WS512K32-XXX 512Kx32 SRAM MODULE, SMD 5962-94611 FEATURES n Access Times of 15*, 17, 20, 25, 35, 45, 55ns n 5 Volt Power Supply n Packaging n Low Power CMOS • 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP (Package 400). n Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation • 68 lead, 40mm Hermetic Low Profile CQFP, 3.5mm (0.140") (Package 502)1, Package to be developed. n Weight WS512K32-XH1X - 13 grams typical • 68 lead, Hermetic CQFP (G2T)1, 22.4mm (0.880") square (Package 509) 4.57mm (0.180") height. Designed to fit JEDEC 68 lead 0.990" CQFJ footprint (Fig. 3). WS512K32-XG2TX1 - 8 grams typical • 68 lead, Hermetic CQFP (G1U), 23.9mm (0.940") square (Package 519) 3.57mm (0.140") height. Designed to fit JEDEC 68 lead 0.990" CQFJ footprint (Fig. 3). WS512K32-XG1TX - 5 grams typical WS512K32-XG1UX - 5 grams typical WS512K32-XG4TX1 - 20 grams typical *15ns Access Time available only in Commercial and Industrial Temperature. This speed is not fully characterized and is subject to change without notice. Note 1: Package Not Recommended For New Design • 68 lead, Hermetic CQFP (G1T), 23.9mm (0.940") square (Package 524) 4.06mm (0.160") height. n Organized as 512Kx32, User Configurable as 1Mx16 or 2Mx8 n Commercial, Industrial and Military Temperature Ranges n TTL Compatible Inputs and Outputs FIG. 1 P IN C ONFIGURATION F OR WS512K32N-XH1X PIN DESCRIPTION T OP VIEW I/O 0-31 Data Inputs/Outputs A0-18 Address Inputs WE1-4 Write Enables CS1-4 Chip Selects OE Output Enable VCC Power Supply GND Ground NC Not Connected BLOCK DIAGRAM November 2001 Rev. 9 1 White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com WS512K32-XXX FIG. 2 PIN C ONFIGURATION FOR WS512K32-XG4TX 1 TOP VIEW PIN DESCRIPTION I/O0-31 Data Inputs/Outputs A0-18 Address Inputs WE Write Enables CS1-4 Chip Selects OE Output Enable VCC Power Supply GND Ground NC Not Connected BLOCK DIAGRAM Note 1: Package Not Recommended For New Design FIG. 3 1 PIN CONFIGURATION F OR WS512K32-XG2TX , WS512 K 32-XG 1TX A ND WS512K32-XG1UX T OP V IEW PIN DESCRIPTION The White 68 lead CQFP fills the same fit and function as the JEDEC 68 lead CQFJ or 68 PLCC. But it has the TCE and lead inspection advantage of the CQFP form. I/O0-31 Data Inputs/Outputs A0-18 Address Inputs WE1-4 Write Enables CS1-4 Chip Selects OE Output Enable VCC Power Supply GND Ground NC Not Connected BLOCK DIAGRAM Note 1: Package Not Recommended For New Design White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com 2 WS512K32-XXX A BSOLUTE MAXIMUM R ATINGS Parameter Symbol TRUTH TABLE Min Max Unit TA -55 +125 °C Storage Temperature TSTG -65 +150 °C Signal Voltage Relative to GND VG -0.5 Vcc+0.5 V Junction Temperature TJ 150 °C 7.0 V Operating Temperature Supply Voltage -0.5 VCC CS OE WE Mode Data I/O Power H L L L X L H X X H H L Standby Read Out Disable Write High Z Data Out High Z Data In Standby Active Active Active CAPACITANCE RECOMMENDED OPERATING CONDITIONS Parameter (TA = +25°C) Symbol Min Max Unit Supply Voltage VCC 4.5 5.5 V OE capacitance COE VIN = 0 V, f = 1.0 MHz Input High Voltage VIH 2.2 V CC + 0.3 V CWE VIN = 0 V, f = 1.0 MHz Input Low Voltage VIL -0.5 +0.8 V Operating Temp (Mil) TA -55 +125 °C WE1-4 capacitance HIP (PGA) CQFP G4T CQFP G2T/G1U/G1T Parameter Symbol Conditions Max Unit 50 pF pF 20 50 20 CS1-4 capacitance CCS VIN = 0 V, f = 1.0 MHz 20 pF Data I/O capacitance CI/O VI/O = 0 V, f = 1.0 MHz 20 pF Address input capacitance CAD VIN = 0 V, f = 1.0 MHz 50 pF This parameter is guaranteed by design but not tested. DC CHARACTERISTICS (VCC = 5.0V, VSS = 0V, TA = -55°C Parameter Symbol TO +125°C) Conditions Units Min Max Input Leakage Current I LI VCC = 5.5, VIN = GND to VCC 10 Output Leakage Current I LO CS = VIH, OE = VIH, VOUT = GND to VCC 10 µA CS = VIL, OE = VIH, f = 5MHz, Vcc = 5.5 660 mA Operating Supply Current x 32 Mode ICC x 32 µA Standby Current ISB CS = VIH, OE = VIH, f = 5MHz, Vcc = 5.5 80 mA Output Low Voltage VOL IOL = 8mA for 15 - 35ns, IOL = 2.1mA for 45 - 55ns, Vcc = 4.5 0.4 V Output High Voltage VOH IOH = -4.0mA for 15 - 35ns, IOH = -1.0mA for 45 - 55ns, Vcc = 4.5 2.4 V NOTE: DC test conditions: VIH = VCC -0.3V, VIL = 0.3V DATA RETENTION CHARACTERISTICS (TA = -55°C Parameter Symbol TO +125°C) Conditions Units Min Max 2.0 VDR CS ³ V CC £ 0.2V 5.5 V Data Retention Current ICCDR1 V CC = 3V 28 mA Low Power Data Retention Current (WS512K32L-XXX) ICCDR2 V CC = 3V 16 mA Data Retention Supply Voltage 3 White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com WS512K32-XXX AC CHARACTERISTICS (VCC = 5.0V, VSS = 0V, TA = -55°C Parameter -15* Symbol Read Cycle Min Read Cycle Time t RC Address Access Time tAA Output Hold from Address Change tOH Chip Select Access Time t ACS -17 Max 15 Min -20 Max Min 17 15 0 Max 20 -25 -35 Max 0 Min Min Max Max ns 45 0 55 ns 55 ns 25 ns 0 35 12 Min Units 55 35 25 10 -55 45 0 20 9 Max 25 0 17 -45 35 20 0 8 +125°C) 25 17 15 Min TO ns 45 Output Enable to Output Valid tOE Chip Select to Output in Low Z t CLZ 1 2 2 2 2 4 25 4 25 4 Output Enable to Output in Low Z t OLZ 1 0 0 0 0 0 0 0 Chip Disable to Output in High Z t CHZ 1 12 12 12 12 15 20 20 ns Output Disable to Output in High Z t OHZ1 12 12 12 12 15 20 20 ns ns ns *15ns Access Time available only in Commercial and Industrial Temperature. This speed is not fully characterized and is subject to change without notice. 1. This parameter is guaranteed by design but not tested. AC CHARACTERISTICS (VCC = 5.0V, VS S = 0V, TA = -55°C Parameter Symbol Write Cycle -15* Min -17 Max Min -20 Max Min TO +125°C) -25 Max Min -35 Max Min -45 Max Min -55 Max Min Units Max Write Cycle Time t WC 15 17 20 25 35 45 55 ns Chip Select to End of Write t CW 13 15 15 17 25 35 50 ns Address Valid to End of Write t AW 13 15 15 17 25 35 50 ns Data Valid to End of Write t DW 10 11 12 13 20 25 25 ns Write Pulse Width t WP 13 15 15 17 25 35 40 ns Address Setup Time t AS 2 2 2 2 2 2 2 ns Address Hold Time t AH 0 0 0 0 0 5 5 ns Output Active from End of Write t OW 1 2 2 3 4 4 5 5 Write Enable to Output in High Z t WHZ 1 Data Hold Time tDH 8 0 9 11 0 0 13 0 15 0 ns 20 0 20 0 ns *15ns Access Time available only in Commercial and Industrial Temperature. This speed is not fully characterized and is subject to change without notice. 1. This parameter is guaranteed by design but not tested. 2. The Address Setup Time of minimum 2ns is for the G2T, G1U and H1 packages. tAS minimum for the G4T package is 0ns. F IG . 4 AC T EST C ONDITIONS AC T EST C IRCUIT Parameter Typ Unit Input Pulse Levels VIL = 0, VIH = 3.0 V Input Rise and Fall 5 ns Input and Output Reference Level 1.5 V Output Timing Reference Level 1.5 V Notes: VZ is programmable from -2V to +7V. IOL & IOH programmable from 0 to 16mA. Tester Impedance Z0 = 75 ý. VZ is typically the midpoint of VOH and VOL. IOL & IOH are adjusted to simulate a typical resistive load circuit. ATE tester includes jig capacitance. White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com 4 ns WS512K32-XXX F IG. 5 T IMING W AVEFORM - R EAD C YCLE F IG . 6 W RITE CYCLE - WE C ONTROLLED F IG . 7 W RITE C YCLE - CS C ONTROLLED WS32K32-XHX 5 White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com WS512K32-XXX P ACKAGE 400: 66 PIN , PGA T YPE , C ERAMIC H E X -IN -L INE P ACK AGE , H IP (H1) ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES P ACK AGE 502: 68 LEAD , C ERAMIC Q UAD F L AT P ACK , L OW P ROFILE CQFP (G4T) 1 ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES Note 1: Package Not Recommended For New Design White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com 6 WS512K32-XXX P ACK AGE 509: 68 LEAD , C ERAMIC Q UAD F L AT P ACK , CQFP (G2T) 1 The White 68 lead G2T CQFP fills the same fit and function as the JEDEC 68 lead CQFJ or 68 PLCC. But the G2T has the TCE and lead inspection advantage of the CQFP form. ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES Note 1: Package Not Recommended For New Design 7 White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com WS512K32-XXX P ACK AGE 519: 68 LEAD , C ERAMIC Q UAD F L AT P ACK, L OW P ROFILE CQFP (G1U) The White 68 lead G1U CQFP fills the same fit and function as the JEDEC 68 lead CQFJ or 68 PLCC. But the G1U has the TCE and lead inspection advantage of the CQFP form. ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com 8 WS512K32-XXX P ACK AGE 524: 68 LEAD , C ERAMIC Q UAD F L AT P ACK , L OW PROFILE CQFP (G1T) The White 68 lead G1T CQFP fills the same fit and function as the JEDEC 68 lead CQFJ or 68 PLCC. But the G1T has the TCE and lead inspection advantage of the CQFP form. ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES 9 White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com WS512K32-XXX ORDERING INFORMATION W S 512K 32 X - XXX X X X LEAD FINISH: Blank = Gold plated leads A = Solder dip leads DEVICE GRADE: Q = MIL-STD-883 Compliant M = Military Screened -55°C to +125°C I = Industrial -40°C to 85°C C = Commercial 0°C to +70°C PACKAGE TYPE: H1 = Ceramic Hex-In-line Package, HIP (Package 400) G2T1 = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 509) G4T1 = 40mm Low Profile CQFP (Package 502) G1U = 23.9mm Low Profile CQFP (Package 519) G1T = 23.9mm Low Profile CQFP (Package 524) ACCESS TIME (ns) IMPROVEMENT MARK: Blank = Standard Power N = No Connect at pin 21 and 39 in HIP for Upgrades L = Low Power Data Retention ORGANIZATION, 512Kx32 User configurable as 1Mx16 or 2Mx8 SRAM WHITE ELECTRONIC DESIGNS CORP. Note 1: Package Not Recommended For New Design White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com 10 WS512K32-XXX DEVICE TYPE SPEED PACKAGE SMD NO. 512K x 32 SRAM Module 55ns 66 pin HIP (H1) 5962-94611 05HTX 512K x 32 SRAM Module 45ns 66 pin HIP (H1) 5962-94611 06HTX 512K x 32 SRAM Module 35ns 66 pin HIP (H1) 5962-94611 07HTX 512K x 32 SRAM Module 25ns 66 pin HIP (H1) 5962-94611 08HTX 512K x 32 SRAM Module 20ns 66 pin HIP (H1) 5962-94611 09HTX 512K x 32 SRAM Module 17ns 66 pin HIP (H1) 5962-94611 10HTX 512K x 32 SRAM Module 55ns 68 lead CQFP Low Profile (G4T)1 5962-94611 05HYX 512K x 32 SRAM Module 45ns 68 lead CQFP Low Profile (G4T)1 5962-94611 06HYX 512K x 32 SRAM Module 35ns 68 lead CQFP Low Profile (G4T)1 5962-94611 07HYX 512K x 32 SRAM Module 25ns 68 lead CQFP Low Profile (G4T)1 5962-94611 08HYX 512K x 32 SRAM Module 20ns 68 lead CQFP Low Profile (G4T)1 5962-94611 09HYX 512K x 32 SRAM Module 17ns 68 lead CQFP Low Profile (G4T) 1 5962-94611 10HYX 512K x 32 SRAM Module 55ns 68 lead CQFP (G2T)1 5962-94611 05HMX 512K x 32 SRAM Module 45ns 68 lead CQFP (G2T)1 5962-94611 06HMX 512K x 32 SRAM Module 35ns 68 lead CQFP (G2T)1 5962-94611 07HMX 512K x 32 SRAM Module 25ns 68 lead CQFP (G2T) 1 5962-94611 08HMX 512K x 32 SRAM Module 20ns 68 lead CQFP (G2T)1 5962-94611 09HMX 512K x 32 SRAM Module 17ns 68 lead CQFP (G2T)1 5962-94611 10HMX 512K x 32 SRAM Module 55ns 68 lead CQFP (G1U) 5962-94611 05H9X 512K x 32 SRAM Module 45ns 68 lead CQFP (G1U) 5962-94611 06H9X 512K x 32 SRAM Module 35ns 68 lead CQFP (G1U) 5962-94611 07H9X 512K x 32 SRAM Module 25ns 68 lead CQFP (G1U) 5962-94611 08H9X 512K x 32 SRAM Module 20ns 68 lead CQFP (G1U) 5962-94611 09H9X 512K x 32 SRAM Module 17ns 68 lead CQFP (G1U) 5962-94611 10H9X Note 1: Package Not Recommended For New Design 11 White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com