Stepping Motor Driver Series Microstep 36V Series Stepping Motor Driver BD63860EFV No.12009EAT09 ●Description BD63860EFV is a high-grade stepping motor driver with an internal 3-bit DAC, designed to drive bipolar stepping motors in eighth-step modes. The IC features several integrated protection circuits and achieves excellent thermal dissipation performance due to its low ON-resistance DMOS output transistors and high-dissipation power package. This IC is rated for 36 V maximum input voltage / 2.5 A maximum output current and employs a constant-current, PWM allowing for full-, half-, quarter- and eighth-step excitation modes. Additionally, the current decay mode can be freely set to a ratio of fast and slow decay, allowing the IC to adapt to the optimum control conditions for every motor. The single-power supply configuration allows for easy design and layout in the application. ●Features 1) Single power supply input (Vin max. 36 V) 2) Rated output current: 2.5 A (peak) 3) Low ON-resistance DMOS output (0.8 Ω total across upper + lower FETs) 4) Serial/CLK-IN drive mode (integrated translator circuit) 5) PWM constant-current control (fixed chopping frequency) 6) Built-in spike noise cancel function (external noise filter is unnecessary) 7) Full-, half-, quarter- and eighth-step functionality 8) AUTO decay mode 9) Current decay mode switching function (linearly variable fast/slow decay ratio) 10) Normal rotation & reverse rotation switching function 11) Power-save function 12) Built-in logic input pull-down resistor 13) Power-on reset function 14) Thermal shutdown circuit (TSD) 15) Over-current protection circuit (OCP) 16) Under-voltage lockout circuit (UVLO) 17) Over-voltage lockout circuit (OVLO) 18) Ghost Supply Prevention (protects against malfunction when power supply is disconnected) 19) Micro-miniature, ultra-thin and high heat-radiation (exposed metal type) HTSSOP package ●Applications Laser printers, multi-function printers, inkjet printers, scanners, mini printers, PPCs, photo printers, etc. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 1/8 2012.02 - Rev.A Technical Note BD63860EFV ●Absolute maximum ratings (Ta = 25°C) Parameter Supply voltage Symbol VCC1,2 Power dissipation Pd Control pin input voltage RNF maximum voltage Maximum output current Operating temperature range Storage temperature range Junction temperature Limit -0.2 – 36.0 *1 1.45 *2 4.7 Unit V -0.2 – 7.0 1.0 2.5 *3 -25 – 85 -55 – 150 150 V V A / phase °C °C °C VIN VRNF IOUT Topr Tstg Tjmax W *1 IC mounted on 70mm x 70mm x 1.6mm glass-epoxy board. Derated at 11.6 mW/C above Ta = 25°C. *2 IC mounted on 4-layer recommended board. Derated at 37.6 mW/°C above Ta = 25°C. *3 Not to exceed Pd, ASO and Tjmax = 150°C. ●Operating conditions (Ta = -25 – 85 °C) Parameter Supply voltage Output current(DC) Symbol Limit Typ 24 1.5 Min 16 VCC1,2 IOUT Max 28 1.7 *4 Unit V A/phase *4 Not to exceed Pd, ASO. ●Electrical characteristics (unless otherwise specified, Ta = 25°C, Vcc1,2 = 24 V) Limit Item Symbol Min Typ Max Overall Device Circuit current at standby ICCST 0.4 2.0 Circuit current ICC 4.0 7.0 Control inputs (PS, RESET, ENABLE, CLK, CW/CCW, MODE1, MODE2, SR) H level input voltage VINH 2.0 5.5 L level input voltage VINL 0 0.8 H level input current IINH 38 55 94 L level input current IINL -10 0 Outputs (OUT1A, OUT1B, OUT2A, OUT2B) Output ON-resistance Output leak current Current control RNF input current VREF input current VREF input voltage range VCR input current VCR input voltage range MTH input current MTH input voltage range Comparator threshold 1 Comparator threshold 2 Comparator threshold 3 Minimum on time www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. Unit mA mA PS = L PS = H, VREF = 2 V V V µA µA VIN = 5.5 V VIN = 0 V RON - 0.8 1.0 Ω ILEAK - - 10 µA IRNF IVREF VREF IVCR VVCR IMTH VMTH VCTH1 VCTH2 VCTH3 tONMIN -40 -2.0 0 60 3.0 -2.0 0 0.212 0.142 0.076 0.21 -20 -0.1 100 -0.1 0.250 0.177 0.096 0.54 3.2 140 5.5 3.5 0.288 0.212 0.116 0.92 µA µA V µA V µA V V V V µs 2/8 Condition IOUT = 1.5 A, total across top and bottom FET RNF = 0 V VREF = 0 V VVCR = 3.3 V MTH = 0 V VREF = 2 V, 100% VREF = 2 V, 70.71% VREF = 2 V, 38.27% R=39kΩ,C=1000pF 2012.02 - Rev.A Technical Note BD63860EFV ●Pin function table No. Name 1 RNF1 Function No. Name Function Output current-sense resistor connection 15 VCC2 No connection 16 SR Motor rotation direction setting terminal 17 RESET Reset terminal H-bridge output terminal 18 OUT2B H-bridge output terminal Clock input terminal (for advancing electrical angle) Power supply terminal 2 N.C. 3 CW/CCW 4 OUT1A 5 MTH Current decay ratio setting terminal 19 CLK 6 CR1 PWM frequency setting RC connection 20 TEST Test terminal (connect to GND during normal use) 7 GND Ground terminal 21 GND Ground terminal 8 VREF Output current value setting terminal 22 N.C. No connection 9 CR2 PWM frequency setting RC connection 23 N.C. No connection 