PHILIPS TDA8578

INTEGRATED CIRCUITS
DATA SHEET
TDA8578
Dual common-mode rejection
differential line receiver
Product specification
Supersedes data of November 1993
File under Integrated Circuits, IC01
1995 Dec 15
Philips Semiconductors
Product specification
Dual common-mode rejection differential
line receiver
FEATURES
APPLICATIONS
• Excellent common-mode rejection up to high
frequencies
• Audio
TDA8578
• Car radio.
• Elimination of source resistance in the common-mode
rejection
GENERAL DESCRIPTION
• Few external components
The TDA8578 is a two-channel differential amplifier in a
16 pin DIL or SO package intended to receive line inputs
in audio applications requiring a high-level of
common-mode rejection. The amplifier has a gain of 0 dB
and a low distortion. The device is primarily developed for
those car radio applications where long connections
between signal sources and amplifiers (or boosters) are
necessary and ground noise has to be eliminated.
• High supply voltage ripple rejection
• Low noise
• Low distortion
• Protected against electrostatic discharge
• AC and DC short circuit safe to ground and VCC
• Fast DC settling.
QUICK REFERENCE DATA
SYMBOL
PARAMETER
VCC
supply voltage
ICC
supply current
Gv
voltage gain
CONDITIONS
VCC = 8.5 V
MIN.
TYP.
MAX.
UNIT
5
8.5
18
V
−
11
14
mA
−0.5
0
+0.5
dB
SVRR
supply voltage ripple rejection
−55
−60
−
dB
Vno
noise output voltage
−
3.7
5
µV
Zi
input impedance
100
240
−
kΩ
CMRR
common-mode rejection ratio
−
80
−
dB
Rs = 0 Ω
ORDERING INFORMATION
PACKAGE
TYPE
NUMBER
NAME
TDA8578
DIP16
plastic dual in-line package; 16 leads (300 mil); long body
SOT38-1
TDA8578T
SO16
plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
1995 Dec 15
DESCRIPTION
2
VERSION
Philips Semiconductors
Product specification
Dual common-mode rejection differential
line receiver
BLOCK DIAGRAM
FUNCTIONAL DESCRIPTION
The TDA8578 contains two identical differential amplifiers
with a voltage gain of 0 dB. The device is intended to
receive line input signals. The device has a very high-level
of common-mode rejection and it eliminates ground noise.
The common-mode rejection keeps constant up to high
frequencies. The gain of the amplifiers is fixed at 0 dB. The
inputs have a high-input impedance and the output stage
is a class AB stage with a low-output impedance. For a
large common-mode rejection also at low frequencies, an
electrolytic input capacitor at the negative input pin is
advised. The input impedance is relative high, this would
result in a large settling time of the DC input voltage.
Therefore a quick charge circuit is included that charges
the input capacitor within 0.2 s.
VCC
16
INL
INL
1
12
5
OUTL
VCC
8
TDA8578
INR
INR
TDA8578
6
11
SVRR
OUTR
7
9
All input and output pins are protected against high
electrostatic discharge conditions (4000 V, 150 pF, 150 Ω).
MBD209
GND
Fig.1 Block diagram.
PINNING
SYMBOL
PIN
DESCRIPTION
INL+
1
positive input left
n.c.
2
not connected
n.c.
3
not connected
n.c.
4
not connected
INL−
5
INR−
6
1
16 V CC
n.c.
2
15
n.c.
negative input left
n.c.
3
14
n.c.
negative input right
n.c.
4
13
n.c.
INR+
7
positive input right
SVRR
8
half supply voltage
GND
9
ground
n.c.
10
not connected
OUTR
11
output right
OUTL
12
output left
n.c.
13
not connected
n.c.
14
not connected
n.c.
15
not connected
VCC
16
supply voltage
1995 Dec 15
INL
TDA8578
INL
5
12 OUTL
INR
6
11 OUTR
INR
7
10
n.c.
SVRR
8
9
GND
MBD210
Fig.2 Pin configuration.
3
Philips Semiconductors
Product specification
Dual common-mode rejection differential
line receiver
TDA8578
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VCC
supply voltage
−
18
V
IORM
repetitive peak output current
−
40
mA
Vsc
AC and DC short-circuit safe voltage
−
18
V
Tstg
storage temperature
−55
+150
°C
Tamb
operating ambient temperature
−40
+85
°C
Tj
junction temperature
−
+150
°C
operating
HANDLING
Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling integrated circuits.
