54F/74F245 Octal Bidirectional Transceiver with TRI-STATEÉ Outputs General Description Features The ’F245 contains eight non-inverting bidirectional buffers with TRI-STATE outputs and is intended for bus-oriented applications. Current sinking capability is 24 mA (20 mA Mil) at the A ports and 64 mA (48 mA Mil) at the B ports. The Transmit/Receive (T/R) input determines the direction of data flow through the bidirectional transceiver. Transmit (active HIGH) enables data from A ports to B ports; Receive (active LOW) enables data from B ports to A ports. The Output Enable input, when HIGH, disables both A and B ports by placing them in a High Z condition. Y Commercial Y Y Y Y Package Number Military Non-inverting buffers Bidirectional data path A outputs sink 24 mA (20 mA Mil) B outputs sink 64 mA (48 mA Mil) Guaranteed 4000V minimum ESD protection Package Description N20A 20-Lead (0.300× Wide) Molded Dual-In-Line J20A 20-Lead Ceramic Dual-In-Line 74F245SC (Note 1) M20B 20-Lead (0.300× Wide) Molded Small Outline, JEDEC 74F245SJ (Note 1) M20D 20-Lead (0.300× Wide) Molded Small Outline, EIAJ 74F245MSA (Note 1) MSA20 20-Lead Molded Shrink Small Outline, EIAJ Type II 54F245FM (Note 2) W20A 20-Lead Cerpack 54F245LM (Note 2) E20A 20-Lead Ceramic Leadless Chip Carrier, Type C 74F245PC 54F245DM (Note 2) Note 1: Devices also available in 13× reel. Use suffix e SCX, SJX and MSAX. Note 2: Military grade device with environmental and burn-in processing. Use suffix e DMQB, FMQB and LMQB. Logic Symbols IEEE/IEC TL/F/9503 – 3 TL/F/9503 – 4 TRI-STATEÉ is a registered trademark of National Semiconductor Corporation. C1995 National Semiconductor Corporation TL/F/9503 RRD-B30M75/Printed in U. S. A. 54F/74F245 Octal Bidirectional Transceiver with TRI-STATE Outputs June 1995 Connection Diagrams Pin Assignment for LCC Pin Assignment for DIP, SOIC, SSOP and Flatpak TL/F/9503–1 TL/F/9503 – 2 Unit Loading/Fan Out 54F/74F Pin Names OE T/R A 0 – A7 B 0 – B7 Description U.L. HIGH/LOW Input IIH/IIL Output IOH/IOL Output Enable Input (Active LOW) Transmit/Receive Input Side A Inputs or TRI-STATE Outputs Side B Inputs or TRI-STATE Outputs 1.0/2.0 1.0/2.0 3.5/1.083 150/40(38.3) 3.5/1.083 600/106.6(80) 20 mA/b1.2 mA 20 mA/b1.2 mA 70 mA/b0.65 mA b 3 mA/24 mA (20 mA) 70 mA/b0.65 mA b 12 mA/64 mA (48 mA) Truth Table Inputs Output OE T/R L L H L H X Bus B Data to Bus A Bus A Data to Bus B High Z State H e HIGH Voltage Level L e LOW Voltage Level X e Immaterial 2 Current Applied to Output in LOW State (Max) Absolute Maximum Ratings (Note 1) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications. twice the rated IOL (mA) ESD Last Passing Voltage (Min) 4000V Storage Temperature b 65§ C to a 150§ C Note 1: Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. Ambient Temperature under Bias Junction Temperature under Bias Plastic b 55§ C to a 125§ C Note 2: Either voltage limit or current limit is sufficient to protect inputs. b 55§ C to a 175§ C b 55§ C to a 150§ C VCC Pin Potential to Ground Pin Recommended Operating Conditions b 0.5V to a 7.0V Free Air Ambient Temperature Military Commercial b 0.5V to a 7.0V Input Voltage (Note 2) Input Current (Note 2) Voltage Applied to Output in HIGH State (with VCC e 0V) Standard Output TRI-STATE Output b 30 mA to a 5.0 mA b 55§ C to a 125§ C 0§ C to a 70§ C Supply Voltage Military Commercial b 0.5V to VCC b 0.5V to a 5.5V a 4.5V to a 5.5V a 4.5V to a 5.5V DC Electrical Characteristics Symbol 54F/74F Parameter Min VIH Input HIGH Voltage VIL Input LOW Voltage VCD Input Clamp Diode Voltage VOH Output HIGH