ANPEC APW7066RC-TRG

APW7066
Dual Synchronous Buck PWM Controllers and One Linear Controller
Features
•
General Description
The APW7066 has two synchronous buck PWM controllers and one linear controller with high precision internal
Two Synchronous Buck Converters and A
Linear Regulator
•
•
references voltage to offer accurate outputs. The PWM
controllers are designed to drive two N-channel MOSFETs
VIN Range up to 12V
Input Power Supplies Require 12V and 5V or
in synchronous buck topology, and the linear controller
drives an external N-channel MOSFET. The device re-
Use 12V to Generate a Shunt Regulator 5.8V
•
0.6V Reference for VOUT1 and VOUT3
quires 12V and 5V power supplies, if the 5V supply is not
available, VCC12 can offer an optional shunt regulator
with 0.8% Accurate
•
•
•
3.3V Reference for VOUT2 with 0.8% Accurate
5.8V for 5V supply.
All outputs have independent soft-start and enable func-
Buffered VTT Reference Output
tions by SS/EN pins to control. Connect a capacitor from
each SS/EN pin to the ground for setting the soft-start
Three Outputs have Independent Soft-Start
and Enable
•
time, and pulling the SS/EN pin below 1V to disable
regulator. Pull the SS2/EN2 to VCC, enter the DDR mode,
Internal 300kHz Oscillator and Programmable
Frequency Range from 70 kHz to 800kHz
•
•
•
•
•
•
the SS1/EN1 controls both VOUT1 and VOUT2, and allows VOUT2 to track VOUT1. It also offers the phase shift
Synchronous Switching Frequency
DDR Mode or Independent Mode Selection
function by REFOUT pin to select the phase shift between
VOUT1 and VOUT2 in DDR mode or Independent mode.
Phase Shift Selection
Power Good Function
When all SS/EN pins exceed 3.3V and no faults are
detected, the PGOOD pin goes high to indicate the regu-
Short-Circuit Protection for VOUT1 and VOUT2
lators are ready. If any of the SS/EN pins goes below 3.2V
or any of the outputs has a fault condition, the PGOOD pin
Thermally Enhanced TSSOP-24P and
QFN5x5-32 Packages
•
will be pulled low.
The internal oscillator is nominally 300kHz (keep the FS/
Lead Free and Green Devices Available
(RoHS Compliant)
SYNC pin open or short to GND), and it offers the programmable frequency function from 70kHz to 800kHz; con-
Applications
necting a resistor from FS/SYNC to VCC12 to decrease
the frequency, conversely, connect a resistor from FS/
•
•
•
SYNC to GND to increase the frequency.The IC also provides the synchronous frequency function. Connect the
Graphic Cards
DDR memory Power Supplies
LGATE signal of another converter to FS/SYNC pin; forcing the switching frequency to follow the external clock.
Low-Voltage Distributed Power Supplies
The possible synchronous frequency is from 150kHz to
800kHz. There is no Rds(on) sensing or under-voltage sensing on APW7066. However, it provides a simple shortcircuit protection by monitoring the COMP1 and COMP2
for over-voltage. When any of two pins exceeds their trip
point and the condition persists for 1-2 internal clock cycle
(3-6µs at 300kHz), then it will shut down all regulators.
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise
customers to obtain the latest version of relevant information to verify before placing orders.
Copyright  ANPEC Electronics Corp.
Rev. A.8 - Aug., 2009
1
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APW7066
BOOT1
NC
NC
VCC
FB1
COMP1
25
1
REFIN
24
UGATE1
NC
PGND_1
VCC12_1
REFOUT
GND
BOTTOM
SIDE PAD
SS1/EN1
SS2/EN2
LGATE1
LGATE2
SS3/EN3
VCC12_2
VREF
PGND_2
DRIVE3
8
BOOT2
NC
UGATE2
GND
9
TSSOP-24P
(TOP VIEW)
PGOOD
NC
17
FS/SYNC
GND
BOTTOM
SIDE PAD
VCC
BOOT1
UGATE1
VCC12
LGATE1
LGATE2
PGND
UGATE2
BOOT2
GND
PGOOD
FS/SYNC
NC
24
23
22
21
20
19
18
17
16
15
14
13
FB3
FB1 1
COMP1 2
COMP2 3
FB2 4
REFIN 5
REFOUT 6
SS1/EN1 7
SS2/EN2 8
SS3/EN3 9
VREF 10
DRIVE3 11
FB3 12
FB2
32
COMP2
Pin Configuration
16
QFN5x5-32
(Top View)
Ordering and Marking Information
Package Code
R : TSSOP-24P QA : QFN5x5-32
Operating Ambient Temperature Range
C : 0 to 70 oC
Handling Code
TR : Tape & Reel
Assembly Material
G : Halogen and Lead Free Device
APW7066
Assembly Material
Handling Code
Temperature Range
Package Code
APW7066 R :
APW7066 QA :
APW7066
XXXXX
XXXXX - Date Code
XXXXX - Date Code
APW7066
XXXXX
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
Copyright  ANPEC Electronics Corp.
Rev. A.8 - Aug., 2009
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APW7066
Absolute Maximum Ratings
Symbol
VCC12
VCC
VUGATE1, VUGATE2
VBOOT1, VBOOT2
Rating
Unit
VCC12 to GND
Parameter
-0.3 to 15
V
Separate Supply
-0.3 to 5.5
V
-0.3 to 6
V
-0.3 to 30
V
-0.3 to 15
V
-0.3 to 15
V
-0.3 to VCC
V
-0.3 to VCC
V
-0.3 to VCC
V
-0.3 to +0.3
V
0 to +70
°C
Shunt Regulator to GND
UGATE1, UGATE2 to GND
BOOT1, BOOT2 to GND
LGATE1, LGATE2 LGATE1, LGATE2 to GND
DRIVE3
FS/SYNC
DRIVE3 to GND
FS/SYNC to GND
REFIN, REFOUT,
REFIN, REFOUT, PGOOD, VREF to GND
PGOOD, VREF
FB1, COMP1, FB2,
FB1, COMP1, FB2, COMP2, FB3 to GND
COMP2, FB3
SS1/EN1,
SS1/EN, SS2/EN2, SS3/EN3 to GND
SS2/EN2,
SS3/EN3
PGND
PGND to GND
TA
Operating Temperature Range
TJ
Maximum Junction Temperature
TSTG
Storage Temperature Range
TSDR
Maximum Lead Temperature Soldering, 10 Seconds
+150
°C
-65 to +150
°C
260
°C
Typical Value
Unit
TSSOP-24P
QFN5x5-32
39
30
°C/W
TSSOP-24P
QFN5x5-32
5
°C/W
Thermal Characteristics
Symbol
Parameter
Thermal Resistance − Junction to Ambient
R θJA
Thermal Resistance − Junction to Case
R θJC
Electrical Characteristics
Operating Conditions: VCC = 5V, VCC12 = 12V, TA = 0 to 70°C, Unless Otherwise Specified.
Symbol
Parameter
Test Conditions
APW7066
Unit
Min.