THERMAL CHARACTERISTICS
SYMBOL
Rth j-a
PARAMETER
VALUE
UNIT
TDA8578 (DIP16)
75
K/W
TDA8578T (SO16)
120
K/W
thermal resistance from junction to ambient in free air
DC CHARACTERISTICS
VCC = 8.5 V; Tamb = 25 °C; in accordance with test circuit (see Fig.3); unless otherwise specified.
SYMBOL
PARAMETER
VCC
supply voltage
ICC
supply current
VO
DC output voltage
tset
DC input voltage settling time
CONDITIONS
note 1
Note
1. The DC output voltage with respect to ground is approximately 0.5VCC.
1995 Dec 15
4
MIN.
TYP.
MAX.
18
UNIT
5
8.5
V
−
11
14
mA
−
4.3
−
V
−
0.2
−
s
Philips Semiconductors
Product specification
Dual common-mode rejection differential
line receiver
TDA8578
AC CHARACTERISTICS
VCC = 8.5 V; f = 1 kHz; Tamb = 25 °C; in accordance with test circuit (see Fig.3); unless otherwise specified.
SYMBOL
Gv
PARAMETER
CONDITIONS
−0.5
voltage gain
αcs
channel separation
∆Gv
channel unbalance
fL
low frequency roll-off
fH
high frequency roll-off
Zi
input impedance
Zo
output impedance
MIN.
TYP.
0
MAX.
+0.5
UNIT
dB
70
80
−
dB
−
−
0.5
dB
−1 dB; note 1
20
−
−
Hz
−1 dB
20
−
−
kHz
100
240
−
kΩ
−
−
10
Ω
Rs = 5 kΩ
Vi(max)
maximum input voltage
THD = 1%
−
2
−
V
Vno
noise output voltage
Rs = 0 Ω; note 2
−
3.7
5
µV
VCM(rms)
common-mode input voltage
(RMS value)
−
−
1
V
CMRR
common-mode rejection ratio
SVRR
supply voltage ripple rejection
THD
total harmonic distortion
THDmax
total harmonic distortion at
maximum output current
Rs = 5 kΩ
66
70
−
dB
Rs = 0 Ω; note 3
−
80
−
dB
note 4
55
65
−
dB
note 5
−
60
−
dB
Vi = 1 V
−
0.02
−
%
Vi = 1 V;
f = 20 Hz to 20 kHz
−
−
0.1
%
Vi = 1 V; RL = 150 Ω
−
−
1
%
Notes
1. Frequency response externally fixed by the input coupling capacitors.
2. Noise output voltage is measured in a bandwidth of 20 Hz to 20 kHz (unweighted).
3. The common-mode rejection ratio is measured at the output, with a voltage source of 1 V (RMS), in accordance with
test circuit (see Fig.3), while VINL and VINR are short-circuited. Frequencies between 100 Hz and 100 kHz.
4. Ripple rejection is measured at the output, with Rs = 2 kΩ; f = 1 kHz and a ripple amplitude of 2 V (p-p).
5. Ripple rejection is measured at the output, with Rs = 0 Ω up to 2 kΩ and f = 100 Hz to 20 kHz; maximum ripple
amplitude of 2 V (p-p).
1995 Dec 15
5
Philips Semiconductors
Product specification
Dual common-mode rejection differential
line receiver
TDA8578
8.5 V
Rs
V INL
100 nF
220 nF
16
2.2 µF
1
5 kΩ
12
22 µF
47 µF
TDA8578
8
SVRR
6
V CM
OUTL
VCC
5
2.2 µF
V INR
11
Rs
220 nF
7
9
5 kΩ
OUTR
RL
RL
10 k Ω
10 k Ω
MBD218
Fig.3 Test circuit.
MBD215
10 1
THD
(%)
10 2
10
3
10
10 2
10 3
10 4
f (Hz)
Fig.4 Total harmonic distortion as a function of frequency; Vi = 1.0 V (RMS).