10 VCR Decay mode setting terminal 24 N.C. No connection 11 OUT2A H-bridge output terminal 25 OUT1B 12 MODE2 Motor excitation mode setting terminal 26 ENABLE 13 MODE1 Motor excitation mode setting terminal 27 PS 14 RNF2 Output current-sense resistor connection 28 VCC1 H-bridge output terminal Output enable terminal Power save terminal Power supply terminal ●Block diagram, application circuit, input/output equivalent circuits Sets PWM frequency. Allowable values: C: 470 pF – 4700 pF R: 10 kΩ – 100 kΩ. Ensure VCC1 and VCC2 are shorted. Buffer VREF 8 CR1 6 Current Limit Comp. DAC CR Timer 28 Logic CLK 19 MODE2 12 MODE1 13 CW_CCW 3 ENABLE 26 OUT1A OUT1B 25 RNF1 1 4 Predriver MTH 5 OCP 16 SR TSD RESET UVLO 27 PS 17 RESET Current Limit Comp. DAC 9 Bypass capacitors. Allowable values: 47 µF – 470 µF (electrolytic) 0.01 µF – 0.1 µF (multi-layer ceramic) OVLO 10 CR2 VCC1 Reg Translator VCR Sets PWM frequency. Allowable values: C: 470 pF – 4700 pF R: 10 kΩ – 100 kΩ. VCC1 CR Timer 15 Logic 11 Predriver 18 14 Output current sense resistor. Allowable values: 0.1 Ω – 0.4 Ω Refer to p. 8. VCC2 OUT2A OUT2B RNF2 OCP TEST 20 21 GND 7 GND Output current sense resistor. Allowable values: 0.1 Ω – 0.4 Ω Test terminal. Connect to GND during operation. Fig.1 Block Diagram / Application Circuit www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 3/8 2012.02 - Rev.A Technical Note BD63860EFV ●Pin descriptions ○ CLK – Clock input terminal for advancing output electrical angle CLK is triggered at the rising edge of the input clock signal. The electrical angle output advances by one step for each CLK pulse input. As the motor may misstep if excessive noise is present on the CLK terminal, the traces leading to this pin should be designed such that noise is kept to a minimum. ○ MODE1, MODE2 – Motor excitation mode terminal Sets the motor excitation mode. Refer to the following table: MODE1 MODE2 Excitation mode L L Full Step H L Half Step A L H Quarter Step H H Eighth Step Refer to pp. 12-13 for the timing chart and motor torque vectors for each excitation mode. Changes to this pin are not synchronized with the CLK input and will reflect immediately in the operation of the IC (refer to p. 16). ○ CW/CCW – Motor rotation direction setting terminal Set the motor’s rotation direction. Changes to this pin are reflected at the rising edge of the next immediate CLK input pulse after the setting is changed (refer to p. 14). CW/CCW Rotation direction L H Clockwise (Channel 2 current is output with a 90° phase-lag relative to channel 1) Counterclockwise (Channel 2 current is output with a 90° phase-lead relative to channel 1) ○ ENABLE – Output enable terminal Forcibly turns off all output transistors (leaving the motor output open). When ENABLE is set to a logic HI, the output electrical angle and operating mode is maintained even if a pulse is input to the CLK pin. However, bear in mind that when the ENABLE signal is switched from HI to LO, the output angle may change depending on whether the CLK input is HI or LO (refer to p. 15). ENABLE Motor output L H ACTIVE OPEN (electrical angle maintained) ○ PS – Power save terminal Switches the IC to standby mode and holds all motor outputs open. Setting the IC to standby mode reinitializes the translator and resets the output angle to the default position (see below). Additionally, when switching from standby to normal mode, a delay of approximately 40μs (max.) occurs before motor output becomes active (refer to p. 11). PS State L H Standby mode (reset) Active mode The default electrical angle for each excitation mode immediately following a reset is as follows (refer to pp. 12-13): Excitation mode Initial electrical angle Full Step Half Step A Quarter Step Eighth Step 45° 45° 45° 45° www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 4/8 2012.02 - Rev.A Technical Note BD63860EFV ●Protection Circuits ○ Thermal shutdown (TSD) This IC features an integrated thermal shutdown for protection against thermal destruction. When the IC’s chip temperature rises above 175°C (typ.), the motor output is forced open. When the temperature returns to 150°C or less (typ.), the IC automatically resumes normal operation. However, even if TSD has engaged, the IC may become damaged if heat continues to be absorbed from an external source. ○ Over-current protection (OCP) This IC features an integrated over-current protection circuit to protect against destruction if the motor outputs are shorted to one another, if VCC is shorted to the motor output, or if the motor output is shorted to GND. The circuit latches the motor output open if current flows above the maximum threshold for 4 µS (typ.), and is disengaged when the IC is power-cycled or if the PS terminal is reset. The OCP circuitry is designed only to protect the IC from irregular conditions (such as motor output shorts) and is not designed to be used as an active security device for