Typ.
Max.
-
4
-
mA
-
6
-
mA
-
50
-
mA
-
7
-
mA
5.6
5.8
6.0
V
-
20
60
mA
INPUT SUPPLY POWER
VCC
VCC12
VCC12
VCC
Input Supply Current (Quiescent)
outputs disabled
Input Supply Current (Dynamic)
UGATEs, LGATEs CL = 1nF, 300kHz
Shunt Regulator Output Voltage
20mA current; ~Equivalent to 300Ω
resistor VCC to 12V
Shunt Regulator Current
300Ω resistor VCC to 12V
Copyright  ANPEC Electronics Corp.
Rev. A.8 - Aug., 2009
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APW7066
Electrical Characteristics (Cont.)
Operating Conditions: VCC = 5V, VCC12 = 12V, TA = 0 to 70°C, unless Otherwise Specified.
Symbol
Parameter
Test Conditions
APW7066
Unit
Min.
Typ.
VCC Rising
4.15
4.23
4.4
V
VCC Falling
3.9
4.0
4.15
V
VCC12 Rising
7.55
7.8
8
V
VCC12 Falling
7.1
7.3
7.55
V
-
0.6
-
V
Max.
INPUT SUPPLY POWER (CONT.)
Power-On Reset Threshold
SYSTEM ACCURACY
Outputs 1 and 3 Reference Voltage
Output 2 Reference Voltage
-
3.3V
-
Outputs 1 and 2 System Accuracy
-0.8
-
0.8
%
Output 3 System Accuracy
-0.8
-
0.8
%
-20
-
20
%
OSCILLATOR
Accuracy
Frequency
FS/SYNC pin open
240
300
360
kHz
Adjustment Range
FS/SYNC pin: resistor to GND; resistor
to VCC12
70
-
800
kHz
Sawtooth Amplitude
-
2.1
-
V
Duty-Cycle Range
0
-
85
%
ERROR AMPLIFIER (OUT1 AND OUT2)
Open-Loop Gain
RL = 10kΩ to ground
-
85
-
dB
Open-Loop Bandwidth
CL = 100pF, RL = 10kΩ to ground
-
15
-
MHz
Slew Rate
CL = 100pF, RL = 10kΩ to ground
-
4
-
V/µs
EA Offset
COMP1/2 to FB1/2; compare to internal
VREF/REFIN
-
2
-
mV
Maximum Output Voltage
RL = 10kΩ to ground; (may trip
short-circuit)
-
VCC
-
V
Output High Source Current
COMP1/2, VCOMP=2V
-
-50
-
mA
Output Low Sink Current
COMP1/2, VCOMP=2V
-
45
-
mA
-
3.3
-
V
PROTECTION AND MONITOR
Causes PGOOD to go low; if there for a
Under-Voltage Threshold (COMP1 and
filter time, implies the COMP pin(s) is
COMP2)
out-of-range, and shuts down IC
UV Filter Time
Based on internal oscillator clock
frequency (nominal 300kHz = 3.3µs
clock period)
1
-
2
Clock
pulses
PGOOD Low Voltage
IPGOOD = 2mA
-
0.1
0.3
V
DRIVE3 to FB3; compare to internal
VREF
-
2
-
mV
DRIVE3 High Output Voltage
-
VCC12
-
DRIVE3 High Output Source Current
-
1.5
-
mA
DRIVE3 Low Output Sink Current
-
2.5
-
mA
LINEAR REGULATOR (OUT3)
EA Offset
Copyright  ANPEC Electronics Corp.
Rev. A.8 - Aug., 2009
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APW7066
Electrical Characteristics (Cont.)
Operating Conditions: VCC = 5V, VCC12 = 12V, TA = 0 to 70°C, unless Otherwise Specified.
Symbol
Parameter
Test Conditions
APW7066
Min.
Typ.
Max.
Unit
VREF
Output Voltage
1.1µF max capacitance
Output Accuracy
Source Current
-
3.3
-
V
-0.8
-
+0.8
%
-
-
2.0
mA
REFOUT (VTTREF)
Output Voltage
0.6
-
3.3
V
Offset Voltage
Determined by REFIN voltage
-10
-
+10
mV
Source Current
0.2
-
20
mA
Sink Current
-
-
0.48
mA
Output Capacitance
-
0.1
-
µF
-
3.8
VCC
V
V
Output High Voltage Minimum
To select 0 degree phase; see Table 1
ENABLE/SOFTSTART (SS/EN 1,2,3)
Enable Threshold
EN Rising
-
1.05
-
EN falling
-
0.95
-
-
-30
-
µA
Soft-Start High Voltage
End of ramp
-
3.5
-
V
Output High Voltage
To select DDR mod; see Table 1
-
3.8
VCC
V
150
-
800
kHz
-
-
12
V
Soft-Start Current
FS/SYNC PLL
Frequency range of Lock-in
High Voltage
From LG pin of another IC, for example
GATE DRIVERS
Output1 GATE Driver Source
UGATE1, LGATE1=3V, BOOT=12V
-
1.8
-
A
Output2 GATE Driver Source
UGATE2, LGATE2=3V, BOOT=12V
-
1
-
A
Output1 GATE Driver Sink
UGATE1, LGATE1=3V, BOOT=12V
-
2.5
-
Ω
Output2 GATE Driver Sink
UGATE2, UGATE2=3V, BOOT=12V
-
4
-
Ω
Output Voltage
UGATE1, UGATE2
-
-
30
V
Output Voltage
LGATE1, LGATE2
-
12
-
V
Copyright  ANPEC Electronics Corp.
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APW7066
Typical Operating Characteristics
VOUT2 Power Up
VOUT1 Power Up
VCC12(5V/div)
VCC12(5V/div)
VCC(2V/div)
VCC(2V/div)
VOUT2(2V/div)
VOUT1(1V/div)
SS2(2V/div)
SS1(2V/div)
Time(5ms/div)
Time(5ms/div)
VOUT3 Power Up
VREF Power Up
VCC12(5V/div)
VCC12(5V/div)
VCC(2V/div)
VCC(2V/div)
VOUT3(1V/div)
VREF(2V/div)
SS3(2V/div)
SS2(2V/div)
Time(5ms/div)
Time(5ms/div)
Copyright  ANPEC Electronics Corp.
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APW7066
Typical Operating Characteristics (Cont.)
VOUT2 Power Up
VOUT1 Power Up
UGATE1(20V/div)
UGATE2(20V/div)
LGATE2(10V/div)
LGATE1(10V/div)
VOUT1(1V/div)
VOUT2(5V/div)
SS1(2V/div)
SS2(2V/div)
Time(2ms/div)
Time(2ms/div)
DDR Mode Power Up
Phase Shift 0 Degrees
SS2=VCC
VOUT1=REFIN
VREF(2V/div)
LG1(10V/div)
VOUT2(2V/div)
LG2(10V/div)
VOUT1(1V/div)
SS1(2V/div)
Time(1µs/div)
Time(2ms/div)
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APW7066
Typical Operating Characteristics (Cont.)
