1/8 ■ Structure Silicon Monolithic Integrated Circuit ■ Product Name For DSC handshake guard, signal processing and motor driving IC ■ Model Name BH9992GU ■ Function ・ ・ ・ ・ ・ ・ ・ ・ GYROAMP 2ch HALLAMP 2ch R-2R type 8bit D/A converter 5ch R-2R type 10bit D/A converter 2ch No dead zone system PWM Driver SAW wave oscillator Regulator Rail to Rail AMP ■ Absolute maximum ratings Item Symbol Standard value Unit Power supply voltage VC, VDD, PVCC 7.0 V Power dissipation （*1） PD 1400 mW Operation temperature TOPR -10～70 ℃ range Storage temperature TSTG -40～125 ℃ range H Bridge output current1 IOUT1 300 mA H Bridge output current2 IOUT2 500 mA （*2） *1 Mounting board specification（Rohm standard board） Material：The glass fabric base epoxy Dimensions：50[mm]×58[mm]×1.75[mm] (8 layers) When using it at Ta=25℃ or more, 14 [mW] of 1[℃] decreases. *2 Instantaneous current（1[us] or less） ■ Operating condition Item Symbol Min. Typ. Max. VC power supply voltage VC 3.0 (*3) 3.3 5.5 VDD power supply voltage（≦VC） VDD 2.5 3.0 5.5 PVCC power supply voltage PVCC 3.0 5.0 5.5 Serial clock frequency FSCLK ― 1.0 4.0 DACOUT limit load capacity 1 CLA1 ― ― 0.1 (DAC0OUT,DAC3OUT,DAC4OUT) Between VDDOUT and GND, CLVDDOUT 1.0 ― 30.0 load capacity *3 When VDDOUT is used, the Min. operating condition of VC power supply voltage is 3.2[V]. ・A radiation is not designed. REV. D Unit V V V MHz μF μF 2/8 ■ Physical Dimension Package type nama ： VCSP85H4 BH9992 Lot. No. ■ CHIP Backside PIN Arrangement AMP4 AMP4 H +IN -IN AMP2 AMP4 AMP9 G OUT OUT +IN AMP2 AMP7 F GND1 -IN OUT AMP7 VDD E VC1 -IN OUT AMP9 AMP8 AMP9 D OUT -IN -IN AMP10 AMP10 C OUT -IN AMP10 VC3 B GND3 +IN A PGND1 OUT1F 1 2 3 AMP3 -IN AMP3 OUT AMP1 OUT DAC4 OUT AMP8 OUT XSTBY REV. D VDD2 AMP1 -IN DAC0 OUT DAC3 OUT DAC6 OUT AGND AMP11 OUT AMP11 -IN VREF1 IN AMP12 -IN DAC5 OUT AMP11 +IN AMP13 OUT VDD1 AMP14 OUT AMP12 OUT VC2 LD DATA CLK GND2 OUT1R 4 PVCC 5 OUT2R 6 OUT2F 7 Please keep open for the terminal, when you use. Fig.1 Physical Dimension (Unit ： mm) AMP3 +IN AMP13 -IN AMP13 +IN AMP14 -IN AMP14 +IN AMP12 +IN PGND2 8 3/8 ■ PIN Description PIN No. Pin Name 1-A ― 2-A 3-A 4-A 5-A PGND1 OUT1F OUT1R PVCC 6-A OUT2R 7-A 8-A 1-B 2-B 3-B 4-B OUT2F ― AMP10+IN GND3 VC3 LD 5-B 6-B 7-B 8-B 1-C 2-C 3-C 4-C 5-C 6-C 7-C 8-C 1-D 2-D 3-D 4-D 5-D 6-D 7-D 8-D DATA CLK GND2 PGND2 AMP10-IN AMP10OUT ― XSTBY DAC6OUT DAC5OUT VC2 AMP12+IN AMP9-IN AMP9OUT AMP8-IN AMP8OUT DAC3OUT AMP12-IN AMP12OUT AMP14+IN Pin explanation ― PIN No. 1-E Pin Name VDDOUT Power block ground CH1 forward output CH1 reverse output Power block power supply CH2 reverse output 2-E 3-E 4-E 5-E VC1 AMP7-IN DAC4OUT DAC0OUT 6-E VREF1IN CH2 forward output ― AMP10+Input GND VC power supply Serial data loading input Serial data input Serial clock input GND Power block ground AMP10-input AMP10 output ― Standby control input DAC6 output DAC5 output VC power supply AMP12+input AMP9-input AMP9 output AMP8-input AMP8 output DAC3 output AMP12-input AMP12 output AMP14+input 7-E 8-E 1-F 2-F 3-F 4-F AMP14OUT AMP14-IN GND1 AMP2-IN AMP7OUT AMP1OUT AMP reference input AMP14 output AMP14-input GND AMP2-input AMP7 output AMP10 output 5-F 6-F 7-F 8-F 1-G 2-G 3-G 4-G 5-G 6-G 7-G 8-G 1-H 2-H 3-H 4-H 5-H 6-H 7-H 8-H AMP1-IN AMP11-IN VDD1 