the application. Therefore, applications should not be designed under the assumption that this circuitry will engage. After OCP has engaged, if irregular conditions continue after a power cycle or PS pin reset, OCP may engage repeatedly, causing the IC to generate heat or otherwise suffer damage. If the inductance of the IC’s input/output wiring is large (e.g., due to long trace length), overload current may flow into the wiring before OCP engages, causing a jump in voltage on the input/output pin that may exceed the IC’s absolute maximum rating and damage the IC. Additionally, if the IC conducts a current through the output that is larger than the specified output current rating but lower than the OCP threshold, the IC may heat up beyond its maximum rating (Tjmax = 150°C) and destroy itself. Therefore, ensure that the set output current does not exceeds the IC’s maximum output rating. ○ Under-voltage lockout (UVLO) This IC features an integrated under-voltage lockout function to prevent against output when powered by an insufficient supply voltage. If the supply voltage connected to the VCC terminal drops below 12 V (typ.), the motor output is forced open. This switching voltage threshold has a hysteresis of 1 V (typ.) to prevent malfunction due to noise on the input. This circuit does not function in power-save mode. Also, when driving the IC in serial (CLK-in) mode, the output angle is reinitialized to the default angle upon release of the UVLO circuitry. ○ Over-voltage lockout (OVLO) This IC features an integrated over-voltage lockout function to prevent against output when powered by a supply voltage exceeding the rated input voltage range. If the supply voltage connected to the VCC terminal reaches 32 V (typ.), the motor output is forced open. This switching voltage threshold has a hysteresis of 1 V (typ.) and a noise-masking period of 4 µs (typ.) to prevent malfunction due to noise on the input. Although the IC features this integrated protection device, it may still be destroyed if the input voltage exceeds the IC’s absolute maximum ratings. This circuit does not operate in power-save mode. ○ Ghost supply prevention This IC features integrated ghost supply protection circuitry, which prevents the IC from being powered by a logic input when the power supply is disconnected or grounded. This circuitry prevents current from flowing through the integrated ESD protection diodes (located between logic input pins and the VCC pin), ensuring that the IC itself or any other peripherals connected to the VCC pin cannot be powered by an input signal on any logic terminals. Therefore, the circuit will not malfunction if a logic signal is input to the IC while the power supply is disconnected or grounded. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 5/8 2012.02 - Rev.A Technical Note BD63860EFV ●Power dissipation ○ HTSSOP-B28 package The HTSSOP-B28 package features a heat-radiating metal slag mounted on the backside of the IC. Ensure that the PCB design incorporates large areas of copper to facilitate heat dissipation as much as possible. As the heat slag is shorted with the substrate of the IC die, ensure that the slag is connected to GND. Connecting the slag to a potential other than GND will cause the chip to malfunction. Also ensure that the backside of the chip is completely and firmly soldered onto the PCB. The ratings specified in this sheet assume the IC has been properly mounted and soldered, and that the PCB has been adequately designed to facilitate heat dissipation. Measurement machine: TH156 (Kuwano Electric) 4.7W Measurement conditions: ROHM board, 70mm x 70 mm x 1.6 mm Board contains through-holes Heat slag soldered completely to PCB 4 4.0 Power Dissipation: Pd[W] 3.3W 3 Board Board Board Board ①: 1-layer board (no copper foil on backside) 2 ②: 2-layer board (15 x 15 mm copper foil on backside) 2 ③: 2-layer board (70 x 70 mm copper foil on backside) 2 ④: 4-layer board (70 x 70 mm copper foil on backside) Board Board Board Board ①: θja = 86.2°C / W ②: θja = 67.5°C / W ③: θja = 37.8°C / W ④: θja = 26.6°C / W 3.0 2.0 1.0 1.85W 1.45W 2 1 0 100 125 Ambient Temperature:Ta [°C] Fig.2 HTSSOP-B28 Derating Curve ●Operation Notes (1) Absolute maximum ratings Use of the IC in excess of absolute maximum ratings (such as the input voltage or operating temperature range) may result in damage to the IC. Assumptions should not be made regarding the state of the IC (e.g., short mode or open mode) when such damage is suffered. If operational values are expected to exceed the maximum ratings for the device, consider adding protective circuitry (such as fuses) to eliminate the risk of damaging the IC. (2) Power supply polarity Connecting the power supply with a reverse polarity can damage IC. Take precautions when connecting the power supply lines. An external diode can be connected to the input for extra protection. (3) Power supply