Phase Shift 180 Degrees
Phase Shift 90 Degrees
LG1(10V/div)
LG1(10V/div)
LG2(10V/div)
LG2(10V/div)
Time(1µs/div)
Time(1µs/div)
PGOOD High
PGOOD Low
SS1(2V/div)
SS1(2V/div)
SS2(2V/div)
SS2(2V/div)
SS3(2V/div)
SS3(2V/div)
PGOOD(5V/div)
PGOOD(5V/div)
Time(5ms/div)
Time(5ms/div)
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APW7066
Typical Operating Characteristics (Cont.)
VOUT1 Short Circuit Protection
VOUT2 Short Circuit Protection
Comp1 (2V/div)
Comp2 (2V/div)
SS1 (2V/div)
SS2 (2V/div)
UG1 (20V/div)
UG2 (20V/div)
PGOOD (5V/div)
PGOOD (5V/div)
Time(5µs/div)
Time(5µs/div)
VOUT1 Load Transient
VOUT2 Load Transient
VOUT1=VIN3
VOUT1 (0.1V/div)
VOUT1=VIN3
VOUT1 (0.2V/div)
VOUT2 (0.1V/div)
VOUT2 (0.1V/div)
VOUT3 (0.1V/div)
VOUT3 (0.05V/div)
IOUT2 (5A/div)
IOUT1 (10A/div)
Time(20µs/div)
Time(20µs/div)
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APW7066
Typical Operating Characteristics (Cont.)
VOUT3 Load Transient
UG1 Rising
VOUT1=VIN3
VOUT1 (0.1V/div)
UG1 (10V/div)
VOUT2 (0.1V/div)
Phase1 (10V/div)
VOUT3 (0.1V/div)
LG1 (10V/div)
IOUT3 (2A/div)
Time(20µs/div)
Time(50ns/div)
UG1 Falling
UG2 Rising
UG1 (10V/div)
UG2 (10V/div)
Phase1 (10V/div)
Phase2 (10V/
LG1 (10V/div)
LG2 (10V/div)
Time(50ns/div)
Copyright  ANPEC Electronics Corp.
Rev. A.8 - Aug., 2009
Time(50ns/div)
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APW7066
Typical Operating Characteristics (Cont.)
UG2 Falling
PGOOD Sink Current vs. PGOOD Voltage
3
2.5
Sink Current (mA)
UG2 (10V/div)
Phase2 (10V/div)
2
1.5
1
0.5
LG2 (10V/div)
0
0
10
Time(50ns/div)
20
30
40
PGOOD Voltage (mV)
REFOUT Voltage vs. Source Current
VREF Voltage vs. Source Current
3.32
3.35
3.34
3.31
3.32
VREF Voltage (V)
REFOUT Voltage (V)
3.33
3.31
3.3
3.29
3.28
3.27
3.3
3.29
3.26
3.28
3.25
0
5
10
15
0
20
Source Current (mA)
Copyright  ANPEC Electronics Corp.
Rev. A.8 - Aug., 2009
0.5
1
1.5
2
Source Current (mA)
11
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APW7066
Typical Operating Characteristics (Cont.)
UG1 Source Current vs. Voltage
2.4
2.2
2.4
2.2
2
1.8
2
1.8
Source Current (A)
Sink Current (A)
UG1 Sink Current vs. Voltage
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
0
0
0
2
4
6
8
10
12
0
2
UG1 Voltage (V)
6
8
10
12
UG1 Voltage (V)
LG1 Sink Current vs. Voltage
LG1 Source Current vs. Voltage
2.4
2.4
2.2
2.2
2
2
1.8
1.8
1.6
1.4
Source Current (A)
Sink Current (A)
4
1.2
1
0.8
0.6
0.4
0.2
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
0
0
0
2
4
6
8
10
12
0
LG1 Voltage (V)
Copyright  ANPEC Electronics Corp.
Rev. A.8 - Aug., 2009
2
4
6
8
10
12
LG1 Voltage (V)
12
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APW7066
Typical Operating Characteristics (Cont.)
UG2 Sink Current vs. Voltage
UG2 Source Current vs. Voltage
1.4
1.6
BOOT=12V
BOOT=12V
1.4
1.2
Source Current (A)
Sink Current (A)
1.2
1
0.8
0.6
0.4
1
0.8
0.6
0.4
0.2
0.2
0
0
0
2
4
6
8
10
0
12
2
4
8
10
12
UG2 Voltage
UG2 Voltage (V)
LG2 Source Current vs. Voltage
LG2 Sink Current vs. Voltage
1.6
1.4
1.4
1.2
1.2
1
1
Source Current (A)
Sink Current (A)
6
0.8
0.6
0.4
0.8
0.6
0.4
0.2
0.2
0
0
0
2
4
6
8
10
0
12
LG2 Voltage (V)
Copyright  ANPEC Electronics Corp.
Rev. A.8 - Aug., 2009
2
4
6
8
10
12
LG2 Voltage (V)
13
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APW7066
Typical Operating Characteristics (Cont.)
DRIVE3 Sink Current vs. Voltage
DRIVE3 Source Current vs. Voltage
3.5
2
3
1.5
Source Current (mA)
Sink Current (mA)
2.5
2
1.5
1
1
0.5
0.5
0
0
0
2
4
6
8
10
0
12
2
4
DRIVE3 Voltage (V)
8
10
12
DRIVE3 Voltage (V)
FS Resistance vs. Switching Frequency
Shunt Regulator Sink Current vs. Voltage
60
1000
FS to VCC12
900
50
800
Sink Current (mA)
700
FS Resistance (kΩ)
6
600
500
400
300
200
40
30
20
10
FS to GND
100
0
0
0
3
100 200 300 400 500 600 700 800
Switching Frequency (kHz)
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Rev. A.8 - Aug., 2009
3.5
4
4.5
5
5.5
6
6.5
7
Shunt Regulator Voltage (V)
14
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APW7066
Typical Operating Characteristics (Cont.)
Comp Source Current vs. Voltage
70
50
60
50
40
Source Current (mA)
Sink Current (mA)
Comp Sink Current vs. Voltage
60
30
20
10
40
30
20
10
0
0
0
0.5
1
1.5
2
2.5
3
0
1
3
4
VREF Voltage vs. Temperature
FB Voltage vs. Temperature
610
3.35
608
3.34
606
3.33
604
3.32
VREF Voltage (V)
FB Voltage (mV)
2
Comp Voltage (V)
Comp Voltage (V)
602
600
598
596
3.31
3.3
3.29
3.28
594
3.27
592
3.26
3.25
590
0
25
50
75
100
125
0
150
50
75
100
125
150
Temperature (°C)
Temperature (°C)
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APW7066
Pin Description
PIN
FUNCTION
NO.
NAME
TSSOP-24P
DFN5x5-32
1
29
2
30
3
31
4
32
FB2
These pins are the inverting inputs of the error amplifiers of their respective
regulators. They are used to set the output voltage and the compensation
components.
