MAXIM MAX1125AIBH

19-1100; Rev 0; 6/96
KIT
ATION
EVALU
BLE
A
IL
A
V
A
8-Bit, 300Msps Flash ADC
The MAX1125 is a monolithic, flash analog-to-digital converter (ADC) capable of digitizing a 2V analog input signal
into 8-bit digital words at a typical 300Msps update rate.
For most applications, no external sample-and-hold is
required for accurate conversion due to the device's
narrow aperture time, wide bandwidth, and low input
capacitance. A single standard -5.2V power supply is
required to operate the MAX1125, with nominal 2.2W
power dissipation. A special decoding scheme reduces
metastable errors to 1LSB.
The part is packaged in a 42-pin ceramic sidebraze
that is pin compatible with the CX20116 and
CX41396D. The surface-mount 44-pin CERQUAD package allows access to additional reference ladder taps,
an overrange bit, and a data-ready output. The pincompatible 150Msps MAX1114 is also available.
________________________Applications
Digital Oscilloscopes
Transient Capture
Radar, EW, ECM
Direct RF Down-Conversion
Medical Electronics
Ultrasound, CAT Instrumentation
D8 (MSB)
D7
D6
D5
D4
D3
D2
D1
D0 (LSB)
DREADY
DGND
44
43
42
41
40
39
38
37
36
35
34
DGND
1
33 AGND
AGND
2
32 VEE
VEE
3
31 LINV
MINV
4
30 N.C.
CLK
5
29 DRINV
CLK
6
VEE
MAX1125
Metastable Errors Reduced to 1LSB
10pF Input Capacitance
210MHz Input Bandwidth
300Msps Conversion Rate
2.2W Typical Power Dissipation
Single -5.2V Supply
______________Ordering Information
PART
TEMP. RANGE PIN-PACKAGE INL (LSBs)
MAX1125AIDO -20°C to +85°C 42 Ceramic SB
±0.75
MAX1125BIDO -20°C to +85°C 42 Ceramic SB
MAX1125AIBH -20°C to +85°C 44 CERQUAD
MAX1125BIBH -20°C to +85°C 44 CERQUAD
±1
±0.75
±1
Functional Diagram appears at end of data sheet.
____Pin Configurations (continued)
TOP VIEW
_________________Pin Configurations
TOP VIEW
____________________________Features
♦
♦
♦
♦
♦
♦
VEE
1
42 N.C.
N.C.
2
41 VRTF
LINV
3
40 N.C.
VEE
4
AGND
5
38 VEE
DGND
6
37 N.C.
DO (LSB)
7
36 N.C.
D1
8
35 AGND
D2
9
34 VIN
MAX1125
39 VEE
D3 10
33 AGND
D4 11
32 VR2
D5 12
31 AGND
D6 13
30 VIN
29 AGND
D7 (MSB) 14
28 N.C.
DGND 15
28 N.C.
7
27 VEE
AGND 16
27 N.C.
AGND
8
26 AGND
AGND
VEE 22
VR3 21
AGND 20
VIN 19
AGND 18
VR2 17
AGND 16
23 VRTF
VIN 15
VRBF 11
AGND 14
24 VRTS
VEE 12
25 AGND
VR1 13
9
VRBS 10
VEE 17
26 VEE
MINV 18
25 VEE
N.C. 19
24 N.C.
CLK 20
23 VRBF
CLK 21
22 N.C.
Ceramic SB
CERQUAD
________________________________________________________________ Maxim Integrated Products
1
For free samples & the latest literature: http://www.maxim-ic.com, or phone 1-800-998-8800
MAX1125
_______________General Description
MAX1125
8-Bit, 300Msps Flash ADC
ABSOLUTE MAXIMUM RATINGS
Negative Supply Voltage (VEE TO GND) ..............-7.0V to +0.5V
Ground Voltage Differential ...................................-0.5V to +0.5V
Analog Input Voltage ...............................................VEE to +0.5V
Reference Input Voltage ..........................................VEE to +0.5V
Digital Input Voltage ................................................VEE to +0.5V
Reference Current VRTF to VRBF ........................................25mA
Digital Output Current ...........................................0mA to -30mA
Operating Temperature Range ...........................-25°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10sec). ............................+300°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VEE = -5.2V, RSOURCE = 50Ω, VRBF = -2.00V, VR2 = -1.00V, VRTF = 0.00V, fCLK = 150MHz, 50% Duty Cycle, TA = TMIN to TMAX,
unless otherwise noted.)
