Moter Drivers for Printers Motor Drivers with Brush for Printers BD63821EFV, BD63823EFV No.12010EAT06 ●Description BD63821EFV/BD63823EFV series are built-in 2 channel H-bridge circuits that can drive 2pcs DC brush motor or 1pcs stepping motor. These drivers facilitate low power consumption by the direct PWM or PWM constant current control. ●Feature 1) Single power supply input (rated voltage of 36V) 2) Rated output current (peak): 1.0A(1.5A), 2.0A(2.8A) 3) Low ON resistance DMOS output 4) Forward, Reverse, Brake, Open 5) Power save function 6) External PWM control 7) PWM constant current control (current limit function) 8) Built-in spike noise cancel function (external noise filter is unnecessary) 9) Driver for 2 DC brush motor 10) Driver for 1 stepping motor 11) FULL STEP, HALF STEP (driving stepping motor) 12) µSTEP drive by external DAC (driving stepping motor) 13) Built-in logic input pull-down resistor 14) Cross-conduction prevention circuit 15) Signal output of detecting the motor lock state (Wired-OR) 16) Signal output of detecting the abnormal states (Wired-OR) 17) Thermal shutdown circuit (TSD) 18) Over current protection circuit (OCP) 19) Under voltage lock out circuit (UVLO) 20) Over voltage lock out circuit (OVLO) 21) Ghost Supply Prevention (protects against malfunction when power supply is disconnected) 22) Electrostatic discharge: 8kV (HBM specification) 23) Adjacent pins short protection 24) Inverted mounting protection 25) Microminiature, ultra-thin and high heat-radiation (exposed metal type) HTSSOP-B28 package 26) Pin-compatible line-up ●Application PPC, multi-function printer, laser beam printer, ink jet printer, monitoring camera, WEB camera, sewing machine, photo printer, FAX, scanner, mini printer, toy, and robot etc. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 1/8 2012.02 - Rev.A Technical Note BD63821EFV, BD63823EFV ●Absolute maximum ratings (Ta=25°C) Item Symbol Supply voltage VCC1,2 Power dissipation Input voltage for control pin RNF maximum voltage Output current Output current (peak)※4 FAULT, LOCK voltage FAULT, LOCK current Operating temperature range Storage temperature range Junction temperature ※1 ※2 ※3 ※4 BD63823 BD63821 Unit V W W V V A/ch A/ch V mA °C °C °C -0.3~+36.0 1.45※1 4.70※2 -0.3~+7.0 0.7 Pd VIN VRNF IOUT 2.0※3 2.8※3 IOUTPEAK VFAULT IFAULT Topr Tstg Tjmax 1.0※3 1.5※3 -0.3~7.0 5 -25~+85 -55~+150 +150 70mm×70mm×1.6mm glass epoxy board. Derating in done at 11.6mW/°C for operating above Ta=25°C. 4-layer recommended board. Derating in done at 37.6mW/°C for operating above Ta=25°C. Do not, however exceed Pd, ASO and Tjmax=150°C. Pulse width tw≦20ms ●Operating conditions (Ta= -25~+85°C) Item Symbol Supply voltage VCC1,2 Input voltage for control pin VIN PWM input frequency FIN Min. 19 0 - Typ. 24 - ●Electrical characteristics (Unless otherwise specified Ta=25°C, VCC1.2=24V) Limit Item Symbol Min. Typ. Whole Circuit current at standby ICCST 1.0 Circuit current ICC 2.5 Control input (IN1A, IN1B, IN2A, IN2B, PS) H level input voltage VINH 2.0 L level input voltage VINL H level input current IINH 35 50 L level input current IINL -10 0 FAULT LOCK output (FAULT, LOCK) Output low voltage VFAULT 50 Output leak current IFAULT_LEAK Output (OUT1A, OUT1B, OUT2A, OUT2B) Output on resistance (BD63823EFV) RON 0.65 Output on resistance (BD63821EFV) RON 1.90 Output leak current ILEAK Current control RNFXS input current IRNFS -2.0 -0.1 RNFX input current IRNF -40 -20 VREF input current IVREF -2.0 -0.1 VREF input voltage range VREF 0 Minimum on time (Blank time) tONMIN 0.7 1.5 Current limit 0.57 0.60 VCTH Comparator threshold www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 2/8 Max. 28 5.5 100 Unit V V kHz Unit Condition 2.5 5.0 mA mA PS=0V PS=IN1A=IN1B=5V 0.8 100 - V V µA µA VIN=5V VIN=0V 100 10 mV µA IFAULT=1mA VFAULT=5V 0.90 2.50 10 Ω Ω µA IOUT=1.5A,sum of upper and lower 3.0 3.0 µA µA µA V µs RNFXS=0V RNFX=0V VREFX=0V 0.63 V VREFX=3V Max. IOUT =0.5A,sum of upper and lower 2012.02 - Rev.A Technical Note BD63821EFV, BD63823EFV ●Terminal function and Application circuit diagram Pin No. Pin name Function 1 GND 2 OUT1B 3 RNF1 4 Pin No. Pin name Function Ground terminal 15 LOCK Motor lock signal output terminal H bridge output terminal 16 IN1A H bridge control terminal Connection terminal of resistor For output current detection 17 IN1B H bridge control terminal RNF1S Input terminal of current limit comparator 18 TEST Terminal for testing 5 OUT1A H bridge output terminal 19 IN2A H bridge control terminal 6 NC Non connection 20 