5
1
REFIN
This pin is the reference input voltage of error amplifier of the VOUT2. It also provides
the voltage into a buffer, which is out on the REFOUT pin.
FB1
These pins are the inverting inputs of the error amplifiers of their respective
regulators. They are used to set the output voltage and the compensation
components.
COMP1 These pins are the outputs of error amplifiers of their respective regulators. They are
COMP2 used to set the compensation components.
6
3
This pin provides a buffed voltage, which is from REFIN pin. In Independent mode, it
can be used by other ICs. In DDR mode, it is from the VOUT1, and can be used as
REFOUT the VTT buffer. This pin also uses to select the phase shift (see table1). When this pin
pulls to VCC, the buffer is disabled and the REFOUT is not available for use. It is
recommended that a 0.1µF capacitor is connected to the ground for stability.
7
4
SS1/EN1
8
5
9
6
10
7
11
8
12
10
These pins provide two functions. Connect a capacitor to the GND for setting the
SS2/EN2 soft-start time. Use an open drain logic signal to pull the SS/EN pin low to disable the
respective output, leave open to enable the respective output.
SS3/EN3
VREF
This pin provides a 3.3V reference voltage, which can be used by the REFIN pin or
other ICs as a voltage reference. It is recommended that a 1µF capacitor is
connected to ground for stability.
DRIVE3 This pin drives the gate of an external N-channel MOSFET for linear regulator.
FB3
These pins are the inverting inputs of the error amplifiers of their respective
regulators. They are used to set the output voltage and the compensation
components.
This pin is used to adjust the switching frequency. Connecting a resistor from
FS/SYNC pin to the ground increases the switching frequency. Conversely,
FS/SYNC connecting a resistor from this pin to the VCC12 reduces the switching frequency. In
addition, this pin also provides synchronous frequency function. An external clock can
be fed into this pin, and force the switching frequency to follow the external clock.
13
11
14
12
PGOOD
This pin is an open drain device; connect a pull up resistor to the VCC for PGOOD
function.
15
13
GND
This pin is the signal ground pin. The metal thermal pad under the package is the IC
substrate; connects the GND pin and metal thermal pad together on the board, and
ties to the good GND plane for electrical and thermal conduction.
16
16
BOOT2
These pins provide the bootstrap voltage to the gate driver for driving the upper
MOSFETs. It can be connected to a power voltage directly, but the difference voltage
between the BOOT and VIN must be high enough to drive the upper MOSFETs.
17
14
UGATE2 These pins provide the gate driver for the upper MOSFETs of VOUT1 and VOUT2.
18
18,23
19
20
LGATE2 These pins provide the gate driver for the lower MOSFETs of VOUT1 and VOUT2.
20
21
LGATE1 These pins provide the gate driver for the lower MOSFETs of VOUT1 and VOUT2.
21
19, 22
PGND
VCC12
Copyright  ANPEC Electronics Corp.
Rev. A.8 - Aug., 2009
This pin is the power ground pin for the gate driver and linear driver circuit. It should
be tied to the GND.
Power supply input pin. Connect a nominal 12V power supply to this pin for the gate
driver. It is recommended that a decoupling capacitor (1 to 10µF) is connected to the
GND for noise decoupling.
16
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APW7066
Pin Description (Cont.)
PIN
FUNCTION
NO.
NAME
TSSOP-24P
DFN5x5-32
22
24
UGATE1 These pins provide the gate driver for the upper MOSFETs of VOUT1 and VOUT2.
23
25
BOOT1
These pins provide the bootstrap voltage to the gate driver for driving the upper
MOSFETs. It can be connected to a power voltage directly, but the difference voltage
between the BOOT and VIN must be high enough to drive the upper MOSFETs.
Power supply input pin. Connect a nominal 5V power supply to this pin for the control
circuit, or connect a resistor (nominally 300Ω) to VCC12 for a shunt regulator function
(typical 5.8V). It is recommended that a decoupling capacitor (1 to 10µF) is
connected to the GND for noise decoupling.
24
28
VCC
-
2,9,15,17,26,27
NC
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APW7066
Block Diagram
VCC
VREF
VCC12
5.8V
30µA
Power On Reset
and Control
SS1/EN1
BOOT1
30µA
3.3V
Bias
Current
SS2/
EN2
0.6V
3.3V
Gate
Control
Logic 1
UGATE1
30µA
LGATE1
SS3/EN3
3.3V
BOOT2
Oscillator
Gate
Control
Logic 2
UGATE2
LGATE2
PGOOD
Monitor COMP Pins for
Short Protection
FS/SYNC
COMP1
0.6V
3.3V
1-2 Clock
Cycle Filter
FB1
REFOUT
If short, Filter shut
down all outputs
REFIN
VCC12
FB3
FB2
0.6V
COMP2
DRIVE3
GND
Copyright  ANPEC Electronics Corp.
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PGND
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APW7066
Typical Application Circuit
APW7066
DDR MODE
VCC
VCC12
Optional for
Shunt Regulator
COMP1
VOUT1
VIN1
BOOT1
FB1
UGATE1
COMP2
VOUT2
VOUT1
LGATE1
VCC12
FB2
BOOT2
VOUT1(DDR)
VIN2=VOUT1(DDR)
REFIN
PHASE
SHIFT 0o
APW7066
VCC12
PHASE
SHIFT 90o
VTTREF
VCC
UGATE2
VOUT2
LGATE2
REFOUT
VREF
PGOOD
VIN3
FS/SYNC
SYNCHRONOUS
FREQUENCY
SS1/EN1
DRIVE3
SS2/EN2
VOUT3
FB3
SS3/EN3
GND
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APW7066
Typical Application Circuit (Cont.)
APW7066
INDEPENDENTMODE
VCC
Optional for shunt VCC12
regulator
COMP1
VOUT1
VIN1
BOOT1
FB1
UGATE1
COMP2
VOUT2
PHASE
SHIFT 0o
LGATE1
VCC12
FB2
BOOT2
VREF
VOUT1
VIN2
REFIN
APW7066
VCC12
VCC
UGATE2
PHASE
SHIFT 180o
VTTREF
VOUT2
LGATE2
REFOUT
VREF
PGOOD
VIN3
FS/SYNC
SYNCHRONOUS
FREQUENCY
SS1/EN1
DRIVE3
SS2/EN2
VOUT3
FB3
SS3/EN3
GND
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APW7066
Function Description
Operational Modes
Phase Shift
The APW7066 has two independent synchronous buck
converters, and it also has DDR mode operation to allow
The APW7066 has phase shift function, use the REFOUT
pin to select the phase shift between Independent mode
VOUT2 to track VOUT1.
In independent mode operation, connect a capacitor from
and DDR mode. Connect the REFOUT to VCC to get the 0
degre in either mode. In this case, the buffer of the
each SS/EN pin to the ground to set each regulator’s softstart time. The 3.3V reference VREF can be used directly,
REFOUT is disabled. Leave the REFOUT open shifts the
phase 90 degrees in DDR mode, or 180 degrees in Inde-
or divided by two resistors for REFIN, since the VREF is
controlled by the SS2/EN2.
pendent mode, REFOUT can be used in this case (see
Table 1.).
