Features Top View Directly mounts to target PCB (needs tooling holes) with hardware Minimum real estate required A Compression plate distributes forces evenly 30.23mm [1.190"] Clamshell lid A Materials: 9 25.48mm [1.003"] Side View (Section AA) Recommended Torque 1-2 in-oz. 1 Clam Shell Lid: Black anodized Aluminum. Height = 16.5 mm. 2 Socket Base: Black anodized Aluminum. Height = 6 mm. 3 4 4 5 37.81mm [1.489"] + IC thickness 6 Pogo Pin Guides: Torlon or Peek 7 Socket Base Screw: Socket Head Cap Screw, alloy steel with black oxide finish, 0-80 Thread, 3/4" long. 8 Pogo Pin Guide Screw: Pan head phillips, 18-8 SS, 0-80 thread, 3/16" long. 9 Latch: Black anodized Aluminum. 10 IC guide: Ultem 1000 11 Insulation Plate : FR4 0.0625'' (1.59 mm) 12 Backing Plate : Black anodized Aluminum 1 3 2 6 10 5 11 Customer's PCB Compression Plate: Black anodized Aluminum. Thickness = 8.5 mm. Compression Screw: Clear anodized Aluminum. Height = 25 mm, Fluted Knob Pogo Pin: Plungers - Hardened Steel/ Gold plated Barrel - Copper Alloy/ Gold plated Spring - Stainless Steel/ Gold wire 12 8 7 SSK-QFN-7000 Drawing © 2010 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: 1.25:1 Rev: A Drawing: M.A. Fedde Date: 11/10/10 File: SSK-QFN-7000 Dwg Modified: All Tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 1 of 4 Ironwood Package code: QFN12H Recommended PCB Layout Top View Orientation Mark 3.303mm Ø 1.61mm±0.05mm(x4) 1.213mm±0.125mm (x4) Non plated mounting hole 0.50mm typ. 1.218mm±0.125mm (x4) 2.00mm 3.61mm Ø 0.850mm±0.025mm (x2) 12.225mm±0.125mm Socket Body Size Non plated alignment hole 0.50mm 3.00mm 3.00mm 0.30 x 0.32mm pad (x 24) 0.50mm 3.42mm 9.725mm (x4) 12.475mm±0.125mm Socket Body Size Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask 14.725mm Backing plate size Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. Target PCB Recommendations SSK-QFN-7000 Drawing Total thickness: 1.6mm © 2010min. IRONWOOD ELECTRONICS, INC. Plating: Gold or11351 Solder finish Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) PCB Pad height: Same or higher than229-8200 solder mask www.ironwoodelectronics.com Status: Released Scale: 4:1 Rev: A Drawing: M.A. Fedde Date: 11/10/10 File: SSK-QFN-7000 Dwg Modified: All dimensions are in mm. PAGE 2 of 4 Compatible QFN (MLF) Spec Ironwood Package code: QFN12H D A b A1 L E e Bottom View Top View Side View DIM MIN MAX A 0.80 A1 0.05 b 0.30 L 0.43 D 4.00 BSC E 3.00 BSC e 0.5 BSC 12 Leads Dimensions are in millimeters. Interpret dimensions and toleraces per ASME Y14.5M-1994. Target PCB SSK-QFN-7000 Recommendations Drawing Total thickness: 1.6mm min. © 2010 IRONWOOD ELECTRONICS, INC. Plating: Gold or Solder 11351 Ruppfinish Drive, Suite 400, Burnsville, MN 55337 PCB Pad height: Same or Tele: higher than solder mask (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: Rev: A Drawing: M.A. Fedde Date: 11/10/10 File: SSK-QFN-7000 Dwg Modified: PAGE 3 of 4 14.73mm 2.50mm 2.50mm 1.27mm (x4) 1.50mm Top View 14.73mm 9.725mm±0.025mm (x4) 3.50mm Ø 1.61mm±0.05mm (x4) 3.00mm sqr. 5.94mm Note: Backing plate holes are tapped to accept 0-80 screws. 1.59mm Insulation Plate Side View Backing Plate 6.35mm Description: Insulation Plate and Backing Plate Target PCB SSK-QFN-7000 Recommendations Drawing Total thickness: 1.6mm min. © 2010 IRONWOOD ELECTRONICS, INC. Plating: Gold 11351 or Solder Rupp finish Drive, Suite 400, Burnsville, MN 55337 (952) 229-8200 PCB Pad height: Same orTele: higher than solder mask www.ironwoodelectronics.com Status: Released Scale: Rev: A Drawing: M.A. Fedde Date: 9/8/10 File: SSK-QFN-7000 Dwg Modified: All dimensions are in mm. All tolerences are +/- 0.125mm. (Unless stated otherwise) PAGE 4 of 4