May 1998
Revision 0.20
W83193R-01
PRELIMINARY
11.0 POWER SUPPLY SUGGESTION
1.A solid ground plane should be placed around the clock device. Ground connections should be tied
to this main ground plane as short as possible. No cuts should be made in the ground plane around
the device.
2.C21,C22,C31,C36 are decoupling capacitors (0.1£gF surface mount, low ESR, ceramic capacitors.)
They should be placed as possible as the Vdd pin and the ground via.
3.C1 and C2 are supply filtering capacitors for low frequency power supply noise. A 22£gF (or 10£gF)
tantalum capacitor is recommended.
4.Use of Ferrite Bead’s (FB) are recommended to further reduce the power supply noise.
5.The power supply race to the Vdd pins must be thick enough so that voltage drops across the trace
resistance is negligible.
Vdd
(3.3V)
C1
FB2
FB1
Vdd Plane
C31
C32
C33
C34
Vdd2 Plane
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
- 17 -
C21
Vdd2
(3.3Vor2.5V)
C2
C22
C36
C35
Publication Release Date: May 1998
Revision 0.20
W83193R-01
PRELIMINARY
12.0 ORDERING INFORMATION
Part Number
Package Type
Production Flow
W83193R-01
48 PIN SSOP
Commercial, 0°C to +70°C
13.0 HOW TO READ THE TOP MARKING
W83193R-01
28051234
814GBB
1st line: Winbond logo and the type number: W83193R-01
2nd line: Tracking code 2 8051234
2: wafers manufactured in Winbond FAB 2
8051234: wafer production series lot number
3rd line: Tracking code 814 G B B
814: packages made in '98, week 14
G: assembly house ID; A means ASE, S means SPIL, G means GR
BB: IC revision
All the trade marks of products and companies mentioned in this data sheet belong to
their respective owners.
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Publication Release Date: May 1998
Revision 0.20
W83193R-01
PRELIMINARY
14.0 PACKAGE DRAWING AND DIMENSIONS
Headquarters
Winbond Electronics (H.K.) Ltd.
No. 4, Creation Rd. III
Science-Based Industrial Park
Hsinchu, Taiwan
TEL: 886-35-770066
FAX: 886-35-789467
www: http://www.winbond.com.tw/
Rm. 803, World Trade Square, Tower II
123 Hoi Bun Rd., Kwun Tong
Kowloon, Hong Kong
TEL: 852-27516023-7
FAX: 852-27552064
Winbond Electronics
(North America) Corp.
2730 Orchard Parkway
San Jose, CA 95134 U.S.A.
TEL: 1-408-9436666
FAX: 1-408-9436668
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd.
Taipei, Taiwan
TEL: 886-2-7190505
FAX: 886-2-7197502
TLX: 16485 WINTPE
Please note that all data and specifications are subject to change without notice. All the
trade marks of products and companies mentioned in this data sheet belong to their
respective owners.
These products are not designed for use in life support appliances, devices, or systems
where malfunction of these products can reasonably be expected to result in personal
injury. Winbond customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Winbond for any damages resulting
from such improper use or sale.
- 19 -
Publication Release Date: May 1998
Revision 0.20