DDR mode is chosen by connecting the SS2/EN2 pin to
VCC(5V). In this mode, SS2/EN2 function will be disabled,
Table1. Mode and Phase Selection
MODE
SS1/EN1 is used to control soft start and enable both
VOUT1 and VOUT2. The VOUT1 is used as the REFIN for
the VOUT2, that makes VOUT2 to track VOUT1.
VREF
SS2/EN2 REFOUT REFIN
PHASE
SHIFT
DDR
VCC
VCC
VOUT1
0 deg
DDR
VCC
Open
VOUT1 90 deg
Independent SS2 cap
VCC
VREF
0 deg
Independent SS2 cap
Open
VREF 180 deg
CH1/CH2
SS1/EN1
for CH1
and CH2
SS1/EN1
for CH1
SS2/EN2
for CH2
REFIN
The advantage of Phase shift is to avoid overlapping the
switching current spikes of the two channels, or interaction between the channels; it also reduces the RMS current of the input capacitors, allowing fewer caps to be
SS1/EN1
employed. However, the phase shift between the rising
edge of LGATE1 and LGATE2 (See figure 3.), depending
SS2/EN2
SS3/EN3
on the duty cycles, the falling edges of the two channels
might overlap; so the user should check it.
GND
Figure 1. Independent Mode Circuit
LG1
LG2
(0deg)
VOUT1
REFIN
LG2
(90deg)
VCC
LG2
(180deg)
SS1/EN1
SS2/EN2
SS3/EN3
0
GND
90
180
0
Figure 3. Phase of LG2 with respect to rising edge of LG1
Figure 2.DDR Mode Circuit
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APW7066
Function Description (Cont.)
Soft-Start/Enable
PGOOD
The three SS/EN pins control the soft-start and enable or
disable the controller. In Independent mode, the three
The PGOOD output is an open-drain device, when the
VCC is present; the gate of open-drain device will be
regulators all have independent soft-start and enable
functions. Connect a soft-start capacitor from each SS/EN
high, forcing the PGOOD pin to go low. The three SS/EN
pins and the SCP signals control the PGOOD signal (see
pin to the GND to set the soft-start interval, and an open
drain logic signal for each SS/EN pin will enable or dis-
block diagram), after the three SS/EN signals are over
threshold high 3.3V and three outputs have no short-
able the respective output.
Figure 4. Shows the soft-start interval. When both VCC
circuit, the PGOOD goes high to indicate all regulators
are ready. If any of the SS/EN pins goes below threshold
and VCC12 reach their Power-On-Reset threshold 4.23V
and 7.8V, a 30µA current source starts to charge the
low 3.2V, the PGOOD will go low. Also, if any of the outputs
has a short, the PGOOD pull low and if short-circuit condi-
capacitor. When the SS reaches the enabled threshold
about 1V, the internal 0.6V reference starts to rise and
tion continues for 1-2 clock pulses, all regulators will shut
down. If the short-circuit is not long enough to shut down,
follows the SS; the error amplifier output (COMP) suddenly raises to 1.1V, which is the valley of the oscillator’s
it may still cause PGOOD to go low momentarily.
Because the PGOOD is an open-drain device, the typical
triangle wave, leads the VOUT to start up. Until the SS
reaches about 3.0V, the internal reference completes the
range of the value to connect a pull high resistor to VCC
will be 1kΩ to 10kΩ; if PGOOD is not used, leave it open.
soft-start interval and reaches to 0.6V; then VOUT1 is in
regulation. The SS1 still rises to 3.5V and then stops.
Shunt Regulator
The APW7066 must have two power supplies VCC (5V)
and VCC12 (12V) to drive the IC; VCC (5V) is for the con-
VOLTAGE
trol circuit and VCC12 (12V) is for the drivers of outputs.
But it can also operate only VCC12, because the shunt
regulator 5.8V was designed for VCC (5V); the range of
VSS
the shunt regulator was designed over the usual range
4.5V to 5.5V of typical 5V power supplies.
3V
Connect a resistor from VCC12 to VCC for shunt regulator and for the supply current. The input supply current of
VCC is 7mA; minimum shunt regulator current is about
7mA, and therefore the 20mA shunt regulator current is
VOUT
1V
enough; thus, the typical value, 300Ω of the resistor is
recommended. The relation among minimun shunt regut0
t1
t2
lator current, required shunt regulator current and supply
current is:
TIME
ISHUNT = ICC + ISHUNT(MIN)
Where:
Figure 4. Soft-Start Interval
ISHUNT = Required Shunt Regulator Current
ICC = Supply Current
TSoft - Start = t2 − t1 = CSS ⋅ 2V
ISS
ISHUNT(MIN) = Minimum Shunt Regulator Current
Where:
CSS = external Soft-Start capacitor
ISS = Soft-Start current = 30µA
Copyright  ANPEC Electronics Corp.
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APW7066
Function Description (Cont.)
Shunt Regulator (Cont.)
Figure 8 shows the switching timing of the synchronization function. The rising edge of external signal
OPTIONAL R
VCC (5.8V) FOR SHUNT
REGULATOR
and the falling edge of UGATE of APW7066 are fixed; there
is a delay time between the rising edge of external sig-
VCC12
nal and the falling edge of UGATE, the delay time is
about 500ns. Figure 9 shows the timing chart of the
synchronization function. An external signal is connected
to the FS/SYNC pin and the switching frequency of
APW7066 will track the frequency of external signal after
an additional 300µs delay time to avoid false triggering. If
Figure 5.
another converter’s signal is lost, the APW7066 will return to internal oscillator. This allows the two switch-
Oscillator
ing converters operating at the same frequency to avoid the
interference from the independent frequencies between
The APW7066 provides the oscillator switching frequency
adjustment. Connect a resistor from FS/SYNC pin to the
them. The acceptable frequency is a range of 150kHz to
800kHz.
ground, the nominally 300kHz oscillator switching frequency is increased according to the value of the resistor.
The adjustment range of the switching frequency is
300kHz to 800kHz.
APW7066
VIN
Other
Regulator
UGATE
Conversely, connecting a resistor from FS/SYNC pin to
the VCC12 reduces the switching frequency.The adjust-
FS/
SYNC
ment range of the switching frequency is 70kHz to 300kHz.
VOUT
LGATE
1000
FS to
VCC12
900
Figure 7. Connecting the LGATE signal from other regulator to FS/SYNC pin
FS Resistance (kΩ)
800
700
600
External Clock (10V/div)
500
400
300
LGATE1 (10V/div)
FS to GND
200
100
0
0
100 200 300 400 500 600 700 800
Switching Frequency
UGATE1 (10V/div)
Figure 6. FS/SYNC Resistance vs. Frequency
LGATE2 (10V/div)
SYNC
The switching frequency also can be synchronized to an
external frequency. If there are two switching convert-
Time (0.5µ/div)
Figure 8. The switching timing of synchronization func-
ers on the same board, taking the LGATE signal from
another switching converter, go through a 10kΩ resistor,
tion
and connecting to the FS/SYNC pin (see Figure 7).