TEST
LEVEL
MIN
Integral Linearity
VI
-0.75
Differential Linearity
VI
-0.75
PARAMETER
CONDITIONS
MAX1125A
TYP
MAX
MIN
MAX1125B
TYP
MAX
UNITS
DC ACCURACY
No Missing Codes
±0.60
+0.75
-0.95
+0.75
-0.95
Guaranteed
±0.80
+0.95
LSB
+0.95
LSB
Guaranteed
ANALOG INPUT
Offset Error VRT
IV
-30
+30
-30
+30
mV
Offset Error VRB
IV
-30
+30
-30
+30
mV
Input Voltage Range
VI
-2.0
0.0
-2.0
0.0
Input Capacitance
Over full input range
V
10
10
V
pF
Input Resistance
V
15
Input Current
VI
250
15
Input Slew Rate
V
1,000
1,000
V/µs
500
250
kΩ
500
µA
Large Signal Bandwidth
VIN = full scale
V
210
210
MHz
Small Signal Bandwidth
IN = 500mVp-p
V
335
335
MHz
REFERENCE INPUT
Ladder Resistance
VI
Reference Bandwidth
V
100
200
300
100
10
200
300
Ω
10
MHz
300
Msps
TIMING CHARACTERISTICS
Maximum Sample Rate
VI
Clock to Data Delay
V
2.4
2.4
ns
Output Delay TEMPCO
V
2
2
ps/°C
CLK-to-Data Ready Delay (tD)
V
2.0
2.0
ns
Aperture Jitter
V
5
5
ps
Acquisition Time
V
1.5
1.5
ns
2
250
300
250
_______________________________________________________________________________________
8-Bit, 300Msps Flash ADC
(VEE = -5.2V, RSOURCE = 50Ω, VRBF = -2.00V, VR2 = -1.00V, VRTF = 0.00V, fCLK = 150MHz, 50% Duty Cycle, TA = TMIN to TMAX,
unless otherwise noted.)
TEST
LEVEL
MIN
FIN = 3.58MHz
VI
45
47
44
46
FIN = 100MHz
VI
39
42
38
41
FIN = 3.58MHz
VI
-48
-52
-46
-50
FIN = 100MHz
VI
-40
-43
-39
-42
FIN = 3.58MHz
VI
44
46
42
44
FIN = 100MHz
VI
37
39
35
37
Digital Input High Voltage
(MINV, LINV)
VI
-1.1
-0.7
-1.1
-0.7
V
Digital Input Low Voltage
(MINV, LINV)
VI
-2.0
-1.5
-2.0
-1.5
V
Clock Synchronous
Input Currents
V
Clock Low Width, TPWL
VI
2
1.8
Clock High Width, TPWH
VI
2
1.8
-1.1
PARAMETER
CONDITIONS
MAX1114A
TYP
MAX
MIN
MAX1114B
TYP
MAX
UNITS
DYNAMIC PERFORMANCE
Signal-to-Noise Ratio
Total Harmonic Distortion
Signal-to-Noise and
Distortion (SINAD)
dB
dB
dB
DIGITAL INPUTS
40
40
µA
2
1.8
ns
2
1.8
ns
DIGITAL OUTPUTS
Digital Output High Voltage
50Ω to -2V
VI
Digital Output Low Voltage
50Ω to -2V
VI
-1.1
V
-1.5
-1.5
V
2.4
Supply Current
TA = +25 °C
I
425
550
425
550
mA
Power Dissipation
TA = +25 °C
I
2.2
2.9
2.2
2.9
W
TEST LEVEL CODES
All electrical characteristics are subject to the
following conditions:
All parameters having min/max specifications are
guaranteed. The Test Level column indicates the
specific device testing actually performed during
production and Quality Assurance inspection.
Any blank section in the data column indicates
that the specification is not tested at the specified
condition.
Unless otherwise noted, all tests are pulsed;
therefore, Tj = TC = TA.
