FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE) A4K SERIES 1. PART NO. EXPRESSION : A4K300-RE-10 (a) Series code (e) R : Reel (a)(b)(c) (d) (b) Dimension code (f) Current code : E = 500mA (c) Material code (g) 10 : Lead Free (e) (f) (g) (d) Impedance code : 300 = 30ȍ 2. CONFIGURATION & DIMENSIONS : A L G D2 J C I H PCB Pattern D1 B P A B D1 C Unit:m/m D2 P 3.20±0.20 1.60±0.20 0.90±0.20 0.40±0.15 0.20±0.10 0.80±0.10 G H I J L 0.80 Ref. 0.40 Ref. 0.80 Ref. 2.80 Ref. 2.20~2.60 3. SCHEMATIC : 4. MATERIALS : b a Ag(100%) Ni(100%)-1.5um(min.) Sn(100%)-3.0um(min.) (a) Body : Ferrite (b) Termination : Ag/Ni/Sn 5. GENERAL SPECIFICATION : a) Temp. rise : 30°C Max. b) Rated current : Base on temp. rise c) Storage temp. : -55°C to +125°C d) Operating temp. : -55°C to +125°C e) Resistance to solder heat : 260°C.10secs NOTE : Specifications subject to change without notice. Please check our website for latest information. 18.06.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 1 FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE) A4K SERIES 6. ELECTRICAL CHARACTERISTICS : Part Number Impedance (ȍ) Test Frequency ( MHz ) DC Resistance (ȍ) Max. Rated Current ( mA ) Max. A4K300-RE-10 30 ±25% 100 0.20 500 A4K600-RD-10 60 ±25% 100 0.25 400 A4K121-RD-10 120 ±25% 100 0.30 350 A4K301-RC-10 300 ±25% 100 0.40 250 A4K601-RB-10 600 ±25% 100 0.50 200 A4K102-RB-10 1000 ±25% 100 0.75 150 NOTE : Specifications subject to change without notice. Please check our website for latest information. 18.06.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 2 FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE) A4K SERIES 7. IMPEDANCE VS. FREQUENCY CURVES : A4K300-RE-10 A4K600-RD-10 A4K121-RD-10 A4K301-RC-10 A4K601-RB-10 A4K102-RB-10 NOTE : Specifications subject to change without notice. Please check our website for latest information. 18.06.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE) A4K SERIES 8. RELIABILITY & TEST CONDITION : ITEM PERFORMANCE TEST CONDITION Electrical Characteristics Test Impedance Refer to standard electrical characteristics list DC Resistance HP4291A, HP4287A+16192A HP4338B Rated Current Temperature Rise Test 30°C max. (ǻt) 1. Applied the allowed DC current. 2. Temperature measured by digital surface thermometer. Solder Heat Resistance Appearance : No significant abnormality Impedance change : Within ±30% No mechanical damage Remaining terminal electrode : 70% Min. Preheat : 150°C, 60sec. Solder : Sn-Ag3.0-Cu0.5 Solder Temperature : 260±5°C Flux for lead free : rosin Dip Time : 10±0.5sec. 260°C 150°C Preheat : 150°C, 60sec. Solder : Sn-Ag3.0-Cu0.5 Solder Temperature : 230±5°C Flux for lead free : rosin Dip Time : 4±1sec. 230°C More than 90% of the terminal electrode should be covered with solder. Solderability 150°C Terminal Strength The terminal electrode & the dielectric must not be damaged by the forces applied on the right conditions. Preheating Dipping 60 seconds 10±0.5 seconds Preheating Dipping 60 seconds Natural cooling Natural cooling 4±1.0 seconds For A Series : Size Force (Kfg) Time (sec) 4 0.5 > 25 W W Flexture Strength The terminal electrode & the dielectric must not be damaged by the forces applied on the right conditions. Solder a chip on a test substrate, bend the substrate by 2mm (0.079in) and return. 20(.787) Bending 45(1.772) 45(1.772) 40(1.575) 100(3.937) NOTE : Specifications subject to change without notice. Please check our website for latest information. 18.06.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE) A4K SERIES 8. RELIABILITY & TEST CONDITION : ITEM PERFORMANCE TEST CONDITION Appearance : No damage. Impedance : Within ±30% of initial value. Loading at High Temperature Humidity Temperature : 125±5°C Applied Current : rated current Duration : 500±12hrs Measured at room temperature after placing for 2 to 3hrs. Humidity : 90~95% RH. Temperature : 40±2°C Duration : 500±12hrs Measured at room temperature after placing for 2 to 3hrs. Appearance : No damage. Impedance : Within ±30% of initial value. Thermal Shock Phase Temperature (°C) Times (min.) 1 -55±2°C 30±3 2 +125±5°C 30±3 For A Series : Condition for 1 cycle Step1 : -55±2°C 30±3 min. Step2 : +125±5°C 30±3 min. Number of cycles : 5 Measured at room temperature after placing for 2 to 3hrs. Measured : 5 times Low temperature storage test Temperature : -55±2°C Duration : 500±12hrs Measured at room temperature after placing for 2 to 3hrs. NOTE : Specifications subject to change without notice. Please check our website for latest information. 18.06.