Copyright  ANPEC Electronics Corp.
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APW7066
Function Description (Cont.)
SYNC (Cont.)
R1
) x REFIN
R2
R1
VOUT3 = (1 +
) x 0.6V
R2
R3
REFIN = (1 +
) x VOUT1(DDR Mode)
R4
R3
REFIN = (1 +
) x VREF (Independe nt Mode)
R4
VOUT2 = (1 +
300µs
External Clock
(LGATE)
LGATE1/2
Where:
R1 = resistor from VOUT to FB
UGATE1/2
R2 = resistor from FB to GND
R3 = resistor from VREF or VOUT1 to REFIN
Figure 9. The timing chart of synchronization function
R4 = resistor from REFIN to GND
Short-Circuit Protection
Note that the R1 is part of the compensation. It should be
conformed to the feedback compensation.
The APW7066 has a simple short-circuit protection to
monitor COMP1 and COMP2 for VOUT1/2. When output
voltage has a short, the FB pin should start to follow output,
since it is a resistor divider from the output. The FB is the
inverting input of Error-Amp, when FB pin is lower than
the Error-Amp reference, then the COMP will rise to increase the duty-cycle of the upper MOSFET gate driver,
this allows output to get higher voltage. If the short-circuit
condition is long enough, the COMP pin will exceed the
trip point 3.3V,and the duty circle will hit the maximum.
This means that either Over-Current or Under-Voltage
condition is detected. If any of the COMP1 and COMP2
exceeds their trip points, and holds over a filter time (1-2
clock cycle of switching frequency), then all regulators
will shut down, and require a POR on either of VCC or
VCC12 to restart. Note that the linear regulator has no
short-circuit protection.
Output Voltage Setting
The output voltage can be adjusted with a resistive divider,
from output voltage to FB pin to the ground. Use 1% or
better resistors for these resistor dividers is
recommended. The reference voltages of VOUT1 and
VOUT3 are 0.6V, the reference voltage of VOUT2 is REFIN
voltage. The VREF voltage is for REFIN in independent
mode. The following equations can be used to calculate
the output voltage:
VOUT1 = (1 +
R1
) x 0.6V
R2
Copyright  ANPEC Electronics Corp.
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APW7066
Application Information
Linear Regulator Input/Output Capacitor Selection
GAINLC =
The input capacitor is chosen based on its voltage rating.
Under load transient condition, the input capacitor will
1+ s × ESR × COUT
s2 × L × COUT + s × ESR × COUT + 1
The poles and zero of this transfer function are:
momentarily supply the required transient current. The
output capacitor for the linear regulator is chosen to minimize any droop during load transient condition. In addition,
the capacitor is chosen based on its voltage rating.
FLC =
1
2 × π × L × COUT
FESR
1
2 × π × ESR× COUT
Linear Regulator Input/Output MOSFET Selection
The FLC is the double poles of the LC filter, and FESR is
the zero introduced by the ESR of the output capacitor.
The maximum DRIVE3 voltage is determined by the
VCC12. Since this pin drives an external N-channel
MOSFET, therefore the maximum output voltage of the
L
Output
PHASE
linear regulator is dependent upon the VGS.
VOUT3MAX = VCC12 - VGS
COUT
Another criteria is its efficiency of heat removal. The power
ESR
dissipated by the MOSFET is given by:
Pdiss = IOUTx (VIN - VOUT3)
where IOUT is the maximum load current VOUT3 is the
nominal output voltage.
In some applications, heatsink might be required to help
Figure 10. The Output LC Filter
maintain the junction temperature of the MOSFET below
its maximum rating.
FLC
-40dB/dec
Linear Regulator Compensation Selection
FESR
The linear regulator is stable over all load current.
However, the transient response can be further enhanced
by connecting a RC network between the FB3 and DRIVE3
-20dB/dec
pin. Depending on the output capacitance and load current of the application, the value of this RC network is
then varied. A good starting point for the resistor value is
6.8kΩ and 470pF for the capacitor.
Frequency
PWM Compensation
Figure 11. The LC Filter Gain & Frequency
The output LC filter of a step down converter introduces a
double pole, which contributes with -40dB/decade gain
The PWM modulator is shown in Figure 12. The input is
the output of the error amplifier and the output is the PHASE
node. The transfer function of the PWM modulator is given
slope and 180 degrees phase shift in the control loop. A
compensation network between COMP, FB and VOUT
by:
should be added. The compensation network is shown
in Figure 13.
GAINPWM =
The output LC filter consists of the output inductor and
output capacitors. The transfer function of the LC filter is
VIN
∆VOSC
given by:
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APW7066
Application Information (Cont.)
C1
PWM Compensation (Cont.)
VIN
R3
Driver
C3
R2
C2
VOUT
PWM
Comparator
R1
-
VOSC
VCOMP
FB
+
Output of
Error
Amplifier
VREF
PHASE
Figure 13. Compensation Network
The closed loop gain of the converter can be written as:
Driver
GAINLC x GAINPWM x GAINAMP
Figure 14. shows the asymptotic plot of the closed loop
Figure 12. The PWM Modulator
The compensation circuit is shown in Figure 13. It pro-
converter gain and the following guidelines will help to
design the compensation network. Using the below
vide a close loop transfer function with the highest zero
crossover frequency and sufficient phase margin. The
guidelines should give a compensation similar to the
curve plotted. A stable closed loop has a -20dB/decade
transfer function of error amplifier is given by:
slope and a phase margin greater than 45 degree.
1. Choose a value for R1, usually between 1K and 5K.
1 // R2 + 1 
sC2 
VCOMP sC1 
GAINAMP =
=
VOUT

1 
R1 // R3 +

sC3


 


1
1
 × s +
s +





(
)
R1
R3
C3
+
×
R1 + R3
R2 × C2  


×
=

1
R1× R3 × C1 s  s + C1 + C2  ×  s +




R2 × C1× C2  
R3 × C3 

2. Select the desired zero crossover frequency FO:
(1/5 ~ 1/10) x FS > FO > FESR
Use the following equation to calculate R2:
R2 =
∆VOSC
VIN
×
FO
× R1
FLC
3. Place the first zero FZ1 before the output LC filter double
pole frequency FLC.
FZ1 = 0.75 x FLC
The poles and zeros of the transfer function are:
Calculate the C2 by the equation:
1
FZ1 =
2 × π × R2 × C2
1
FZ2 =
2 × π × (R1+ R3)× C3
1
FP1 =
 C1× C2 

2 × π × R2 × 

 C1 + C2 
1
FP2 =
2 × π × R3 × C3
C2 =
1
2 × π × R2 × FLC × 0.75
4. Set the pole at the ESR zero frequency FESR:
FP1 = FESR
Calculate the C1 by the equation:
C1 =
C2
2 × π × R2 × C2 × FESR − 1
5. Set the second pole FP2 at half the switching frequency
and also set the second zero FZ2 at the output LC filter
double pole FLC. The compensation gain should not
exceed the error amplifier open loop gain, check the compensation gain at FP2 with the capabilities of the error
amplifier.
