VISHAY SI3590DV

Si3590DV
New Product
Vishay Siliconix
N- and P-Channel 30-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
N-Channel
30
P-Channel
-30
rDS(on) (W)
ID (A)
0.077 @ VGS = 4.5 V
3
0.120 @ VGS = 2.5 V
2
0.170 @ VGS = -4.5 V
-2
0.300 @ VGS = -2.5 V
-1.2
D TrenchFETr Power MOSFET
D Ultra Low rDS(on) N- and P-Channel for High
Efficiency
D Optimized for High-Side/Low-Side
D Minimized Conduction Losses
APPLICATIONS
D Portable Devices Including PDAs, Cellular
Phones and Pagers
D1
S2
TSOP-6
Top View
G1
1
D1
6
G2
3 mm
S2
2
5
S1
G2
3
4
D2
G1
S1
D2
N-Channel MOSFET
P-Channel MOSFET
2.85 mm
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
N-Channel
Parameter
Symbol
10 secs
P-Channel
Steady State
10 secs
Steady State
Drain-Source Voltage
VDS
30
-30
Gate-Source Voltage
VGS
"12
"12
Continuous Drain Current (TJ = 150_C)
_ a
TA = 25_C
TA = 70_C
Pulsed Drain Current
ID
Continuous Source Current (Diode Conduction)a
Maximum Power Dissipationa
IS
TA = 25_C
TA = 70_C
Operating Junction and Storage Temperature Range
PD
V
3
2.5
-2
-1.7
2.3
2.0
-1.6
-1.3
IDM
8
A
-8
1.05
0.75
-1.05
-0.75
1.15
0.83
1.15
0.83
0.70
0.53
0.70
0.53
TJ, Tstg
Unit
W
_C
-55 to 150
THERMAL RESISTANCE RATINGS
N-Channel
Parameter
Symbol
t v 10 sec
Maximum Junction-to-Ambienta
Maximum Junction-to-Foot (Drain)
Steady State
Steady State
RthJA
RthJF
P-Channel
Typ
Max
Typ
Max
93
110
93
110
130
150
130
150
75
90
75
90
Unit
_C/W
C/W
Notes
a. Surface Mounted on 1” x 1” FR4 Board.
Document Number: 72032
S-21979—Rev. A, 04-Nov-02
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Si3590DV
New Product
Vishay Siliconix
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Static
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Currenta
Drain-Source On-State Resistancea
Forward Transconductancea
Diode Forward Voltagea
VGS(th)
IGSS
IDSS
ID(on)
rDS(on)
gfs
VSD
VDS = VGS, ID = 250 mA
N-Ch
0.6
1.5
VDS = VGS, ID = -250 mA
P-Ch
-0.6
-1.5
VDS = 0 V, VGS = "12
" V
V
N-Ch
"100
P-Ch
"100
VDS = 24 V, VGS = 0 V
N-Ch
1
VDS = -24 V, VGS = 0 V
P-Ch
-1
VDS = 24 V, VGS = 0 V, TJ = 55_C
N-Ch
5
VDS = -24 V, VGS = 0 V, TJ = 55_C
P-Ch
VDS w 5 V, VGS = 4.5 V
N-Ch
5
VDS p -5 V, VGS = -4.5 V
P-Ch
-5
nA
m
mA
-5
A
VGS = 4.5 V, ID = 3 A
N-Ch
0.062
0.077
VGS = -4.5 V, ID = -2 A
P-Ch
0.135
0.170
VGS = 2.5 V, ID = 2 A
N-Ch
0.095
0.120
VGS = -2.5 V, ID = -1.2 A
P-Ch
0.235
0.300
VDS = 5 V, ID = 3 A
N-Ch
10
VDS = -5 V, ID = -2 A
P-Ch
5
IS = 1.05 A, VGS = 0 V
N-Ch
0.80
1.10
IS = -1.05 A, VGS = 0 V
P-Ch
-0.83
-1.10
N-Ch
3
4.5
6
W
S
V
Dynamicb
Total Gate Charge
Qg
P-Ch
3.8
N-Ch
0.6
P-Ch
0.6
N-Ch
1.0
P-Ch
1.5
N-Ch
5
P-Ch
5
8
N-Channel
VDD = 15 V, RL = 15 W
ID ^ 1 A, VGEN = 10 V, RG = 6 W
N-Ch
12
23
P-Ch
15
23
P-Channel
VDD = -15 V, RL = 15 W
ID ^ -1 A, VGEN = -10 V, RG = 6 W
N-Ch
13
23
P-Ch
20
30
N-Ch
7
12
P-Ch
20
30
IF = 1.05 A, di/dt = 100 A/ms
N-Ch
15
25
IF = -1.05 A, di/dt = 100 A/ms
P-Ch
18
30
N-Channel
VDS = 15 V, VGS = 4.5 V, ID = 2 A
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Turn-On Delay Time
td(on)
Rise Time
Turn-Off Delay Time
tr
td(off)
Fall Time
tf
Source-Drain
Reverse Recovery Time
trr
nC
P-Channel
VDS = -15 V, VGS = -4.5 V, ID = -2 A
8
ns
Notes
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.
