NEC 2SJ648

DATA SHEET
MOS FIELD EFFECT TRANSISTOR
2SJ648
P-CHANNEL MOS FIELD EFFECT TRANSISTOR
FOR SWITCHING
DESCRIPTION
PACKAGE DRAWING (Unit: mm)
The 2SJ648 is a switching device which can be driven directly by a
2.5 V power source.
The 2SJ648 features a low on-state resistance and excellent
switching characteristics, and is suitable for applications such as
power switch of portable machine and so on.
FEATURES
• 2.5 V drive available
• Low on-state resistance
RDS(on)1 = 1.45 Ω MAX. (VGS = −4.5 V, ID = −0.2 A)
RDS(on)2 = 1.55 Ω MAX. (VGS = −4.0 V, ID = −0.2 A)
RDS(on)3 = 2.98 Ω MAX. (VGS = −2.5 V, ID = −0.15 A)
0.8 ± 0.1
1.6 ± 0.1
0.3 +0.1
–0
0.15 +0.1
–0.05
3
0 to 0.1
2
1
0.2
0.5
+0.1
–0
1.0
1.6 ± 0.1
PACKAGE
2SJ648
SC-75 (USM)
0.75 ± 0.05
1: Source
2: Gate
3: Drain
ORDERING INFORMATION
PART NUMBER
0.6
0.5
Marking: H1
EQUIVALENT CIRCUIT
ABSOLUTE MAXIMUM RATINGS (TA = 25°C)
Drain to Source Voltage (VGS = 0 V)
VDSS
−20
V
Gate to Source Voltage (VDS = 0 V)
VGSS
m12
V
Drain Current (DC)
ID(DC)
m0.4
A
ID(pulse)
m1.6
A
PT
200
mW
Channel Temperature
Tch
150
°C
Storage Temperature
Tstg
−55 to +150
°C
Drain Current (pulse) Note1
Total Power Dissipation
Note2
Drain
Body
Diode
Gate
Gate
Protection
Diode
Source
Notes 1. PW ≤ 10 µs, Duty Cycle ≤ 1%
2
2. Mounted on ceramic substrate of 300 mm x 0.64 mm.
Remark
The diode connected between the gate and source of the transistor serves as a protector against ESD. When
this device actually used, an additional protection circuit is externally required if a voltage exceeding the rated
voltage may be applied to this device.
Caution
This product is electrostatic-sensitive device due to low ESD capability and should be handled with
caution for electrostatic discharge.
VESD = ±100 V TYP. (C = 200 pF, R = 0 Ω, Single pulse)
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
Document No. D16597EJ2V0DS00 (2nd edition)
Date Published November 2004 NS CP(K)
Printed in Japan
The mark
shows major revised points.
2003
2SJ648
ELECTRICAL CHARACTERISTICS (TA = 25°C)
CHARACTERISTICS
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
Zero Gate Voltage Drain Current
IDSS
VDS = −20 V, VGS = 0 V
−1.0
µA
Gate Leakage Current
IGSS
VGS = m12 V, VDS = 0 V
m10
µA
−1.8
V
Gate Cut-off Voltage
Forward Transfer Admittance
VDS = −10 V, ID = −1.0 mA
−0.8
−1.3
| yfs |
VDS = −10 V, ID = −0.2 A
0.2
0.6
RDS(on)1
VGS = −4.5 V, ID = −0.2 A
1.17
1.45
Ω
RDS(on)2
VGS = −4.0 V, ID = −0.2 A
1.25
1.55
Ω
RDS(on)3
VGS = −2.5 V, ID = −0.15 A
2.25
2.98
Ω
VGS(off)
Note
Drain to Source On-state Resistance
Note
S
Input Capacitance
Ciss
VDS = –10 V
29
pF
Output Capacitance
Coss
VGS = 0 V
15
pF
Reverse Transfer Capacitance
Crss
f = 1 MHz
3.0
pF
Turn-on Delay Time
td(on)
VDD = −10 V, ID = −0.2 A
23
ns
VGS = −4.0 V
39
ns
RG = 10 Ω
50
ns
33
ns
0.93
V
Rise Time
tr
Turn-off Delay Time
td(off)
Fall Time
tf
Body Diode Forward Voltage
VF(S-D)
IF = 0.4 A, VGS = 0 V
Note Pulsed PW ≤ 350 µs, Duty Cycle ≤ 2%
TEST CIRCUIT SWITCHING TIME
VGS(−)
D.U.T.
VGS
RL
RG
PG.
Wave Form
0
VGS
10%
90%
VDS(−)
VDD
90%
90%
VDS
VDS
VGS (−)
0
Wave Form
10%
0
td(on)
τ
tr
ton
10%
td(off)
tf
toff
τ = 1 µs
Duty Cycle ≤ 1%
2
Data Sheet D16597EJ2V0DS
2SJ648
TYPICAL CHARACTERISTICS (TA = 25°C)
DRAIN CURRENT vs.