IN2B H bridge control terminal 7 VCC1 Power supply terminal 21 NC 8 NC Non connection 22 VCC2 9 GND Ground terminal 23 NC 10 CR Connection terminal of CR for setting chopping frequency 24 OUT2A H bridge output terminal 11 VREF1 Current limit value setting terminal 25 RNF2S Input terminal of current limit comparator 12 VREF2 Current limit value setting terminal 26 RNF2 13 PS Power save terminal 27 OUT2B 14 FAULT Fault signal output terminal 28 NC Non connection Power supply terminal Non connection Connection terminal of resistor for output current detection H bridge output terminal Non connection ●Application circuit diagram Constant voltage control or external PWM control (when not using the motor lock detection function) 3.3V or 5.0V VREF1 11 VREF2 12 ＋ － ＋ 1/5 － RNF1S ＋ － 1/5 RNF2S FAULT 10kΩ When using the fault output function ⇒Pull up resistor 5kΩ~100kΩ. Not using ⇒Connect to GND. ＋ － Blank time PWM control CR 10 14 Regulator TSD OCP UVLO OVLO 15 OSC Bypass capacitor. Setting range is 100uF~470uF(electrolytic) 0.01uF~0.1uF(multilayer ceramic etc.) Be sure to short VCC1 & VCC2. LOCK Control input terminal. 7 VCC1 IN2A 19 IN2B 20 PS 13 Forward Reverse BRAKE Open 3 Predriver Power save terminal 5 2 Control logic IN1A 16 IN1B 17 Forward Reverse BRAKE Open 4 22 24 27 26 Terminal for testing Connect to GND. 25 TEST 18 1,9 OUT1A M OUT1B RNF1 100µF 0.1µF RNF1S VCC2 OUT2A M OUT2B RNF2 RNF2S GND Fig.1Application circuit diagram of constant voltage control or external PWM control (When not using the motor lock detection function) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 3/8 2012.02 - Rev.A Technical Note BD63821EFV, BD63823EFV ●Points to notice for terminal description ○PS/ Power save terminal PS can make circuit standby state and make motor output open Please be careful of delay 40μs(max.) before it is returned from off state to normal state. PS State L H POWER SAVE (STANDBY) ACTIVE ○IN1A,I N1B, IN2A, IN2B/ H bridge control terminal Input Output IN1A IN1B OUT1A OUT1B PS IN2A IN2B OUT2A OUT2B L X X OPEN OPEN H L L OPEN OPEN H H L H L H L H L H H H H L L X: H or L State POWER SAVE (STANDBY) STOP FORWARD REVERSE BRAKE ●Protection Circuits ○Thermal Shutdown (TSD) This IC has a built-in thermal shutdown circuit for thermal protection. When the IC’s chip temperature rises above 175°C (Typ.), the motor output becomes open. Also, when the temperature returns to under 150°C (Typ.), it automatically returns to normal operation. However, even when TSD is in operation, if heat is continued to be added externally, heat overdrive can lead to destruction. ○Over Current Protection (OCP) This IC has a built in over current protection circuit as a provision against destruction when the motor outputs are shorted each other or VCC-motor output or motor output-GND is shorted. This circuit latches the motor output to open condition when the regulated threshold current flows for 4μs (typ.). It returns with power reactivation or a reset of the PS terminal. The over current protection circuit’s only aim is to prevent the destruction of the IC from irregular situations such as motor output shorts, and is not meant to be used as protection or security for the set. Therefore, sets should not be designed to take into account this circuit’s functions. After OCP operating, if irregular situations continues and the return by power reactivation or a reset of the PS terminal is carried out repeatedly, then OCP operates repeatedly and the IC may generate heat or otherwise deteriorate. When the L value of the wiring is great due to the wiring being long, after the over current has flowed and the output terminal voltage jumps up and the absolute maximum values may be exceeded and as a result, there is a possibility of destruction. Also, when current which is over the output current rating and under the OCP detection current flows, the IC can heat up to over Tjmax=150°C and can deteriorate, so current which exceeds the output rating should not be applied. ○Under Voltage Lock Out (UVLO) This IC has a built-in under voltage lock out function to prevent false operation such as IC output during power supply under voltage. When the applied voltage to the VCC terminal goes under 15V (Typ.), the motor output is set to open. This switching voltage has a 1V (Typ.) hysteresis to prevent false operation by noise etc. Please be aware that this circuit does not operate during power save mode. ○Over Voltage Lock Out (OVLO) This IC has a built-in over voltage lock out function to protect the IC output