CYStech Electronics Corp. Spec. No. : C303C2 Issued Date : 2004.02.11 Revised Date : Page No. : 1/3 High Speed Switching diode 1SS400C2 Features •Extremely small surface mounting type.(SC-79/SOD523) •High speed switching applications •Low reverse current Symbol Outline Absolute Maximum Ratings • Maximum Temperatures Storage Temperature Tstg .................................................................................................... -55~+150°C Junction Temperature Tj .............................................................................................................. +150°C • Maximum Voltages and Currents (Ta=25°C) DC Reverse Voltage VR .................................................................................................................... 100 V Mean Rectifying Current IF ........................................................................................……….. 200mA Peak Forward Surge Current IFSM………………………………….. ………………………………………. 500mA • Thermal Characteristics Total Device Dissipation @ TA=25°C (Note) Thermal Resistance, Junction to Ambient PD……………………………………………….200mW RθJA……………………………………………625°C/W Note: FR-5 board minimum pad. 1SS400C2 CYStek Product Specification Spec. No. : C303C2 Issued Date : 2004.02.11 Revised Date : Page No. : 2/3 CYStech Electronics Corp. Characteristics (Ta=25°C) Characteristic Symbol Condition Min. Max. Unit Forward Voltage VF IF=100mA - 1.2 V Reverse Leakage Current IR VR=80V - 0.1 µA Diode Capacitance CD VR=0.5V, f=1MHz - 3 pF Reverse Recovery Time trr IF=IR=10mA - 4 ns Characteristic Curves Forward Current vs Forward Voltage Forward Current Derating Curve 100 M ounting on glass epoxy PCBs 100 Forward Current---I F(mA) Percentage of Rated Forward Current---(%) 120 80 60 40 10 8 5℃ 25℃ 1 20 - 40℃ 0 0.1 0 25 50 75 100 125 150 175 200 0.2 0.6 0.8 1 1.2 Forward Voltage---VF(V) Ambient Temperature---TA(℃) Reverse Leakage Current vs Reverse Voltage Capacitance vs Reverse Voltage 0.68 Capacitance between terminals---C T(pF) 10 Reverse Leakage Current---IR(μA) 0.4 T a= 125℃ 1 0.1 T a= 8 5℃ 0.01 T a= 25℃ f=1MHz Ta=25℃ 0.64 0.6 0.56 0.52 0.001 0 10 20 30 Reverse Voltage---VR(V) 1SS400C2 40 50 0 2 4 6 8 Reverse Voltage---VR (V) CYStek Product Specification Spec. No. : C303C2 Issued Date : 2004.02.11 Revised Date : Page No. : 3/3 CYStech Electronics Corp. SOD-523 Dimension Marking Code : 1 1 2 A Style : Pin 1. Cathode 2. Anode 2 2-lead SOD-523 Plastic Package CYStek Package Code : C2 *: Typical Millimeters DIM Min 0.5 0.25 0.1 1.1 A bp c D .Max. 0.7 0.35 0.2 1.3 DIM E HE V Millimeters Min. 0.7 1.5 Max. 0.9 1.7 0.15(typ) Notes: 1.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 2.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: 42 Alloy; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. 1SS400C2 CYStek Product Specification