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APW7066
Application Information (Cont.)
PWM Compensation (Cont.)
A smaller inductor will give the regulator a faster load
transient response at the expense of higher ripple current.
FP2 = 0.5xFO
FZ2 = FLC
Increasing the switching frequency (FS) also reduces the
ripple current and voltage, but it will increase the switch-
Combine the two equations will get the following component calculations:
R1
R3 =
FS
2xFLC
C3 =
−1
ing loss of the MOSFET and the power dissipation of the
converter. The maximum ripple current occurs at the
1
maximum input voltage. A good starting point is to choose
the ripple current to be approximately 30% of the maxi-
π × R3 × FS
mum output current.
Once the inductance value has been chosen, select an
inductor that is capable of carrying the required peak current without going into saturation. In some types of
Open Loop Error
Amp Gain
Gain
FZ1=0.75FLC FP1=FESR
FZ2=FLC
20log
(R2/R1)
inductors, especially core that is made of ferrite, the ripple
current will increase abruptly when it saturates. This will
FP2=0.5FS
result in a larger output ripple voltage.
Output Capacitor Selection
20log
(VIN/ VOSC) Compensation
Gain
0
FLC
Higher Capacitor value and lower ESR reduce the output
ripple and the load transient drop. Therefore select high
performance low ESR capacitors that are intended for
switching regulator applications. In some applications,
FO
FESR
PWM & Filter
Gain
multiple capacitors have to be parallel to achieve the desired ESR value. A small decoupling capacitor in parallel
Converter
Gain
for bypassing the noise is also recommended, and the
voltage rating of the output capacitors are also must be
Frequency
considered. If tantalum capacitors are used, make sure
they are surge tested by the manufactures. If in doubt,
Figure 14. Converter Gain & Frequency
Output Inductor Selection
consult the capacitors manufacturer.
The inductor value determines the inductor ripple current
and affects the load transient response. Higher inductor
Input Capacitor Selection
value reduces the inductor’s ripple current and induces
lower output ripple voltage. The ripple current and ripple
The input capacitor is chosen based on the voltage rating
and the RMS current rating. For reliable operation, select
voltage can be approximated by:
the capacitor voltage rating to be at least 1.3 times higher
than the maximum input voltage. The maximum RMS
VIN − VOUT VOUT
IRIPPLE =
×
FS × L
VIN
current rating requirement is approximately IOUT/2, where
IOUT is the load current. During power up, the input capaci-
∆VOUT = IRIPPLE x ESR
tors have to handle large amount of surge current. If tantalum capacitors are used, make sure they are surge tested
where Fs is the switching frequency of the regulator. Although increase the inductor value and frequency reduce
by the manufactures. If in doubt, consult the capacitors
manufacturer. For high frequency decoupling, a ceramic
the ripple current and voltage, but there is a tradeoff exists between the inductor’s ripple current and the regula-
capacitor 1µF can be connected between the drain of upper MOSFET and the source of lower MOSFET.
tor load transient response time.
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APW7066
Application Information (Cont.)
MOSFET Selection
MOSFETs. If the circuit still works, remove the short can
cause an inductive kick on the phase pin, and it may dam-
The selection of the N-channel power MOSFETs are determined by the RDS(ON), reverse transfer capacitance (CRSS)
age the IC and MOSFETs.
• If the resistance of the short is not low enough to cause
and maximum output current requirement. The losses in
the MOSFETs have two components: conduction loss and
protection, the regulator will work as the load has
transition loss. For the upper and lower MOSFET, the
losses are approximately given by the following :
increased, and continue to regulate up until the MOSFETs
is damaged. The resistance of the short should include
wiring, PCB traces, contact resistances, and all of the return paths.
PUPPER = Iout 2(1+ TC)(RDS(ON))D + (0.5)(Iout)(VIN)(tsw)FS
PLOWER = Iout 2(1+ TC)(RDS(ON))(1-D)
• The higher duty cycle will give a higher COMP voltage
where IOUT is the load current
level, and it is easy to touch the trip point.
The compensation components also affect the response
TC is the temperature dependency of RDS(ON)
FS is the switching frequency
of COMP voltage; smaller caps may give a faster
response.
tsw is the switching interval
D is the duty cycle
• The output current has faster rising time during short;
the COMP pin will have a sharp rise. However, if the cur-
Note that both MOSFETs have conduction losses while
the upper MOSFET include an additional transition loss.
rent rises too fast, it may cause a false trip. The output
capacitance and its ESR can affect the rising time of the
The switching internal, tsw, is a function of the reverse
transfer capacitance CRSS.
current during short.
The (1+TC) term is to factor in the temperature dependency of the RDS(ON) and can be extracted from the “RDS(ON)
Layout Consideration
vs. Temperature” curve of the power MOSFET.
In high power switching regulator, a correct layout is important to ensure proper operation of the regulator. In
general, interconnecting impedances should be mini-
Connecting One Input from Another Output
It can be connected one of the 3 outputs as the input
voltage to the 2nd. In these cases the output current of the
mized by using short, wide printed circuit traces. Signal
and power grounds are to be kept separate and finally
first output includes its own load current and the 2nd
output’s load current. Therefore, the components of the
combined using ground plane construction or single point
grounding. Figure 15 illustrates the layout, with bold lines
first output must be designed and sized for the both
outputs. The soft-start of first output must be faster than
indicating high current paths; these traces must be short
and wide. Components along the bold lines should be
the 2nd output. If the first output is not present when the
2nd output tries to start up, the 2nd output cannot get
placed lose together. Below is a checklist for your layout:
• The metal plate of the bottom of the packages (TSSOP-
smooth and controlled output voltage rise, even cause
short-circuit protection.
24 and QFN5x5-32) must be soldered to the PCB and
connected to the GND plane on the backside through
several thermal vias.
• Keep the switching nodes (UGATE, LGATE and PHASE)
Short Circuit Protection
The APW7066 provides a simple short circuit protection
away from sensitive small signal nodes since these
nodes are fast moving signals. Therefore, keep traces to
function, and it is not easy to predict its performance, since
many factors can affect how well it works. Therefore, the
these nodes as short as possible.
• The traces from the gate drivers to the MOSFETs (UG1,
limitations and suggestions of this method must be provided for users to understand how to work it well.
LG1, UG2, LG2, DRIVE3) should be short and wide.
• Decoupling capacitor, compensation component, the
• The short circuit protection was not designed to work
for the output in initial short condition. In this case, the
resistor dividers, boot capacitors, and SS capacitors
should be close their pins.
short circuit protection may not work, and damage the
Copyright  ANPEC Electronics Corp.
Rev. A.8 - Aug., 2009
28
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APW7066
Application Information (Cont.)
Layout Consideration
• The input capacitor should be near the drain of the upper MOSFET; the output capacitor should be near the
loads. The input capacitor GND should be close to the
output capacitor GND and the lower MOSFET GND.