and the motor during power supply over voltage. When the applied voltage to the VCC terminal goes over 32V (Typ.), the motor output is set to OPEN. This switching voltage has a 1V (Typ.) hysteresis and a 4μs (Typ.) mask time to prevent false operation by noise etc. Although this over voltage locked out circuit is built-in, there is a possibility of destruction if the absolute maximum value for power supply voltage is exceeded, therefore the absolute maximum value should not be exceeded. Please be aware that this circuit does not operate during power save mode. ○Ghost Supply Prevention (protects against malfunction when power supply is disconnected) If a signal (IN1A, IN1B, IN2A, IN2B, PS, VREF1, VREF2) is input when there is no power supplied to this IC, there is a function which prevents the false operation by voltage supplied via the electrostatic destruction prevention diode from these input terminals to the VCC to this IC or to another IC’s power supply. Therefore, there is no malfunction of the circuit even when voltage is supplied to these input terminals while there is no power supply. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 4/8 2012.02 - Rev.A Technical Note BD63821EFV, BD63823EFV ●Thermal derating curve HTSSOP-B28 has exposed metal on the back, and it is possible to dissipate heat from a through hole in the back. Also, the back of board as well as the surfaces has large areas of copper foil heat dissipation patterns, greatly increasing power dissipation. The back metal is shorted with the back side of the IC chip, being a GND potential, therefore there is a possibility for malfunction if it is shorted with any potential other than GND, which should be avoided. Also, it is recommended that the back metal is soldered onto the GND to short. Please note that it has been assumed that this product will be used in the condition of this back metal performed heat dissipation treatment for increasing heat dissipation efficiency. 5.0 4.70W Measurement machine：TH156（Kuwano Electric） Measurement condition：ROHM board Board size：70mm*70mm*1.6mm (With through holes on the board) The exposed metal of the backside is connected to the board with solder. 4 Board①：1-layer board (Copper foil on the back 0mm) Board②：2-layer board (Copper foil on the back 15mm*15mm) Board③：2-layer board (Copper foil on the back 70mm*70mm) Board④：4-layer board (Copper foil on the back 70mm*70mm) 4.0 Power Dissipation：Pd[W] 3.30W 3 Board①：θja=86.2°C/W Board②：θja=67.6°C/W /W Board③：θja=37.9°C/W Board④：θja=26.6°C/W 3.0 2.0 1.0 1.85W 1.45W 2 1 0 25 50 75 85 100 125 150 Ambient temperature:Ta[°C] Fig. 2 HTSSOP-B28 Thermal derating curve www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 5/8 2012.02 - Rev.A Technical Note BD63821EFV, BD63823EFV ●Operation Notes (1) Absolute maximum ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. (2) Connecting the power supply connector backward Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply lines. An external direction diode can be added. (3) Power supply lines As return of current regenerated by back EMF of FET output happens, take steps such as putting capacitor between power supply and GND as an electric pathway for the regenerated current. Be sure that there is no problem with each property such as emptied capacity at lower temperature regarding electrolytic capacitor to decide capacity value. If the connected power supply does not have sufficient current absorption capacity, regenerative current will cause the voltage on the power supply line to rise, which combined with the product and its peripheral circuitry may exceed the absolute maximum ratings. It is recommended to implement a physical safety measure such as the insertion of a voltage clamp diode between the power supply and GND pins. (4) GND potential The potential of GND pin must be minimum potential in all operating conditions. (5) Metal on the backside (Define the side where product markings are printed as front) The metal on the backside is shorted with the backside of IC chip therefore it should be connected to GND. Be aware that there is a possibility of malfunction or destruction if it is shorted with any potential other than GND. (6) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. This IC exposes the metal on the backside of package. Note that this part is assumed to use after providing heat dissipation treatment to improve heat dissipation efficiency. Try to occupy as wide as possible with heat dissipation pattern not only on the board surface but also