b. Guaranteed by design, not subject to production testing.
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Document Number: 72032
S-21979—Rev. A, 04-Nov-02
Si3590DV
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
N−CHANNEL
Output Characteristics
Transfer Characteristics
8
8
7
VGS = 5 thru 2.5 V
6
I D - Drain Current (A)
I D - Drain Current (A)
7
5
4
3
2V
2
6
5
4
3
TC = 125_C
2
1
25_C
1
-55 _C
1.5 V
0
0
1
2
3
4
0
0.0
5
0.5
VDS - Drain-to-Source Voltage (V)
1.0
2.5
3.0
Capacitance
0.5
450
0.4
360
C - Capacitance (pF)
r DS(on) - On-Resistance ( W )
2.0
VGS - Gate-to-Source Voltage (V)
On-Resistance vs. Drain Current
0.3
0.2
Ciss
270
180
VGS = 2.5 V
0.1
90
Coss
VGS = 4.5 V
0.0
Crss
0
0
2
4
6
8
10
0
6
12
18
24
30
VDS - Drain-to-Source Voltage (V)
ID - Drain Current (A)
Gate Charge
On-Resistance vs. Junction Temperature
6
1.8
VDS = 15 V
ID = 2 A
5
r DS(on) - On-Resistance (W)
(Normalized)
V GS - Gate-to-Source Voltage (V)
1.5
4
3
2
1
VGS = 4.5 V
ID = 3 A
1.6
1.4
1.2
1.0
0.8
0
0
1
2
3
Qg - Total Gate Charge (nC)
Document Number: 72032
S-21979—Rev. A, 04-Nov-02
4
5
0.6
-50
-25
0
25
50
75
100
125
150
TJ - Junction Temperature (_C)
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Si3590DV
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
N−CHANNEL
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
0.25
r DS(on)- On-Resistance ( W )
I S - Source Current (A)
10
TJ = 150_C
1
TJ = 25_C
0.20
ID = 3 A
0.15
0.10
0.05
0.00
0.1
0.00
0.3
0.6
0.9
1.2
0
1.5
1
VSD - Source-to-Drain Voltage (V)
2
3
4
5
VGS - Gate-to-Source Voltage (V)
Threshold Voltage
Single Pulse Power, Junction-to-Ambient
0.4
8
ID = 250 mA
6
Power (W)
V GS(th) Variance (V)
0.2
-0.0
-0.2
4
2
-0.4
-0.6
-50
0
-25
0
25
50
75
100
125
150
0.1
0.01
TJ - Temperature (_C)
1
10
30
Time (sec)
Safe Operating Area, Junction-to-Case
100
IDM Limited
I D - Drain Current (A)
10
rDS(on) Limited
100 ms
1
1 ms
ID(on)
Limited
0.1
10 ms
10 s, 1 s
dc
BVDSS Limited
0.01
0.1
100 ms
TC = 25_C
Single Pulse
1
10
100
VDS - Drain-to-Source Voltage (V)
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Document Number: 72032
S-21979—Rev. A, 04-Nov-02
Si3590DV
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
N−CHANNEL
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.1
0.2
Notes:
0.1
PDM
t1
0.05
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = RthJA = 87_C/W
3. TJM - TA = PDMZthJA(t)
4. Surface Mounted
Single Pulse
0.01
10- 4
10- 3
10- 2
10- 1
1
100
10
600
Square Wave Pulse Duration (sec)
Normalized Thermal Transient Impedance, Junction-to-Foot
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10- 4
Document Number: 72032
S-21979—Rev. A, 04-Nov-02
10- 3
10- 2
10- 1