TEST LEVEL
2.4
V
POWER-SUPPLY REQUIREMENTS
ns
TEST PROCEDURE
I
100% production tested at the specified temperature.
II
100% production tested at TA = +25°C, and sample tested at the
specified temperatures.
III
QA sample tested only at the specified temperatures.
IV
Parameter is guaranteed (but not tested) by design and
characterization data.
V
Parameter is a typical value for information purposes only.
VI
100% production tested at TA = +25°C. Parameter is guaranteed
over specified temperature range.
_______________________________________________________________________________________
3
MAX1125
ELECTRICAL CHARACTERISTICS (continued)
__________________________________________Typical Operating Characteristics
fs = 250Msps
48
65
46
60
44
42
fs = 250Msps
70
THD (dB)
55
50
40
45
38
40
36
35
30
34
1
10
100
INPUT FREQUENCY (MHz)
INPUT FREQUENCY (MHz)
SIGNAL-TO-NOISE AND DISTORTION
vs. INPUT FREQUENCY
SNR, THD, SINAD
vs. TEMPERATURE
fs = 250Msps
50
1
100
50
MAX1125 -03
52
10
fs = 250Msps
fIN = 100MHz
SNR, THD, SINAD (dB)
48
46
44
42
40
MAX1125 -04
SNR (dB)
50
75
MAX1125 -01
52
MAX1125 -02
TOTAL HARMONIC DISTORTION
vs. INPUT FREQUENCY
SIGNAL-TO-NOISE RATIO
vs. INPUT FREQUENCY
SINAD (dB)
MAX1125
8-Bit, 300Msps Flash ADC
45
THD
SNR
40
SINAD
35
38
36
30
34
1
10
INPUT FREQUENCY (MHz)
4
100
-40
-20
0
20
40
TEMPERATURE (°C)
_______________________________________________________________________________________
60
80
8-Bit, 300Msps Flash ADC
PIN
NAME
FUNCTION
Ceramic SB
CERQUAD
1, 4, 17, 25, 26, 38, 39
3, 7, 12, 22, 27, 32
VEE
Negative Analog Supply (nominally -5.2V)
2, 19, 22, 24, 27, 28, 36,
37, 40, 42
28, 30
N.C.
No Connect. Not internally connected.
3
31
LINV
D0–D6 Output Inversion Control
5, 16, 29, 31, 33, 35
2, 8, 9, 14, 16, 18, 20,
25, 26, 33
AGND
Analog Ground
6, 15
1, 34
DGND
Digital Ground
7
36
D0
8–13
37–42
D1–D6
14
43
D7
18
4
MINV
—
44
D8
20
5
CLK
Inverse ECL Clock Input Pin
ECL Clock Input Pin
Digital Data Output (LSB)
Digital Data Output
Digital Data Output (MSB)
D7 Output Inversion Control
Overrange Output
21
6
CLK
—
10
VRBS
Reference Voltage Bottom, Sense
23
11
VRBF
Reference Voltage Bottom, Force
30, 34
15, 19
VIN
Analog Input. Can be connected to the input
signal or used as a sense.
—
13
VR1
Reference Voltage Tap 1 (typically -1.5V)
32
17
VR2
Reference Voltage Tap 2 (typically -1V)
—
21
VR3
Reference Voltage Tap 3 (typically -0.5V)
41
23
VRTF
Reference Voltage Top, Force
—
24
VRTS
Reference Voltage Top, Sense
—
29
DRINV
Data-Ready Inverse
—
35
DREADY
Data-Ready Output
_______________Detailed Description
The MAX1125 is a 300Msps, monolithic, 8-bit parallel
flash analog-to-digital converter (ADC) with an analog
bandwidth of over 200MHz. A major advance over previous flash converters is the inclusion of 256 input preamplifiers between the reference ladder and input
comparators. (See Functional Diagram.) This feature
not only reduces clock-transient kickback to the input
and reference ladder due to a low AC beta, but also
reduces the effect of the dynamic state of the input signal on the latching characteristics of the input comparators. The preamplifiers act as buffers and stabilize the
input capacitance so it remains constant for varying
input voltages and frequencies, making the part easier
to drive than previous flash converters. The MAX1125
incorporates a special decoding scheme that reduces
metastable errors (sparkle codes or flyers) to a maximum of 1LSB.