AMP13+IN AMP9+IN AMP2OUT AMP4OUT AMP3OUT VDD2 AMP11OUT AMP13OUT AMP13-IN ― AMP4+IN AMP4-IN AMP3-IN AMP3+IN AGND AMP11+IN ― AMP1-input AMP11-input VDD power supply AMP13+input AMP9+input AMP2 output AMP4 output AMP3 output VDD power supply AMP11 output AMP13 output AMP13-input ― AMP4+input AMP4- input AMP3- input AMP3+ input Analog GND AMP11+input ― REV. D Pin explanation VDD regulator output VC power supply AMP7-input DAC4 output DAC0 output 4/8 ■ Whole Block Diagram GYRO AMP1 (VDD) AMP7OUT AMP7-IN HALL AMP2 (VDD) HALL AMP1 (VDD) AMP9+IN GYRO AMP2 (VDD) AMP2-IN AMP8-IN VDD (VC) GND1 DAC7ch (VC standard voltage is VDD) VC1 VDDOUT AMP9OUT AMP9-IN XSTBY PWM1 (VC) PWM2 (VC) LOGIC (VC) AMP10OUT AMP10-IN VC3 AMP10+IN GND3 Pre Driver1 VC, PVCC Pre Driver2 VC, PVCC POWER Driver1 (PVCC) Fig.2 POWER Driver2 (PVCC) Whole Block Diagram REV. D VREF1IN AMP12-IN AMP13-IN VDD1 AMP14OUT AMP13+IN DAC6OUT AMP12OUT AMP14-IN DAC5OUT AMP14+IN VC2 AMP12+IN GND2 LD DATA PGND CLK 5/8 ■ Electrical characteristic ◎Circuit current（VC=3.3[V], VDD=3.0[V], PVCC=5.0[V], DAC0OUT=VREF1IN, Ta=25[℃] except as otherwise noted.） Standard value Item Symbol Unit Notes Min. Typ. Max. Current consumption 1 at standby ISTBY － 1.5 10 μA XSTBY, CLK, DI, LD=L (VC+VDD+PVCC) Current consumption1 when operating DAC0=080H ICC1 － 4.0 6.0 mA (VC+VDD) DAC1,2,3,4,5,6=000H Current consumption2 when operating DAC0=080H, DAC1,2,3,4,=0FFH ICC2 － 11.0 16.5 mA (VC+VDD) DAC 5,6,=3FFH Current consumption3 when operating ICC3 － 25 50 μA XSTBY=H, POWSTBY_N=”0” (PVCC) ◎HALL Sensor input _AMP （VC=3.3[V], VDD=3.0[V], PVCC=5.0[V], DAC0=080H, DAC0OUT=VREF1IN, Ta=25[℃] except as otherwise noted） Standard value Item Symbol Unit Notes Min. Typ. Max. <HALL_AMP (A1,A2)> DAC1, 2=0FFH Output voltage H1VOUT 2.50 － － V External 500[Ω], 270[Ω] Output voltage range (Hi) DAC1, 2=0FFH H1VOH 2.40 － － V (Open loop) Outflow current 5.0[mA], Output voltage range (Low) DAC1, 2=000H H1VOL － － 0.4 V (Open loop) Inflow current 5.0[mA], VIN=250[mV] ◎HALL Sensor output _AMP （VC=3.3[V], VDD=3.0[V], PVCC=5.0[V], DAC0, DAC3, DAC4=080H, DAC0OUT=VREF1IN, Ta=25[℃] except as otherwise noted） Standard value Item Symbol Unit Notes Min. Typ. Max. <HALL_AMP (A3,A4,A9,A10)> Output voltage 1 H2VOUT1 2.9 － － V VINP=1.2[V], VINN=1.1[V] (Open loop) Output voltage 2 H2VOUT2 － － 0.2 V VINP=1.1[V], VINN=1.2[V] (Open loop) VIN=10[mVpp] (Differential voltage input) Voltage gain H2GVD 38.5 40.0 41.5 dB f=100[Hz] Cutoff frequency H2fc 4.1 8.1 12.1 kHz -3[dB], Capa 10[pF] <HALL_AMP (A5-A7, A6-A8)> VINP Input=1.125, VINN Input=0.375 Output voltage 1 H3VOUT1 2.8 － － V HALLSW1,3=ON, HALLSW2=OFF DAC0=0BFH, DAC3,4=040H VINP Input=0.375, VINN Input=1.125 Output voltage 2 H3VOUT2 － － 0.2 V HALLSW1,3=ON, HALLSW2=OFF DAC0=040H, DAC3,4=0BFH VINP Input=0.0[V], VINN Input=3.0[V] Output voltage 3 H3VOUT3 2.8 － － V HALLSW2=ON, HALLSW1,3=OFF DAC3,4=0AAH VINP Input=0.0[V], VINN Input=0.0[V] Output voltage 4 H3VOUT4 － － 0.2 V HALLSW2=ON, HALLSW1,3=OFF DAC3,4=055H VIN=10[mVpp] (Differential voltage input) Voltage gain H3GVD -1.5 0 1.5 dB f=100[Hz] Cutoff frequency H3fc 23.0 46.0 69.0 kHz -3[dB], Capa 33[pF] REV. D 6/8 ◎GYRO_AMP （VC=3.3[V], VDD=3.0[V], PVCC=5.0[V], DAC0=080H, DAC0OUT=VREF1IN, Ta=25[℃] except as otherwise