Hermetic Packages for Integrated Circuits Package Outline Drawing R64.B 64 CERAMIC QUAD FLATPACK PACKAGE (CQFP) WITH E-PAD Rev 2, 10/13 1.118 (28.40) 1.080 (27.43) 0.567 (14.40) 0.547 (13.90) 0.290 (7.37) 0.255 (6.48) 49 64 0.025 (0.635) BSC 1 PIN 1 INDEX AREA 48 0.567 (14.40) 0.547 (13.90) 1.118 (28.40) 1.080 (27.43) 0.010 (0.25) 0.006 (0.15) 33 16 17 32 TOP VIEW SEE DETAIL "A" 0.105 (2.67) 0.075 (1.91) 0.0075 (0.188) 0.005 (0.125) 0.008 (0.20) REF SIDE VIEW 0.380 (9.655) 0.370 (9.395) DETAIL “A” 0.100 (2.537) 0.085 (2.157) 0.359 (9.12) 0.349 (8.86) METALIZED E-PAD [THICKNESS 0.003 (0.076) MAX] 0.039 (1.00) REF X45° CHAMFER (4X) 0.044 (1.12) REF 0.359 (9.12) 0.349 (8.86) PIN 1 INDEX AREA 1 0.035 (0.89) REF 64 NOTE: BOTTOM VIEW 1 1. All dimensions are in inches (millimeters).