_______________________________________________________________________________________
5
MAX1125
______________________________________________________________Pin Description
MAX1125
8-Bit, 300Msps Flash ADC
The MAX1125 has true differential analog and digital
data paths from the preamplifiers to the output buffers
(Current-Mode Logic) for reducing potential missing
codes while rejecting common-mode noise.
Careful layout of the analog circuitry reduces signature
errors. Every comparator also has a clock buffer to
reduce differential delays and to improve signal-tonoise ratio. The output-drive capability of the device
can provide full ECL swings into 50Ω loads.
___________Typical Interface Circuit
Figure 1 shows the typical interface circuit. The
MAX1125 is relatively easy to apply depending on the
accuracy needed. Wire-wrap may be employed with
careful point-to-point ground connections if desired,
but a double-sided PC board with a ground plane on
the component side, separated into digital and analog
sections, gives the best performance. The converter is
bonded-out to place the digital pins on the left side of
the package and the analog pins on the right side. Additionally, an RF bead connection through a single
point from the analog to digital ground planes reduces
ground noise pickup.
Figure 2 (CERQUAD package only) shows the most
elaborate method of achieving the least error by correcting for integral nonlinearity, input induced distortion, and power-supply/ground noise. It uses external
reference ladder tap connections, an input buffer, and
supply decoupling. The function of each pin and external connections to other components is as follows:
VEE, AGND, DGND
V EE is the supply pin with AGND as ground for the
device. The power-supply pins should be bypassed as
close to the device as possible with at least a 0.01µF
ceramic capacitor. A 1µF tantalum should also be used
for low-frequency suppression. DGND is the ground for
the ECL outputs and should be referenced to the output
pulldown voltage and bypassed as shown in Figure 1.
Analog Input VIN
There are two analog input pins that are tied to the
same point internally. Either one may be used as an
analog input sense and the other for input force. This is
convenient for testing the source signal to see if there is
sufficient drive capability. The pins can also be tied together and driven by the same source. The MAX1125 is
superior to similar devices due to a preamplifier stage
before the comparators (Figure 4). This makes the
device easier to drive because it has constant capacitance and induces less slew-rate distortion. An optional
input buffer may be used.
6
Clock Inputs CLK, CLK
The clock inputs are designed to be driven differentially
with ECL levels. Because CLK is internally biased to -1.3V,
the clock may be driven single-ended (Figure 5). CLK
may be left open, but a 0.01µF bypass capacitor from
CLK to AGND is recommended. NOTE: System performance may be degraded due to increased noise or jitter.
Output Logic Control MINV, LINV
These are ECL-compatible digital controls for changing
the output code from straight binary to two's complement, etc. (Table 1 and Figure 4). Both MINV and LINV
are in the logic low (0) state when left open. The high
state can be obtained by tying to AGND through a
diode or 3.9kΩ resistor.
Table 1. Output Coding
MINV
LINV
0
0
0
1
1
0
1
1
0V
111...11
100...00
011...11
000...00
.
111...10
100...01
011...10
000...01
.
.
.
.
.
.
.
VIN .
.
.
100...00
.
.
111...11
.
.
000...00
.
.
011...11
.
011...11
000...00
111...11
100...00
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
000...01
011...10
100...01
111...10
-2V
000...00
011...11
100...00
111...11
1: VIH, VOH
0: VIL, VOL
Digital Outputs D0 to D7
The digital outputs can drive ECL levels into 50Ω when
pulled down to -2V. When pulled down to -5.2V, the
outputs can drive 150Ω to 1kΩ loads.
Reference Inputs VRBF, VR2, VRTF
There are two reference inputs and one external reference voltage tap. These are -2V (VRBF), mid-tap (VR2)
and AGND (VRTF). The reference pins can be driven
as shown in Figure 1. VR2 should be bypassed to
AGND for further noise suppression.
Reference Inputs VRBF, VRBS, VR1, VR2,
VR3, VRTF, VRTS (CERQUAD package only)
These are five external reference voltage taps from -2V
(VRBF) to AGND (VRTF) that can be used to control integral linearity over temperature. The taps can be driven by
_______________________________________________________________________________________
8-Bit, 300Msps Flash ADC
Not Connected (N.C.)
