74HC4017; 74HCT4017 Johnson decade counter with 10 decoded outputs Rev. 03 — 8 January 2008 Product data sheet 1. General description The 74HC4017; 74HCT4017 is a high-speed Si-gate CMOS device and is pin compatible with the HEF4017. The 74HC4017; 74HCT4017 is a 5-stage Johnson decade counter with 10 decoded active HIGH outputs (Q0 to Q9), an active LOW output from the most significant flip-flop (Q5-9), active HIGH and active LOW clock inputs (CP0 and CP1) and an overriding asynchronous master reset input (MR). The counter is advanced by either a LOW-to-HIGH transition at CP0 while CP1 is LOW or a HIGH-to-LOW transition at CP1 while CP0 is HIGH (see Table 3). When cascading counters, the Q5-9 output, which is LOW while the counter is in states 5, 6, 7, 8 and 9, can be used to drive the CP0 input of the next counter. A HIGH on MR resets the counter to zero (Q0 = Q5-9 = HIGH; Q1 to Q9 = LOW) independent of the clock inputs (CP0 and CP1). Automatic code correction of the counter is provided by an internal circuit: following any illegal code the counter returns to a proper counting mode within 11 clock pulses. 2. Features ■ Multiple package options ■ Complies with JEDEC standard no. 7 A ■ ESD protection: ◆ HBM JESD22-A114E exceeds 2000 V ◆ MM JESD22-A115-A exceeds 200 V ■ Specified from −40 °C to +85 °C and from −40 °C to +125 °C 74HC4017; 74HCT4017 NXP Semiconductors Johnson decade counter with 10 decoded outputs 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version 74HC4017N −40 °C to +125 °C DIP16 plastic dual in-line package; 16 leads (300 mil) SOT38-4 74HC4017D −40 °C to +125 °C SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 74HC4017DB −40 °C to +125 °C SSOP16 plastic shrink small outline package; 16 leads; body width 5.3 mm SOT338-1 74HC4017PW −40 °C to +125 °C TSSOP16 plastic thin shrink small outline package; 16 leads; SOT403-1 body width 4.4 mm 74HC4017BQ −40 °C to +125 °C SOT763-1 DHVQFN16 plastic dual in-line compatible thermal-enhanced very thin quad flat package; no leads; 16 terminals; body 2.5 × 3.5 × 0.85 mm 74HCT4017N −40 °C to +125 °C DIP16 plastic dual in-line package; 16 leads (300 mil) SOT38-4 74HCT4017D −40 °C to +125 °C SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 74HCT4017BQ −40 °C to +125 °C DHVQFN16 plastic dual in-line compatible thermal-enhanced SOT763-1 very thin quad flat package; no leads; 16 terminals; body 2.5 × 3.5 × 0.85 mm 74HC4017 74HCT4017 4. Functional diagram 13 14 15 CP1 CP0 5-STAGE JOHNSON COUNTER MR Q5-9 DECODING AND OUTPUT CIRCUITRY 12 Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7 Q8 Q9 3 2 4 7 10 1 5 6 9 11 001aah242 Fig 1. Functional diagram 74HC_HCT4017_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 8 January 2008 2 of 23 74HC4017; 74HCT4017 NXP Semiconductors Johnson decade counter with 10 decoded outputs CTRDIV10/DEC 14 13 14 15 0 Q0 3 Q1 2 Q2 4 Q3 7 3 Q4 10 4 Q5 1 5 Q6 5 6 Q7 6 7 Q8 9 8 Q9 11 9 Q5-9 12 CT≥5 CP1 CP0 MR & 13 15 1 2 CT = 0 001aah239 3 2 4 7 10 1 5 6 9 11 12 001aah240 Fig 2. Logic symbol Fig 3. IEC logic symbol D Q FF 1 CP Q RD CP1 CP0 D Q FF 2 CP Q RD D Q FF 3 CP Q RD D Q FF 4 CP Q RD D Q FF 5 CP Q RD MR Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7 Q8 Q9 Q5-9 001aah243 Fig 4. Logic diagram 74HC_HCT4017_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 8 January 2008 3 of 23 NXP Semiconductors 74HC4017; 74HCT4017 Johnson decade