lines PCB design should allow for low-impedance GND and supply lines. To minimize noise on these lines, the GND section and supply lines of the digital and analog blocks should be routed separately on the PCB. Furthermore, for all power IC supply terminals, a capacitor should be connected between the power supply and GND terminal. If using electrolytic capacitors, note that their capacitance values may be reduced at lower temperatures. (4) GND potential The potential of the GND pin must be the minimum potential in the system in all operating conditions. pins are at a voltage below the GND at any time, regardless of transient characteristics. Ensure that no (5) Backside heat slag The metal heat slag integrated on the backside of the IC is connected internally with the backside of the IC die. Therefore, it should always be connected to GND. Connecting to any other potential may cause malfunction or destruction of the IC. (6) Thermal design Use a thermal design that allows for a sufficient margin for the package’s rated power dissipation (Pd) under actual operating conditions. Keep in mind that the packaging of this IC series has been designed with an exposed heat slag on the backside of the package, and that this heat slag should be soldered completely to as broad a GND pattern as possible (on both the base fin of the slag as well as the entire backside) to improve heat dissipation. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 6/8 2012.02 - Rev.A Technical Note BD63860EFV (7) Inter-pin shorts and mounting errors Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result in damage to the IC. Shorts between output pins or between output pins and the power supply or GND pins (caused by poor soldering or foreign objects) may result in damage to the IC. (8) Actions in strong electromagnetic field The IC is not designed for using in the presence of strong electromagnetic field. Be sure to confirm that no malfunction is found when using the IC in a strong electromagnetic field. (9) ASO – Area of safe operation When using the IC, ensure that operating conditions do not exceed absolute maximum ratings or ASO of the output transistors. (10) Thermal shutdown circuit The IC incorporates a built-in thermal shutdown circuit, which is designed to force the motor output open if the IC’s internal temperature exceeds Tjmax = 150°C. It is not designed to protect the IC from damage or guarantee its operation. ICs should not be used after this function has activated, or in applications where the operation of this circuit is assumed. TSD on temperature [°C] (Typ.) Hysteresis Temperature [°C] (Typ.) 175 25 (11) Testing on application boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from a jig or fixture during the evaluation process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. (12) Input terminal of IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. PN junctions are formed at the intersection of these P layers with the N layers of other elements, creating parasitic diodes and/or transistors. For example (refer to the figure below): When GND > Pin A and GND > Pin B, the PN junction operates as a parasitic diode When GND > Pin B, the PN junction operates as a parasitic transistor Parasitic diodes occur inevitably in the structure of the IC, and the operation of these parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Accordingly, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C B Pin B Pin A P+ N N P P E N + N Parasitic element P + P substrate Parasitic element B N P+ P N C E P substrate GND Parasitic element GND GND GND Parasitic element Other adjacent elements Fig.3 Example of Monolithic IC Structure (13) Ground wiring patterns When using both small-signal and large-current GND traces, the two ground traces should be routed separately but connected to a single ground potential within the application in order to avoid variations in the small-signal ground caused by large currents. Also ensure that the GND traces of external components do not cause variations on GND voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance. (14) TEST Terminal Connect the TEST pin to GND during operation. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 7/8 2012.02 - Rev.A Technical Note BD63860EFV ●Ordering part number B D 6 3 8 6 0 E F V - E2 パッケージ EFV=HTSSOP-B28 形名 包装、フォーミング仕様 E2: リール状エンボステーピング HTSSOP-B28 <Tape and Reel information> 9.7±0.1 (MAX 10.05 include BURR) (5.5) 1 Tape Embossed carrier tape (with dry pack) Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 14 +0.05 0.17 -0.03 1PIN MARK 1.0MAX 0.625 1.0±0.2 (2.9) 0.5±0.15 15 4.4±0.1 6.4±0.2 28 +6° 4° −4° 0.08±0.05 0.85±0.05 S 0.08 S 0.65 +0.05 0.24 -0.04 0.08 1pin M (Unit : mm) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. Reel 8/8 Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. 2012.02 - Rev.A Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. R1120A