All N.C. pins should be tied to DGND on the left side of
the package and to AGND on the right side of the
package.
Data Ready and Data Ready Inverse
DREADY, DRINV (CERQUAD package only)
The data-ready pin is a flag that goes high or low at the
output when data is valid or ready to be received. It is
essentially a delay line that accounts for the time necessary for information to be clocked through the
MAX1125's decoders and latches. This function is useful for interfacing with high-speed memory. Using the
data-ready output to latch the output data ensures minimum setup and hold times. DRINV is a data-ready
inverse control pin (Figure 3).
Overrange Input D8
(CERQUAD package only)
When the MAX1125 is in an overrange state, D8 goes
high, and all data outputs go high as well. This makes it
possible to include the MAX1125 in higher resolution
systems.
Operation
The MAX1125 has 256 preamp/comparator pairs that
are each supplied with the voltage from VRTF to VRBF
divided equally by the resistive ladder as shown in the
Functional Diagram. This voltage is applied to the posi-
tive input of each preamplifier/comparator pair. An analog input voltage applied at VIN is connected to the
negative inputs of each preamplifier/comparator pair.
The comparator states are then clocked through each
comparator's individual clock buffer. When CLK is low,
the comparators' master, or input stage, compares the
analog input voltage to the respective reference voltage. When CLK changes from low to high, the comparators are latched to the state prior to the clock
transition and output logic codes in sequence from the
top comparators, closest to VRTF (0V), down to the
point where the magnitude of the input signal changes
sign (thermometer code). The output of each comparator is then registered into four 64-to-6 bit decoders
when CLK changes from high to low. At the output of
the decoders is a set of four 7-bit latches that are
enabled (track) when CLK changes from high to low.
From here, the outputs of the latches are coded into 6
LSBs from 4 columns and 4 columns are coded into 2
MSBs. Next are the MINV and LINV controls for output
inversions that consist of a set of eight XOR gates.
Finally, 8 ECL output latches and buffers are used to
drive the external loads. The conversion takes one
clock cycle from the input to the data outputs.
_________________Evaluation Boards
The MAX1114/MAX1125 evaluation kit (EV kit) demonstrates the full performance of the MAX1125. This
board includes a voltage reference circuit, clock driver
circuit, output data latches and an on-board reconstruction of the digital data. A separate data sheet
describing the operation of this board is also available.
Contact the factory for price and delivery.
_______________________________________________________________________________________
7
MAX1125
op amps (Figure 2). These voltage level inputs can be bypassed to AGND for further noise suppression, if so desired. VRB and VRT have force and sense pins for
monitoring the top and bottom voltage references.
MAX1125
8-Bit, 300Msps Flash ADC
L
ANALOG INPUT CAN
BE EITHER FORCE
OR SENSE.
OPTIONAL
BUFFER
VRTF
0.01µF
VEE
-5.2V
LINV
VIN
MINV
PREAMP COMPARATOR
256
CLOCK
BUFFER
= AGND
255
= DGND
152
D7 (MSB)
151
D6
256-BIT
TO 8-BIT
ENCODER
128
VR2
ECL
LATCHES
AND
BUFFERS
D5
0.01µF
127
D4
64
D3
D2
63
D1
2
D0 (LSB)
VREF
-2V
1
10Ω TO
25Ω
OP07
VRBF
0.01µF
*
50Ω x 8
MAX1125
VIN
100116
CLK
CONVERT
50Ω
-2V
(ANALOG)
50Ω
2
CLK
0.01µF
0.01µF
VEE
-5.2V
0.01µF
-2V
(DIGITAL)
Figure 1. Typical Interface Circuit 1
8
_______________________________________________________________________________________
8-Bit, 300Msps Flash ADC
MAX1125
OPTIONAL
BUFFER
*
DGND
10Ω TO
25Ω
L
AGND
0.01µF
VEE
-5.2V
VRTF
U1
LINV
VIN
VRTS
0.01µF
MINV
PREAMP COMPARATOR
256
CLOCK
BUFFER
*ANALOG INPUT (FORCE)
**ANALOG INPUT (SENSE)
255
1k,
0.1%
OVERRANGE
D8
152
10Ω TO
25Ω
VR3
U2
D7
(MSB)
151
0.01µF
1k,
0.1%
D6
10Ω TO
25Ω
NOTE: U1–U5
ARE OP07 OR
EQUIVALENT,
LOW-NOISE,
LOW-OFFSET
AMPLIFIERS.