noted） Standard value Item Symbol Unit Notes Min. Typ. Max. <GYRO_AMP (A11,A12)> Output voltage 1 G1VOUT1 2.9 － － V VINP =1.2[V], VINN =1.1[V] (Open loop) Output voltage 2 G1VOUT2 － － 0.2 V VINP =1.1[V], VINN =1.2[V] (Open loop) VIN=10[mVpp] (Differential voltage input) Voltage gain G1GVD 38.5 40.0 41.5 dB f=100[Hz] Cutoff frequency G1fc 4.1 8.1 12.1 kHz -3[dB], Capa 33[pF] <GYRO_AMP (A13,A14)> GYROSW2=ON, Output voltage 1 G2VOUT1 1.30 1.50 1.70 V GYROSW1, At GYROSW3=OFF, VINP=open GYROSW1, GYROSW2=ON, Output voltage 2 G2VOUT2 1.1 1.50 1.90 V At GYROSW3=OFF, VINP=open GYROSW2=ON, At GYROSW3=OFF Voltage gain G2GVD 36.3 37.8 39.3 dB VIN=10[mVpp] (Differential voltage input) f=100[Hz] GYROSW2=ON, At GYROSW3=OFF Cutoff frequency G2fc 1.1 2.1 3.1 kHz -3[dB], Capa 100[pF] GYROSW2=ON, At GYROSW3=ON Voltage gain G2GVD2 32.5 34.0 35.5 dB VIN=10[mVpp] (Differential voltage input) f=100[Hz] GYROSW2=ON, At GYROSW3=ON Cutoff frequency G2fc2 1.7 3.3 4.9 kHz -3[dB], Capa 100[pF] REV. D 7/8 ■ Directions 1．Absolute maximum ratings This IC might be destroyed when the absolute maximum ratings, such as impressed voltages (VC,PVCC,VDD) or the operating temperature range (TOPR) is exceeded, and whether the destruction is short circuit mode or open circuit mode cannot be specified. Please take into consideration the physical countermeasures for safety, such as fusing, if a particular mode that exceeds the absolute maximum rating is assumed. 2．Reverse polarity connection Connecting the power line to the IC in reverse polarity (from that recommended) will damage the part. Please utilize the direction protection device as a diode in the supply line. 3．Power supply line Due to switching and EMI noise generated by magnetic components (inductors and motors), using electrolytic and ceramic suppress filter capacitors close to the IC power input terminals (Vcc and GND) is recommended. Please note: the electrolytic capacitor value decreases at lower temperatures. 4．GND line The ground line is where the lowest potential and transient voltages are connected to the IC. 5．Thermal design Do not exceed the power dissipation (Pd) of the package specification rating under actual operation, and please design enough temperature margins. (Refer to page 10.) 6．Short circuit mode between terminals and wrong mounting Do not mount the IC in the wrong direction and be careful about the reverse-connection of the power connector. Moreover, this IC might be destroyed when the dust short the terminals between them or GND. 7．Radiation Strong electromagnetic radiation can cause operation failures. 8．ASO(Area of Safety Operation.) Do not exceed the maximum ASO and the absolute maximum ratings of the output driver. 9．TSD(Thermal shut-down) The TSD is activated when the junction temperature (Tj) reaches 1750C(with +/-250C hysteresis), and the output terminal is switched to Hi-z. The TSD circuit aims to intercept IC from high temperature. The guarantee and protection of IC are not purpose. Therefore, please do not use this IC after TSD circuit operates, nor use it for assumption that operates the TSD circuit. 10．