Square Wave Pulse Duration (sec)
1
10
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Si3590DV
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
P−CHANNEL
Output Characteristics
Transfer Characteristics
8
8
VGS = 5 thru 3.5 V
7
TC = -55_C
7
25_C
I D - Drain Current (A)
I D - Drain Current (A)
3V
6
5
4
2.5 V
3
2
6
5
125_C
4
3
2
2V
1
1
1.5 V
0
0
1
2
3
4
0
0.0
5
0.5
VDS - Drain-to-Source Voltage (V)
1.0
2.0
2.5
3.0
3.5
VGS - Gate-to-Source Voltage (V)
On-Resistance vs. Drain Current
Capacitance
0.75
500
0.60
400
C - Capacitance (pF)
r DS(on) - On-Resistance ( W )
1.5
0.45
VGS = 2.5 V
0.30
VGS = 4.5 V
Ciss
300
200
0.15
100
0.00
0
Coss
Crss
0
1
2
3
4
5
6
7
8
0
6
Gate Charge
24
30
On-Resistance vs. Junction Temperature
6
1.8
VDS = 15 V
ID = 2 A
5
r DS(on) - On-Resistance (W)
(Normalized)
V GS - Gate-to-Source Voltage (V)
18
VDS - Drain-to-Source Voltage (V)
ID - Drain Current (A)
4
3
2
1
VGS = 4.5 V
ID = 2 A
1.6
1.4
1.2
1.0
0.8
0
0
1
2
3
Qg - Total Gate Charge (nC)
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6
12
4
5
0.6
-50
-25
0
25
50
75
100
125
150
TJ - Junction Temperature (_C)
Document Number: 72032
S-21979—Rev. A, 04-Nov-02
Si3590DV
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
P−CHANNEL
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
0.5
0.4
r DS(on)- On-Resistance ( W )
I S - Source Current (A)
10
TJ = 150_C
1
TJ = 25_C
0.3
ID = 2 A
0.2
0.1
0.0
0.1
0.00
0.3
0.6
0.9
1.2
0
1.5
1
VSD - Source-to-Drain Voltage (V)
2
3
4
5
6
7
VGS - Gate-to-Source Voltage (V)
Threshold Voltage
Single Pulse Power, Junction-to-Ambient
0.4
8
ID = 250 mA
0.3
Power (W)
V GS(th) Variance (V)
6
0.2
0.1
4
0.0
2
-0.1
-0.2
-50
0
-25
0
25
50
75
100
125
150
0.1
0.01
TJ - Temperature (_C)
1
10
30
Time (sec)
Safe Operating Area, Junction-to-Case
100
IDM Limited
I D - Drain Current (A)
10
rDS(on) Limited
100 ms
1
1 ms
ID(on)
Limited
0.1
10 ms
100 ms
10 s, 1 s
TC = 25_C
Single Pulse
dc
BVDSS Limited
0.01
0.1
1
10
100
VDS - Drain-to-Source Voltage (V)
Document Number: 72032
S-21979—Rev. A, 04-Nov-02
www.vishay.com
7
Si3590DV
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
P−CHANNEL
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.1
0.2
Notes:
0.1
PDM
t1
t2
1. Duty Cycle, D =
0.05
0.02
t1
t2
2. Per Unit Base = RthJA = 87_C/W
3. TJM - TA = PDMZthJA(t)
4. Surface Mounted
Single Pulse
0.01
10- 4
10- 3
10- 2
10- 1
1
100
10
600
Square Wave Pulse Duration (sec)
Normalized Thermal Transient Impedance, Junction-to-Foot
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10- 4
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10- 3
10- 2
10- 1
Square Wave Pulse Duration (sec)
1
10
Document Number: 72032
S-21979—Rev. A, 04-Nov-02