the backside. (7) Inter-pin shorts and mounting errors When attaching to a printed circuit board, pay close attention to the direction of the IC and displacement. Improper attachment may lead to destruction of the IC. There is also possibility of destruction from short circuits which can be caused by foreign matter entering between outputs or an output and the power supply or GND. (8) Operation in strong electromagnetic field Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction. (9) ASO When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO. (10) Thermal shutdown circuit The IC has a built-in thermal shutdown circuit (TSD circuit). If the chip temperature becomes Tjmax=150°C, and higher, coil output to the motor will be open. The TSD circuit is designed only to shut the IC off to prevent runaway thermal operation. It is not designed to protect or indemnify peripheral equipment. Do not use the TSD function to protect peripheral equipment. TSD on temperature [°C] (typ.) Hysteresis temperature [°C] (typ.) 175 25 (11) Over current protection circuit The IC has a built-in over current protection circuit (OCP circuit). The OCP circuit is designed only to shut the IC off to prevent abnormal situations, when absolute maximum output current is exceeded. It is not designed to protect or indemnify peripheral equipment. Do not use the OCP function to protect peripheral equipment. (12) Inspection of the application board During inspection of the application board, if a capacitor is connected to a pin with low impedance there is a possibility that it could cause stress to the IC, therefore an electrical discharge should be performed after each process. Also, as a measure again electrostatic discharge, it should be earthed during the assembly process and special care should be taken during transport or storage. Furthermore, when connecting to the jig during the inspection process, the power supply should first be turned off and then removed before the inspection. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 6/8 2012.02 - Rev.A Technical Note BD63821EFV, BD63823EFV (13) Input terminal of IC This IC is a monolithic IC, and between each element there is a P+ isolation for element partition and a P substrate. This P layer and each element’s N layer make up the P-N junction, and various parasitic elements are made up. For example, when the resistance and transistor are connected to the terminal as shown in figure 3, ○When GND＞(Terminal A) at the resistance and GND＞(Terminal B) at the transistor (NPN), the P-N junction operates as a parasitic diode. ○Also, when GND＞(Terminal B) at the transistor (NPN) The parasitic NPN transistor operates with the N layers of other elements close to the aforementioned parasitic diode. Because of the IC’s structure, the creation of parasitic elements is inevitable from the electrical potential relationship. The operation of parasitic elements causes interference in circuit operation, and can lead to malfunction and destruction. Therefore, be careful not to use it in a way which causes the parasitic elements to operate, such as by applying voltage that is lower than the GND (P substrate) to the input terminal. Resistor Transistor (NPN) Pin A Pin B Pin B C B Pin A E C N P+ N P P+ N N P substrate GND Parasitic element P + P P B + N E P substrate Parasitic element Parasitic element N GND GND GND Parasitic element Other adjacent elements Fig. 3 Pattern diagram of parasitic element (14) Ground Wiring Pattern When using both large current and small signal GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external components, either. (15) TEST pin Be sure to connect TEST pin to GND. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 7/8 2012.02 - Rev.A Technical Note BD63821EFV, BD63823EFV ●Ordering part number B D 6 3 8 2 1 E F V パッケージ EFV=HTSSOP-B28 形名 - E2 包装、フォーミング仕様 E2: リール状エンボステーピング HTSSOP-B28 <Tape and Reel information> 9.7±0.1 (MAX 10.05 include BURR) (5.5) 1 Tape Embossed carrier tape (with dry pack) Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 14 +0.05 0.17 -0.03 1PIN MARK 1.0MAX 0.625 1.0±0.2 (2.9) 0.5±0.15 15 4.4±0.1 6.4±0.2 28 +6° 4° −4° 0.08±0.05 0.85±0.05 S 0.08 S 0.65 +0.05 0.24 -0.04 0.08 1pin M Reel (Unit : mm) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 8/8 Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. 2012.02 - Rev.A Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. 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If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. R1120A