Voltage VOL Typ Units 2.0 54F 10% VCC 54F 10% VCC 74F 10% VCC 74F 10% VCC 74F 5% VCC VCC Conditions Max V 0.8 V b 1.2 V 2.4 2.0 2.4 2.0 2.7 Recognized as a HIGH Signal Recognized as a LOW Signal Min V Min IIN e b18 mA IOH IOH IOH IOH IOH e e e e e b 3 mA (An) b 12 mA (Bn) b 3 mA (An) b 15 mA (Bn) b 3 mA (An) e e e e 20 mA (An) 48 mA (Bn) 24 mA (An) 64 mA (Bn) Output LOW Voltage 54F 10% VCC 54F 10% VCC 74F 10% VCC 74F 10% VCC 0.5 0.55 0.5 0.55 V Min IOL IOL IOL IOL IIH Input HIGH Current 54F 74F 20.0 5.0 mA Max VIN e 2.7V IBVI Input HIGH Current 54F Breakdown Test 74F 100 7.0 mA Max VIN e 7.0V (OE, T/R) IBVIT Input HIGH Current 54F Breakdown (I/O) 74F 1.0 0.5 mA Max VIN e 5.5 V (An, Bn) ICEX Output HIGH Leakage Current 54F 74F 250 50 mA Max VOUT e VCC (An, Bn) VID Input Leakage Test 74F V 0.0 IID e 1.9 mA All Other Pins Grounded IOD Output Leakage Circuit Current 74F 3.75 mA 0.0 VIOD e 150 mV All Other Pins Grounded IIL Input LOW Current b 1.2 mA Max VIN e 0.5V (T/R, OE) IIH a IOZH Output Leakage Current 70 mA Max VOUT e 2.7V (An, Bn) IIL a IOZL Output Leakage Current b 650 mA Max VOUT e 0.5V (An, Bn) 4.75 3 DC Electrical Characteristics Symbol (Continued) 54F/74F Parameter Min Typ Units VCC Conditions b 150 b 225 mA Max VOUT e 0V (An) VOUT e 0V (Bn) 500 mA 0.0V VOUT e 5.25V(An, Bn) Max IOS Output Short-Circuit Current b 60 b 100 IZZ Bus Drainage Test ICCH Power Supply Current 70 90 mA Max VO e HIGH ICCL Power Supply Current 95 120 mA Max VO e LOW ICCZ Power Supply Current 85 110 mA Max VO e HIGH Z AC Electrical Characteristics Symbol Parameter 74F 54F 74F TA e a 25§ C VCC e a 5.0V CL e 50 pF TA, VCC e Mil CL e 50 pF TA, VCC e Com CL e 50 pF Min Typ Max Min Max Min Max tPLH tPHL Propagation Delay An to Bn or Bn to An 2.5 2.5 4.2 4.2 6.0 6.0 2.0 2.0 7.5 7.5 2.0 2.0 7.0 7.0 tPZH tPZL Output Enable Time 3.0 3.5 5.3 6.0 7.0 8.0 2.5 3.0 9.0 10.0 2.5 3.0 8.0 9.0 tPHZ tPLZ Output Disable Time 2.0 2.0 5.0 5.0 6.5 6.5 2.0 2.0 9.0 10.0 2.0 2.0 7.5 7.5 Units ns ns Ordering Information The device number is used to form part of a simplified purchasing code where the package type and temperature range are defined as follows: 74F 245 S Temperature Range Family 74F e Commercial 54F e Military C X Special Variations QB e Military grade device with environmental and burn-in processing X e Devices shipped in 13× reel Device Type Package Code P e Plastic DIP D e Ceramic DIP F e Flatpak L e Leadless Chip Carrier (LCC) S e Small Outline SOIC JEDEC MSA e Shrink Small Outline Package (EIAJ SSOP) SJ e Small Outline Package SOIC EIAJ Temperature Range C e Commercial (0§ C to a 70§ C) M e Military (b55§ C to a 125§ C) NOTE: NOT REQUIRED FOR MSA PACKAGE CODE 4 Physical Dimensions inches (millimeters) 20-Lead Ceramic Leadless Chip Carrier (L) NS Package Number E20A 20-Lead Ceramic Dual-In-Line Package (D) NS Package Number J20A 5 Physical Dimensions inches (millimeters) (Continued) 20-Lead (0.300× Wide) Molded Small Outline Package, JEDEC (S) NS Package Number M20B 20-Lead (0.300× Wide) Molded Small Outline Package, EIAJ (SJ) NS Package Number M20D 6 Physical Dimensions inches (millimeters) (Continued) 20-Lead Molded Shrink Small Outline Package, EIAJ, Type II (MSA) NS Package Number MSA20 20-Lead Molded (0.300× Wide) Dual-In-Line Package (P) NS Package Number N20A 7 54F/74F245 Octal Bidirectional Transceiver with TRI-STATE Outputs Physical Dimensions inches (millimeters) (Continued) 20-Lead Ceramic Flatpak (F) NS Package Number W20A LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. 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