Spec. No. : C332SN Issued Date : 2003.04.15 Revised Date : Page No. : 1/3 CYStech Electronics Corp. 100V/100mA SURFACE MOUNT SWITCHING DIODE CDSS355A Features: ● Designed for mounting on small surface ● High speed switching ● High mounting capability, strong surge withstand, high reliability Mechanical data: ● Case: 0805(2012) Standard package, molded plastic ● Terminals : Solder plated, solderable per MIL-STD-750, method 2026. ● Polarity: Indicated by cathode band ● Mounting position: Any ● Weight: 4.8mg (approximately) Absolute Maximum Ratings(Ta=25℃) Characteristics Repetitive Peak Reverse Voltage Reverse Voltage Average Forward Current @ 8.3ms single half sinewave superimposed on rated load(JEDEC method) Peak Forward Surge Current @ single sinewave, 60Hz Power Dissipation Junction Temperature Storage Temperature Range Symbol VRRM VR Value 110 100 Unit V V IO 100 mA IFSM PD Tj Tstg 1.0 300 -55 to +125 -55 to +125 A mW °C °C Electrical Characteristics ( Tj=25°C) Characteristics Forward Voltage at IF=100mA Reverse Leakage Current at VR=100V Diode Capacitance at VR = 1V Reverse Recovery Time From IF=-IR=10mA to IRR=-1mA, VR=6V, RL=50Ω CDSS355ASN Symbol VF IR CD Min - Typ - Max 1 100 3 Unit V nA pF trr - - 4 ns CYStek Product Specification Spec. No. : C332SN Issued Date : 2003.04.15 Revised Date : Page No. : 2/3 CYStech Electronics Corp. Characteristic Curves Reverse Leakage Current vs Temperature Forward Current vs Forward Voltage 10000 Reverse Leakage Current---IR(nA) Forward Current---IF(mA) 1000 125℃ 100 75℃ 25℃ -25℃ 10 125℃ 1000 75℃ 100 25℃ 10 1 1 0 0.2 0.4 0.6 0.8 1 0 1.2 10 30 40 50 60 70 80 Ambient Temperature---TA(℃) Forward Voltage---VF(V) Diode Capacitance vs Reverse Voltage Forward Current vs Ambient Temperature 125 Percentage of Peak Average Forward Current(%) 5 Diode Capacitance---CD(pF) 20 f=1MHz Ta=25℃ 4 3 2 1 0 Mounting on glass epoxy PCBs 100 75 50 25 0 0 2 4 6 8 10 Reverse Voltage---VR(V) CDSS355ASN 12 14 0 25 50 75 100 125 150 Ambient Temperature---Ta(℃) CYStek Product Specification CYStech Electronics Corp. Spec. No. : C332SN Issued Date : 2003.04.15 Revised Date : Page No. : 3/3 0805(2012) Dimension A B R C D 0805 surface mount package CYStek package code:SN *:Typical Inches Min. Max. 0.079 0.087 0.016(typ.) 0.008(tup.) DIM A B R Millimeters Min. Max. 2.00 2.20 0.40(typ.) 0.20(typ.) DIM C D Inches Min. Max. 0.047 0.055 0.035 0.043 Millimeters Min. Max. 1.20 1.40 0.90 1.10 Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. CDSS355ASN CYStek Product Specification