counter with 10 decoded outputs CP0 INPUT CP1 INPUT MR INPUT Q0 OUTPUT Q1 OUTPUT Q2 OUTPUT Q3 OUTPUT Q4 OUTPUT Q5 OUTPUT Q6 OUTPUT Q7 OUTPUT Q8 OUTPUT Q9 OUTPUT Q5-9 OUTPUT 001aah244 Fig 5. Timing diagram 74HC_HCT4017_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 8 January 2008 4 of 23 74HC4017; 74HCT4017 NXP Semiconductors Johnson decade counter with 10 decoded outputs 5. Pinning information 5.1 Pinning terminal 1 index area 1 74HC4017 74HCT4017 2 15 MR Q0 3 14 CP0 2 15 MR Q0 3 14 CP0 Q2 4 13 CP1 Q6 5 12 Q5-9 Q2 4 13 CP1 Q6 5 12 Q5-9 Q7 6 Q3 7 Q7 6 11 Q9 Q3 7 10 Q4 GND 8 9 Q8 GND(1) 11 Q9 10 Q4 9 Q1 Q1 Q8 16 VCC 8 1 GND Q5 16 VCC Q5 74HC4017 74HCT4017 001aah241 Transparent top view 001aah238 Fig 6. Pin configuration DIP16, SO16 and (T)SSOP16 Fig 7. Pin configuration DHVQFN16 5.2 Pin description Table 2. Pin description Symbol Pin Description Q[0:9] 3, 2, 4, 7, 10, 1, 5, 6, 9, 11 decoded output GND 8 ground (0 V) Q5-9 12 carry output (active LOW) CP1 13 clock input (HIGH-to-LOW edge-triggered) CP0 14 clock input (LOW-to-HIGH edge-triggered) MR 15 master reset input (active HIGH) VCC 16 supply voltage 74HC_HCT4017_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 8 January 2008 5 of 23 74HC4017; 74HCT4017 NXP Semiconductors Johnson decade counter with 10 decoded outputs 6. Functional description Table 3. Function table[1] MR CP0 CP1 Operation H X X Q0 = Q5-9 = HIGH; Q1 to Q9 = LOW L H ↓ counter advances L ↑ L counter advances L L X no change L X H no change L H ↑ no change L ↓ L no change [1] H = HIGH voltage level; L = LOW voltage level; X = don’t care; ↑ = LOW-to-HIGH transition; ↓ = HIGH-to-LOW transition; 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter VCC supply voltage Conditions Min Max Unit −0.5 +7 V - ±20 mA - ±20 mA - ±25 mA mA IIK input clamping current VI < −0.5 V or VI > VCC + 0.5 V [1] IOK output clamping current VO < −0.5 V or VO > VCC + 0.5 V [1] IO output current −0.5 V < VO < VCC + 0.5 V ICC supply current - 50 IGND ground current −50 - mA Tstg storage temperature −65 +150 °C Ptot total power dissipation [1] Tamb = −40 °C to +125 °C DIP16 package [2] - 750 mW SO16 package [3] - 500 mW (T)SSOP16 package [4] - 500 mW DHVQFN16 package [5] - 500 mW The input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] Ptot derates linearly with 12 mW/K above 70 °C. [3] Ptot derates linearly with 8 mW/K above 70 °C. [4] Ptot derates linearly with 5.5 mW/K above 60 °C. [5] Ptot derates linearly with 4.5 mW/K above 60 °C. 74HC_HCT4017_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 8 January 2008 6 of 23 74HC4017; 74HCT4017 NXP Semiconductors Johnson decade counter with 10 decoded outputs 8. Recommended operating conditions Table 5. Recommended operating conditions Symbol Parameter Conditions Min Typ Max Unit 2.0 5.0 6.0 V 74HC4017 VCC supply voltage VI input voltage 0 - VCC V VO output voltage 0 - VCC V ∆t/∆V input transition rise and fall rate VCC = 2.0 V - - 625 ns/V VCC = 4.5 V - 1.67 139 ns/V VCC = 6.0 V - - 83 ns/V ambient temperature −40 - +125 °C VCC supply voltage 4.5 5.0 5.5 V Tamb 74HCT4017 VI input voltage 0 - VCC V VO output voltage 0 - VCC V ∆t/∆V input transition rise and fall rate VCC = 4.5 V - 1.67 139 ns/V Tamb ambient temperature −40 - +125 °C 9. Static characteristics Table 6. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter 25 °C Conditions −40 °C to +85 °C −40 °C to +125 °C Unit Min Typ Max Min Max Min Max VCC = 2.0 V 1.5 1.2 - 1.5 - 1.5 - V VCC = 4.5 V 3.15 2.4 - 3.15 - 3.15 - V VCC = 6.0 V 4.2 3.2 - 4.2 - 4.2 - V VCC = 2.0 V - 0.8 0.5 - 0.5 - 0.5 V VCC = 4.5 V - 2.1 1.35 - 1.35 - 1.35 V 74HC4017 VIH VIL VOH HIGH-level input voltage LOW-level input voltage VCC = 6.0 V - 2.8 1.8 - 1.8 - 1.8 V HIGH-level VI = VIH or VIL output voltage IO = −20 µA; VCC = 2.0 V 1.9 2.0 - 1.9 - 1.9 - V IO = −20 µA; VCC = 4.5 V 4.4 4.5 - 4.4 - 4.4 - V IO = −20 µA; VCC = 6.0 V 5.9 6.0 - 5.9 - 5.9 - V IO = −4.0 mA; VCC = 4.5 V 3.98 4.32 - 3.84 - 3.7 - V IO = −5.2 mA; VCC = 6.0 V 5.48 5.81 - 5.34 - 5.2 - V 74HC_HCT4017_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 8 January 2008 7 of 23 74HC4017; 74HCT4017 NXP Semiconductors Johnson decade counter with 10 decoded outputs Table 6. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter VOL 25 °C Conditions −40 °C to +85 °C −40 °C to +125 °C Unit Min Typ Max Min Max Min Max LOW-level VI = VIH or VIL output voltage IO = 20 µA; VCC = 2.0 V - 0 0.1 - 0.1 - 0.1 V IO = 20 µA; VCC = 4.5 V - 0 0.1 - 0.1 - 0.1 V IO = 20 µA; VCC = 6.0 V - 0 0.1 - 0.1 - 0.1 V IO = 4.0 mA; VCC = 4.5 V - 0.15 0.26 - 0.33 - 0.4 V IO = 5.2 mA; VCC = 6.0 V - 0.16 0.26 - 0.33 - 0.4 V - - ±0.1 - ±1.0 - ±1.0 µA II input leakage current VI = VCC or GND; VCC = 6.0 V ICC supply current VI = VCC or GND; IO = 0 A; VCC = 6.0 V - - 8.0 - 80 - 160 µA CI input capacitance - 3.5 - - - - - pF 74HCT4017 VIH HIGH-level input voltage VCC = 4.5 V to 5.5 V 2.0 1.6 - 2.0 - 2.0 - V VIL LOW-level input voltage VCC = 4.5 V to 5.5 V - 1.2 0.8 - 0.8 - 0.8 V VOH HIGH-level VI = VIH or VIL; VCC = 4.5 V output voltage IO = −20 µA 4.4 4.5 - 4.4 - 4.4 - V 3.98 4.32 - 3.84 - 3.7 - V IO = −4 mA VOL LOW-level VI = VIH or VIL; VCC = 4.5 V output voltage IO = 20 µA - 0 0.1 - 0.1 - 0.1 V IO = 4.0 mA - 0.15 0.26 - 0.33 - 0.4 V VI = VCC or GND; VCC = 5.5 V - - ±0.1 - ±1.0 - ±1.0 µA - - 8.0 - 80 - 160 µA CP0 input - 25 90 - 113 - 123 µA CP1 input - 40 144 - 180 - 196 µA MR input - 50 180 - 225 - 245 µA - 3.5 - - - - - pF II input leakage current ICC supply current VI = VCC or GND; VCC = 5.5 V; IO = 0 A ∆ICC additional per input pin; supply current VI = VCC − 2.1 V; other inputs at VCC or GND; VCC = 4.5 V to 5.5 V; IO = 0 A CI input capacitance 74HC_HCT4017_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 8 January 2008 8 of 23 74HC4017; 74HCT4017 NXP Semiconductors Johnson decade counter with 10 decoded outputs 10. Dynamic characteristics Table 7. Dynamic characteristics GND = 0 V; tr = tf = 6 ns; CL = 50 pF; see Figure 11. Symbol Parameter 25 °C Conditions −40 °C to +85 °C −40 °C to +125 °C Unit Min Typ Max Min Max Min Max - 63 230 - 290 - 345 74HC4017 tpd propagation delay CP0 to Qn; CP0 to Q5-9; see Figure 10 [1] VCC = 2.0 V ns VCC = 4.5 V - 23 46 - 58 - 69 ns VCC = 5.0 V; CL = 15 pF - 20 - - - - - ns VCC = 6.0 V - 18 39 - 49 - 59 ns VCC = 2.0 V - 61 250 - 315 - 375 ns VCC = 4.5 V - 22 50 - 63 - 75 ns VCC = 5.0 V; CL = 15 pF - 20 - - - - - ns VCC = 6.0 V - 18 43 - 54 - 64 ns VCC = 2.0 V - 52 230 - 290 - 345 ns VCC = 4.5 V - 19 46 - 58 - 69 ns VCC = 6.0 V - 15 39 - 49 - 59 ns VCC = 2.0 V - 55 230 - 290 - 345 ns VCC = 4.5 V - 20 46 - 58 - 69 ns - 16 39 - 49 - 59 ns VCC = 2.0 V - 19 75 - 95 - 110 ns VCC = 4.5 V - 7 15 - 19 - 22 ns VCC = 6.0 V - 6 13 - 16 - 19 ns VCC = 2.0 V 80 17 - 100 - 120 - ns VCC = 4.5 V 16 6 - 20 - 24 - ns VCC = 6.0 V 14 5 - 17 - 20 - ns VCC = 2.0 V 80 19 - 100 - 120 - ns VCC = 4.5 V 16 7 - 20 - 24 - ns VCC = 6.0 V 14 6 - 17 - 20 - ns CP1 to Qn; CP1 to Q5-9; see Figure 10 tPHL tPLH HIGH to LOW propagation delay LOW to HIGH propagation delay MR to Q[1:9]; see Figure 10 MR to Q5-9, Q0; see Figure 10 VCC = 6.0 V tt tW transition time pulse width [2] see Figure 10 CP0 and CP1 (HIGH or LOW); see Figure 9 MR (HIGH); see Figure 9 74HC_HCT4017_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 8 January 2008 9 of 23 74HC4017; 74HCT4017 NXP Semiconductors Johnson decade counter with 10 decoded outputs Table 7. Dynamic characteristics …continued GND = 0 V; tr = tf = 6 ns; CL = 50 pF; see Figure 11. Symbol Parameter tsu th trec fmax set-up time hold time recovery time maximum frequency 25 °C Conditions Min Typ Max Min Max Min Max VCC = 2.0 V 50 −8 - 65 - 75 - ns VCC = 4.5 V 10 −3 - 13 - 15 - ns VCC = 6.0 V 9 −2 - 11 - 13 - ns VCC = 2.0 V 50 17 - 65 - 75 - ns VCC = 4.5 V 10 6 - 13 - 15 - ns VCC = 6.0 V 9 5 - 11 - 13 - ns VCC = 2.0 V 5 −17 - 5 - 5 - ns VCC = 4.5 V 5 −6 - 5 - 5 - ns VCC = 6.0 V 5 −5 - 5 - 5 - ns VCC = 2.0 V 6.0 23 - 4.8 - 4.0 - MHz VCC = 4.5 V 30 70 - 24 - 20 - MHz VCC = 5.0 V; CL = 15 pF - 77 - - - - - MHz 25 83 - 28 - 24 - MHz - 35 - - - - - pF VCC = 4.5 V - 25 46 - 58 - 69 ns VCC = 5.0 V; CL = 15 pF - 21 - - - - - ns VCC = 4.5 V - 25 50 - 63 - 75 ns VCC = 5.0 V; CL = 15 pF - 21 - - - - - ns - 22 46 - 58 - 69 ns - 20 46 - 58 - 69 ns CP1 to CP0; CP0 to CP1; see Figure 8 CP1 to CP0; CP0 to CP1; see Figure 8 MR to CP0 and MR to CP1; see Figure 9 CP0 or CP1; see Figure 9 VCC = 6.0 V CPD power dissipation capacitance −40 °C to +85 °C −40 °C to +125 °C Unit VI = GND to VCC; VCC = 5 V; fi = 1 MHz [3] CP0 to Qn; CP0 to Q5-9; see Figure 10 [1] 74HCT4017 tpd propagation delay CP1 to Qn; CP1 to Q5-9; see Figure 10 tPHL HIGH to LOW propagation delay MR to Q[1:9]; see Figure 10 tPLH LOW to HIGH propagation delay MR to Q5-9, Q0; see Figure 10 VCC = 4.5 V VCC = 4.5 V 74HC_HCT4017_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 8 January 2008 10 of 23 74HC4017; 74HCT4017 NXP Semiconductors Johnson decade counter with 10 decoded outputs Table 7. Dynamic characteristics …continued GND = 0 V; tr = tf = 6 ns; CL = 50 pF; see Figure 11. Symbol Parameter 25 °C Conditions −40 °C to +85 °C −40 °C to +125 °C Unit Min Typ Max Min Max Min Max - 7 15 - 19 - 22 ns 16 7 - 20 - 24 - ns 16 4 - 20 - 24 - ns 10 −3 - 13 - 15 - ns 10 6 - 13 - 15 - ns 5 −5 - 5 - 5 - ns [2] tt transition time see Figure 10 tW pulse width CP0 and CP1 (HIGH or LOW); see Figure 9 VCC = 4.5 V VCC = 4.5 V MR (HIGH); see Figure 9 VCC = 4.5 V tsu set-up time CP1 to CP0; CP0 to CP1; see Figure 8 th hold time CP1 to CP0; CP0 to CP1; see Figure 8 VCC = 4.5 V VCC = 4.5 V trec recovery time MR to CP0 and MR to CP1; see Figure 9 VCC = 4.5 V fmax CPD [1] maximum frequency power dissipation capacitance CP0 or CP1; see Figure 9 VCC = 4.5 V 30 61 - 24 - 20 - MHz VCC = 5.0 V; CL = 15 pF - 67 - - - - - MHz - 36 - - - - - pF VI = GND to VCC − 1.5 V; VCC = 5 V; fi = 1 MHz [3] tpd is the same as tPHL and tPLH. [2] tt is the same as tTHL and tTLH. [3] CPD is used to determine the dynamic power dissipation (PD in µW): PD = CPD × VCC2 × fi × N + ∑(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; ∑(CL × VCC2 × fo) = sum of outputs. 