• The drain of the MOSFETs (VIN and phase nodes) should
be a large plane for heat sinking.
VIN
APW7066
UG
FB
CREFOUT
CVREF
VOUT
CBOOT Q1
BOOT
REFOUT
Q2
LG
VREF PGND
VCC
SS VCC12
CSS
L1
CIN
COUT
L
O
A
D
CVCC12 CVCC
GND
Figure 15. Layout Guidelines
Copyright  ANPEC Electronics Corp.
Rev. A.8 - Aug., 2009
29
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APW7066
Package Information
TSSOP-24P
D
SEE VIEW A
b
A
VIEW A
L
0
GAUGE PLANE
SEATING PLANE
A1
S
Y
M
B
O
L
0.25
c
A2
e
E
E2
EXPOSED
PAD
E1
D1
TSSOP-24P
MILLIMETERS
MIN.
INCHES
MAX.
A
MIN.
MAX.
1.20
0.047
A1
0.05
0.15
0.002
0.006
A2
0.80
1.05
0.031
0.041
b
0.19
0.30
0.007
0.012
c
0.09
0.20
0.004
0.008
D
7.70
7.90
0.303
0.311
D1
3.50
5.00
0.138
0.197
E
6.20
6.60
0.244
0.260
E1
4.30
4.50
0.169
0.177
E2
2.50
3.50
0.098
0.138
0.75
0.018
8o
0o
e
L
0
0.65 BSC
0.45
0o
0.026 BSC
0.030
8o
Note : 1. Followed from JEDEC MO-153 ADT.
2. Dimension "D" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 6 mil per side.
3. Dimension "E1" does not include inter-lead flash or protrusions.
Inter-lead flash and protrusions shall not exceed 10 mil per side.
Copyright  ANPEC Electronics Corp.
Rev. A.8 - Aug., 2009
30
www.anpec.com.tw
APW7066
Package Information
QFN5x5-32
D
b
E
A
A1
D2
A3
L K
E2
Pin 1
Corner
e
S
Y
M
B
O
L
QFN5x5-32
MILLIMETERS
INCHES
MIN.
MAX.
MIN.
MAX.
A
0.80
1.00
0.031
0.039
A1
0.00
0.05
0.000
A3
0.20 REF
0.002
0.008 REF
b
0.18
0.30
0.007
0.012
D
4.90
5.10
0.193
0.201
D2
3.50
3.80
0.138
0.150
0.201
0.150
E
4.90
5.10
0.193
E2
3.50
3.80
0.138
0.45
0.014
e
0.50 BSC
L
0.35
K
0.20
0.020 BSC
0.018
0.008
Note : 1. Followed from JEDEC MO-220 VHHD-4.
Copyright  ANPEC Electronics Corp.
Rev. A.8 - Aug., 2009
31
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APW7066
Carrier Tape & Reel Dimensions
P0
P2
P1
A
B0
W
F
E1
OD0
K0
A0
A
OD1 B
B
T
SECTION A-A
SECTION B-B
H
A
d
T1
Application
QFN 5x5-32
Application
TSSOP-24P
A
H
330.0±2.00
50 MIN.
P0
P1
4.0±0.10
8.0±0.10
A
H
330.0±2.00
50 MIN.
P0
P1
4.00±0.10
8.00±0.10
T1
C
12.4+2.00 13.0+0.50
-0.00
-0.20
d
D
1.5 MIN.
20.2 MIN.
W
E1
12.0±0.30 1.75±0.10
F
5.5±0.10
P2
D0
D1
T
A0
B0
K0
2.0±0.10
1.5+0.10
-0.00
1.5 MIN.
0.6+0.00
-0.40
5.35±0.20
5.35±0.20
1.30±0.20
T1
C
d
D
W
E1
F
1.5 MIN.
20.2 MIN.
16.4+2.00 13.0+0.50
-0.00
-0.20
P2
D0
2.00±0.10
1.5+0.10
-0.00
16.0±0.30 1.75±0.10
7.50±0.10
D1
T
A0
B0
K0
1.5 MIN.
0.6+0.00
-0.40
6.9±0.20
8.30.±0.20
1.50±0.20
(mm)
Devices Per Unit
Package Type
QFN5x5-32
TSSOP-24P
Copyright  ANPEC Electronics Corp.
Rev. A.8 - Aug., 2009
Unit
Tape & Reel
Tape & Reel
Quantity
2500
2000
32
www.anpec.com.tw
APW7066
Taping Direction Information
TSSOP-24P
USER DIRECTION OF FEED
QFN5x5-32
USER DIRECTION OF FEED
Copyright  ANPEC Electronics Corp.
Rev. A.8 - Aug., 2009
33
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APW7066
Classification Profile
Classification Reflow Profiles
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-120 seconds
3 °C/second max.
3°C/second max.
183 °C
60-150 seconds
217 °C
60-150 seconds
See Classification Temp in table 1
See Classification Temp in table 2
Time (tP)** within 5°C of the specified
classification temperature (Tc)
20** seconds
30** seconds
Average ramp-down rate (Tp to Tsmax)
6 °C/second max.
6 °C/second max.
6 minutes max.
8 minutes max.
Preheat & Soak
Temperature min (Tsmin)
Temperature max (Tsmax)
Time (Tsmin to Tsmax) (ts)
Average ramp-up rate
(Tsmax to TP)
Liquidous temperature (TL)
Time at liquidous (tL)
Peak package body Temperature
(Tp)*
Time 25°C to peak temperature
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Copyright  ANPEC Electronics Corp.
Rev. A.8 - Aug., 2009
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APW7066
Classification Reflow Profiles (Cont.)
Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)
Package
Thickness
<2.5 mm
≥2.5 mm
Volume mm
<350
235 °C
220 °C
3
Volume mm
≥350
220 °C
220 °C
3
Table 2. Pb-free Process – Classification Temperatures (Tc)
Package
Thickness
<1.6 mm
1.6 mm – 2.5 mm
≥2.5 mm
Volume mm
<350
260 °C
260 °C
250 °C
3
Volume mm
350-2000
260 °C
250 °C
245 °C
3
Volume mm
>2000
260 °C
245 °C
245 °C
3
Reliability Test Program
Test item
SOLDERABILITY
HOLT
PCT
TCT
HBM
MM
Latch-Up
Method
JESD-22, B102
JESD-22, A108
JESD-22, A102
JESD-22, A104
MIL-STD-883-3015.7
JESD-22, A115
JESD 78
Description
5 Sec, 245°C
1000 Hrs, Bias @ 125°C
168 Hrs, 100%RH, 2atm, 121°C
500 Cycles, -65°C~150°C
VHBM≧2KV
VMM≧200V
10ms, 1tr≧100mA
Customer Service
Anpec Electronics Corp.
Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,
Sindian City, Taipei County 23146, Taiwan
Tel : 886-2-2910-3838
Fax : 886-2-2917-3838
Copyright  ANPEC Electronics Corp.
Rev. A.8 - Aug., 2009
35
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