1995 Dec 15
6
10 5
Philips Semiconductors
Product specification
Dual common-mode rejection differential
line receiver
TDA8578
MBD216
0
CMR
(dB)
20
40
(1)
60
(2)
80
(3)
100
10
10 2
10 3
10 4
f (Hz)
10 5
(1) Rs = 5 kΩ.
(2) Rs = 2 kΩ.
(3) Rs = 0 Ω.
Fig.5 Common-mode rejection as function of frequency; VCM = 1.0 V (RMS).
MBD213
1
THD
(%)
10
1
10 2
10 3
10
10 2
10 3
V i (rms) (mV)
Fig.6 Total harmonic distortion as a function of input voltage; f = 1 kHz.
1995 Dec 15
7
10 4
Philips Semiconductors
Product specification
Dual common-mode rejection differential
line receiver
TDA8578
MBD214
40
CMR
(dB)
50
60
70
80
90
100
300
500
700
900
1100
V CM (rms) (mV)
1300
Fig.7 Common-mode rejection as a function of common-mode input voltage; f = 1 kHz; Rs = 0 Ω.
MBD211
0
CMR
(dB)
20
40
(1)
(2)
(3)
60
80
100
10
10 2
10 3
10 4
(1) C2 = 22 µF.
(2) C2 = 47 µF.
(3) C2 = 100 µF.
Fig.8 Common-mode rejection as a function of frequency; VCM = 1.0 V.
1995 Dec 15
8
f (Hz)
10 5
Philips Semiconductors
Product specification
Dual common-mode rejection differential
line receiver
TDA8578
MBD212
30
SVR
(dB)
40
50
60
70
10 2
10
10 3
f (Hz)
Vripple = 2 V (p-p); Rs = 2 kΩ.
Fig.9 Supply voltage ripple rejection as a function of frequency.
APPLICATION INFORMATION
8.5 V
220 nF
Rs
V INL
100 nF
16
2.2 µF
1
5 kΩ
12
10 µF
OUTL
VCC
5
47 µF
TDA8578
SVRR
8
10 µF
6
2.2 µF
V INR
11
220 nF
Rs
5 kΩ
7
9
OUTR
RL
RL
10 k Ω
10 k Ω
MBD217
Fig.10 Application circuit balanced signal source.
1995 Dec 15
9
10 4
Philips Semiconductors
Product specification
Dual common-mode rejection differential
line receiver
TDA8578
PACKAGE OUTLINES
DIP16: plastic dual in-line package; 16 leads (300 mil); long body
SOT38-1
ME
seating plane
D
A2
A
A1
L
c
e
Z
b1
w M
(e 1)
b
MH
9
16
pin 1 index
E
1
8
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.7
0.51
3.7
1.40
1.14
0.53
0.38
0.32
0.23
21.8
21.4
6.48
6.20
2.54
7.62
3.9
3.4
8.25
7.80
9.5
8.3
0.254
2.2
inches
0.19
0.020
0.15
0.055
0.045
0.021
0.015
0.013
0.009
0.86
0.84
0.26
0.24
0.10
0.30
0.15
0.13
0.32
0.31
0.37
0.33
0.01
0.087
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT38-1
050G09
MO-001AE
1995 Dec 15
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
92-10-02
95-01-19
10
Philips Semiconductors
Product specification
Dual common-mode rejection differential
line receiver
TDA8578
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
D
E
A
X
c
y
HE
v M A
Z
16
9
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
8
e
0
detail X
w M
bp
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
10.0
9.8
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
0.069
0.010 0.057
0.004 0.049
0.01
0.019 0.0100 0.39
0.014 0.0075 0.38
0.16
0.15
0.050
0.039
0.016
0.028
0.020
0.01
0.01
0.004
0.028
0.012
inches
0.244
0.041
0.228
θ
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT109-1
076E07S
MS-012AC
1995 Dec 15
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
95-01-23
97-05-22
11
o
8
0o
Philips Semiconductors
Product specification
Dual common-mode rejection differential
line receiver
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
WAVE SOLDERING
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
DIP
SOLDERING BY DIPPING OR BY WAVE
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
REPAIRING SOLDERED JOINTS
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
REPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
SO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
1995 Dec 15
TDA8578
12
Philips Semiconductors
Product specification
Dual common-mode rejection differential
line receiver
TDA8578
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1995 Dec 15
13