74HC_HCT4017_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 8 January 2008 11 of 23 74HC4017; 74HCT4017 NXP Semiconductors Johnson decade counter with 10 decoded outputs 11. Waveforms VI CP0 input VM GND tsu th tsu th VI CP1 input VM GND 001aah245 Measurement points are given in Table 8. VOL and VOH are typical voltage output levels that occur with the output load. Fig 8. Waveforms showing the set-up and hold times for CP0 to CP1 and CP1 to CP0 1/f max tW VI CP0 input VM GND 1/f max VI CP1 input VM GND tW trec VI MR input VM GND tW VOH Q1 - Q9 output VM VOL tPHL VOH Q0, Q5 - Q9 output VOL VM tPLH 001aah246 Measurement points are given in Table 8. VOL and VOH are typical voltage output levels that occur with the output load. Fig 9. Waveforms showing the minimum pulse width for CP0, CP1 and MR input; the maximum frequency for CP0 and CP1 input; the recovery time for MR and the MR input to Qn and Q5-9 output propagation delays 74HC_HCT4017_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 8 January 2008 12 of 23 74HC4017; 74HCT4017 NXP Semiconductors Johnson decade counter with 10 decoded outputs VI CP0 input VM GND VI CP1 input VM GND tPHL tPLH VOH Q1 - Q9 output VM VOL tPLH tPHL VOH Q0, Q5 - Q9 output VOL VM tTLH tTHL 001aah247 Measurement points are given in Table 8. VOL and VOH are typical voltage output levels that occur with the output load. Conditions: CP1 = LOW while CP0 is triggered on a LOW-to-HIGH transition and CP0 = HIGH, while CP1 is triggered on a HIGH-to-LOW transition. Fig 10. Waveforms showing the propagation delays for CP0, CP1 to Qn, Q5-9 outputs and the output transition times Table 8. Measurement points Type Input Output VM VM 74HC4017 0.5 × VCC 0.5 × VCC 74HCT4017 1.3 V 1.3 V 74HC_HCT4017_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 8 January 2008 13 of 23 74HC4017; 74HCT4017 NXP Semiconductors Johnson decade counter with 10 decoded outputs VI tW 90 % negative pulse VM 0V tf tr tr tf VI 90 % positive pulse 0V VM 10 % VM VM 10 % tW VCC VCC PULSE GENERATOR VI VO RL S1 open DUT RT CL 001aad983 Test data is given in Table 9. Definitions test circuit: RT = Termination resistance should be equal to output impedance Zo of the pulse generator. CL = Load capacitance including jig and probe capacitance. RL = Load resistance. S1 = Test selection switch. Fig 11. Load circuitry for measuring switching times Table 9. Test data Type Input Load S1 position VI tr, tf CL RL tPHL, tPLH tPZH, tPHZ tPZL, tPLZ 74HC4017 VCC 6 ns 15 pF, 50 pF 1 kΩ open GND VCC 74HCT4017 3V 6 ns 15 pF, 50 pF 1 kΩ open GND VCC 12. Application information Some examples of applications for the 74HC4017; 74HCT4017 are: • • • • Decade counter with decimal decoding 1 out of n decoding counter (when cascaded) Sequential controller Timer Figure 12 shows a technique for extending the number of decoded output states for the 74HC4017; 74HCT4017. Decoded outputs are sequential within each stage and from stage to stage, with no dead time (except propagation delay). 74HC_HCT4017_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 8 January 2008 14 of 23 74HC4017; 74HCT4017 NXP Semiconductors Johnson decade counter with 10 decoded outputs CP0 MR CP0 74HC4017 74HCT4017 CP1 Q0 Q1- - - - Q8 Q9 clock MR CP0 74HC4017 74HCT4017 MR 74HC4017 74HCT4017 CP1 Q0 Q1- - - - Q8 Q9 CP1 Q1 - - - - - - Q8 Q9 9 decoded outputs 8 decoded outputs 8 decoded outputs first stage intermediate stages last stage 001aah248 Fig 12. Counter expansion Remark: It is essential not to enable the counter on CP1 when CP0 is HIGH, or on CP0 when CP1 is LOW, as this would cause an extra count. Figure 13 shows an example of a divide-by 2 through divide-by 10 circuit using one 74HC4017; 74HCT4017. Since the 74HC4017; 74HCT4017 has an asynchronous reset, the output pulse widths are narrow (minimum expected pulse width is 6 ns). The output pulse widths can be enlarged by inserting an RC network at the MR input. 