Capacitor between output and GND If a large capacitor is connected between the output and GND, this IC might be destroyed when Vcc becomes 0V or GND, because the electric charge accumulated in the capacitor flows to the output. Please set said capacitor to smaller than 0.1μF. REV. D 8/8 11．Inspection by the set circuit board The stress might hang to IC by connecting the capacitor to the terminal with low impedance. Then, please discharge electricity in each and all process. Moreover, in the inspection process, please turn off the power before mounting the IC, and turn on after mounting the IC. In addition, please take into consideration the countermeasures for electrostatic damage, such as giving the earth in assembly process, transportation or preservation. 12．Each input terminal This IC is a monolithic IC, and has P+ isolation and P substrate for the element separation. Therefore, a parasitic PN junction is firmed in this P-layer and N-layer of each element. For instance, the resistor or the transistor is connected to the terminal as shown in the figure below. When the GND voltage potential is greater than the voltage potential at Terminals A or B, the PN junction operates as a parasitic diode. In addition, the parasitic NPN transistor is formed in said parasitic diode and the N layer of surrounding elements close to said parasitic diode. These parasitic elements are formed in the IC because of the voltage relation. The parasitic element operating causes the wrong operation and destruction. Therefore, please be careful so as not to operate the parasitic elements by impressing to input terminals lower voltage than GND(P substrate). Please do not apply the voltage to the input terminal when the power-supply voltage is not impressed. Moreover, please impress each input terminal lower than the power-supply voltage or equal to the specified range in the guaranteed voltage when the power-supply voltage is impressing. Resister Transistor(NPN) Terminal B Terminal A C Terminal B B E Terminal A B P+ P P+ Parasitic element C E P+ P P-Substrate P+ P-Substrate Surrounding elements Parasitic element GND Parasitic element Parasitic element GND GND GND Simplified structure of IC 13．Earth wiring pattern Use separate ground lines for control signals and high current power driver outputs. Because these high current outputs that flows to the wire impedance changes the GND voltage for control signal. Therefore, each ground terminal of IC must be connected at the one point on the set circuit board. As for GND of external parts, it is similar to the above-mentioned. 14．Reverse brake When you do the reversal brake from the high-velocity revolution note the counter electromotive force. Moreover, confirm the output current enough and examine the rotational speed which uses the reversal brake. 15．About the capacitor between PVCC-PGND The PVCC-PGND capacitor absorbs the change in a steep voltage and the current because of the PWM drive. As a result, there is a role to suppress the disorder of the PVCC voltage. However, the effect decreases by the influence of the wiring impedance etc. if the capacitor becomes far from IC. Arrange the PVCC-PGND capacitor near IC. 16．Bypass capacitor Between the supply power supplies connect the bypass capacitor(0.1μF) near the pin of this IC. REV. 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