ECL
LATCHES
AND
BUFFERS
256-BIT
TO 8-BIT
ENCODER
128
VR2
U3
D5
127
0.01µF
D4
1k,
0.1%
10Ω TO
25Ω
64
D3
VR1
U4
D2
63
0.01µF
D1
2
1k,
0.1%
D0
(LSB)
VREF
-2V
1
10Ω TO
25Ω VRBF
U5
VRBS
0.01µF
100116
50Ω
x 10
CLK
2
CONVERT
50Ω
-2V
(ANALOG)
50Ω
DRINV
DREADY
MAX1125
CLK
**
VIN
0.01µF
0.01µF
VEE
0.01µF
VEE
-5.2V
AGND
-2V
0.01µF
-2V
(DIGITAL)
Figure 2. Typical Interface Circuit 2 (CERQUAD package only)
_______________________________________________________________________________________
9
MAX1125
8-Bit, 300Msps Flash ADC
N+2
N
ANALOG INPUT
N+1
VIN
Tpw1
CLOCK
Tpw0
CLK
CLK
MASTER
INTERNAL TIMING
COMPARATOR OUTPUT
SLAVE
6-BIT LATCH OUTPUT
8-BIT LATCH OUTPUT
DATA OUTPUT D0–D7
N-1
OVERRANGE D8
N
N+1
tD
DREADY
TIMING FOR CERQUAD PACKAGE ONLY
Figure 3. Timing Diagram
AGND
AGND
VIN
AGND
DGND
VR
10k
MINV
LINV
-1.3V
DATA OUT
16k
VEE
VEE
INPUT CIRCUIT
OUTPUT CIRCUIT
MINV, LINV INPUT CIRCUIT
Figure 4. Subcircuit Schematics
10
______________________________________________________________________________________
8-Bit, 300Msps Flash ADC
MAX1125
AGND
-1.3V
CLK
13k
CLK
13k
VEE
Figure 5. Clock Input
VEE
1N4736
-2V
R4
R4
VREF
R1
R1
R1
R1
R1
R1
R1
R1
R3
VRBF
VEE
D0
D1
D2
R2
MAX1125
VIN
D3
VIN
D4
D5
CLK
D6
R2
CLK
D7
CLK
CLK
LINV
AGND
R1 = 50Ω 1/4 Watt CC 5%
R2 = 1kΩ 1/4 Watt CC 5%
R3 = 6.5Ω 1/4 Watt CC 5%
R4 = 6.5Ω 1/2 Watt CC 5%
VREF = -2.00V
VEE = -6.6V
VRTF
DGND
R2
MINV
R2
-2V
Figure 6. Burn-In Circuit (Ceramic SB package only)
______________________________________________________________________________________
11
MAX1125
8-Bit, 300Msps Flash ADC
_________________________________________________________Functional Diagram
ANALOG INPUT
(FORCE OR SENSE)
AGND DGND
VEE
LINV MINV
VRTS
MAX1125
VRTF
PREAMP COMPARATOR
256
DRINV
CLOCK
BUFFER
255
VR3
D7 (MSB)
DREADY
152
OVERRANGE
D7 (MSB)
151
D6
ECL
LATCHES
AND
BUFFERS
256-BIT
TO 8-BIT
ENCODER
128
VR2
D5
127
D4
D6
64
D5
D3
D4
VR1
63
D2
D3
D2
D1
2
D1
D0 (LSB)
1
D0 (LSB)
VRBE
VRBS
CONVERT
CLK
THESE FUNCTIONS ARE
AVAILABLE IN THE
CERQUAD PACKAGE ONLY.
2
CLK
ANALOG INPUT
(FORCE OR SENSE)
VEE
AGND
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
12 __________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 (408) 737-7600
© 1996 Maxim Integrated Products
Printed USA
is a registered trademark of Maxim Integrated Products.