74HC4017 74HCT4017 divide - by 5 Q5 VCC VCC Q1 MR Q0 CP0 divide - by 2 Q2 CP1 divide - by 6 Q6 Q5-9 divide - by 7 Q7 Q9 divide - by 9 divide - by 3 Q3 Q4 divide - by 4 GND Q8 divide - by 8 fin divide - by 10 fout 001aah249 Fig 13. Divide-by 2 through divide-by 10 74HC_HCT4017_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 8 January 2008 15 of 23 74HC4017; 74HCT4017 NXP Semiconductors Johnson decade counter with 10 decoded outputs 13. Package outline DIP16: plastic dual in-line package; 16 leads (300 mil) SOT38-4 ME seating plane D A2 A A1 L c e Z w M b1 (e 1) b b2 MH 9 16 pin 1 index E 1 8 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.2 0.51 3.2 1.73 1.30 0.53 0.38 1.25 0.85 0.36 0.23 19.50 18.55 6.48 6.20 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 0.76 inches 0.17 0.02 0.13 0.068 0.051 0.021 0.015 0.049 0.033 0.014 0.009 0.77 0.73 0.26 0.24 0.1 0.3 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.03 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 95-01-14 03-02-13 SOT38-4 Fig 14. Package outline SOT38-4 (DIP16) 74HC_HCT4017_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 8 January 2008 16 of 23 74HC4017; 74HCT4017 NXP Semiconductors Johnson decade counter with 10 decoded outputs SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 D E A X c y HE v M A Z 16 9 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 8 e 0 detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.39 0.014 0.0075 0.38 0.039 0.016 0.028 0.020 inches 0.010 0.057 0.069 0.004 0.049 0.16 0.15 0.05 0.244 0.041 0.228 0.01 0.01 0.028 0.004 0.012 θ o 8 o 0 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT109-1 076E07 MS-012 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Fig 15. Package outline SOT109-1 (SO16) 74HC_HCT4017_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 8 January 2008 17 of 23 74HC4017; 74HCT4017 NXP Semiconductors Johnson decade counter with 10 decoded outputs SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm D SOT338-1 E A X c y HE v M A Z 9 16 Q A2 A (A 3) A1 pin 1 index θ Lp L 8 1 detail X w M bp e 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) θ mm 2 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 6.4 6.0 5.4 5.2 0.65 7.9 7.6 1.25 1.03 0.63 0.9 0.7 0.2 0.13 0.1 1.00 0.55 8 o 0 o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT338-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 MO-150 Fig 16. Package outline SOT338-1 (SSOP16) 74HC_HCT4017_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 8 January 2008 18 of 23 74HC4017; 74HCT4017 NXP Semiconductors Johnson decade counter with 10 decoded outputs TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 E D A X c y HE v M A Z 9 16 Q (A 3) A2 A A1 pin 1 index θ Lp L 1 8 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) θ mm 1.1 0.15 0.05 0.95 0.80 0.25 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 1 0.75 0.50 0.4 0.3 0.2 0.13 0.1 0.40 0.06 8 o 0 