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 5 FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE) A4K SERIES 9. SOLDERING AND MOUNTING : 9-1. Recommended PC Board Pattern PC board should be designed so that products are not sufficient under mechanical stress as warping the board. Products shall be positioned in the sideway direction against the mechanical stress to prevent failure. 0.8 2.2 - 2.6 2.8 0.8 0.4 9-2. Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 9-2.1 Lead Free Solder Re-flow : Recommended temperature profiles for re-flow soldering in Figure 1. 9-2.2 Solder Wave : Wave soldering is perhaps the most rigorous of surface mount soldering processes due to the steep rise in temperature seen by the circuit when immersed in the molten solder wave, typical at 230°C. Due to the risk of thermal damage to products, wave soldering of large size products is discouraged. Recommended temperature profile for wave soldering is shown in Fig. 2 9-2.3 Soldering Iron (Figure 3) : Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Note : d) 1.0mm tip diameter (max) a) Preheat circuit and products to 150°C. e) Use a 20 watt soldering iron with tip diameter of 1.0mm b) 350°C tip temperature (max) f) Limit soldering time to 3 secs. c) Never contact the ceramic with the iron tip Soldering 10s max. Natural cooling Preheating TEMPERATURE °C TEMPERATURE °C Preheating 250 ~ 260 230 180 150 60~120s 30~60s Time(sec.) Soldering Natural cooling 260 245 150 Gradual Cooling Over 2min. Figure 1. Re-flow Soldering TEMPERATURE °C Preheating Soldering 3s (max.) 350 Natural cooling Within 3s Figure 2. Wave Soldering 10s (max.) 330 150 Over 1min. Gradual Cooling Figure 3. Hand Soldering NOTE : Specifications subject to change without notice. Please check our website for latest information. 18.06.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 6 FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE) A4K SERIES 9-3. Solder Volume Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in Fig. 4. Upper limit t Recommendable Figure 4 NOTE : Specifications subject to change without notice. Please check our website for latest information. 18.06.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 7 FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE) A4K SERIES 10. PACKAGING INFORMATION : 10-1. Reel Dimension C(mm) D(mm) Type A(mm) B(mm) 7" x 8mm 9.0±0.5 60.0±2.0 13.5±0.5 178.0±2.0 7" x 12mm 13.5±0.5 60.0±2.0 13.5±0.5 178.0±2.0 C D B A 13.5±0.5 2±0.5 7" x 8mm 7" x 12mm R10.5 R1.9 R0.5 120° 10-2 Tape Dimension / 8mm t Series P Ao A Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) D1(mm) 1 1.12±0.05 0.67±0.05 0.54±0.05 2.0±0.1 0.23±0.05 none 2 1.80±0.10 1.01±0.10 1.02±0.10 4.0±0.1 0.22±0.05 none 3 (09) 2.25±0.10 1.42±0.10 1.04±0.10 4.0±0.1 0.22±0.05 1.0±0.1 3 (12) 2.35±0.10 1.50±0.10 1.45±0.10 4.0±0.1 0.22±0.05 1.0±0.1 4 3.50±0.10 1.88±0.10 1.27±0.10 4.0±0.1 0.22±0.05 1.0±0.1 5 3.42±0.10 2.77±0.10 1.55±0.10 4.0±0.1 0.22±0.05 1.0±0.1 A 4 3.40±0.10 1.77±0.10 1.04±0.10 4.0±0.1 0.22±0.05 1.0±0.1 Series Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) D1(mm) 6 4.95±0.1 1.93±0.1 1.93±0.1 4.0±0.1 0.24±0.05 1.5±0.1 7 4.95±0.1 3.66±0.1 1.85±0.1 8.0±0.1 0.24±0.05 1.5±0.1 8 6.10±0.1 5.40±0.1 2.00±0.1 8.0±0.1 0.30±0.05 1.5±0.1 Bo W:8.0±0.1 A F:3.5±0.05 E:1.75±0.1 D:1.5+0.1 Po:4±0.1 P2:2±0.05 Z Ko Section A-A D1:1±0.1 10-2.1 Tape Dimension / 12mm Po:4±0.1 P2:2±0.05 t Ao P A Z Bo W:12.0±0.1 A F:5.5±0.05 E:1.75±0.1 D:1.5+0.1 Ko Section A-A D1:1.5±0.1 10-3. Packaging Quantity Chip Size 8 7 6 5 4 3 (12) 3 (09) 2 1 Chip / Reel 1000 1000 2000 2500 3000 2000 4000 4000 10000 Inner Box 4000 4000 8000 12500 15000 10000 20000 20000 50000 Middle Box 20000 20000 40000 62500 75000 50000 100000 100000 250000 Carton 40000 40000 80000 125000 150000 100000 200000 200000 500000 Bulk (Bags) 7000 12000 20000 30000 50000 100000 150000 200000 300000 NOTE : Specifications subject to change without notice. Please check our website for latest information. 18.06.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 8 FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE) A4K SERIES 10-4. Tearing Off Force The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. F 165° to 180° Top cover tape Room Temp. (°C) Room Humidity (%) Room atm (hPa) Tearing Speed (mm/min) 5~35 45~85 860~1060 300 Base tape Application Notice 1. Storage Conditions : To maintain the solderabililty of terminal electrodes : a) Temperature and humidity conditions : -10 ~ 40°C and 30 ~ 70% RH. b) Recommended products should be used within 6 months from the time of delivery. c) The packaging material should be kept where no chlorine or sulfur exists in the air. 2. Transportation : a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. NOTE : Specifications subject to change without notice. Please check our website for latest information. 18.06.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 9