DRAIN TO SOURCE VOLTAGE
- 1.6
240
Pulsed
Mounted on ceramic substrate of
2
300 mm × 0.64 mm
200
ID - Drain Current - A
PT - Total Power Dissipation - mW
TOTAL POWER DISSIPATION vs.
AMBIENT TEMPERATURE
160
120
80
- 0.8
- 0.4
−2.5 V
40
0
0
25
50
75
100
125
150
0
175
0
-1
TA - Ambient Temperature - °C
-4
-5
- 1.6
VGS(off) - Gate Cut-off Voltage - V
V D S = −10 V
Pulsed
ID - Drain Current - A
-3
GATE CUT-OFF VOLTAGE vs.
CHANNEL TEMPERATURE
- 10
-1
- 0.1
T A = 125°C
75°C
25°C
−25°C
- 0.01
- 0.001
- 0.0001
0
-1
-2
-3
V DS = −10 V
ID = −1.0 mA
- 1.4
- 1.2
-1
- 0.8
- 0.6
- 50
-4
0
TA = −25°C
25°C
75°C
125°C
0.1
- 0.01
- 0.1
-1
- 10
RDS(on) - Drain to Source On-state Resistance - Ω
VDS = −10 V
Pulsed
0.01
- 0.001
100
150
DRAIN TO SOURCE ON-STATE RESISTANCE vs.
CHANNEL TEMPERATURE
FORWARD TRANSFER ADMITTANCE vs.
DRAIN CURRENT
1
50
Tch - Channel Temperature - °C
VGS - Gate to Source Voltage - V
10
-2
VDS - Drain to Source Voltage - V
FORWARD TRANSFER CHARACTERISTICS
| yfs | - Forward Transfer Admittance - S
−4.0 V
V GS = −4.5 V
- 1.2
4
Pulsed
3
VGS = −2.5 V, ID = −0.15 A
2
1
VGS = −4.0 V, ID = −0.20 A
VGS = −4.5 V, ID = −0.20 A
0
- 50
0
50
100
150
Tch - Channel Temperature - °C
ID - Drain Current - A
Data Sheet D16597EJ2V0DS
3
2SJ648
4
ID = −0.20 A
Pulsed
3
2
1
0
0
-2
-4
-6
-8
- 10
- 12
DRAIN TO SOURCE ON-STATE RESISTANCE vs.
DRAIN CURRENT
4
RDS(on) - Drain to Source On-state Resistance - Ω
RDS(on) - Drain to Source On-state Resistance - Ω
DRAIN TO SOURCE ON-STATE RESISTANCE vs.
GATE TO SOURCE VOLTAGE
VGS = −4.5 V
Pulsed
3
T A = 125°C
75°C
2
1
25°C
−25°C
0
- 0.01
- 0.1
VGS - Gate to Source Voltage - V
VGS = −4.0 V
Pulsed
3
TA = 125°C
75°C
2
1
25°C
−25°C
0
- 0.01
- 0.1
-1
- 10
4
VGS = −2.5 V
Pulsed
T A = 125°C
75°C
3
2
25°C
1
0
- 0.01
ID - Drain Current - A
−25°C
- 0.1
- 10
SWITCHING CHARACTERISTICS
100
1000
td(on), tr, td(off), tf - Switching Time - ns
V GS = 0 V
f = 1.0 MHz
Ciss, Coss, Crss - Capacitance - pF
-1
ID - Drain Current - A
CAPACITANCE vs.
DRAIN TO SOURCE VOLTAGE
C iss
C oss
10
C rss
1
- 0.1
-1
- 10
V DD = −10 V
V GS = −4.0 V
R G = 10 Ω
100
- 100
VDS - Drain to Source Voltage - V
4
- 10
DRAIN TO SOURCE ON-STATE RESISTANCE vs.
DRAIN CURRENT
RDS(on) - Drain to Source On-state Resistance - Ω
RDS(on) - Drain to Source On-state Resistance - Ω
DRAIN TO SOURCE ON-STATE RESISTANCE vs.
DRAIN CURRENT
4
-1
ID - Drain Current - A
tr
td(off)
tf
td(on)
10
- 0.01
- 0.1
-1
ID - Drain Current - A
Data Sheet D16597EJ2V0DS
- 10
2SJ648
SOURCE TO DRAIN DIODE FORWARD VOLTAGE
10
IF - Diode Forward Current - A
V GS = 0 V
Pulsed
1
0.1
0.01
0.001
0.4
0.6
0.8
1
1.2
1.4
VF(S-D) - Source to Drain Voltage - V
Data Sheet D16597EJ2V0DS
5
2SJ648
• The information in this document is current as of November, 2004. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC Electronics data
sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not
all products and/or types are available in every country. Please check with an NEC Electronics sales
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M8E 02. 11-1