o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT403-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18 MO-153 Fig 17. Package outline SOT403-1 (TSSOP16) 74HC_HCT4017_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 8 January 2008 19 of 23 74HC4017; 74HCT4017 NXP Semiconductors Johnson decade counter with 10 decoded outputs DHVQFN16: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; SOT763-1 16 terminals; body 2.5 x 3.5 x 0.85 mm A B D A A1 E c detail X terminal 1 index area terminal 1 index area C e1 e 2 7 y y1 C v M C A B w M C b L 1 8 Eh e 16 9 15 10 Dh X 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT mm A(1) max. A1 b 1 0.05 0.00 0.30 0.18 c D (1) Dh E (1) Eh 0.2 3.6 3.4 2.15 1.85 2.6 2.4 1.15 0.85 e 0.5 e1 L v w y y1 2.5 0.5 0.3 0.1 0.05 0.05 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT763-1 --- MO-241 --- EUROPEAN PROJECTION ISSUE DATE 02-10-17 03-01-27 Fig 18. Package outline SOT763-1 (DHVQFN16) 74HC_HCT4017_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 8 January 2008 20 of 23 74HC4017; 74HCT4017 NXP Semiconductors Johnson decade counter with 10 decoded outputs 14. Abbreviations Table 10. Abbreviations Acronym Description CMOS Complementary Metal Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic 15. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes 74HC_HCT4017_3 20080108 Product data sheet - Modifications: 74HC_HCT4017_CNV_2 The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • • • • Legal texts have been adapted to the new company name where appropriate. Section 3: DHVQFN16 package added. Section 7: derating values added for DHVQFN16 package. Section 13: outline drawing added for DHVQFN16 package. 19970829 Product specification 74HC_HCT4017_3 Product data sheet 74HC_HCT4017_CNV_2 • - - © NXP B.V. 2008. All rights reserved. Rev. 03 — 8 January 2008 21 of 23 74HC4017; 74HCT4017 NXP Semiconductors Johnson decade counter with 10 decoded outputs 16. Legal information 16.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 16.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 16.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 17. Contact information For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: [email protected] 74HC_HCT4017_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 8 January 2008 22 of 23 NXP Semiconductors 74HC4017; 74HCT4017 Johnson decade counter with 10 decoded outputs 18. Contents 1 2 3 4 5 5.1 5.2 6 7 8 9 10 11 12 13 14 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 5 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 Functional description . . . . . . . . . . . . . . . . . . . 6 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6 Recommended operating conditions. . . . . . . . 7 Static characteristics. . . . . . . . . . . . . . . . . . . . . 7 Dynamic characteristics . . . . . . . . . . . . . . . . . . 9 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Application information. . . . . . . . . . . . . . . . . . 14 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 21 Legal information. . . . . . . . . . . . . . . . . . . . . . . 22 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 22 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Contact information. . . . . . . . . . . . . . . . . . . . . 22 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2008. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 8 January 2008 Document identifier: 74HC_HCT4017_3